2. ESD
• Electrostatic Sensitive Devices (ESD) are
electronic components and other parts that are
prone to damage from stray electric charge.
• Extensive (and permanent) damage to static
sensitive devices can result from mishandling and
inappropriate methods of storage and
transportation.
3. STATIC ELECTRICITY
• When two dissimilar, initially uncharged non-
conducting materials are rubbed together, the friction
is responsible in transferring charge from one material
to.
• The process of electron transfer known as
'triboelectric charging'.
• The amount of charge depends on factors like the rate
of separation, humidity etc.
4. POSITIVE TRIBOELECTRIC
The following materials give up electrons and become positive when charged when
rubbed against other materials:
• Air (most positive)
• Dry human skin
• Leather
• Rabbit fur
• Glass
•Human hair
• Nylon
• Wool
•Lead
•Cat fur
• Silk
• Aluminium
• Paper (least positive).
5. NEGATIVE TRIBOELECTRIC
The following materials tend to attract electrons when rubbed against other materials
and become negative when charged:
• Wood (least negative)
• Amber
• Hard rubber
• Nickel, copper, brass & silver
• Gold and platinum
• Polyester
• Polystyrene
• Saran
• Polyurethane
• Polyethylene
• Polypropylene
• Polyvinylchloride (PVC)
• Silicon • Teflon (most negative)
7. CAUSES ESD
• Electrostatic discharge from a human body
• charged material to the ESDS device.
• Electrostatic discharge from the device
• Field induced discharges
10. HANDLING ESD EQUIPMENT
• Placards installed on the ESD LRU
• The ESD printed circuit boards are identified with a
static sensitive placard.
• Contaminated or unwanted material should be kept
clear of the sensitive devices.
• Connect the wrist strap into the Electrostatic Ground
Jack of the card file or recognised aircraft ESD ground
point.
• LRU or circuit boards are to be placed in the correct
conductive bag or container which must display an ESD
label.
11. TRANSPORTING ESD EQUIPMENT
1. Use of wrist straps which must be worn when handling ESD
2. Use a heel strap
3. Use of static dissipative floor and bench mats.
4. Avoidance of very dry environments
5. Availability of ground jacks
6. Use of grounded test equipment
7. Use of low-voltage soldering equipment and anti-static
soldering stations
8. Use of anti-static insertion and removal tools for integrated
circuits.
9. Avoidance of nearby high-voltage sources
10.Use of anti-static packaging