SlideShare a Scribd company logo
1 of 19
Download to read offline
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Epson PrecisionCore Printhead
MEMS PZT Inkjet Die
MEMS report by Sylvain Hallereau
September 2018 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o Epson
o Supply Chain
Physical Analysis 13
o Printer disassembly
o Printhead
 Disassembly
 Cross-Section
o Electronic Board
o Driver
 Die Dimension
 Transistor
 CMOS Process
o MicroTFP Inkjet Die
 Inkjet Die Disassembly
 Inkjet Die Cross-Section
 Nozzle Plate
 Flow Path Substrate
 Vibration Plate Cost
 Protection substrate Cost
 PZT Actuator
 Final Assembly cost
o Comparison
Sensor Manufacturing Process 97
o Driver IC
o MicroTFP Inkjet Die
o PrecisionCore Printhead
Cost Analysis 1117
o Accessing the BOM
o MicroTFP inkjet Die
o Driver Wafer Cost
o Driver Die Cost
o Nozzle Plate Cost
o Flow Path Substrate Cost
o Vibration Plate Cost
o Protection substrate Cost
o Final Assembly cost
o Component Cost
o BOM Cost
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Details of the Electronic Board AV Cost
o Details of the Housing AV Cost
o Manufacturing Cost Breakdown for 3M units
Estimated Price Analysis 149
o Estimation of the Manufacturing Price
Customer Feedback 152
Company services 154
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 3
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the
PZT Print head and of the PZT Inkjet Die used in the Epson printer.
The PZT printhead integrates 4 PrecisionCore MicroTFP print chip on an unique support to print 4 colors.
We have simulated the cost of the PrecisionCore print head for a volume of 3,000,000 units in 2018.
The total material and manufacturing costs calculated in this report reflect only the costs for direct materials, manufacturing and basic
tests. Not included in this analysis are the costs of intellectual property, royalties and licensing fees, software loading and test,
shipping, logistics, marketing.
The Epson PZT Inkjet Die is a new inkjet die manufactured by Epson for familial, office and professional applications.
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 4
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Executive Summary
The MEMS inkjet printhead market is expected to reach $1B in 2023, with a 3.5% compound annual growth rate (CAGR) from
2017 to 2023 . With in that, office printers and industrial segments are driving innovative technologies for piezo printheads,
with CAGRs of 2.7% and 18% respectively for the next five years.
System Plus Consulting has a long experience on reverse costing studies on printhead with more than 15 custom analysis. Today
our competency in the reverse costing of printheads is available in catalog report and we are proud to release two catlogue
reports on Epson and Xaar printhead.
Epson is the first printer manufacturer to integrate a thin film PZT MEMS inkjet die in their industrial and office printer. Named
microTFP inkjet die, this MEMS can be assembled by 2, 4 or more according to the need. Each microTFP can print 1 color with a
density of 600dpi.
This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the microTFP inkjet
MEMS and the precisionCore printhead supplied by Epson.
The inkjet MEMS used a patented technology based on a property of no standard silicon crystal to manufacture the pressure
chambers and manifolds. The PZT actuators and the 2 electrodes show a complex structure in the material choice and in the
stacking structure. The final component is a complex structure with nozzle plate, pressure chambers, manifolds and channels all
manufactured on silicon substrate and bonded together.
The microTFP has 2 rows of nozzles stagger on the die to obtain 600dpi.
The PrecisionCore is a 4 colors printheads. 1 microTFP MEMS is used per color. The driver ICs are assembled in the printhead.
A comparison between the XAAR 1201 and the Epson PrecisionCore printhead is included.
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 5
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
PrecisionCore Printhead
Total Weight: 31g
69mm
18mm
46mm
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Printhead X-Ray
Connector
XXX
Print head X-ray top view
©2018 by System Plus Consulting
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Printhead Cross-Section
Print head cross-section – optical view
©2018 by System Plus Consulting
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Driver IC
Pads number : xxx toward the PZT Inkjet die
xxx from the PCB
xxx to enhance the mechanical assembly with the flex.
Connected pads : xxx
Total Pad number : xxx
Pad connected to the PCB
Pad connected to the PZT inkjet die
Pad soldering with the Flex
Pad pitch: xxµm
Driver IC top view – optical view
©2018 by System Plus Consulting
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Nozzle Plate
Nozzle Plate Top view – SEM View
©2018 by System Plus Consulting
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Printer
o PrecisionCore Printhead
o Electronic Boards
o Driver IC
o MicroTFP Inkjet Die
o Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
PZT Actuator
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Global Overview
o Driver IC
o MicroTFP Inkjet Die
o Nozzle Plate
o Flow Path Substrate
o Vibration Plate
o Protection Substrate
o Inkjet Process Flow
o Printhead
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Inkjet Process Flow
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Global Overview
o Driver IC
o MicroTFP Inkjet Die
o Nozzle Plate
o Flow Path Substrate
o Vibration Plate
o Protection Substrate
o Inkjet Process Flow
o Printhead
Selling Price Analysis
Related Reports
About System Plus
Nozzle Plate – MicroTFP Front-End Cost
