High Performance SSD Memory Application with Compressible TIM- Based On Phase Change Technology

Vendor Workshop
SEMI-THERM 2016
March 16th, 2016

High Performance SSD Memory Application
utilizing compressible TIM
based on Phase Change Technology
Stewart Dunlap - Micron
&
Chris Lee, Hyo Xi, Linda Shen – Honeywell

© 2015 by Honeywell International Inc. All rights reserved.
Additional Disclaimers As Needed (Consult Legal)
OUTLINE
1.  Thermal Trends
2.  Compressible TIM Overview
3.  PCM Technology
4.  Application and Methods
5.  Results & Summary

INDUSTRY TREND: ACCELERATING POWER DENSITIES
•  Greater Functionality
•  Increase Power consumption
•  Device / Package shrink
•  Higher Power densities
•  Greater density board layout
•  Increasing Device Temperatures
Rising Power densities drives greater thermal needs
TIM Thermal Management
-  Lower Thermal Impedance
-  Harsher Test Conditions
-  Increased Thermal Stability and
Reliability
Server and Telecom
ASIC Power in
Networking Applications
Heat Load

SATA II
(2010-2011)
•  ONFI 2.0
•  Toggle 1.0
25nm Class
•  NAND Flash
SATA III
(2012-2013)
•  ONFI 2.0
•  Toggle 1.0
20nm Class
•  NAND Flash
PCIe G2
(2014-2015)
•  ONFI 3.0
•  Toggle 2.0
1xnm Class
•  NAND Flash
PCIe G3
(2016-2017)
•  ONFI 4.0
•  Toggle 3.0
15/16mm Class/
3D
•  NAND Flash
SSD Technology Trends
New Technology Drives High Thermal Needs
5
Faster,
Stable
Read /
Writing
Speed
Higher
Packagin
g Density
NAND tech node development
Higher
Storage
Volume
2Dà2.5Dà3D (TSV, V-NAND. 3D X-point,etc.)

TIM CONFIGURATIONS
Dedicated Heat Sink
•  Power Levels >50W
•  TIM 1 and TIM 2 for each device
•  THIN Bond line <50um
•  Thermal Impedance <0.1 cm2-C/W
•  Key Needs: Thin Bond Lines and Low
thermal ImpedanceIC
TIM 2
substrate
PC board
TIM 1
PC board
TIM 1.5
Heat Spreader
Shared Heat Spreader
•  Power Levels <50W
•  THICK Bond line 0.5 – 3 mm
•  One TIM type across several devices
•  Thermal Impedance >0.1 cm2-C/W
•  Key Needs: high compliance and
compression properties to support
multiple thicknesses
DEDICATED
Heat Sink
SHARED
Heat Sink/Spreader
Heat Sink
Compressible TIM

COMPRESSIBLE TIM EXAMPLES
7
All NAND and
Controllers
Require TIM

Lower Contact Resistance and Impedance is critical to Thermal Performance
THERMAL PATH
•  TIM: 3 Thermal Paths of Resistance
1.  Contact Resistance @ Device/TIM
2.  Thermal Path of TIM
3.  Contact Resistance @ TIM/Heat Sink Interface
•  Compressible TIM thick bond lines
-  High Thermal Conductivity >3 W/mK
-  Critical path is low contact resistance at the interfaces
•  Thermal Impedance is key
Heat Sink
Thermal Path
of TIM
IC DevicePC board
SHARED
Heat Sink/Spreader 0.5 mm3.0 mm
RTIM =
Contact Resistance at Interface
Rc1
Rc2
BLTKTIM
BLT
TIM Thermal Impedance:
TIT = BLT/K + RC
TIT = Total Thermal Impedance
BLT = Bond Line Thickness of TIM
K = Bulk Thermal Conductivity of TIM
RC = Thermal Contact Resistance at the Interfaces
Contact Resistance at Interface
heat origin

