Electronic systems are subjected to electrostatic discharges (ESD). PCB designers must ensure their PCB is ESD-proof by adding TVS close to the connectors exposed to ESD. This presentation is an introduction on why and how to protect electronic systems. Advanced informations on IEC61000-4-2 and ISO10605 standards are also mentioned. Finally application examples from STMicroelectronics boards are shown as examples with ESD product recommendation for interfaces commonly used around MCUs like USB, RS-232, RS-485, USB-C, microphone, speakers, SWD, JTAG, memory card, ethernet, MIPI, Display port, HDMI, PLC inputs, CAN bus, KNX, DC barrel, SIM cards, etc.
Concepts of Electrostatic Discharge in Surface Mount TechnologyPaul Akinde
The intent of this paper is to present an analysis of electrostatic discharge and electrical overstress in surface mount technology. It recognises the recent development in modern electronics and emergence of solid state device in small and miniaturised forms as its building blocks which are electrostatic sensitive by nature. It began with an overview of electrostatic discharge and electrical stress, classification of ESD sensitivity, its effects on solid state devices and the various sources of ESD.
ESD Damage – The Surprisingly Dominant Failure Mechanism! Cheryl Tulkoff
This document discusses electrostatic discharge (ESD) as a surprisingly dominant failure mechanism in electronics. It provides an overview of ESD models like the human body model and charged device model. It also discusses ESD failures at various levels from the device to the system level. The document recommends techniques for ESD damage prevention including design solutions, manufacturing solutions, and establishing an electrostatic discharge protection area.
This document provides guidelines for protecting commonly used interfaces from electrostatic discharge (ESD) and transient voltages. It discusses ESD protection considerations and solutions for automotive interfaces like CAN, LIN, and FlexRay. It also covers general input/output, serial buses, displays, Ethernet, and radio frequency interfaces. For each interface, example protection circuits are shown along with NXP's recommended protection devices that offer high ESD robustness and minimal impact on signal integrity.
Transforming Technologies is a leading provider of electrostatic discharge (ESD) protection solutions for the electronics industry. They offer over 10 years of experience and a wide range of ESD products including personal grounding equipment, ionizers, ESD apparel, and test and measurement devices. Proper ESD control is important to prevent costly damage to electronic components from static electricity, which can occur at voltages as low as 15-30 volts.
Electrostatic discharge (ESD) refers to the transfer of static electricity between two objects with different electrical potentials. ESD events are common and occur whenever two materials contact and separate, such as walking across a carpet. While people may feel an ESD event at 2000 volts, component damage can occur at voltages as low as 15-30 volts. Proper ESD control programs aim to prevent such damage and include employee training, establishing ESD protected areas, ensuring proper grounding of equipment and personnel, and using ionizers to neutralize static charges that cannot be grounded. ESD can cause both immediate failures as well as latent defects, resulting in significant costs to the electronics industry.
Electrostatic discharge (ESD) occurs when two surfaces contact and separate, leaving one surface with a positive charge and the other with a negative charge. ESD can damage electronic components, even at voltages too low for humans to feel. Proper ESD control includes grounding conductors like people, equipment, and work surfaces; neutralizing insulators with ionizers; and shielding electrostatic sensitive items when outside protected areas. Following ESD safety procedures is important to prevent costly component damage.
This document discusses electrostatic discharge (ESD) control in electronic assembly. It outlines how static charge is generated through contact and separation of dissimilar materials and the effects this can have, including physical damage, contamination, and automation issues. The key elements of an ESD control program are reviewed, including grounding conductors, eliminating insulators, and using ionizers to neutralize static charge on insulators and isolated conductors. Different types of ionizers are described, and maintenance of ionizers is discussed. The importance of ESD control is increasing as electronic devices become more sensitive.
Concepts of Electrostatic Discharge in Surface Mount TechnologyPaul Akinde
The intent of this paper is to present an analysis of electrostatic discharge and electrical overstress in surface mount technology. It recognises the recent development in modern electronics and emergence of solid state device in small and miniaturised forms as its building blocks which are electrostatic sensitive by nature. It began with an overview of electrostatic discharge and electrical stress, classification of ESD sensitivity, its effects on solid state devices and the various sources of ESD.
ESD Damage – The Surprisingly Dominant Failure Mechanism! Cheryl Tulkoff
This document discusses electrostatic discharge (ESD) as a surprisingly dominant failure mechanism in electronics. It provides an overview of ESD models like the human body model and charged device model. It also discusses ESD failures at various levels from the device to the system level. The document recommends techniques for ESD damage prevention including design solutions, manufacturing solutions, and establishing an electrostatic discharge protection area.
This document provides guidelines for protecting commonly used interfaces from electrostatic discharge (ESD) and transient voltages. It discusses ESD protection considerations and solutions for automotive interfaces like CAN, LIN, and FlexRay. It also covers general input/output, serial buses, displays, Ethernet, and radio frequency interfaces. For each interface, example protection circuits are shown along with NXP's recommended protection devices that offer high ESD robustness and minimal impact on signal integrity.
Transforming Technologies is a leading provider of electrostatic discharge (ESD) protection solutions for the electronics industry. They offer over 10 years of experience and a wide range of ESD products including personal grounding equipment, ionizers, ESD apparel, and test and measurement devices. Proper ESD control is important to prevent costly damage to electronic components from static electricity, which can occur at voltages as low as 15-30 volts.
