This document presents a finite element analysis of multilayer transmission line models, including an asymmetric coupled microstrip and a four-line symmetric coupled microstrip on a two-layer substrate. The models were designed and analyzed using COMSOL Multiphysics software to calculate electrical parameters such as capacitance, inductance, and impedance matrices. Potential distributions and meshing analyses are also provided. The results of the finite element analysis can be used for signal integrity analysis of high-speed digital interconnects on printed circuit boards.