© 2015 by Honeywell International Inc. All rights reserved . PMT STRAP 2016-2020
Thermal Conductivity is only one measure
THERMAL CONDUCTIVITY AND THERMAL
IMPEDANCE
•  Low Contact Resistance
•  Lower Thermal
Impedance
•  Thick Bond lines
ASTM D5470
1 mm bond line
3.00
3.00
3.50
4.00
4.00
2.84
2.09
0.30
0.00
1.00
2.00
3.00
4.00
5.00
6.00
0.00
1.00
2.00
3.00
4.00
5.00
6.00
Gap Pad Putty Gel HON Compresible
PCM
ThermalImpedance(C-cm2/W)
ThermalConductivity(W/m-K)
Compressible Materials vs.
Thermal Conductivity &Thermal Impedance
Thermal Conductivity Thermal Impedance

Viscosity
Melt temp
Solid Liquid/gel state
• Optimal Surface wetting
• Low Contact Resistance
• Low Thermal Impedance
Temperature !
45 °C
Theoretical Curve: PCM Viscosity vs. Temperature

© 2015 by Honeywell International Inc. All rights reserved . PMT STRAP 2016-2020
PCM Polymer Structure Enables
PCM TECHNOLOGY
PCM: Long Chain Si-O-Si structure
“Less Rigid
Structure”
PCM: C-C-C with H
steric hindrance
“Rigid Structure”
steric hindrance
•  High molecular weight
•  Stable and consistent filler-polymer Matrix
•  Minimizes filler migration and separation
•  Increase Reliability Performance

12
Honeywell
PCM
Initial 1000 cycles
Silicone
Grease
Thermal Cycling Test Condition:
•  -55°Cx10min + 125°Cx10 min, for 500 to 1000 cycles
•  Sandwich PCM & grease between aluminum and glass plates set at 200µm gap
•  TI Test : ASTM D5470
Thermal Cycle (-55 °C to 125 °C)
vs. Grease
HEM PCM vs. Silicone Grease
Grease breaks down Grease TI degrades
Silicone Grease
Honeywell PCM
PCM Stable Polymer Structure with No Pump-Out Issue

0.00
0.20
0.40
0.60
0.80
1.00
1.20
0 200 400 600 800 1000
ThermalImpedance(°C-cm2/W)
Hours
High Temperature Bake at 150 °C
TI vs. Hours of exposure
PTM3180
Grease A
Grease B
PCM THERMAL RELIABILITY
Test Condition: 150°C continuous baking
Test Method: Laser Flash, ASTM E1461
Significantly better reliability than leading competitors
PTM5000

0.12
0.09
0.52
0.11 0.09 0.09 0.09 0.11
0.00
0.10
0.20
0.30
0.40
0.50
0.60
AC 96hrs 120hrs 192hrs 240hrs
PTM3180 Avg PTM6000 Avg
TI/('C.cm2/W)
ENHANCED RELIABILITY
150’C HTS: TI vs. Hrs
HAST: TI vs. Hrs
Sample Size = 4
Sample Size = 12
PTM5000 Avg
0.00
0.10
0.20
0.30
0.40
0.50
0.60
T0 600x 1000x 2000x 2400x 3200x 4000x 4400xTI(℃.cm2/W)
PTM6000 Stdev PTM6000 Avg
Sample Size = 8
T/C-B (-55~+125’C): TI vs. Hrs
0.12
0.09 0.09 0.09 0.09 0.09
0.22
0.11
0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08 0.08
0.11
0.00
0.05
0.10
0.15
0.20
0.25
TI (AC) 200hr 400hr 600hr 800hr 1000hr 1300hr 1500hr 1800hr 2000hr 2200hr 2400hr 2600hr 2800hr 3000hr 3200hr
PTM3180 Stdev PTM6000 Stdev PTM3180 Avg PTM6000 Avg
TI/('C.cm2/W)
PTM5000 Stdev PTM5000 Avg
New PCM formulation demonstrate significantly improved reliability