Electrostatic discharge (ESD) refers to the transfer of static electricity between two objects with different electrical potentials. ESD events are common and occur whenever two materials contact and separate, such as walking across a carpet. While people may feel an ESD event at 2000 volts, component damage can occur at voltages as low as 15-30 volts. Proper ESD control programs aim to prevent such damage and include employee training, establishing ESD protected areas, ensuring proper grounding of equipment and personnel, and using ionizers to neutralize static charges that cannot be grounded. ESD can cause both immediate failures as well as latent defects, resulting in significant costs to the electronics industry.
Electrostatic discharge (ESD) occurs when two surfaces contact and separate, leaving one surface with a positive charge and the other with a negative charge. ESD can damage electronic components, even at voltages too low for humans to feel. Proper ESD control includes grounding conductors like people, equipment, and work surfaces; neutralizing insulators with ionizers; and shielding electrostatic sensitive items when outside protected areas. Following ESD safety procedures is important to prevent costly component damage.
This document discusses electrostatic discharge (ESD) control in electronic assembly. It outlines how static charge is generated through contact and separation of dissimilar materials and the effects this can have, including physical damage, contamination, and automation issues. The key elements of an ESD control program are reviewed, including grounding conductors, eliminating insulators, and using ionizers to neutralize static charge on insulators and isolated conductors. Different types of ionizers are described, and maintenance of ionizers is discussed. The importance of ESD control is increasing as electronic devices become more sensitive.
Electrostatic discharge (ESD) is a spark or discharge caused by a buildup of static electricity. It can damage electronics like computer components. The document discusses ESD, how it occurs, common test models used to evaluate ESD thresholds, types of damage it can cause, and ways to prevent ESD such as proper grounding, neutralization, and using anti-static protective equipment and bags in work areas. It also lists components of a static safe workplace and names team members who contributed to the document.
The document discusses electrostatic discharge (ESD) standards for repair areas. It covers basic ESD concepts, hazards, and damaged samples. It outlines regulations for electrostatic materials, repair workbenches, tools, and environments. The repair workbench must use an anti-static mat connected to electronic ground. Repair engineers must wear anti-static protective clothing like aprons, footwear, wrist straps, gloves, and caps to isolate electrostatic charges produced by personal clothing and properly handle sensitive electronic components. Following these ESD precautions helps prevent costly damage to devices during repair.
The document discusses electrostatic discharge (ESD) and provides information on controlling ESD in electronics manufacturing environments. Some key points:
- ESD occurs when a charged object discharges to another object, which can damage electronic components. Static electricity builds up from friction and movement.
- ESD costs the electronics industry millions annually in damaged parts. Despite efforts, ESD still affects production yields and costs.
- Controlling ESD involves designing products to withstand ESD, reducing charge generation, grounding conductive materials to dissipate charges, and neutralizing charges that do occur.
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
In this seminar, we discuss the challenges designers will be facing over the next several years. Changes in technology will continue to put pressure on designers to provide adequate protection but often without good information or tools. Highlights of the following will be covered: The shrinking design window for CMOS integrated circuits; changes in component level ESD threshold targets and the lack of availability of component information; the implications of new packaging and interconnect technologies such as through silicon vias (TSV); design of system connection and user interfaces; the use and misuse of component level ESD information for system level protection and emerging methods for co-design; and the evolution of EOS/ESD testing methods and standards.
The document discusses electrostatic discharge and its risks. It explains that a static charge builds up from certain materials rubbing together, like clothes or one item against another. This charge can damage electronic components through sparks or discharges. Anyone working with electronics must wear a wristband and use a grounded mat to safely dissipate any static charge and prevent damage.
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
Many engineers are aware of some aspects of the importance of ESD as a threat to product yield, returns and malfunction. What is surprising is the breadth of its impact across a wide variety of products, technologies, services and markets. For instance, it has recently been determined that, for some technologies, many EOS (Electrical Overstress) failures have been misdiagnosed and were actually ESD. In this seminar we present a broad survey of the impacts including this EOS misdiagnosis issue. The best known effects, those on integrated circuits, will be discussed and the implications of the IC technology and packaging roadmaps will be discussed. We will also describe the effects on other areas including MEMS, flat panel displays, phototools, manufacturing equipment, hand-held devices and operating systems. In each case we will describe how ESD caused failure or malfunction. Where available, industry-wide data will be summarized. Newly realized ESD failure mechanisms such as Charged-Board Events (CBE), Cable Discharge Events (CDE) and transient-induced latch-up will also be discussed.
This document discusses electrostatic discharge (ESD) and ESD control. It explains that ESD occurs when electrically charged objects discharge, which can damage electronic components. Common sources of ESD include walking on carpets and unwrapping tapes. While a discharge of 3,000 volts or more can be felt, far less voltage of only 100 volts can damage electronics. The document outlines the basics of ESD control, which includes grounding conductors like people with wrist straps, shielding ESD sensitive items, and neutralizing insulators with ionizers. Proper ESD control and training of personnel are needed to prevent the costly latent damage caused by ESD that is invisible to the naked eye.
This document discusses electrostatic discharge (ESD) protection in integrated circuits. It introduces ESD, outlines common ESD models like the human body model and machine model, and describes key ESD protection mechanisms such as avalanche breakdown and thermal breakdown in nMOS transistors. These protection mechanisms allow ESD protection devices to safely discharge static electricity through controlled conduction paths before thermal damage occurs.
Ionizers remove static from surfaces that cannot be grounded. There are two types: AC or Alternating Current and DC or Direct Current. This presentation proves pros and cons to each technology. For more information, contact Transforming Technologies.
