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OIF's CEI 56G Interfaces –OIF's CEI 56G Interfaces –
Key Building Blocks for Optics in theKey Building Blocks for Optics in the
400G Data Center400G Data Center
Ed Frlan
OIF Physical and Link Layer Interoperability Working Group Chair
Senior System Architect, Semtech
28 Sept, 2015
2
Agenda
Interconnect challenges facing next-generation 200G/400G
data centers
Overview of OIF’s CEI-56G projects
56G VSR chip-to-module example
Other OIF projects addressing the Data Center
Summary
3
Data Center (DC) Trends
2015 Data Center facts
• DC traffic > 5 ZB in 2015, much of that being intra-DC
• Inter-DC traffic growth to increase at a higher rate than intra-DC
• DC SDN based networks
Data center interconnect (DCI) becoming a significant
portion of overall cost and power consumption
Significant growth of DCI market for geographically dispersed
sites
100G in deployment now, 200G/400G on the horizon
4
Data Center Interconnect Challenges
Power efficiency (pJ/bit or mW/Gb/s)
Port density (Gb/s/mm2
)
Reach (km)
Cost efficiency ($/Gb/s)
5
Technologies Enabling Future DC Client
Interconnects
Cu twinax
MM/SM VCSELs
SM Si Photonics
SM CWDM
PAM-4 modulation
FEC
6
Next Generation Interconnect
Framework
Identify the application spaces that might benefit from
Implementation Agreements
Die to Die
Chip to chip over a
backplane
7
OIF Physical and Link Layer Projects
CEI – 56G – Ultra Short Reach (CEI-56G-USR)
CEI – 56G – Extra Short Reach (CEI-56G-XSR)
CEI – 56G – Very Short Reach (CEI-56G-VSR)
CEI – 56G – Medium Reach (CEI-56G-MR)
CEI – 56G – Long Reach (CEI-56G-LR)
Flex Ethernet Project
MLG (Multi-Link Gearbox) 3.0
Intermediate Reach DWDM Framework
Electro-Mechanical Footprint for Optical Engines in a Chip Scale
Package
CFP2 Analog Coherent Optics Module (CFP2-ACO)
Integrated Polarization Multiplexed Quadrature Modulated Transmitters
for Metro Applications
High Bandwidth Polarization Multiplexed Quadrature Transmitter
High Bandwidth Integrated Coherent Receiver
8
OIF CEI-56G Projects
CEI-56G is leading the drive to higher bandwidths
Projects underway in five link reaches with multiple modulations
9
CEI-56G Electrical Modulation Variants
OIF is pursuing multiple modulation variants for several reaches
including NRZ, PAM-4 and ENRZ
FEC required for most reaches longer than XSR
What about CEI-112G? When will it come and what will enable it?
Interface NRZ PAM-4 ENRZ
CEI-56G-USR ●
CEI-56G-XSR ● ●
CEI-56G-VSR ● ●
CEI-56G-MR ● ●
CEI-56G-LR ● ●
10
56G VSR/Chip-to-Module Channel
Potential 56G channel based upon present CEI-28G-VSR
channel
Host IC
CEI-28G-VSR host-to-module channel
Module
Connector
AC
Coupling
Cap
Module
Retimer IC
On-
die
term.
Device
package
Device
package
On-
die
term.
