The document discusses DDi's expansion into the ATE/BIB market through acquiring new equipment, talent, and capabilities. This will allow them to produce specialized printed circuit boards for applications like semiconductor testing that require tight tolerances and processing controls. The new resources are described along with design guidelines for standard, advanced, and engineering-level boards to address various customer needs in this market.

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DDi ATE / BIB
Technology Overview
June 25, 2009

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Notice
Notification of Proprietary Information: This document
contains proprietary information of DDi Corp. and its
receipt or possession does not convey any rights to
reproduce or disclose its contents, or to manufacture,
use, or sell anything it may describe. Reproduction,
dissemination, disclosure, or use, in whole or in part,
without specific written authorization of DDi Corp. is
strictly forbidden. All data contained within this
document are subject to this restriction.

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ATE/BIB Market Opportunities
• DDi has been focused on the ATE and BIB market segment for some
time. We have been working with our customers to understand their
demand and technology requirements in this market sector.
• This market is important to DDi as we are always seeking to expand
our product offerings and leverage existing customer relationships
• We recently announced that we have extended our capabilities and
capacity with the acquisition of key capital and human assets to
support the high end ATE market
• This market requires specialized equipment and processing expertise
in the following areas:
– Material movement and layer to layer registration
– Lamination process controls
– High aspect ratio drilling and positional accuracy
– High aspect ratio electroless and electrolytic copper plating
– Very tight hole to copper tolerances
– Understanding of customer’s design rules and requirements

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Semiconductor Manufacturers

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1. Probe Cards
3. ATE Boards
2. THB Boards
5. System Boards
4. Burn-in Boards
Multiple Levels of Semiconductor Testing
Wafer Level Testing
Package Level Testing
Package Level Testing
Package Level Testing
New Market
Opportunities

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Probe Card PCB’s
Semiconductor Wafer Level Testing
12” Silicon Wafer
Electroglas
Wafer Prober
Prober Manufacturers:
Aehr Test Electroglas
MicroTec Tokyo Electron
Close-Up

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THB - HAST PCB’s
THB - Temperature, Humidity, Bias testing is a reliability test designed to accelerate
metal corrosion, particularly that of the metallization on the die surface of the device.
HAST - Highly Accelerated Temperature/Humidity Stress Test. It was developed as
a shorter alternative to THB testing.
Trio Tech 6000X
Pressurized Humidity Test Systems

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ATE PCB’s
1. ATE (Automatic Test Equipment) Boards
2. DUT (Device Under Test) Boards
3. Performance Boards
4. Load Boards
Test Equipment Boards have a number of names:
Teradyne Tester
Packaged Semiconductor Testing

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Burn In Board (BIB) PCB’s
Packaged IC Burn-in
Three types of Burn-in
1. Static Burn-in
2. Dynamic Burn-in
3. Test & Burn-in
Micro Control Oven

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Introducing New Team Members
• John Papagni, Director ATE/BIB Technology, brings 30 years of
experience to DDi. Prior to joining DDi John was President and
CEO of Technitron, a leading producer of PCB’s for the
ATE/BIB market
• Armando Ceballos, Production Manager, will be responsible for
production training and manufacturing coordination of the
ATE/BIB product line, Armando brings 25+ years of experience
to DDi.
• Keith Lal, Senior Drill Technician, will be responsible for driving
drill technology and critical processing steps into the day to
day operations at DDi. Keith has 20+ years experience in high
aspect ratio precision drill processing of ATE/BIB PCB’s

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DDi ATE Market Support
• Dual site approach
– Milpitas with additional equipment and engineering support
– Anaheim by leveraging current technology and expertise
– Share synergies site to site
• In Milpitas…DDi has acquired, installed, and certified the following
specialized equipment assets:
– Lamination tooling for oversized panels
– PLC controlled lamination press for tight tolerance heat rise
parameters
– High aspect ratio Electroless copper plating line
– Large Format photo printer for oversized panels
– Solder mask developer with high pressure rinse
– High speed multi-spindle drill machines for high aspect ratio
drilling
• In Anaheim…DDi has transitioned flip drill technology and high aspect
ratio pulse plating capability for this product set

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Equipment – Lam Press
Lauffer “PLC Controlled” Hot Oil Press

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Equipment – Pluritec & Router
Pluritec Inspecta X-Ray
Drill Position Optimizer
PDA Router

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Equipment – Hitachi Drill Machines
Five Additional Hitachi’s
(Eight Total)

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Equipment – Exposure & Planarizer
Large Format photo printer
MASS Planarizer