The document discusses different types of ESD (electrostatic discharge) and EOS (electrical overstress) testing methods. It provides an overview of the Human Body Model (HBM), Machine Model (MM), and Charged Device Model (CDM) test methods, including their relevant standards, test procedures, waveforms, and device classification levels. It also discusses the history and evolution of these ESD test methods over time as standards have been developed and refined by organizations like ESDA, JEDEC, AEC, and others.
This document discusses electrostatic discharge and how to prevent damage to electrostatic sensitive devices. It notes that a small imbalance of electrons can cause ESD, which is enough voltage to damage components like RAM. Common ESD-sensitive devices include computer chips, cards, and LEDs. The document recommends using antistatic mats, wrist straps, and dissipative materials when handling electronics to prevent a buildup of static electricity that could damage components.
This document provides information about electrostatic discharge (ESD) and the need for ESD safe tools when working with electronic components. It defines static electricity and how small static charges below the threshold of human sensation can still damage electronic components. Semiconductor devices can be damaged by charges as low as 10 volts. The document discusses the types of ESD damage, including upset failures, direct catastrophic failures, and latent failures. It emphasizes that ESD damage may not be detectable through normal testing and compares ESD contamination to medical viruses or bacteria. The last part provides details about ESD safe precision screwdriver sets and individual drivers that meet the IEC 61340-5-1 standard for surface resistance.
Esd, factory issues, measurement methods & product quality –martinwuest
Electrostatic discharge (ESD) is an increasing cause of failures in electronic devices and needs to be addressed. ESD can occur at various stages of the electronics production process, especially when electrostatically sensitive devices are handled. Both manual workplaces and automated production machinery need optimization to minimize ESD. Current standards provide guidance but not strict requirements for ESD control systems. Measurement methods also need improvement to better assess ESD risks and ensure appropriate protections are in place throughout the electronics manufacturing process.
Electricity is the second leading cause of death in construction, accounting for over 600 deaths annually. Proper safety procedures and equipment are required to prevent electrical accidents and injuries. Key risks include contacting energized power lines or equipment, using defective tools or cords, and failing to follow lockout/tagout procedures to de-energize circuits before working. Proper grounding, GFCI protection, insulation, and avoiding overloads are vital for electrical safety.
Lista esd-user-handbook-esd rev2 ino de alexandresgonzal
This document provides instructions for properly grounding and maintaining electrostatic discharge (ESD) protected workstations. Key points include:
- Drill into worksurfaces to securely attach grounding studs which connect to the common ground point using ground cords.
- Isolate any electrical components from the worksurface using insulating pads to prevent unintended ground loops.
- Regularly test resistance to ground and isolation to ensure proper ESD protection is maintained.
- Follow standard practices like wearing wrist straps, avoiding sharp objects, and cleaning surfaces to preserve ESD properties.
ST on 96Boards OpenHours - System level ESD protection96Boards
These are the presentation slides that are linked to the 96Boards OpenHours episode #36. This episode can be found on YouTube here:
https://youtu.be/pgK_JRJtBzY
Please join us every week: www.96Boards.org/OpenHours
The document provides an overview of protection against overvoltages in photovoltaic installations according to European standards. It discusses the lightning and surge risks in PV installations, including direct lightning strikes, surge voltages from the AC network, nearby lightning strikes, and electromagnetic coupling. It reviews the European insurance statistics on damages and the evolution of relevant standards to address surge protection. The document outlines the general design for lightning and surge protection of PV installations according to European guidelines. It presents typical surge protection solutions for domestic and industrial PV installations.
Electrostatic discharge (ESD) is a spark or discharge caused by a buildup of static electricity. It can damage electronics like computer components. The document discusses ESD, how it occurs, common test models used to evaluate ESD thresholds, types of damage it can cause, and ways to prevent ESD such as proper grounding, neutralization, and using anti-static protective equipment and bags in work areas. It also lists components of a static safe workplace and names team members who contributed to the document.
The document discusses electrostatic discharge (ESD) standards for repair areas. It covers basic ESD concepts, hazards, and damaged samples. It outlines regulations for electrostatic materials, repair workbenches, tools, and environments. The repair workbench must use an anti-static mat connected to electronic ground. Repair engineers must wear anti-static protective clothing like aprons, footwear, wrist straps, gloves, and caps to isolate electrostatic charges produced by personal clothing and properly handle sensitive electronic components. Following these ESD precautions helps prevent costly damage to devices during repair.
The document discusses electrostatic discharge (ESD) and provides information on controlling ESD in electronics manufacturing environments. Some key points:
- ESD occurs when a charged object discharges to another object, which can damage electronic components. Static electricity builds up from friction and movement.
- ESD costs the electronics industry millions annually in damaged parts. Despite efforts, ESD still affects production yields and costs.
- Controlling ESD involves designing products to withstand ESD, reducing charge generation, grounding conductive materials to dissipate charges, and neutralizing charges that do occur.
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
In this seminar, we discuss the challenges designers will be facing over the next several years. Changes in technology will continue to put pressure on designers to provide adequate protection but often without good information or tools. Highlights of the following will be covered: The shrinking design window for CMOS integrated circuits; changes in component level ESD threshold targets and the lack of availability of component information; the implications of new packaging and interconnect technologies such as through silicon vias (TSV); design of system connection and user interfaces; the use and misuse of component level ESD information for system level protection and emerging methods for co-design; and the evolution of EOS/ESD testing methods and standards.
The document discusses electrostatic discharge and its risks. It explains that a static charge builds up from certain materials rubbing together, like clothes or one item against another. This charge can damage electronic components through sparks or discharges. Anyone working with electronics must wear a wristband and use a grounded mat to safely dissipate any static charge and prevent damage.