VSR host channel PCB Model
(2 via transitions + 5” Nelco stripline)
zQSFP+
Connector
Model
Module PCB +
AC coupling
caps Model
Channel Loss @ 14 GHz = 10 dB
~ 7 dB < 1 dB ~ 2 dB
CTLE
11
Challenges of serial 56 Gb/s electrical
interconnects
Interconnect challenges:
• Even premium PCB materials
show significant losses for 56 Gb/s
NRZ signals
• Package and connector
performance/crosstalk will also
be an issue
• Cost effective electronics with
necessary performance an issue
at 56 Gb/s
More complex electrical modulation
schemes must be employed
ICR = 30.8dB
@ 14 GHz
Typical QSFP28 VSR
Electrical Channel
Loss and Crosstalk
12
Benefits of PAM-4 vis-à-vis NRZ
Modulation for 56G VSR Interfaces
56G NRZ solutions are likely to require more advanced CMOS
nodes that can be cost prohibitive
PAM-4 interface can be largely equalized with a receiver
CTLE function
Optical line card based on 56G PAM-4 for both VSR and MR
interfaces
13
56G PAM-4 VSR Channel Simulation
Parameters
Simulation setup
Data pattern: PRBS23
Signaling format: PAM-4
Jitter
• TX RJ: 0.18ps RMS
• RX RJ: 0.22ps RMS
• TX DJ: 1.5ps peak-to-peak
Rx Noise
• 3.7e-8 V2/GHz
Baud rate: 28.0 Gbaud
Target BER: 1e-6, 1e-15
Equalization schemes
• One-zero and two-pole CTLE with
variable DC gain and up to 10dB
AC gain at 14GHz
Serial Link System:
CDR Input Block Diagram:
14
PAM4 VSR Analysis
1E-6 eye diagram at
CDR slicer input
Voltage, Timing Bathtub Curves
15
IEEE 400G 802.3bs electrical interfaces
and optical PMD’s
CDAUI-8 chip-to-module and chip-to-chip electrical
interconnects selected as PAM-4 based upon OIF’s CEI-56G-
VSR-PAM4 and CEI-56G-MR-PAM4, respectively
400G FR8/LR8 2km/10km SM PMD’s based on 8x 50G PAM-4
modulation with host based FEC
400G PSM4 or DR4 based on 4x 100G PAM-4
16
IEEE 802.3bs 400G FR8/LR8 Module (1/2)
CDAUI-8 c2m electrical interface based on CEI-56G-VSR-
PAM4 interface
c2c interface based on CEI-56G-MR-PAM4
FR8/LR8 optical PMD also selected as PAM4
400 GbE Module
Line Card
ASIC
(with
FEC)
IEEE CDAUI-8
Interface
8 x 50G PAM-4
Transmit
Re-Timer
8 x 50G PAM-4
Receive
Re-Timer
8 channel TOSA
8x Linear
Driver ICs
8
8x Linear
TIAs
8
88
8 channel ROSA
8x
Lasers
8x
PINs
MUXDMUX
8λ
8λ
Duplex SMF
8λ
8λ
8 x 50G (Tx)
8 x 50G (Rx)
17
IEEE 802.3bs 400G FR8/LR8 Module (2/2)
400G FR8/LR8 module:
• Initial 400G CDAUI-8 module would be based on a CFP2
form factor with other options to follow
• This architecture can be largely implemented with present
25 Gb/s optics thus leveraging the high volume 100 GbE
market
• Having both PMA and PMD blocks based on PAM-4 is
beneficial from several aspects
• Required FEC in the host IC manages both the optical and
electrical links
18
Possible future client pluggable modules
based on 56G VSR host interfaces
50G SFP56
• 1x 56G client interface
100G QSFP56, µQSFP
• 2x 56G client interface
200G QSFP56, µQSFP
• 4x 56G client interface
400G “double” QSFP28
module
• 8x 56G client interface
At present QSFP28 is most
desirable data center 100G
client pluggable
µQSFP targeting next
generation 100G/200G data
center client interconnects
QSFP28
module
µQSFP
module
19
OIF 100G/200G CFP2-ACO Module Form
Factor
CFP2-ACO pluggable modules are presently one option
addressing the DCI Metro/Regional DWDM market
20
OIF Flex Ethernet Project
A mechanism to support a variety of Ethernet MAC rates not
corresponding to an existing Ethernet PHY rate
Can enable bonding of PHYs, sub-rate operation of PHY or
channelization within a group of PHYs
Enables applications such as “router-to-transport” connection
and intra-DC “fat-pipe”