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Global Overview
o Driver IC
o MicroTFP Inkjet Die
o Nozzle Plate
o Flow Path Substrate
o Vibration Plate
o Protection Substrate
o Inkjet Process Flow
o Printhead
Selling Price Analysis
Related Reports
About System Plus
Manufacturing Cost Breakdown for 3M units in 2018
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS
• Xaar 1201 GS2p5 PZT Printhead
• MEMS Pressure Sensor Comparison 2018
• Vesper VM1000 Piezoelectric Microphone
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMS
• Inkjet Functional and Additive Manufacturing for Electronics
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 15
COMPANY
SERVICES
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
o Company services
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | Epson PrecisionCore Printhead 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
o Company services
o Contact
o Legal
Contact
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
onozawa@yole.fr
Mavis WANG
GREATER CHINA
wang@yole.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
PHOENIX
YOLE Inc.
America Sales Office
Steve LAFERRIERE
Eastern USA
laferriere@yole.fr
Troy BLANCHETTE
Western USA
blanchette@yole.fr
KOREA
YOLE
Headquarters
22 Boulevard Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
ORDER FORM
Please process my order for “Epson PrecisionCore Printhead with
MicroTFP Inkjet Dies” Reverse Costing® – Structure, Process & Cost
Report
Ref: SP18420
 Full Structure, Process & Cost Report : EUR 3,990*
 Bunlde Offer with Xaar 1201 GS2p5 PZT Printhead
 Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:
HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain France
BIC code: CCFRFRPP
• In EUR
Bank code : 30056 - Branch code : 00955 - Account :
09550003234
IBAN: FR76 3005 6009 5509 5500 0323 439
• In USD
Bank code : 30056 - Branch code : 00955 - Account :
09550003247
IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by:
FAX: +33 2 53 55 10 59
MAIL: SYSTEM PLUS CONSULTING
22, bd Benoni Goullin
Nantes Biotech
44200 Nantes – France
*For price in dollars please use the day’s
exchange rate
*All reports are delivered electronically in
pdf format
*For French customer, add 20 % for VAT
*Our prices are subject to change. Please
check our new releases and price
changes on www.systemplus.fr. The
present document is valid 6 months after
its publishing date: September 2018
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTEPSONPRECISIONCORE PRINTHEADWITHMICROTFP INKJETDIES
Each year System Plus Consulting
releases a comprehensive collection
of new reverse engineering and
costing analyses in various domains.
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or 15
Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released each
year on the following topics
(considered for 2018):
• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas
- Gyroscope - IMU/Combo -
Microphone - Optics - Oscillator -
Pressure
• Power: GaN - IGBT - MOSFET - Si
Diode - SiC
• Imaging: Camera - Spectrometer
• LED and Laser: UV LED – VCSEL -
White/blue LED
• Packaging: 3D Packaging -
Embedded - SIP - WLP
• Integrated Circuits: IPD –
Memories – PMIC - SoC
• RF: FEM - Duplexer
• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
1.INTRODUCTION
The present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus
Consulting except in the case of a particular written agreement.
Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICES
Prices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and
worked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be
charged on these initial prices.
System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company
commits itself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTS
The quoted prices already include the rebates and discounts that System Plus Consulting could have granted according
to the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early
payment.
4.TERMS OF PAYMENT
System Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the
case of a particular written agreement.
If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a
penalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is the
current one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice
deadline. This penalty is sent without previous notice.
When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the
total invoice amount when placing his order.
5. OWNERSHIP
System Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIES
The delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.
Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to
cancel the order.
7.ENTRUSTED GOODS SHIPMENT
The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or
damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the
shipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carrier
current ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURE
System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties
described in the current terms and conditions if these are the result of a force majeure case. Therefore, the force
majeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French Code
Civil?
9.CONFIDENTIALITY
As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.
A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATION
The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.
Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect
damage, financial or otherwise, that may result from the use of the results of our analysis or results obtained using
one of our costing tools.
11.APPLICABLE LAW
Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved
applying the French law.
It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES

More Related Content

What's hot

EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
Yole Developpement
 
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
Yole Developpement
 

What's hot (20)

Tesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD ChipTesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD Chip
 
STMicroelectronics MASTERGAN1 Half-Bridge Driver
STMicroelectronics MASTERGAN1 Half-Bridge DriverSTMicroelectronics MASTERGAN1 Half-Bridge Driver
STMicroelectronics MASTERGAN1 Half-Bridge Driver
 
Samsung LPDDR5 12GB Mobile Memory
Samsung LPDDR5 12GB Mobile MemorySamsung LPDDR5 12GB Mobile Memory
Samsung LPDDR5 12GB Mobile Memory
 
NVIDIA A100 ampere GPU
NVIDIA A100 ampere GPUNVIDIA A100 ampere GPU
NVIDIA A100 ampere GPU
 
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicsTesla Model 3 Inverter with SiC Power Module from STMicroelectronics
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics
 
Axis P1375-E Network Camera
Axis P1375-E Network CameraAxis P1375-E Network Camera
Axis P1375-E Network Camera
 
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consulting
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus ConsultingUnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consulting
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consulting
 
Qorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End ModuleQorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End Module
 
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
 
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on AppleRF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
 
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
 
Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
 
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...
 
Broadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiDBroadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiD
 
EPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN ICEPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN IC
 
Oppo Find X Teardown and Identification of Key Components
 Oppo Find X Teardown and Identification of Key Components Oppo Find X Teardown and Identification of Key Components
Oppo Find X Teardown and Identification of Key Components
 
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
 
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...
 
Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2
 
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar ChipsetMediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
 

Similar to Epson PrecisionCore Printhead with MicroTFP Inkjet Dies

Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
Yole Developpement
 
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
Yole Developpement
 
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Yole Developpement
 
Infineon DPS310 Capacitive Pressure Sensor
Infineon DPS310 Capacitive Pressure SensorInfineon DPS310 Capacitive Pressure Sensor
Infineon DPS310 Capacitive Pressure Sensor
Yole Developpement
 
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Yole Developpement
 
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
Yole Developpement
 

Similar to Epson PrecisionCore Printhead with MicroTFP Inkjet Dies (20)

Xaar 1201 GS2p5 PZT Printhead
Xaar 1201 GS2p5 PZT PrintheadXaar 1201 GS2p5 PZT Printhead
Xaar 1201 GS2p5 PZT Printhead
 
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...
 
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...
 
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...
 
Triple Forward Camera from Tesla Model 3
 Triple Forward Camera from Tesla Model 3 Triple Forward Camera from Tesla Model 3
Triple Forward Camera from Tesla Model 3
 
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
 
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor  Wireless Broadband SolutionPeraso X710 Chipset 60GHz Outdoor  Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
 
Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
Orbbec’s Front 3D Depth Sensing System in the Oppo Find XOrbbec’s Front 3D Depth Sensing System in the Oppo Find X
Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
 
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
 
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
 
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Inkjet functional and additive manufacturing for electronics 2018 Report by Y...
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...
 
Additive Manufacturing Impact on Supply Chain and Production Scheduling
Additive Manufacturing Impact on Supply Chain and Production SchedulingAdditive Manufacturing Impact on Supply Chain and Production Scheduling
Additive Manufacturing Impact on Supply Chain and Production Scheduling
 
Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 UD Smartphone
Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 UD SmartphoneSynaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 UD Smartphone
Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 UD Smartphone
 
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
 
Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Le...
Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Le...Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Le...
Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Le...
 
Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2...
Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2...Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2...
Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens 2...
 
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...
 