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
Many engineers are aware of some aspects of the importance of ESD as a threat to product yield, returns and malfunction. What is surprising is the breadth of its impact across a wide variety of products, technologies, services and markets. For instance, it has recently been determined that, for some technologies, many EOS (Electrical Overstress) failures have been misdiagnosed and were actually ESD. In this seminar we present a broad survey of the impacts including this EOS misdiagnosis issue. The best known effects, those on integrated circuits, will be discussed and the implications of the IC technology and packaging roadmaps will be discussed. We will also describe the effects on other areas including MEMS, flat panel displays, phototools, manufacturing equipment, hand-held devices and operating systems. In each case we will describe how ESD caused failure or malfunction. Where available, industry-wide data will be summarized. Newly realized ESD failure mechanisms such as Charged-Board Events (CBE), Cable Discharge Events (CDE) and transient-induced latch-up will also be discussed.
This document discusses electrostatic discharge (ESD) and ESD control. It explains that ESD occurs when electrically charged objects discharge, which can damage electronic components. Common sources of ESD include walking on carpets and unwrapping tapes. While a discharge of 3,000 volts or more can be felt, far less voltage of only 100 volts can damage electronics. The document outlines the basics of ESD control, which includes grounding conductors like people with wrist straps, shielding ESD sensitive items, and neutralizing insulators with ionizers. Proper ESD control and training of personnel are needed to prevent the costly latent damage caused by ESD that is invisible to the naked eye.
This document discusses electrostatic discharge (ESD) protection in integrated circuits. It introduces ESD, outlines common ESD models like the human body model and machine model, and describes key ESD protection mechanisms such as avalanche breakdown and thermal breakdown in nMOS transistors. These protection mechanisms allow ESD protection devices to safely discharge static electricity through controlled conduction paths before thermal damage occurs.
Ionizers remove static from surfaces that cannot be grounded. There are two types: AC or Alternating Current and DC or Direct Current. This presentation proves pros and cons to each technology. For more information, contact Transforming Technologies.
The document discusses different types of ESD (electrostatic discharge) and EOS (electrical overstress) testing methods. It provides an overview of the Human Body Model (HBM), Machine Model (MM), and Charged Device Model (CDM) test methods, including their relevant standards, test procedures, waveforms, and device classification levels. It also discusses the history and evolution of these ESD test methods over time as standards have been developed and refined by organizations like ESDA, JEDEC, AEC, and others.
This document discusses electrostatic discharge and how to prevent damage to electrostatic sensitive devices. It notes that a small imbalance of electrons can cause ESD, which is enough voltage to damage components like RAM. Common ESD-sensitive devices include computer chips, cards, and LEDs. The document recommends using antistatic mats, wrist straps, and dissipative materials when handling electronics to prevent a buildup of static electricity that could damage components.
This document provides information about electrostatic discharge (ESD) and the need for ESD safe tools when working with electronic components. It defines static electricity and how small static charges below the threshold of human sensation can still damage electronic components. Semiconductor devices can be damaged by charges as low as 10 volts. The document discusses the types of ESD damage, including upset failures, direct catastrophic failures, and latent failures. It emphasizes that ESD damage may not be detectable through normal testing and compares ESD contamination to medical viruses or bacteria. The last part provides details about ESD safe precision screwdriver sets and individual drivers that meet the IEC 61340-5-1 standard for surface resistance.
Esd, factory issues, measurement methods & product quality –martinwuest
Electrostatic discharge (ESD) is an increasing cause of failures in electronic devices and needs to be addressed. ESD can occur at various stages of the electronics production process, especially when electrostatically sensitive devices are handled. Both manual workplaces and automated production machinery need optimization to minimize ESD. Current standards provide guidance but not strict requirements for ESD control systems. Measurement methods also need improvement to better assess ESD risks and ensure appropriate protections are in place throughout the electronics manufacturing process.
Electricity is the second leading cause of death in construction, accounting for over 600 deaths annually. Proper safety procedures and equipment are required to prevent electrical accidents and injuries. Key risks include contacting energized power lines or equipment, using defective tools or cords, and failing to follow lockout/tagout procedures to de-energize circuits before working. Proper grounding, GFCI protection, insulation, and avoiding overloads are vital for electrical safety.
Lista esd-user-handbook-esd rev2 ino de alexandresgonzal
This document provides instructions for properly grounding and maintaining electrostatic discharge (ESD) protected workstations. Key points include:
- Drill into worksurfaces to securely attach grounding studs which connect to the common ground point using ground cords.
- Isolate any electrical components from the worksurface using insulating pads to prevent unintended ground loops.
- Regularly test resistance to ground and isolation to ensure proper ESD protection is maintained.
- Follow standard practices like wearing wrist straps, avoiding sharp objects, and cleaning surfaces to preserve ESD properties.
ST on 96Boards OpenHours - System level ESD protection96Boards
These are the presentation slides that are linked to the 96Boards OpenHours episode #36. This episode can be found on YouTube here:
https://youtu.be/pgK_JRJtBzY
Please join us every week: www.96Boards.org/OpenHours
The document provides an overview of protection against overvoltages in photovoltaic installations according to European standards. It discusses the lightning and surge risks in PV installations, including direct lightning strikes, surge voltages from the AC network, nearby lightning strikes, and electromagnetic coupling. It reviews the European insurance statistics on damages and the evolution of relevant standards to address surge protection. The document outlines the general design for lightning and surge protection of PV installations according to European guidelines. It presents typical surge protection solutions for domestic and industrial PV installations.
