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IMEC is an independent research organization established in 1984 by the Flemish government. It has over 1,000 employees across multiple sites worldwide and collaborates with over 600 companies and 208 universities. IMEC conducts world-leading research in nano-electronics, with a focus on scientific knowledge and innovative partnerships to develop industry-relevant technology solutions. Its research programs span areas like healthcare, energy, wireless communications, and more.
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- 3. HISTORY ▸ Established by state government of Flanders in 1984 ▸ Independent non-profit organization ▸ Worldwide reach ▸ Initial investment: 62M€ ▸ Initial staff: ~70 © IMEC 2012
- 4. MISSION ▸ W ld l di research in World-leading hi nano-electronics ▸ Scientific knowledge with innovative power of global partnerships in ICT, healthcare and energy ▸ Industry-relevant technology solutions ▸ International top talent in a unique high-tech environment committed to provide building blocks for a better life in a sustainable society © IMEC 2012
- 5. FULL ECO SYSTEM Universities Europe IMEC Government Industry y
- 6. FACTS & FIGURES ▸ Total revenue in 2011 of 300M€, a growth of 5% ▸ 1 773 publications R&D 1,773 related in 2011 ▸ 132 patents awarded & p 133 patents submitted in 2011 ▸ Collaboration with 600 companies & 208 universities ▸ 600 residents © IMEC 2012
- 7. Top 5 foreign employees HEADCOUNT 1. 1 The Netherlands (# 159) 2. China (# 87) 3. France (# 86) May 2012: 4. India (# 76) 5. Japan (# 61) ▸ 1,077 Belgians ▸ 72 foreign nationalities 159 160 140 120 100 87 86 80 76 59 61 60 46 43 40 30 31 28 25 16 18 20 13 13 15 10 10 12 7 7 5 8 8 7 4 4 5 4 4 5 6 4 2 5 1 1 3 1 2 2 1 1 1 1 1 1 1 2 1 3 2 1 1 1 2 1 3 1 1 1 1 2 1 2 1 1 1 1 1 0
- 8. IMEC IN THE WORLD The Netherlands Belgium China office US office Japan Taiwan India
- 9. Organic Silicon solar cell 200mm line NERF solar cell lab pilot line line Nano 300mm biolabs pilot line 450mm ready STATE-OF-THE-ART RESEARCH FACILITIES
- 10. 300mm PILOT LINE IMEC TOWER ‣ Expansion of 14,208 m2 14 208 ‣ 16 floors – capacity of 450 people & lab space
- 11. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 12. SCALING ‣ 1965: Lithography enabled scaling ‣ 2002-2003: ~ 90 nm 2002 2003: Materials enabled scaling ‣ ~ 14 nm: 3D enabled scaling © IMEC 2012
- 13. FINFET ‣ 22nm – 14nm ‣ FinFET introduction at 22nm for high-end high end applications ‣ 14nm for foundry processes © IMEC 2012
- 14. LOGIC ‣ High mobility channel ‣ 10 nm – 7nm Ge © IMEC 2012
- 15. LOGIC ‣ High mobility channel InGa As ‣ 10nm – 7nm Ge InP GaAs Ge Si © IMEC 2012
- 16. LOGIC Tunnel FET ‣ New device concepts Pinch-off FET ‣ Tunnel FET ‣ Pinch-off FET ‣ 7nm – 5nm © IMEC 2012
- 17. ReRAM ‣ Resistive RAM ‣ Integration in a vertical concept ‣ In 2011: world’s smallest, fully-functional HfO2-based ReRAM cell, with an area of less than 10 x 10nm² © IMEC 2012
- 18. DRAM ‣ STT RAM as stand alone and for embedded memory <20nm © IMEC 2012
- 19. 3D INTEGRATION ‣ Reducing floor space – small form factor ‣ 3D stacking of memory on logic or RF on interposer © IMEC 2012
- 20. OPTICAL I/O ‣ Extreme high bandwidth I/O in high performance computing ‣ Imec world-first sub- 100nm photonics components on 300mm Si technology with optical lithography li h h © IMEC 2012
- 21. EUV ‣ ASML preproduction scanner NXE:3100 for extreme UV lithography © IMEC 2012
- 22. LITHO POWER ‣ 16nm half pitch ‣ Phenomenal lithographic power can be achieved © IMEC 2012
- 23. DIRECTED SELF ASSEMBLY ‣ Extending optical g p lithography beyond its current limits ‣ Alternative patterning enabling frequency multiplication through use p g of block copolymers © IMEC 2012
- 24. INSITE ‣ Technology insights for gy g SYSTEM DESIGN product roadmaps (Fabless - Fablite) INSITE PROCESS TECHNOLOGY (Foundry) © IMEC 2012