Infineon DPS310 Capacitive Pressure Sensor
Infineon DPS310 Capacitive Pressure SensorInfineon DPS310 Capacitive Pressure Sensor
Infineon DPS310 Capacitive Pressure Sensor
 
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
 
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
 

More from system_plus

More from system_plus (19)

SP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for SmartphoneSP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for Smartphone
 
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G ChipsetRF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
 
Apple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and AntennaApple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and Antenna
 
InnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical TransceiverInnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical Transceiver
 
ams’ NanEye Mini Camera
ams’ NanEye Mini Cameraams’ NanEye Mini Camera
ams’ NanEye Mini Camera
 
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
 
Micron LPDDR5 12GB Mobile Memory
Micron LPDDR5 12GB Mobile MemoryMicron LPDDR5 12GB Mobile Memory
Micron LPDDR5 12GB Mobile Memory
 
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End AccelerometersSafran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
 
Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)
 
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARHamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
 
Everspin EMD3D256M STTMRAM Memory
Everspin EMD3D256M STTMRAM MemoryEverspin EMD3D256M STTMRAM Memory
Everspin EMD3D256M STTMRAM Memory
 
Spectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor XSpectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor X
 
Goodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display FingerprintGoodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display Fingerprint
 
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 SeriesBroadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
 
Advanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods ProAdvanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods Pro
 
Consumer MEMS Microphones Comparison 2020
Consumer MEMS Microphones Comparison 2020Consumer MEMS Microphones Comparison 2020
Consumer MEMS Microphones Comparison 2020
 
Audi-Bosch FPK Generation 2 Instrument Cluster
Audi-Bosch FPK Generation 2 Instrument ClusterAudi-Bosch FPK Generation 2 Instrument Cluster
Audi-Bosch FPK Generation 2 Instrument Cluster
 
Tesla Model 3 Driver-Assist Autopilot Control Module Unit
Tesla Model 3 Driver-Assist Autopilot Control Module UnitTesla Model 3 Driver-Assist Autopilot Control Module Unit
Tesla Model 3 Driver-Assist Autopilot Control Module Unit
 
Denso’s Monocular Forward ADAS Camera in the Toyota Alphard
Denso’s Monocular Forward ADAS Camera in the Toyota AlphardDenso’s Monocular Forward ADAS Camera in the Toyota Alphard
Denso’s Monocular Forward ADAS Camera in the Toyota Alphard
 

Recently uploaded

Artificial Intelligence: Facts and Myths
Artificial Intelligence: Facts and MythsArtificial Intelligence: Facts and Myths
Artificial Intelligence: Facts and Myths
Joaquim Jorge
 
Histor y of HAM Radio presentation slide
Histor y of HAM Radio presentation slideHistor y of HAM Radio presentation slide
Histor y of HAM Radio presentation slide
vu2urc
 

Recently uploaded (20)

How to Troubleshoot Apps for the Modern Connected Worker
How to Troubleshoot Apps for the Modern Connected WorkerHow to Troubleshoot Apps for the Modern Connected Worker
How to Troubleshoot Apps for the Modern Connected Worker
 
Advantages of Hiring UIUX Design Service Providers for Your Business
Advantages of Hiring UIUX Design Service Providers for Your BusinessAdvantages of Hiring UIUX Design Service Providers for Your Business
Advantages of Hiring UIUX Design Service Providers for Your Business
 
[2024]Digital Global Overview Report 2024 Meltwater.pdf
[2024]Digital Global Overview Report 2024 Meltwater.pdf[2024]Digital Global Overview Report 2024 Meltwater.pdf
[2024]Digital Global Overview Report 2024 Meltwater.pdf
 
Handwritten Text Recognition for manuscripts and early printed texts
Handwritten Text Recognition for manuscripts and early printed textsHandwritten Text Recognition for manuscripts and early printed texts
Handwritten Text Recognition for manuscripts and early printed texts
 
Real Time Object Detection Using Open CV
Real Time Object Detection Using Open CVReal Time Object Detection Using Open CV
Real Time Object Detection Using Open CV
 
From Event to Action: Accelerate Your Decision Making with Real-Time Automation
From Event to Action: Accelerate Your Decision Making with Real-Time AutomationFrom Event to Action: Accelerate Your Decision Making with Real-Time Automation
From Event to Action: Accelerate Your Decision Making with Real-Time Automation
 
