This document discusses the development of 112Gbps electrical interfaces. It begins with an overview of the OIF's CEI specifications for various data rates ranging from 1.6Gbps to 112Gbps. It then examines potential modulation schemes for 112Gbps, including PAM-4, PAM-8, duo-binary and DMT. The document evaluates the feasibility of a 112Gbps very short reach channel based on existing 56Gbps channel models. It finds that channel improvements would be needed to support 112Gbps. Finally, it considers approaches to developing improved 112Gbps channels, such as reducing channel length, using lower loss materials, and integrating cable connectors.
DesignCon 2019 112-Gbps Electrical Interfaces: An OIF Update on CEI-112GLeah Wilkinson
DesignCon 2019
112-Gbps Electrical Interfaces: An OIF Update on CEI-112G
Brian Holden, Kandou Bus
Cathy Liu, Broadcom
Steve Sekel, Keysight
Nathan Tracy, TE Connectivity
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost effective networks and data centers. A panel of OIF contributors will discuss the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable based solutions. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.
Fronthaul technologies kwang_submit_to_slideshareKwangkoog Lee
5G Fronthaul Technologies (Especially, this document specifies the e-CPRI technology, because many telcos are now considering the eCPRI for the next fronthaul.)
Description: In this presentation / video we look at the argument why 5G NSA Option 3 (EN-DC) may not be around for a very long time and may be turned off by the operators when 5G Core is up and running and all the initial issues have been sorted out.
Video link: https://youtu.be/ERnq8WLlse0
All our #3G4G5G slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
Overview of standardisation status and 3GPP technology evolution trendSylvia Lu
Presented by Sylvia Lu, Cellular Technology, u-blox & Member of UK5G Advisory Board at Cambridge Wireless event Radio technology for 5G – making it work on 18 Sep 2018
DesignCon 2019 112-Gbps Electrical Interfaces: An OIF Update on CEI-112GLeah Wilkinson
DesignCon 2019
112-Gbps Electrical Interfaces: An OIF Update on CEI-112G
Brian Holden, Kandou Bus
Cathy Liu, Broadcom
Steve Sekel, Keysight
Nathan Tracy, TE Connectivity
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost effective networks and data centers. A panel of OIF contributors will discuss the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable based solutions. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.
Fronthaul technologies kwang_submit_to_slideshareKwangkoog Lee
5G Fronthaul Technologies (Especially, this document specifies the e-CPRI technology, because many telcos are now considering the eCPRI for the next fronthaul.)
Description: In this presentation / video we look at the argument why 5G NSA Option 3 (EN-DC) may not be around for a very long time and may be turned off by the operators when 5G Core is up and running and all the initial issues have been sorted out.
Video link: https://youtu.be/ERnq8WLlse0
All our #3G4G5G slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
Overview of standardisation status and 3GPP technology evolution trendSylvia Lu
Presented by Sylvia Lu, Cellular Technology, u-blox & Member of UK5G Advisory Board at Cambridge Wireless event Radio technology for 5G – making it work on 18 Sep 2018
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All our slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
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Watch the complete webinar here: http://bit.ly/2zkBIHb
I AM SUDANESE,MASTER OF TELECOM FROM SUDAN UNEVERSITY ,THIS IS MY DOCUMENT I INVESTIGATE IN LTE WITH MORE THAN 50 REFERENCE , GOD BLESS US ,PLEASE FEEL FREE TO ASK ABOUT ANY THING IN THIS TOPIC
MY EMAIL khalidaam2015@hotmail,khalidaa@sudatel.sd
دعواتكم لى وللوالدين ولاهلى , الحمد لله فبنعمته تتم الصالحات اللهم احفظ الدول الاسلامية من كل كيد واغدق عليهم الرخاء
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Mobile Service Providers are seeing unprecedented challenges in relation to their Transport architectures with the 3GPP evolution towards IP based Node Bs, LTE (Long Term Evolution) and LTE-Advanced. This presentation will initially discuss the network migration trends and factors that are changing how mobile networks are evolving. A description is provided on Unified MPLS and the current issues that need to be fixed and how this architecture addresses this. A more detailed analysis will then examine the options available for transporting GSM/2G, UMTS/3G traffic and IP/Ethernet Node B deployments and some of factors that need consideration like scalability, resiliency and security. Finally, there is a detailed description of the LTE/LTE - A evolution and the feature requirements made on the transport network. There will be detailed analysis of different LTE models and also some technical enhancements and proposals considered for the implementation of LTE in a Unified MPLS environment.