- 25. INSITE Technology Option selection ‣ Linking process technology gp gy & system design Path-finding Technology- Test chips design g Design & co-exploration build Model Measure & characterize © IMEC 2012
- 26. 300mm PILOT LINE ‣ Investment > 1B$ $ ‣ Unique lithography cluster centered around ASML equipment ‣ Advanced equipment and preproduction tools ‣ Ballroom type of cleanroom ‣ 4 800 ² class 1 000 area 4,800m² l 1,000 © IMEC 2012
- 27. 300mm PILOT LINE 300mm PILOT LINE: ‣ Silicon pilot line for (sub-)22nm ‣ Semi-industrial operation - 24/7, process monitoring, short cycle time
- 28. PREPARING 450mm ‣ Funding Flemish g Government ‣ Towards Europe’s innovation engine © IMEC 2012
- 29. GLOBAL NETWORK SYSTEM COMPANIES MEMORY IDM LOGIC IDM FOUNDRIES FABLITE FABLESS EQUIPMENT MATERIAL SOFTWARE SUPPLIERS SUPPLIERS SUPPLIERS
- 30. GLOBAL NETWORK Memory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
- 31. CORE CMOS PARTNERS The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again. Lam RESEARCH
- 32. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 34. internet doctor BODY AREA hospital NETWORKS ▸ W Wearable h l h and bl health d comfort monitoring © IMEC 2012
- 35. HEALTH PATCH ▸ M l i parameter: Multi - heartbeat - skin temperature - skin conductance - sweat analysis - chemical sensing g © IMEC 2012
- 36. HEALTH PATCHECG PATCH ▸ Ul l Ultra-low power ECG patch ▸ Bluetooth low energy gy ▸ Embedded algorithm ▸ 30 days autonomy © IMEC 2012
- 37. WIRELESS EEG Applications: A li i ▸ Improving traffic safety through drowsiness g monitoring ▸ Games that adapt to the player s player’s cognitive state ▸ E-learning that adapts to the user’s concentration ▸ Accurate EEG monitoring at home, e.g. epilepsy patients © IMEC 2012
- 38. ULTRA LOW ENERGY DESIGN ▸ Di i l system d i f Digital design for battery operated and harvested devices with 10-100 times less power consumption ▸ Reliable near-threshold near threshold design ▸ Ultra energy efficient biomedical processing bi di l i © IMEC 2012
- 39. MOBILE DIAGNOSTICS ▸ Aff d bl Affordable ▸ Health monitoring to rural environments in developing countries © IMEC 2012
- 40. CMUT 4D RT imaging ▸ C Capacitive Mi i i Micromachined hi d Ultrasonic Transducers technology Mock up ▸ Towards mobile real-time 4D ultrasound ▸ More precise & faster ultrasound scans © IMEC 2012
- 41. CMUT: BASED ON SiGe MEMS ▸ SiG MEMS on top of SiGe f CMOS ▸ Membranes integrated g with electronics ▸ More compact, faster, more sensitive, increasing sensitive pixel density © IMEC 2012
- 43. EARLY DETECTION ▸ E l d Early detection of cancer i f cells ▸ Secondary tumors are y main cause of most cancer deaths ▸ Challenge: detecting one in 5 billion cells © IMEC 2012
- 44. INSPECTION CIRCUITS ▸ Chi with thousands of Chip i h h d f parallel inspection circuits ▸ Each containingg electronics, microfluidics & imaging hardware ▸ Goal: inspect 20 million cells per second with high reliability © IMEC 2012
- 46. STEM CELLS ▸ T Treat diabetes patients by di b i b replacing faulty pancreas cells with new pancreas cells ▸ Reprogrammed on the basis of own stem cells © IMEC 2012
- 47. STEM CELL BIOREACTOR ▸ G Growing cells & tissues on i ll i chips ▸ Two-way communication y between electronics & cells ▸ Expertise in electrode arrays on active CMOS for cell recording of neurons & cardiac cells di ll © IMEC 2012
- 48. PRECISE REPROGRAMMING ▸ Ch ll Challenge: a platform f l f for precise reprogramming and growth of stem cells ▸ Built on expertise in advanced semiconductor equipment & advanced metrology © IMEC 2012
- 49. NERF LAB ▸ I Imec & VIB & KU Leuven L ▸ Unraveling the human brain ▸ Research interests: - sensory integration & processing i the i in h zebrafish brain - neural circuits & behavior - functional assembly of neural circuits l i it © IMEC 2012