The document describes the ABB UNO-DM-6.0-TL-PLUS single-phase solar inverter. It is a 6 kW inverter that features high power density in a compact design, easy installation and commissioning, and smart monitoring capabilities. It allows remote monitoring and control through wireless connectivity.
The document describes ABB's UNO-DM-PLUS string inverters for residential solar installations ranging from 1.2 to 5 kW. The inverters feature easy plug-and-play installation, wireless monitoring capabilities, dynamic feed-in control, and future-proof connectivity for smart integration. They offer high efficiency, a compact design that fits multiple power ratings, and remote firmware upgrades.
Low voltage circuit breakers & contactors general leaflet lsmaianhbao_6519
1) The document provides information on LS Industrial Systems' electric products including miniature circuit breakers, residual current circuit breakers, and surge protective devices.
2) The miniature circuit breakers and residual current circuit breakers come in various pole configurations and rated currents, and provide overload and short circuit protection.
3) The surge protective devices include DIN-rail mounted and box type models for single and three phase systems, and provide protection from surge overvoltages with response times less than 5 nanoseconds.
The document summarizes specifications for the Aurora Trio 10.0 kW and 12.5 kW three-phase string inverters. It has two independent MPPTs, high maximum efficiency of 97.8%, and wide operating voltage and frequency ranges to optimize energy harvesting. It is designed for outdoor commercial use and includes an electrolyte-free power converter, three-phase bridge topology, and optional integrated DC switch for increased reliability.
The AZ25A20DDC is a PWM servo drive designed to drive DC motors from 40-175VDC power supplies. It can provide up to 25A of peak current and 12.5A of continuous current. The drive integrates directly onto PCBs and includes protections for overvoltage, undervoltage, overcurrent, and short circuits. It interfaces with digital controllers using PWM and direction inputs.
This document provides information on the ABB TRIO-20.0/27.6-TL-OUTD string inverters. The inverters come in 20-27.6 kW sizes, have up to 98.2% efficiency, include two maximum power point tracking inputs, wide input voltage ranges, and options for integrated string combiners, disconnect switches, and surge protection. They are designed for commercial solar installations and flexible to accommodate varying array aspects and orientations.
The latest in ABB’s TRIO range, this new-look three-phase inverter fills a specific niche in the commercial solar market. This new three-phase inverter benefits from the three-phase inverter technology perfected in the PVI-10.0 and 12.5, probably the world’s most commonly used three-phase inverter which has led the way in best-in-class efficiency.
Controlling more PV panels than its smaller predecessor, the TRIO-27.6 and TRIO-20.0 will offer more flexibility and control to installers who have large installations with varying aspects or orientations. This device has two independent MPPTs and efficiency ratings of up to 98.3%. The very wide input voltage range makes the inverter suitable to installations with reduced string size.
The new look inverter has new features including a special built-in heat sink compartment and front panel display system. The unit is free of electrolytic capacitors, leading to a longer product lifetime.
NOTE: If installing a PV system using TRIO in North America, please verify that the selected PV module is listed for use in 1000Vdc systems in accordance with local electrical codes.
The AZ10A20DDC is a PWM servo drive designed to drive DC motors. It has a peak current of 10A, continuous current of 6A, and operates on a supply voltage of 40-175VDC. The drive provides protection against overvoltage, undervoltage, overcurrent and other faults. It interfaces with digital controllers using PWM and direction inputs.
The AZ25A20 is a PWM servo drive designed to drive brush-type DC motors at high switching frequencies. It has a peak current of 25A, continuous current of 12.5A, and operates on a supply voltage of 40-175VDC. The drive is compact, lightweight, and designed for direct integration into PCBs. It provides overvoltage, undervoltage, overcurrent, and overheating protection.
The PVS-100/120-TL is ABB's three-phase string inverter solution for decentralized photovoltaic systems with power ratings up to 120 kW. It has six independent MPPTs, a compact size, integrated DC/AC disconnection and surge protection, and horizontal or vertical mounting options. Standard wireless connectivity and mobile apps make configuration and monitoring easy.
The document discusses a high-end multi-functional electronic load called the Load Station Series (300W/1000W). It has several key features:
1) It can precisely set current waveforms on a color LCD and has dynamic, sequence, and sweep modes for testing.
2) It has a high-speed current control technology that eliminates overshoot and delivers a smooth current transition.
3) Unlike conventional loads, it acts as a resistive load from 0V so there is no delay between current and voltage, allowing it to test low-voltage devices.
4) It has options like a ripple and noise measurement module, can be remotely controlled, and its units can be connected in
This document summarizes the features of the KG Load Station Series 300W/1000W electronic loads. It has a revolutionary UI like an oscilloscope for easy operation. It realizes less 35% weight than previous models. It can operate just like a resistor with no minimum voltage requirement. It has high speed current control and 4 models from 300W to 1000W in 125V and 500V ranges.
The document discusses a high-end multi-functional electronic load called the Load Station Series (300W/1000W). It has several key features:
1) It can precisely set current waveforms on a color LCD and has a revolutionary oscilloscope-like user interface for ease of operation.
2) It has high-speed current control technology that eliminates overshoot and delivers an ideal current shape.
3) It offers flexible operation modes including constant current, constant resistance, constant power, constant voltage, external control, and sequence mode. Accessories like a ripple and noise measurement module are also available.