PCM delivers High Compressibility & Thermal Performance
COMPRESSIBLE PCM
•  Phase Change Based
•  Molecular Weight & polymer
formulation enables compressibility
•  Low Thermal Impedance < 0.12 C-
cm2/W
Compressibility TCM11 TCM12
30% 10psi 7psi
40% 14psi 8psi
50% 19psi 10psi
70% 49psi 21psi
0
10
20
30
40
50
60
70
-10% 0% 10% 20% 30% 40% 50% 60% 70%
Stress(psi)
Strain(%)
Compression-Deflection of TCM vs Gap Pad
TCM11 TCM12 Gap Pad A
ASTM D575 1in2 sq ;2mm thickness;0.25mm/min test speed
4.0
3.3
0.12 0.15
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
0.0
1.0
2.0
3.0
4.0
5.0
6.0
HON Compresible
TCM11
HON Compresible
TCM12
ThermalImpedance(C-cm2/W)
ThermalConductivity(W/m-K)
Compressible PCM
Thermal Conductivity Thermal Impedance
ASTM D5470
0.05 mm bond line

Phase Change Polymer Structure enables thermal stability
COMPRESSIBLE RELIABILITY
16
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
TI(AC)
200hrs
400hrs
600hrs
800hrs
1000hrs
TI(AC)
200hrs
400hrs
600hrs
800hrs
1000hrs
TCM11 TCM12
TI('Ccm2/W)
HTB-150◦C Baking 1000hrs
ASTM E1461
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
TI
(AC)
200x 400x 600x 800x 1000x TI
(AC)
200x 400x 600x 800x 1000x
TCM11 TCM12
TI('Ccm2/W)
Temp Cycle Condition B
(-55◦C-125◦C, 1000 cycles)
ASTM E1461

©2014 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS”
basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
17
|

©2014
Micron
Technology,
Inc.

|

Micron
Conﬁden:al

Applica:on:
Micron
PCie
SSD

17

18
|

©2014
Micron
Technology,
Inc.

|

Micron
Conﬁden:al

Mechanical
Stress
Tes:ng
(MST)

Mechanical
stress
tes:ng
is
a
family
of
accelerated
test
that
are
intended
to
ﬁnd

intrinsic
mechanical
capabili:es
of
an
SSD
to
withstand
various
environmental

condi:ons.
In
this
case,
the
tests
used
for
the
study
were
Shock,
Temperature
cycle

tes:ng
and
Temperature
&
Humidity
tes:ng.

•  Shock

"  Precondi:on:
48
hour
oven
bake
at
125°

"  Shock
condi:on:
1500g
/
0.5ms
half-‐sine
pulse,
5
drops
each
axis
(+/-‐
x,
+/-‐
y,
+/-‐
z)
(total

30
drops)

"  JESD22-‐B110
condi:on
B

•  Temperature
cycle
tes:ng

"  TC-‐N:
-‐40C
to
85C,
2cyc/hr,
1000cycles

"  JESD22-‐A104,
condi:on
N

•  Temperature
&
humidity
tes:ng

"  THB
85C/
85%
RH,
for
1008
hours

"  JESD22-‐A101C

April
7,
2016

19
|

©2014
Micron
Technology,
Inc.

|

Micron
Conﬁden:al

Honeywell
TIM
Experimental
Results

PCie
SSD

April
7,
2016

• PTM7000:
had
great
thermal
results.
Thermal
performance
is
top
:er
for
pad
thermal
interface.

It
was

combined
with
a
dispensable
thermal
interface
material
because
of
thicknesses
needed
on
sample
drive.

Test

will
be
run
in
future
applica:ons
of
pad
thermal
interface,
with
pad
interface
only.
Passed
Mechanical
Stress

Tes:ng
(MST).

Rework
was
achieved.

• Compressible
TCM11:
had
great
thermal
results;
however,
viscosity
ﬂow
is
low
and
recommended
for
thin
gaps

• Compressible
TCM12:
had
great
thermal
results.
Ideal
for
larger
gaps.
Passed
MST.
Dispensing
in
line
with
other

thermal
interface
materials.