- 51. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 52. WIRLESS SENSORS ▸ Improving connectedness ▸ Smarter world: - smart healthcare - smart buildings - smart phone - smart display © IMEC 2012
- 53. WIRELESS COMMUNICATION ▸ Innovative solutions for tomorrow’s wireless communication ▸ By combining advanced IC technology with innovative design strategies & smart software techniques ▸ Fully-integrated energy- efficient solutions with more performance & flexibility y © IMEC 2012
- 54. RECONFIGURABLE RADIOS ▸ Towards low cost & low low-cost low- power reconfigurable radios ▸ Enabling future 4G networks and digital video broadcasting ▸ Reconfigurable analog front- front end ▸ Reconfigurable digital baseband b b d ▸ Spectrum sensing ▸ Record breaking ADCs © IMEC 2012
- 55. mmWAVE SOLUTIONS ‣ Wireless solutions that exploit the bandwidth capacity available at 60GHz for h t 60GH f short-range Gigabit/s communication ‣ Radar & backhaul applications emerging © IMEC 2012
- 56. ULTRA LOW ULTRA-LOW POWER RADIOS ‣ Radios for battery & energy harvested devices with power consumption that i 10 100 times l th t is 10-100 ti lower than conventional low- power systems © IMEC 2012
- 57. PARTNERS W S WIRELESS TECHNOLOGY SS C O OG
- 58. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 59. TARGET MARKETS ▸ Space p ▸ Instrumentation ▸ Machine vision ▸ Medical ▸ Biology © IMEC 2012
- 60. SPECIALIZED IMAGING ▸ Ultra fast ▸ Non-visible light ▸ Enhanced performance ▸ Hyperspectral ▸ Lensless © IMEC 2012
- 61. ULTRA FAST IMAGING Challenge g ▸ Fast readout at low power consumption ▸ Towards million frames/sec Building on imec expertise: ▸ High speed ADCs ▸ Embedded CCD © IMEC 2012
- 62. IMAGING NON VISIBLE LIGHT ▸ Fully qualified EUV sensors yq installed in customer’s product: ASML/3100 lithography tool - EUV Energy sensor to monitor EUV dose - 2 EUV position sensors to calibrate, align and focus lens systems © IMEC 2012
- 63. ENHANCED PERFORMANCE ▸ Backside illumination for: - High quantum efficiency - Broad spectral range from 193nm to 1μm © IMEC 2012
- 64. HYPERSPECTRAL IMAGING Advantages: g ▸ More spectral information (than RGB) ▸ Extreme miniaturization ▸ Low cost ▸ High speed ▸ Wafer-level filter integration © IMEC 2012
- 65. LENSLESS Microscopic imaging over a p g g large area Biomedical applications: ▸ Cell sorting & monitoring (flow cytometry) ▸ Molecular diagnostics (biomarkers assays) 150 µm ▸ DNA sequencing © IMEC 2012
- 66. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 67. APPLICATIONS ‣ Smart buildings g ‣ Preventive maintenance ‣ Logistics ‣ Automotive ‣ Monitoring environmental parameters © IMEC 2012
- 68. SENSOR SYSTEMS ‣ Long-time autonomy g y ‣ Ultra-low power wireless solutions: 10 – 100 times lower than conventional low-power systems p y © IMEC 2012
- 69. MEMS HARVERSTER ‣ Piezoelectric harvesters ‣ MEMS harvester to power intelligent tire ‣ Record output of 489µW © IMEC 2012
- 70. ETHYLENE SENSOR ‣ Sensor in one single chip g p ‣ Monitor fruit ripening ‣ Low detection limits low limits, cost, low power consumption © IMEC 2012
- 71. 2.3/2.4 GHZ TRANSMITTER ‣ Multi-standard transceiver for sensor networks ‣ 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards ‣ 3 to 5 times more power efficient than state-of-the- art Bl Bluetooth LE h © IMEC 2012
- 72. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 73. ENERGY STRATEGY ▸ Solar energy generation ▸ Switching energy ▸ Storing energy ▸ Saving energy © IMEC 2012
- 74. SILICON PV
- 75. COMBINING EXPERTISE ▸ Process steps ▸ Materials ▸ Device/module concepts p Towards world record performance © IMEC 2012
- 76. SILVER REPLACEMENT ▸ 7% of all silver used in PV ▸ A major part of PV cell cost is silver ▸ Replacing silver by copper © IMEC 2012
- 77. Cu PLATED Cu-PLATED Si SOLAR CELL ▸ Copper electroplating ▸ >21% efficiency © IMEC 2012