4) The lightweight and compact design incorporates a large LCD, memory functions, multi-
Ls catalog thiet bi tu dong dpr e_dienhathe.vnDien Ha The
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The document provides information on surge protection devices (SPDs) for protecting electrical equipment from overvoltage transients. It discusses the causes of transients from lightning strikes and power switching. SPDs are divided into Type 1, 2 and 3 depending on their protection level and location in the electrical system. The document provides specifications for various SPD modules with different voltage ratings that can be used as replacement parts.
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Tài Liệu Khoa Học Kỹ Thuật: http://tailieukythuat.info
Thiết bị Điện Công Nghiệp - Điện Hạ Thế: http://dienhathe.vn
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4. EMC Immunity Example
Discovery Kit: STM32MP157A-DK1
USB Type-C Power Delivery
ESDA7P120-1U1M, ESDA25L
CC1, CC2VBUS
AUDIO
ESDA6V1BC6: 4-line ESD protection
OUTA, OUTB, MIC IN
USB HOST x2 (Dual USB Type-A)
ESDA7P120-1U1M (x2), ECMF02-2AMX6 (x2)
VBUS DP, DM
USB Type-C DRP (Source Only)
ESDA7P120-1U1M, ESDA25L, ECMF02-2AMX6
CC1, CC2VBUS
USB HOST x2 (Dual USB Type-A)
ESDA7P120-1U1M (x2), ECMF02-2AMX6 (x2)
VBUS DP, DM
DP, DM
HDMI
ECMF04-4HSWM10 (x2), ESDALC6V1-5M6
CEC, I2C, HPDTMDS datalines
MORPHO CONNECTOR
ESDA7P120-1U1M
5V Vin
USER BUTTONS
ESDALC6V1-1U2
MICRO SD CARD
HSP051-4M10 (x2)
SDMMC dataline
ST-LINK USB CONNECTOR
USBLC6-2P6
ETHERNET
HSP053-4M5
DP, DM, VBUS
4
5. AGENDA
• ESD Protection at System Level
• How to select an ESD protection device?
• ESD Layout Guidelines
• Application Examples
5
8. ESD Damages to ICs
White Paper on Electrical Overstress - EOS Industry Council on ESD Target Levels
In preparation for this white paper, the Industry Council conducted a worldwide survey of the electronics industry concerning EOS. Results
confirmed the long held view that EOS is consistently one of the “high bars” on product failure Pareto charts. Looking at the EOS survey,
respondents reported greater than 20% of total failures being EOS-related or 30% of total electrical failures being EOS-related, making
EOS the largest bar on the Pareto chart of that responder’s known causes of returns.
Source:https://pdfs.semanticscholar.org/235b/0bfd01dd5f0c6c2c99df3b93bc27f56a9cfd.pdf
“30% of total electrical failure is EOS -related”
Silicon melting Hole in the oxide Melting Flash
Source: STMicroelectronics
8
9. ESD Sensitivity is Increasing
Vdd = power supply voltage
VBD = breakdown voltage
V
2V
8V
9
10. ESD and EOS Standards
ESD and EOS standards
ESD
Electro-Static Discharge
EOS
Electrical Over
Stress
Component level
to ensure manufacturability
System level
to assure
robustness
HBM
Human Body
Model
CDM
Charged Device
model
MM
Machine Model
ISO7637
ISO16750
IEC 61000-4-2
ISO10605 (auto)
Final user simulation
System robustness for end users. Uncontrolled environment.These standards have low-level surges as factories are well-controlled environments.
System level
to simulate car
behavior
10
11. Energy for 8kV IEC 61000-4-2
Energy for 8kV HBM
Energy for 2kV HBM
HV
supply
R(MΩ) 1500Ω
DUT
100pF
Human Body Model for IC
(+/-2kV for most of IC)
HV
supply
R(MΩ) 330Ω
DUT
150pF
IEC 61000-4-2 for system
(+/-8kV for level 4)
HBM and IEC Standards 11
Difference in standards : IEC 61000-4-2 carries more energy than HBM
12. Silicon die area for
component level ESD
(2 kV HBM)
Silicon die area for
system level ESD
(8 kV IEC contact)
Component Level vs System Level
Silicon Die Area Comparison
12
13. System-level ESD protection standard
IEC 61000-4-2 test bench
Contact discharge Air discharge
Stress Level
Test Voltage (kV) Test Voltage (kV) Number of
dischargeq
1 2 4 At least 10 single
discharges at 1 Hz
in the most
sensitive polarity
2 4 6
3 6 8
4 8 15
System state as a result of system–level ESD stress
A Normal performance
B
Temporary loss of function or degradation of performance which
cease after the disturbance ceases. The DUT recover its normal
performance , without operator intervention
C Temporary loss of function or degradation of performance , the
correction of which requires operator intervention
D loss of function or degradation of performance, no recovery possible
Self-restored
Require a system reset
13
14. ESD in Automotive: ISO10605
Configuration Mode
Component
acessible
from:
Test
(A= Air
C= contact)
Capacitance Resistance
Max test
voltage
Operating
conditions
Min
number
of
dischar
ges
Min. time
interval
Max
suggested
severity
levels
(ISO10605
Annex C)
Component Direct Inside A & C 330 pF 330 ohm - Powered 3 1s
15 kV C