Artificial Intelligence: Facts and Myths
Artificial Intelligence: Facts and MythsArtificial Intelligence: Facts and Myths
Artificial Intelligence: Facts and Myths
 
Histor y of HAM Radio presentation slide
Histor y of HAM Radio presentation slideHistor y of HAM Radio presentation slide
Histor y of HAM Radio presentation slide
 
Tech Trends Report 2024 Future Today Institute.pdf
Tech Trends Report 2024 Future Today Institute.pdfTech Trends Report 2024 Future Today Institute.pdf
Tech Trends Report 2024 Future Today Institute.pdf
 
Finology Group – Insurtech Innovation Award 2024
Finology Group – Insurtech Innovation Award 2024Finology Group – Insurtech Innovation Award 2024
Finology Group – Insurtech Innovation Award 2024
 
Strategies for Landing an Oracle DBA Job as a Fresher
Strategies for Landing an Oracle DBA Job as a FresherStrategies for Landing an Oracle DBA Job as a Fresher
Strategies for Landing an Oracle DBA Job as a Fresher
 
How to Troubleshoot Apps for the Modern Connected Worker
How to Troubleshoot Apps for the Modern Connected WorkerHow to Troubleshoot Apps for the Modern Connected Worker
How to Troubleshoot Apps for the Modern Connected Worker
 
Axa Assurance Maroc - Insurer Innovation Award 2024
Axa Assurance Maroc - Insurer Innovation Award 2024Axa Assurance Maroc - Insurer Innovation Award 2024
Axa Assurance Maroc - Insurer Innovation Award 2024
 
Strategies for Unlocking Knowledge Management in Microsoft 365 in the Copilot...
Strategies for Unlocking Knowledge Management in Microsoft 365 in the Copilot...Strategies for Unlocking Knowledge Management in Microsoft 365 in the Copilot...
Strategies for Unlocking Knowledge Management in Microsoft 365 in the Copilot...
 
Developing An App To Navigate The Roads of Brazil
Developing An App To Navigate The Roads of BrazilDeveloping An App To Navigate The Roads of Brazil
Developing An App To Navigate The Roads of Brazil
 
Driving Behavioral Change for Information Management through Data-Driven Gree...
Driving Behavioral Change for Information Management through Data-Driven Gree...Driving Behavioral Change for Information Management through Data-Driven Gree...
Driving Behavioral Change for Information Management through Data-Driven Gree...
 
Bajaj Allianz Life Insurance Company - Insurer Innovation Award 2024
Bajaj Allianz Life Insurance Company - Insurer Innovation Award 2024Bajaj Allianz Life Insurance Company - Insurer Innovation Award 2024
Bajaj Allianz Life Insurance Company - Insurer Innovation Award 2024
 
What Are The Drone Anti-jamming Systems Technology?
What Are The Drone Anti-jamming Systems Technology?What Are The Drone Anti-jamming Systems Technology?
What Are The Drone Anti-jamming Systems Technology?
 
AWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of TerraformAWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of Terraform
 
04-2024-HHUG-Sales-and-Marketing-Alignment.pptx
04-2024-HHUG-Sales-and-Marketing-Alignment.pptx04-2024-HHUG-Sales-and-Marketing-Alignment.pptx
04-2024-HHUG-Sales-and-Marketing-Alignment.pptx
 