- 78. INTERDIGITATED BACK-CONTACT Si SOLAR CELL ▸ > 23% efficiency © IMEC 2012
- 79. I MODULE I-MODULE ▸ Cell integration of ultra ultra- thin wafers onto module glass ▸ Integrating additional electronics to module for p power conversion & load optimization © IMEC 2012
- 81. OPV
- 82. ORGANIC CELLS ▸ Towards: - 10% efficiency - 10 years lifetime © IMEC 2012
- 83. INVERTED POLYMER CELL ▸ World record efficiency 8,3% © IMEC 2012
- 84. COMBINING EXPERTISE ▸ Materials and cell architectures ▸ Collaboration between world-class chemical companies, innovative developers & imec d l © IMEC 2012
- 85. GaN on Si GaN-on-Si LEDs ▸ LED on 200mm GaN-on- Si wafers ▸ To make LEDs cheaper © IMEC 2012
- 86. GaN on Si GaN-on-Si LEDs ▸ Process flow fully compatible with 200mm CMOS processing line © IMEC 2012
- 87. GaN ON Si GaN-ON-Si power devices ▸ GaN power devices on 200mm Si substrates © IMEC 2012
- 88. OLED ▸ New flexible OLED lighting program ▸ Economically scalable route to high-volume manufacturing ▸ Low power consumption, high resolution, large area, outdoor readability, flexibility & light weight © IMEC 2012
- 89. GaN PARTNERS 25 year solar cell research
- 90. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 91. CMORE MEMS NANO-PHOTONICS ‣ Turn your silicon concept y p into a product SENSORS POWER-HIGH V-HBT BIO-INTERFACE GaN © IMEC 2012
- 92. CMORE PRO STEP 1 STEP 4 OTOTYPIN - CONCEPT DESIGN - PROTOTYPING - LOW-VOLUME MANUFACTURING AT IMEC ‣ Turn your silicon concept y p NG LOPMENT into a product STEP 2 STEP 5 - PROCESS DEVELOPMENT - TRANSFER O-)DEVEL - PACKAGING - TESTING - RELIABILITY (CO STEP 3 STEP 6 PRODUCTION - PRODUCT - HIGH-VOLUME QUALIFICATION MANUFACTURING AT FOUNDRY PARTNER © IMEC 2012
- 93. EUV SENSORS ‣ High-quality EUV sensors g q y for ASML’s next-generation lithography tools ‣ Main requirements: - superior lifetime - sensitivity to direct and y high doses of EUV irradiation ‣N Next generation: i - NXE:3100 - NXE: 3300 © IMEC 2012
- 94. BIOSENSORS ‣ Biosensor chips for p Genalyte diagnostic & molecular detection equipment ‣ CMORE service making use of imec’s silicon photonic p technology © IMEC 2012
- 95. CMORE PARTNERS
- 96. RESEARCH PROGRAMS FOR FULL ECO SYSTEM Human++ Green Radio Imaging Sensor Energy BAN Low power Image sensors systems Photovoltaics Life Sciences wireless & vision systems for industrial Power devices communication applications LEDs Core CMOS CMORE Organic Lithography Devices Interconnects MEMS, Sensor electronics Photonics
- 97. SYSTEM ON FOIL Thin-film electronics on flexible plastic foils Applications: ▸ rollable displays for tablet computers or phones p p ▸ electronics printed on objects ▸ intelligent food packaging, or paper with integrated electronics © IMEC 2012
- 98. MICROPROCESSO R ▸ First microprocessor p © IMEC 2012
- 100. BUSINESS MODEL Services Training Spin-offs Transfer & licenses Joint R&D © IMEC 2012
- 101. OPEN INNOVATION IP Risk Ri k Services Training Cost Talent Spin- Transfer & offs licenses Joint R&D Accelerated, cost-effective R&D ff © IMEC 2012
- 102. OPEN Partner INNOVATION A Partner Partner E B Program Services Training Partner Partner Spin- Transfer & D C offs licenses Joint R&D Imec i d t i l affiliation program I industrial ffili ti Customized programs © IMEC 2012
- 103. RESEARCH PROGRAMS System Services Training Fabless Fablite Logic IDM Spin- Transfer & Memory IDM Foundries offs licenses Suppliers Joint Material Equipment R&D Suppliers Suppliers EDA SAT © IMEC 2012
- 104. RESEARCH PROGRAMS FOR FULL INDUSTRY ECO SYSTEM Memory IDM Logic IDM Foundries Fablite Fabless The image cannot be display ed. Your computer may not hav e enough memory to open the image, or the image may hav e been corrupted. Restart y our computer, and then open the file again. If the red x still appears, y ou may hav e to delete the image and then insert it again.