A presentation / video looking at 5G spectrum auctions and allocations and how different types of spectrum is required for providing a perfect 5G coverage
All our slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
What is SS7? An Introduction to Signaling System 7Alan Percy
SS7 or Signaling System 7 is the dominant protocol used to control the public telephone network. Call routing, number portability, caller-ID, mobile SMS and more are handled using SS7 in the public network. SS7 (along with SIGTRAN for transport), allow application to access public network resources for call control and authentication. During this session, we share some background on SS7, show how it is used in everyday communications, and provide some use cases in popular applications.
A quick look at 5G System architecture in Reference point representation and in Service Based representation and also look at the different Network Functions (NFs) within the 5G System.
Synopsis: A tutorial on the NETCONF protocol. The operations of the core NETCONF protocol are taught. This is followed by examination of traces of NETCONF sessions.
5 Clock Tree Design Techniques to Optimize SerDes Performance for Networking ...Silicon Labs
As new designs adopt FPGAs, SoCs, ASICs, and CPUs with higher speed SerDes, it’s becoming increasingly important to understand the impact of reference timing on overall system performance. This deck provides practical guidance on overcoming common timing design challenges by reviewing timing requirements for 10G/25G/40G/56G-based designs, explaining when to use clocks versus oscillators, highlighting system-level factors that degrade signal integrity and reviewing how to budget jitter and/or phase noise margin in order to select an optimal timing solution. This deck also explains how to use common bench equipment and software-based tools to simplify the design-in process.
Watch the complete webinar here: http://bit.ly/2zkBIHb
I AM SUDANESE,MASTER OF TELECOM FROM SUDAN UNEVERSITY ,THIS IS MY DOCUMENT I INVESTIGATE IN LTE WITH MORE THAN 50 REFERENCE , GOD BLESS US ,PLEASE FEEL FREE TO ASK ABOUT ANY THING IN THIS TOPIC
MY EMAIL khalidaam2015@hotmail,khalidaa@sudatel.sd
دعواتكم لى وللوالدين ولاهلى , الحمد لله فبنعمته تتم الصالحات اللهم احفظ الدول الاسلامية من كل كيد واغدق عليهم الرخاء
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System Architectures Using OIF CEI-56G Interfaces by
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Vishnu Shukla of Verizon USA and the OIF Carrier Working Group Chair spoke at Globecom 2015 about the Verizon perspective towards SDN and how the OIF was working to support carrier needs to improve transport control through SDN.
Lyndon Ong, of Ciena and the OIF Marketing Committee Co-Chair spoke at Globecom 2015. Focus on work in OIF Transport SDN Framework and joint work between OIF and ONF on Transport APIs
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Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
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Cyberattack types and targets
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Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
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Systemic attacks in the Middle East
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The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
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- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
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OIF 112G Panel at DesignCon 2017
1. Image
Topic:
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malesuada blandit euismod.
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TITLE
CEI-112G: THE NEXT WAVE OF ELECTRICAL INTERFACES
Nathan Tracy, TE Connectivity
Ed Frlan, Semtech
Tom Palkert, MACOM
Brian Holden, Kandou Bus
2. SPEAKERS
Nathan Tracy
OIF VP of Marketing/Board Member, TE Connectivity Technologist
ntracy@te.com
Ed Frlan
OIF TC vice chair, Semtech Senior System Architect
edwardfrlan@semtech.com
Tom Palkert
OIF PLL vice chair, MACOM System Engineer
tom.palkert@macom.com
Brian Holden
OIF MA&E co-chair, Kandou Bus
brian@kandou.com
3. CEI IA is a clause-based format supporting publication of new clauses over time:
CEI-1.0: included CEI-6G-SR, CEI-6G-LR, and CEI-11G-SR clauses.