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Equipment – Electroless

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Equipment – SM Developer

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Equipment – Testers
Three Additional
Flying Probe
Electrical Testers

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• ‘DDi Standard'
DDi’s current everyday capability with no premium.
•• ‘‘DDi Advanced'DDi Advanced' = DDi’s current everyday capability
with a small premium
• ‘DDi Engineering' = product DDi has experience with
and can build on request with a significant premium
ATE Design Guidelines

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ATE Design Guidelines
> 0.250”
Standard Advanced Engineering
Layer Count Up to 30 layers 32 to 40 42 to 60
External Trace 0.003" 0.0025" 0.002"
External Space 0.003" 0.0025" 0.002"
Internal Trace 0.003" 0.0025" 0.002"
Internal Space 0.003" 0.0025" 0.002"
Drill Diameter 0.006" 0.006“ & 0.005” 0.004"
Pad Diameter 0.010" 0.008" 0.005"
0.004" drill 32:1
0.006" drill 20:1 32:1
0.008" drill 25:1 32:1
0.125" 0.200"
0.187" 0.250"
Trace & Space
PCB Thickness
Drilled Via Size
Aspect Ratio

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ATE Design Guidelines
Standard Advanced Engineering
Min Outer 1/2 oz 3/8 oz 1/4 oz
Min Inner 1/2 oz 3/8 oz
Max Inner 1 oz 2 oz 3 & 4 oz
Max Outer 2 oz 3 & 4 oz 5 oz
Isola 370 HR
Nelco 4000-29
N4000-13 EP
N4000-13EP SI
Polyimide
Rogers 4000
18" x 24" 16" X 18" 24" x 36"
21" x 26" 14" X 26" 26" x 30"
24" x 26" 18" x 30"
21" x 24" 24" x 30"
Materials
Panel Sizes
Copper Weights 3/8 oz

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ATE Design Guidelines
Standard Advanced Engineering
BC2000™
FaradFlex™
Dupont HK04
Ceramic Filled
Electrolytic Gold, OSP
Lead Free HASL, ENIG
Immersion Silver, Immersion Tin
E-Less Gold
ENEPIG
Multiple
Finishes
+/- 0.0025" +/- 0.001"
0.008" 0.005"
Via Fill/Cap Plate
Non-CVF = Non-Conductive Via Fill 0.008" 0.006" 0.004"
CVF = Conductive Via Fill Non-CVF & CVF Non-CVF & CVF Non-CVF
Surface Finishes
Solder Mask Clearance
Solder Mask Opening
Embedded Passives
+/- 0.0020"
0.006"

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ATE Design Guidelines
Standard Advanced Engineering
0.007" 0.006" 0.005"
Min A/R Drill + 0.008" Drill + 0.006" Drill + 0.004"
Tangency
Circuit to PCB edge 0.025" 0.010" 0.008”
Plane to PCB edge 0.025" 0.010" 0.008”
Routing Tolerance +/- 0.005" +/- 0.004" +/- 0.002”
Edge of hole barrel 0.025" 0.020" 0.016”
to PCB Edge
Solder Mask Dam 0.004" min 0.003" min 0.0025” min
Drill-to-Copper

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ATE Design Guidelines
Standard Advanced Engineering
0.005”
Buried Mechanical Vias 0.005” 0.004”
Laser Drilled Microvias 0.006” 0.005” 0.004”
Mechanical Depth Drilled Vias 0.5:1 0.75:1 1:1
Back Drill Yes Yes Yes
Back Drill Depth Tolerance +/- 0.004" +/- 0.003" +/- 0.002"
Stacked Microvias 1+1 2+2 3+3 4+4
Copper Filled Microvias Yes Yes Yes
Conductive Via Fill Yes Yes Yes
Non Conductive Via Fill Yes Yes Yes
Impedance Control +/- 10% +/- 8% +/- 5%
Sequential Lamination Yes Yes Yes
Blind Mechanical Vias 0.004”0.006”
0.006”

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Micro section picture from 30 layer ATE PCB

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Micro section picture from 30 layer ATE PCB

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In Summary
• The ATE/BIB market segment has been on our radar for some
time as it extends our level of support to our existing customer
base
• Recent activities have allowed us to support the high end of the
ATE technology spectrum
• Dual site approach minimizes the risk to customer and allows
for site to site synergies
• The acquisition of key talent and specialized equipment set has
enabled DDi to shorten the process development time to
support the high end market
• DDi is committed to supporting a broad spectrum of PCB
products used by a multitude of customers and this product set
will expand our offering in both regards