- 105. SERVICES ▸ ASIC services: - Design - Prototyping to low-volume ▸ CMORE platform: - Design Services Training - Process techn. development - Prototyping to low- Spin- Transfer & volume offs licenses ▸ CAMS: - A unique set of reliability and q y Joint characterization services R&D © IMEC 2012
- 106. TRAINING ▸ Imec Academy y ▸ Training for industry & academia on advanced concepts and technologies ▸ Advanced training programs on IC technology Services Training and design and related ▸ E-learning and web-based training ▸ On-line knowledge exchange Spin- Transfer & offs licenses Joint R&D www.imec-academy.be © IMEC 2012
- 107. SPIN OFFS SPIN-OFFS Services Training Spin- Transfer & offs licenses Integrated in Synopsis Inc. Integrated in Cypress g yp Integrated in Agilent Technologies T h l i Joint R&D Integrated in ARM Belgium Integrated in Huawei Alphabit & UCB Electronics integrated in Agilent Technologies Cobrain integrated in Matrix Integrated Systems, Inc. © IMEC 2012
- 108. TRANSFER & LICENSES ▸ Process steps, modules, technologies: 65nm and 28nm CMOS platform ▸ IP blocks: Services Training - ADCs - Software-defined radio - Reconfigurable processor Spin- Transfer & -… offs licenses Joint R&D © IMEC 2012
- 109. IMEC IN FLANDERS
- 110. LEVERAGE TO FLANDERS With a dedicated team stimulating, initiating & coordinating cooperation with Flemish companies & innovation actors Exploration, transfer & consolidation in Flanders Worldwide industrial network of top companies Build-up Build up of technology portfolio in generic R&D Programs
- 111. COOPERATION WITH LOCAL COMPANIES / ACTORS Timely insight Participation in and inputs for LT/MT/ST LT research researchh 1 few Sharing Focussed added value Application of pp technological research results know-how Cooperation with Support for Informing about development of technological local new products d opportunities companies/actors and processes 1 many 1 1 Low threshold High threshold Generic added value Specific added value
- 112. EXPANSION MODEL: MICROELECTRONICS FOR BENEFIT OF OTHER SECTORS Textile Automotive Biomedic Food al Electronic Design Construction Health & Wellness
- 113. IMEC’S IMPACT ON THE LOCAL INDUSTRY EVOLUTION COLLABORATION LOCAL COMPANIES 600 1984 2001: 500 142 local companies 486 464 2002 2011: 447 344 extra local companies, 411 400 >60% SME’s! 381 350 306 300 261 222 200 166 142 127 102 110 86 100 74 57 45 26 32 0 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
- 114. OUR PARTNERS 3 66 4 10 38 8 11 32 9 15 Hasselt 10 20 8 102 68 24 58 PARTNERS SPREAD OUT OVER FLANDERS
- 115. A SAMPLE OF THE FLEMISH PARTNERS
- 116. COOPERATION IN DIFFERENT SECTORS 2011 WITH LOCAL COMPANIES 22% 34% Microelectronics Non-ICT Textile Automotive Medical Food Graphics Wellness 26% Health H lth Chemical 18% Electronic prod. Construction ICT (others) Domotics