• 

No
silicone
bleed
issue

Honeywell
TIM
Study

(
◦C
)

Bond
Line

(mm)

PTM7000
TCM
11
TCM
12

Ambient
air

55.0

55.0

55.0

ASIC

1.0
-‐
1.3

70.6

71.9

71.0

NAND
1.40
-‐
1.65

67.7

68.8

67.8

20
|

©2014
Micron
Technology,
Inc.

|

Micron
Conﬁden:al

Environmental
Tes:ng

April
7,
2016

Drop

Temperature
Cycle
Temperature
Humidity
Bias

21
|

©2014
Micron
Technology,
Inc.

|

Micron
Confiden:al

Environmental
Tes:ng

April
7,
2016

Drop
50X
magnifica:on
THB
50X
magnifica:on
Temperature
cycle
50X
magnifica:on

SUMMARY
• Increasing power densities and board layout
drive higher temperatures
• Gap Pads and Putty delivery compressibility and
compliance
• Formulating PCM enables compressibility, low
thermal impedance and thermal stability
• Tested in SSD Memory Application
22

•  Per Fourier’s Law of Heat Conduction:
Connect to data
acquisition set-up
Cooling Block
(maintain constant low temp.)
Lower Intermediate Block
Test Sample
Upper Intermediate Block
Heater Block
(provide constant heat)
T1
T3
T2
T4
T6
T5
A
q
T
TI
x
T
kAq
Δ
=
Δ
Δ
=
q = heat flux
K = thermal conductivity
Δx = thickness of sample
ΔT = temperature difference across sample
A = cross-sectional area of sample
THERMAL IMPEDANCE TEST METHOD: CUT BAR
•  ASTM D5470
-  Destructive, one time test only
-  Fast test for immediate results
-  Most common test method

THERMAL IMPEDANCE TEST METHOD: LASER FLASH
ASTM E1461
•  Thermal Impedance Between Si, Ni-plated Cu Surfaces
-  Includes the CTE mismatch
-  includes actual surface finish
•  Typical Coupons:
-  Ni-plate copper, 0.5”X0.5”X0.03”
-  Si, 0.5”X0.5”X0.02”
•  Suitable for Accelerated Life Test
Die
TIM
Spreader
Flash
IR Sensor
Time
Temperature
Laser Pulse
Netzsch Laser Flash™
k = (α)(Cp)(ρ)
k = Thermal Conductivity (W/cmK)
α = Thermal Diffusivity (cm2/s)
α =0.13879L2 /t1/2
L=specimen thickness, meter
t1/2=the time required for the temperature
rise to reach 50% percent of ΔTmax
Cp = Specific Heat Capacity (J/gK)
ρ = Density (g/cm3)
• Determines Thermal Diffusivity
• Thermal Conductivity/Resistance Calculated

RELIABILITY TEST CONDITION
•  Highly-Accelerated Temperature and Humidity Stress
Test (HAST)
- Standard: JESD22-A110-B
- Testing Condition: 130°C, 85%RH, 96 hours
- Objective: Accelerate corrosive impact of high humidity and
temperature on the thermal performance of the test structure
•  Temperature Cycling Test
- Standard: JESD22-A104C
- Testing Condition: -55°C to 125°C (TCB), 1000 cycles
- Objective: Determine the resistance of TIM to extremes of high
and low temperatures, and its ability to withstand cyclical
stresses
•  High Temperature Storage
- Standard: JESD22-A103
- Testing Condition: 150°C, 1000 hours
- Objective: Accelerate changes in TIM’s material and
performance characteristics relative to prolonged and elevated
temperature
HAST chamber
TC chamber
Oven

High Performance SSD Memory Application with Compressible TIM- Based On Phase Change Technology

More Related Content

What's hot

Similar to High Performance SSD Memory Application with Compressible TIM- Based On Phase Change Technology

Recently uploaded

High Performance SSD Memory Application with Compressible TIM- Based On Phase Change Technology