CEI-2.0: added CEI-11G-LR clause
CEI-3.0: added work from CEI-25G-LR, CEI-28G-SR
CEI-3.1: added work from CEI-28G-MR and CEI-28G-VSR
CEI-11G and -28G specifications have been used as a basis for specifications developed in IEEE 802.3, ANSI/INCITS T11, and IBTA.
CEI 56G projects are in progress:
LR: backplane
MR: chip to chip
VSR: chip to module
XSR: chip to optics engine (separate chips)
USR: chip to optics engine (2.5D or 3D package)
CEI 112G project has begun!
11G
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
SxI-5 CEI-1.0 CEI-2.0 CEI-3.0 CEI-3.1
3G
6G
25G & 28G
56G
112G
OIF Electrical Implementation Agreements
4. 4
Name Rate per pair Year Activities that Adopted, Adapted or were influenced
by the OIF CEI
CEI-112G 112Gbps 201X The future is bright
CEI-56G 56Gbps 2016 in process: IEEE, InfiniBand, T11 (Fibre Channel)
CEI-28G 28 Gbps 2011 InfiniBand EDR, 32GFC, SATA 3.2, SAS-4,100GBASE-KR4,
CR4, CAUI4
CEI-11G 11 Gbps 2008 InfiniBand QDR, 10GBASE-KR, 10GFC, 16GFC, SAS-3,
RapidIO v3
CEI-6G 6 Gbps 2004 4GFC, 8GFC, InfiniBand DDR, SATA 3.0, SAS-2, RapidIO
v2, HyperTransport 3.1
SxI5 3.125 Gbps 2002-3 Interlaken, FC 2G, InfiniBand SDR, XAUI, 10GBASE-KX4,
10GBASE-CX4, SATA 2.0, SAS-1, RapidIO v1
SPI4, SFI4 1.6 Gbps 2001-2 SPI-4.2, HyperTransport 1.03
SPI3, SFI3 0.800 Gbps 2000 (from PL3)
OIF’s CEI work has been a significant industry
contributor
6. OIF 112Gbps Panel Discussion
Nathan Tracy, TE Connectivity
Ed Frlan, Semtech
Tom Palkert, MACOM
Brian Holden, Kandou Bus
7. Image
Topic:
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Topic:
o Nam elementum commodo mattis. Pellentesque
malesuada blandit euismod.
o Nam elementum commodo mattis. Pellentesque
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o Nam elementum commodo mattis. Pellentesque
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TITLE
CEI-112G: The next wave of electrical interfaces
Ed Frlan, (Semtech, Senior System Architect)
OIF Technical Committee Vice Chair
8. IEEE 802.3cd Task Force is standardizing
100GBASE-DR Optical Modules:
o 4x 25G NRZ electrical (CAUI-4,100GAUI-4) <-> 1x 100G
PAM-4 optical (500m)
o 2x 50G PAM-4 electrical (100GAUI-2) <-> 1x 100G PAM-4
optical (500m)
Next-gen 100GBASE-DR Optical Module:
o 1x 100G ?PAM-4? electrical <-> 1x 100G PAM-4 optical
(500m)
112G VSR Application: Next-Gen 100GBASE-DR
Optical Modules
28G-VSR, 56G-VSR-PAM4 DR Modules
112G-?PAM4? DR Module
100GAUI4/
100GAUI-2
Tx
100G PAM4
Encoder
100G PAM4
Encoder
E/O
O/E
FIR
FFE/
DFE
100GAUI4/
100GAUI-2
Rx
100GAUI-1
Tx
E/O
O/E
FIR
FFE/
DFE
100GAUI-1
Rx
9. Ability to enable simple, low-power optical module implementations
o E.g. CE-28G-VSR/CAUI-4 electrical interfaces based on low-power CTLE receivers
o CEI-56G-VSR-PAM4/50GAUI also based on CTLE approach
Channel selection enabling a broad suite of applications
o Nominal 10dB channel was the right choice
Selection of a modulation scheme which could be the basis for a wide range of electrical
reaches
o 25G/28G CEI interfaces (VSR, MR, LR) based on NRZ modulation
o 56G CEI interfaces (XSR, VSR, MR, LR) addressable by PAM-4 modulation
pJ/bit efficiency of new interface better than previous generation
Elements of successful, past VSR standards
10. Possible 112G modulation schemes include: PAM-4, PAM-8, duo-binary, DMT
Other modulation schemes and/or variants on the above are possible!