Epson PrecisionCore Printhead with MicroTFP Inkjet Dies

  • 1. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Epson PrecisionCore Printhead MEMS PZT Inkjet Die MEMS report by Sylvain Hallereau September 2018 - Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
  • 2. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 2 Table of Contents Overview / Introduction 3 o Executive Summary o Reverse Costing Methodology Company Profile 7 o Epson o Supply Chain Physical Analysis 13 o Printer disassembly o Printhead  Disassembly  Cross-Section o Electronic Board o Driver  Die Dimension  Transistor  CMOS Process o MicroTFP Inkjet Die  Inkjet Die Disassembly  Inkjet Die Cross-Section  Nozzle Plate  Flow Path Substrate  Vibration Plate Cost  Protection substrate Cost  PZT Actuator  Final Assembly cost o Comparison Sensor Manufacturing Process 97 o Driver IC o MicroTFP Inkjet Die o PrecisionCore Printhead Cost Analysis 1117 o Accessing the BOM o MicroTFP inkjet Die o Driver Wafer Cost o Driver Die Cost o Nozzle Plate Cost o Flow Path Substrate Cost o Vibration Plate Cost o Protection substrate Cost o Final Assembly cost o Component Cost o BOM Cost o Material Cost Breakdown by Component Category o Accessing the Added Value (AV) cost o Details of the Electronic Board AV Cost o Details of the Housing AV Cost o Manufacturing Cost Breakdown for 3M units Estimated Price Analysis 149 o Estimation of the Manufacturing Price Customer Feedback 152 Company services 154
  • 3. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the PZT Print head and of the PZT Inkjet Die used in the Epson printer. The PZT printhead integrates 4 PrecisionCore MicroTFP print chip on an unique support to print 4 colors. We have simulated the cost of the PrecisionCore print head for a volume of 3,000,000 units in 2018. The total material and manufacturing costs calculated in this report reflect only the costs for direct materials, manufacturing and basic tests. Not included in this analysis are the costs of intellectual property, royalties and licensing fees, software loading and test, shipping, logistics, marketing. The Epson PZT Inkjet Die is a new inkjet die manufactured by Epson for familial, office and professional applications.
  • 4. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 4 Overview / Introduction o Executive Summary o Reverse Costing Methodology Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Executive Summary The MEMS inkjet printhead market is expected to reach $1B in 2023, with a 3.5% compound annual growth rate (CAGR) from 2017 to 2023 . With in that, office printers and industrial segments are driving innovative technologies for piezo printheads, with CAGRs of 2.7% and 18% respectively for the next five years. System Plus Consulting has a long experience on reverse costing studies on printhead with more than 15 custom analysis. Today our competency in the reverse costing of printheads is available in catalog report and we are proud to release two catlogue reports on Epson and Xaar printhead. Epson is the first printer manufacturer to integrate a thin film PZT MEMS inkjet die in their industrial and office printer. Named microTFP inkjet die, this MEMS can be assembled by 2, 4 or more according to the need. Each microTFP can print 1 color with a density of 600dpi. This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the microTFP inkjet MEMS and the precisionCore printhead supplied by Epson. The inkjet MEMS used a patented technology based on a property of no standard silicon crystal to manufacture the pressure chambers and manifolds. The PZT actuators and the 2 electrodes show a complex structure in the material choice and in the stacking structure. The final component is a complex structure with nozzle plate, pressure chambers, manifolds and channels all manufactured on silicon substrate and bonded together. The microTFP has 2 rows of nozzles stagger on the die to obtain 600dpi. The PrecisionCore is a 4 colors printheads. 1 microTFP MEMS is used per color. The driver ICs are assembled in the printhead. A comparison between the XAAR 1201 and the Epson PrecisionCore printhead is included.
  • 5. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 5 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus PrecisionCore Printhead Total Weight: 31g 69mm 18mm 46mm
  • 6. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Printhead X-Ray Connector XXX Print head X-ray top view ©2018 by System Plus Consulting
  • 7. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Printhead Cross-Section Print head cross-section – optical view ©2018 by System Plus Consulting
  • 8. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Driver IC Pads number : xxx toward the PZT Inkjet die xxx from the PCB xxx to enhance the mechanical assembly with the flex. Connected pads : xxx Total Pad number : xxx Pad connected to the PCB Pad connected to the PZT inkjet die Pad soldering with the Flex Pad pitch: xxµm Driver IC top view – optical view ©2018 by System Plus Consulting
  • 9. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Nozzle Plate Nozzle Plate Top view – SEM View ©2018 by System Plus Consulting
  • 10. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Printer o PrecisionCore Printhead o Electronic Boards o Driver IC o MicroTFP Inkjet Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus PZT Actuator
  • 11. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o Driver IC o MicroTFP Inkjet Die o Nozzle Plate o Flow Path Substrate o Vibration Plate o Protection Substrate o Inkjet Process Flow o Printhead Cost Analysis Selling Price Analysis Related Reports About System Plus Inkjet Process Flow
  • 12. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Global Overview o Driver IC o MicroTFP Inkjet Die o Nozzle Plate o Flow Path Substrate o Vibration Plate o Protection Substrate o Inkjet Process Flow o Printhead Selling Price Analysis Related Reports About System Plus Nozzle Plate – MicroTFP Front-End Cost
  • 13. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Global Overview o Driver IC o MicroTFP Inkjet Die o Nozzle Plate o Flow Path Substrate o Vibration Plate o Protection Substrate o Inkjet Process Flow o Printhead Selling Price Analysis Related Reports About System Plus Manufacturing Cost Breakdown for 3M units in 2018