25kV A
Component Direct Outside A & C 150 pF 330 ohm - Powered 3 1s
15 kV C
25kV A
Component Indirect Inside C 330 pF 330 ohm - Powered 50 50ms 20kV C
Component Indirect Outside C 150 pF 330 ohm - Powered 50 1s 20kV C
Component
packaging and
handling
Direct NA A & C 150 pF 330 or 2000 ohm - Unpowered 3 1s
Vehicle test Direct Inside A & C 330 pF 330 or 2000 ohm 15 kV
Engine drive or
idle
3 1s
8kV C
15kV A
Vehicle test Direct Outside A & C 150 pF 330 or 2000 ohm 25 kV
Engine drive or
idle
3 1s
8kV C
25kV A
14
16. Key Parameters
Parameters Description
VRM Stand-off voltage (normal condition voltage)
IRM Leakage current
VBR Breakdown voltage (voltage when the ESD protection starts working)
VCL Clamping voltage (maximum voltage accross the ESD protection)
IPP Peak Pulse Current (maximum current in the ESD protection)
C Line capacitance (impacts signal integrity)
16
17. Protection Selection
Key Parameter : Voltage
VBR
Isurge
VF
Ipp
V
No TVS
protection
Failure
VCL
t
VRM
V
Uni-directional
I
With TVS
protection
17
18. • Mandatory for audio and RF signals
Bi-directional
VBR
Isurge
Ipp
V
Failure
VCL
t
VRM
V
I
No TVS
protection
With TVS
protection
Key Parameters
Voltage Polarity
18
19. Time domain Frequency domain
Key Parameters
Capacitance Value
• Example of the impact of parasitic capacitance on high-speed signal
simulated with discrete capacitance
19
Fc =
1
π tr
fc
240 MHz
S21 (dB)V
21. Impact on Data-lines
Eye Diagram Integrity
• USB 3.1 Gen2 mask at 10.0 Gbps per channel
(Type-C connector, reference cable, EQ with DC=6dB and DFE)
21
Line without HSP053-4M5 Line with HSP053-4M5
22. Impact on Data-lines
Time Domain Reflectometer Impedance
TDR with 200ps pule rise time impedance of
100Ω line without / with HSP053-4M5
ZLOAD
Step
generator
50Ω
Z0
Transmission Line
Oscilloscope Mainframe
Sampler
ZLOAD
Step
generator
50Ω
Z0
Transmission Line
Oscilloscope Mainframe
Sampler
Step
generator
50Ω
Z0
Transmission Line
Oscilloscope Mainframe
Sampler
HDMI 2.0b TDR specification : 100Ω ±15Ω
Incident step Reflected step
TDR voltage
22
23. Impact on RF-signal
S21 Attenuation
• ESDARF02-1BU2CK S21
• 30 GHz at -3 dB
• 8 GHz at -0.5 dB
• Negligible impact major frequencies for telecom
• FM radio : 87.5 MHz - 108.0 MHz
• Numerical TV : 400 MHz – 900 MHz
• Cellular phones : 700 MHz … 4.7 GHz
• GNSS : 1.6 GHz
• Bluetooth : 2.4 GHz
• Sub-GHz industrial : 400 MHz … 1.1GHz
• WiFi : 2.4 / 5.0 GHz
10M 100M 1G 10G 100G
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
ESDARF02-1BU2CK
APLAC 8.21 User: F:Cust# 8463:STMicroelectronics Tours SAS:National Instruments
f/Hz
ESDARF02-1BU2C
23
25. ESD Protection
Transmission Line Pulse*
• IEC 61000-4-2 8 kV 30 ns clamping voltage ↔ TLP* 16 A 100 ns 70 - 90% voltage
Injected current :
16A – 100ns square current
Measured voltage on 70% – 90% windows
on ESD051-1BF4 : 10.5V
*ANSI / ESD STM5.5.1-2014
25
26. ESD Protection
Transmission Line Pulse* I/V Curve
• I/V TLP* curve is done with several pulses
*ANSI / ESD STM5.5.1-2014
ESD051-1BF4 TLP* I/V curve
26
27. System-Efficient ESD
Design Methodology
• TLP input current shared between high performance MCU FT input and ESDA5-1BF4
• High performance MCU + ESDA5-1BF4 robustness reach more than 8kV IEC 61000-4-2
• Even if, ESD5-1BF4 clamping voltage > High Performance MCU FT input AMR
• ESD051-1BF4
• 11V clamping voltage at +8kV ESD 61000-4-2
• High Performance MCU FT input
• 3.6 V max operating
• 2 kV HBM ESD
• 250 V CMD ESD
• 5.5 V AMR
MCU working voltage : 3.3V
MCU destruction voltage : 12.5V
27
28. Snap-back Protections
System Integration
• Snap-back protection (ESDZV5-1BF4) clamping voltage lower than
standard protection (ESD051-1BF4) clamping voltage
• Protected line DC voltage MUST be lower
than holding voltage
• To avoid protection latch-up
i.e. continuous leakage current flowing into the protection
ESDZV5-1BF4
holding voltage
ESDZV5-1BF4
turn-on voltage
28
29. Recap
Basics of ESD Protection
• Transparency :
• Capacitance must be in-line with application bandwidth / data rate
• Efficiency :
• VRM must be slightly higher than maximum line voltage
To obtain a low clamping voltage
• System integration of snap-back protection :
• Holding voltage must be higher than DC voltage
10M 100M 1G 10G 100G
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
ESDARF02-1BU2CK
APLAC 8.21 User: F:Cust# 8463:STMicroelectronics Tours SAS:National Instruments
f/Hz
ESDARF02-1BU2C
AN5241, Fundamentals of ESD protection at system level
29
31. ESD Robustness
PCB Layout Impact
• PCB Tracks must be under control !
• For protection device length
connection of ~1cm from side to
side, 35µm copper, 0.5mm wide
(microstrip)
• 2 x L = 5 nH !