21
Summary
CEI-56G interface specification work is well under way
Several standards bodies are planning to leverage OIF’s work
on CEI-56G
CEI PAM4 interfaces will be key in enabling a solid foundation
for next generation 200G/400G client optics
OIF has several projects addressing the needs of the data
center

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ECOC Panel on OIF CEI 56G

  • 1. OIF's CEI 56G Interfaces –OIF's CEI 56G Interfaces – Key Building Blocks for Optics in theKey Building Blocks for Optics in the 400G Data Center400G Data Center Ed Frlan OIF Physical and Link Layer Interoperability Working Group Chair Senior System Architect, Semtech 28 Sept, 2015
  • 2. 2 Agenda Interconnect challenges facing next-generation 200G/400G data centers Overview of OIF’s CEI-56G projects 56G VSR chip-to-module example Other OIF projects addressing the Data Center Summary
  • 3. 3 Data Center (DC) Trends 2015 Data Center facts • DC traffic > 5 ZB in 2015, much of that being intra-DC • Inter-DC traffic growth to increase at a higher rate than intra-DC • DC SDN based networks Data center interconnect (DCI) becoming a significant portion of overall cost and power consumption Significant growth of DCI market for geographically dispersed sites 100G in deployment now, 200G/400G on the horizon
  • 4. 4 Data Center Interconnect Challenges Power efficiency (pJ/bit or mW/Gb/s) Port density (Gb/s/mm2 ) Reach (km) Cost efficiency ($/Gb/s)
  • 5. 5 Technologies Enabling Future DC Client Interconnects Cu twinax MM/SM VCSELs SM Si Photonics SM CWDM PAM-4 modulation FEC
  • 6. 6 Next Generation Interconnect Framework Identify the application spaces that might benefit from Implementation Agreements Die to Die Chip to chip over a backplane
  • 7. 7 OIF Physical and Link Layer Projects CEI – 56G – Ultra Short Reach (CEI-56G-USR) CEI – 56G – Extra Short Reach (CEI-56G-XSR) CEI – 56G – Very Short Reach (CEI-56G-VSR) CEI – 56G – Medium Reach (CEI-56G-MR) CEI – 56G – Long Reach (CEI-56G-LR) Flex Ethernet Project MLG (Multi-Link Gearbox) 3.0 Intermediate Reach DWDM Framework Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package CFP2 Analog Coherent Optics Module (CFP2-ACO) Integrated Polarization Multiplexed Quadrature Modulated Transmitters for Metro Applications High Bandwidth Polarization Multiplexed Quadrature Transmitter High Bandwidth Integrated Coherent Receiver
  • 8. 8 OIF CEI-56G Projects CEI-56G is leading the drive to higher bandwidths Projects underway in five link reaches with multiple modulations
  • 9. 9 CEI-56G Electrical Modulation Variants OIF is pursuing multiple modulation variants for several reaches including NRZ, PAM-4 and ENRZ FEC required for most reaches longer than XSR What about CEI-112G? When will it come and what will enable it? Interface NRZ PAM-4 ENRZ CEI-56G-USR ● CEI-56G-XSR ● ● CEI-56G-VSR ● ● CEI-56G-MR ● ● CEI-56G-LR ● ●
  • 10. 10 56G VSR/Chip-to-Module Channel Potential 56G channel based upon present CEI-28G-VSR channel Host IC CEI-28G-VSR host-to-module channel Module Connector AC Coupling Cap Module Retimer IC On- die term. Device package Device package On- die term. VSR host channel PCB Model (2 via transitions + 5” Nelco stripline) zQSFP+ Connector Model Module PCB + AC coupling caps Model Channel Loss @ 14 GHz = 10 dB ~ 7 dB < 1 dB ~ 2 dB CTLE