  • 14. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus Related Reports REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEMS • Xaar 1201 GS2p5 PZT Printhead • MEMS Pressure Sensor Comparison 2018 • Vesper VM1000 Piezoelectric Microphone MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMS • Inkjet Functional and Additive Manufacturing for Electronics
  • 15. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 15 COMPANY SERVICES
  • 16. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus o Company services o Contact o Legal Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 17. ©2018 by System Plus Consulting | Epson PrecisionCore Printhead 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Related Reports About System Plus o Company services o Contact o Legal Contact Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europe Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc. America Sales Office Steve LAFERRIERE Eastern USA laferriere@yole.fr Troy BLANCHETTE Western USA blanchette@yole.fr KOREA YOLE Headquarters 22 Boulevard Benoni Goullin 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr
  • 18. ORDER FORM Please process my order for “Epson PrecisionCore Printhead with MicroTFP Inkjet Dies” Reverse Costing® – Structure, Process & Cost Report Ref: SP18420  Full Structure, Process & Cost Report : EUR 3,990*  Bunlde Offer with Xaar 1201 GS2p5 PZT Printhead  Annual Subscription offers possible from 3 reports, including this report as the first of the year. Contact us for more information. SHIP TO Name (Mr/Ms/Dr/Pr): ............................................................. Job Title: ……............................................................................. Company: …............................................................................. Address: ……............................................................................. City: ………………………………… State: .......................................... Postcode/Zip: .......................................................................... Country: ……............................................................................ VAT ID Number for EU members: .......................................... Tel: ………………......................................................................... Email: ..................................................................................... Date: ...................................................................................... Signature: .............................................................................. BILLING CONTACT First Name : ............................................................................ Last Name: ……....................................................................... Email: ….................................................................................. Phone: …….............................................................................. PAYMENT By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain France BIC code: CCFRFRPP • In EUR Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439 • In USD Bank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797 Return order by: FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING 22, bd Benoni Goullin Nantes Biotech 44200 Nantes – France *For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT *Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: September 2018 REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTEPSONPRECISIONCORE PRINTHEADWITHMICROTFP INKJETDIES Each year System Plus Consulting releases a comprehensive collection of new reverse engineering and costing analyses in various domains. You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! More than 60 reports released each year on the following topics (considered for 2018): • MEMS & Sensors: Accelerometer – Environment - Fingerprint - Gas - Gyroscope - IMU/Combo - Microphone - Optics - Oscillator - Pressure • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Imaging: Camera - Spectrometer • LED and Laser: UV LED – VCSEL - White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP • Integrated Circuits: IPD – Memories – PMIC - SoC • RF: FEM - Duplexer • Systems: Automotive - Consumer - Energy - Telecom ANNUAL SUBSCRIPTIONS
  • 19. 1.INTRODUCTION The present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consulting except in the case of a particular written agreement. Buyer must note that placing an order means an agreement without any restriction with these terms and conditions. 2.PRICES Prices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and worked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged on these initial prices. System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commits itself in invoicing at the prices in force on the date the order is placed. 3.REBATES and DISCOUNTS The quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment. 4.TERMS OF PAYMENT System Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of a particular written agreement. If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty is sent without previous notice. When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total invoice amount when placing his order. 5. OWNERSHIP System Plus Consulting remains sole owner of the delivered services until total payment of the invoice. 6.DELIVERIES The delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order. 7.ENTRUSTED GOODS SHIPMENT The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones (reimbursement based on good weight instead of the real value). 8.FORCE MAJEURE System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described in the current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French Code Civil? 9.CONFIDENTIALITY As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential. A non-disclosure agreement can be signed on demand. 10.RESPONSABILITY LIMITATION The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting. Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage, financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costing tools. 11.APPLICABLE LAW Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved applying the French law. It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes. TERMS AND CONDITIONS OF SALES