31
Vcc
Vias to
GND plane
L
L
=
=
ICtoprotect
Vias to
GND plane
32. ESD Robustness
PCB Layout Impact
dt
di
L
V
Vic
Assuming that lines inductance
is L = 5nH
di/dt = 37.5 A / ns
Vic= V + 2 x L x di/dt
Vic= V + 375 V
ESD surge is
8 kV /0.8 ns rise time, this
makes 37.5 A/nsdt
di
L
ESD
ICtoprotect
Vias to
GND plane
Vcc
Vias to
GND plane
32
33. ESD Robustness
PCB Layout Recommendation
Vias to GND plane as close as possible to the product GND
ICtoprotect
Vias to
GND plane
Vcc
ESD
33
34. PCB Layout recommendations in Application note AN1751
Vcc
ICtoprotect
Vic
In this case, Vic ≤ V
In addition, ESD
protection must be placed
as close as possible to the
ESD source, to avoid any
coupling between tracks
on the PCB.
ESD robustness
PCB layout recommendation
V
Vias to
GND plane
ESD
34
36. Protections and Filters Around MCUs 36
ECMF04-4HSWM10
High Speed Differential
MIPI, USB 3.1, Display port, HDMI
ESDALC6V1W5
ESDA6V1BC6
SPT01-335DEE
HSP051-4M10
ETH 1G, secondary
ESDA7P120-1U1M
USBLC6-2SC6
TCPP01-M12
Type-C Port Protection
EMIF06-MSD02N16
SD 2.0
EMIF03-SIM02M8 ESDA5V3LDSILC6-4P6 (TAG) SMA6F
ESDA14V2BP6
RS-232
SMAJ40CA
CLT03-2Q3PLC inputs
37. USB 2.0 Full Speed
Without OTG
SOD323-6L
Compliant with USB 2.0 eye diagram
ESD robustness: + 15 kV contact discharge IEC61000-4-2
USBLC6-2SC6
Reuse gerber file
STM32L4R9I-EVAL
DESIGN TIP:
Place the ESD protection close to ESD
source: here close to USB connector
37
38. RS-232
Reuse gerber file
STM32L4R9I-EVAL
Low capacitance, 4-line, bi-directional ESD protection
ESD protection as per IEC61000-4-2 Level 4: + 8kV contact
ESDA14V2BP6
SOT666-6L
DESIGN TIP:
Place the ESD protection close to ESD source:
here close to RS-232 connector
38
39. USER BUTTON
GPIO Input
SOT23-3L
PCB space saving: 2 diodes array
ESD robustness: + 30 kV contact discharge IEC61000-4-2
ESDA5V3L
Reuse gerber file
STM32L4R9I-EVAL
Design note:
Although buttons are not
made of conductive
materials, they are highly
sensitive to ESD air
discharge used during
IEC certification tests
39
40. ESD protections in STM32MP1 40
USB Type-C Power Delivery
ESDA7P120-1U1M, ESDA25L
CC1, CC2VBUS
AUDIO
ESDA6V1BC6: 4-line ESD protection
OUTA, OUTB, MIC IN
USB HOST x2 (Dual USB Type-A)
ESDA7P120-1U1M (x2), ECMF02-2AMX6 (x2)
VBUS DP, DM
USB Type-C DRP (Source Only)
ESDA7P120-1U1M, ESDA25L, ECMF02-2AMX6
CC1, CC2VBUS
USB HOST x2 (Dual USB Type-A)
ESDA7P120-1U1M (x2), ECMF02-2AMX6 (x2)
VBUS DP, DM
DP, DM
HDMI
ECMF04-4HSWM10 (x2), ESDALC6V1-5M6
CEC, I2C, HPDTMDS datalines
MORPHO CONNECTOR
ESDA7P120-1U1M
5V Vin
USER BUTTONS
ESDALC6V1-1U2
MICRO SD CARD
HSP051-4M10 (x2)
SDMMC dataline
ST-LINK USB CONNECTOR
USBLC6-2P6
ETHERNET
HSP053-4M5
DP, DM, VBUS
41. Any Electronic Board Must be Protected
3D-printer Control Board
41
• Protections on the application PCB
• Power lines → surge protection : IEC
61000-4-5
• Connector
• Button
• SD card
• Integrated on all IC’s → ESD protection
for manufacturing is JEDEC HBM
SMAJ12A
SMBJ24A
EMIF06-MSD02N16
3x USBLC6-2SC6
ESDA5V3L
ESD protection for
system : IEC 61000-4-2
42. Resources
Application Notes and Video
• AN5241, Fundamentals of ESD protection at system level
• AN4871, USB Type-C protection and filtering
• AN5121, HDMI ESD protection and signal conditioning products for STBs
• AN3353, IEC 61000-4-2 standard testing
• AN2689, Protection of automotive electronics from electrical hazards,
guidelines for design and component selection
• AN1826, TRANSIENT PROTECTION SOLUTIONS: Transil™ diode versus
Varistor
• AN5241 : Fundamentals of ESD Protection
• Video - ESD Protection: why and how to protect microcontrollers efficiently
42
43. ST Protection Finder Mobile App
• ST-PROTECTION-FINDER is an application available for
Android™ and iOS™ that allows you to explore ST’s TVS
product portfolio.
• Parametric or series search engine
• Efficient part number search engine
43
44. 4 Steps to Discover ST’s Portfolio
1
OPEN
application
2
SELECT
parameter
3
CHOOSE
product
44
4
GET
datasheet