  • 11. 11 Challenges of serial 56 Gb/s electrical interconnects Interconnect challenges: • Even premium PCB materials show significant losses for 56 Gb/s NRZ signals • Package and connector performance/crosstalk will also be an issue • Cost effective electronics with necessary performance an issue at 56 Gb/s More complex electrical modulation schemes must be employed ICR = 30.8dB @ 14 GHz Typical QSFP28 VSR Electrical Channel Loss and Crosstalk
  • 12. 12 Benefits of PAM-4 vis-à-vis NRZ Modulation for 56G VSR Interfaces 56G NRZ solutions are likely to require more advanced CMOS nodes that can be cost prohibitive PAM-4 interface can be largely equalized with a receiver CTLE function Optical line card based on 56G PAM-4 for both VSR and MR interfaces
  • 13. 13 56G PAM-4 VSR Channel Simulation Parameters Simulation setup Data pattern: PRBS23 Signaling format: PAM-4 Jitter • TX RJ: 0.18ps RMS • RX RJ: 0.22ps RMS • TX DJ: 1.5ps peak-to-peak Rx Noise • 3.7e-8 V2/GHz Baud rate: 28.0 Gbaud Target BER: 1e-6, 1e-15 Equalization schemes • One-zero and two-pole CTLE with variable DC gain and up to 10dB AC gain at 14GHz Serial Link System: CDR Input Block Diagram:
  • 14. 14 PAM4 VSR Analysis 1E-6 eye diagram at CDR slicer input Voltage, Timing Bathtub Curves
  • 15. 15 IEEE 400G 802.3bs electrical interfaces and optical PMD’s CDAUI-8 chip-to-module and chip-to-chip electrical interconnects selected as PAM-4 based upon OIF’s CEI-56G- VSR-PAM4 and CEI-56G-MR-PAM4, respectively 400G FR8/LR8 2km/10km SM PMD’s based on 8x 50G PAM-4 modulation with host based FEC 400G PSM4 or DR4 based on 4x 100G PAM-4
  • 16. 16 IEEE 802.3bs 400G FR8/LR8 Module (1/2) CDAUI-8 c2m electrical interface based on CEI-56G-VSR- PAM4 interface c2c interface based on CEI-56G-MR-PAM4 FR8/LR8 optical PMD also selected as PAM4 400 GbE Module Line Card ASIC (with FEC) IEEE CDAUI-8 Interface 8 x 50G PAM-4 Transmit Re-Timer 8 x 50G PAM-4 Receive Re-Timer 8 channel TOSA 8x Linear Driver ICs 8 8x Linear TIAs 8 88 8 channel ROSA 8x Lasers 8x PINs MUXDMUX 8λ 8λ Duplex SMF 8λ 8λ 8 x 50G (Tx) 8 x 50G (Rx)
  • 17. 17 IEEE 802.3bs 400G FR8/LR8 Module (2/2) 400G FR8/LR8 module: • Initial 400G CDAUI-8 module would be based on a CFP2 form factor with other options to follow • This architecture can be largely implemented with present 25 Gb/s optics thus leveraging the high volume 100 GbE market • Having both PMA and PMD blocks based on PAM-4 is beneficial from several aspects • Required FEC in the host IC manages both the optical and electrical links
  • 18. 18 Possible future client pluggable modules based on 56G VSR host interfaces 50G SFP56 • 1x 56G client interface 100G QSFP56, µQSFP • 2x 56G client interface 200G QSFP56, µQSFP • 4x 56G client interface 400G “double” QSFP28 module • 8x 56G client interface At present QSFP28 is most desirable data center 100G client pluggable µQSFP targeting next generation 100G/200G data center client interconnects QSFP28 module µQSFP module
  • 19. 19 OIF 100G/200G CFP2-ACO Module Form Factor CFP2-ACO pluggable modules are presently one option addressing the DCI Metro/Regional DWDM market
  • 20. 20 OIF Flex Ethernet Project A mechanism to support a variety of Ethernet MAC rates not corresponding to an existing Ethernet PHY rate Can enable bonding of PHYs, sub-rate operation of PHY or channelization within a group of PHYs Enables applications such as “router-to-transport” connection and intra-DC “fat-pipe”
  • 21. 21 Summary CEI-56G interface specification work is well under way Several standards bodies are planning to leverage OIF’s work on CEI-56G CEI PAM4 interfaces will be key in enabling a solid foundation for next generation 200G/400G client optics OIF has several projects addressing the needs of the data center