112G candidate modulations
112G VSR Modulation
Format
Pros Cons
PAM-4
• Ability to re-use electronics developed for
112G optical PAM-4
• Analog implementation may be feasible
• Familiarity, availability of test equipment
• May not be feasible for longer reach
interfaces
PAM-8
• Possible feasibility for longer reach
interfaces
• Likely mandates an ADC/DSP
implementation
• Smaller SNR than PAM-4
• DMT higher performance than PAM-8
Duo-binary
• Analog implementation may be feasible
• Feasibility for longer reach interfaces
• Requirement for 112G NRZ transmitter
DMT
• Ability to deal with poor channels
• Feasibility for longer reach interfaces
• Challenge of transmitters having large
PAPR
• Challenging ADC
• Unfamiliarity, perceived complexity
11. 56G PAM-4 OIF VSR Channel
Example of cobo 7dB VSR
channels
10dB loss from host IC ball to module CDR IC at 14 GHz
12. Key question: can a 112G VSR channel based on an as is 10dB CEI 56G-PAM4 channel be
made to work?
112G OIF VSR Channel (1/3)
Example of cobo VSR channel (from previous slide) extended to 10dB loss @ 14 GHz
The example 112G channel is based
on the 56G cobo channel with 3dB
additional loss
Channel exhibits excellent
performance for 28 GBd signals
Much worse for 56 GBd signals (loss
> 20dB + non-neglible ILD)
A 100G PAM-4 solution would
require advanced, power-hungry
equalizers
Such a channel is likely not a
suitable starting point for 112G VSR
13. 10dB channel pulse response including “12mm IEEE” packages at either end
Two significant pre-cursors, tail extends to > 20 UI
112G VSR Channel – pulse response (2/3)
Cd Cp
160 fF 110 fF
Zp 12mm, Zc 85W
IEEE 12mm package
14. “COM” = 3.26 dB @ SER = 1E-6,
VEO (vertical eye opening) = 5mV @
SER = 1E-6
Channel will require significant
improvements in order to improve
system margin (Note: simulation
included no crosstalk!)
This type of heavy equalization was
required for 56G-PAM4 LR reaches
(35dB loss channels)
112G VSR Channel – equalized response (3/3)
Equalization based on 4-tap Tx FIR and Rx CTLE +
20-tap DFE
15. Summary – Keys to a successful 112G VSR
specification
If 112G is required to meet present reach then along with channel improvements (via improved
packages, connectors, etc), losses must also drop – the optical module will not be able to
support a high power electrical interface solution!
How? Possibilities include:
o Improved PCB materials
o Channels based on coaxial interconnects
….. or, channels need to be shorter; optics must get closer to the host switch
Likely a combination of all the above will be required
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TITLE
CEI-112G: Considering Electrical Channels
Nathan Tracy, TE Connectivity
OIF Board Member and Marketing VP
18. 18
VSR - Connecting Chips to Modules - Typical Reach up to 10”
LR - Channels in Chassis - Typical Reach = 1m
4-10”, PWB trace
Connector with footprint
0.7-1.5”, PWB trace
• ~1m of improved PWB
• 2 backplane connectors
• 0.5m of PWB
• 1 orthogonal connector
• 14” of improved PWB
• 1m of cable
• 2 cable backplane connectors
Channels Considered for this Discussion
19. • Used 25G (published) and 50G (in development) OIF and IEEE industry standards as
starting point
• Based on the shift towards PAM4 with the transition from 25G to 50G we can
assume 100G will likely be PAM4
• Other encoding schemes were not considered but new emerging methods could
enable next generation high speed links.
• For 100G the actual data rate will likely be 112GBaud/s with a Nyquist frequency
around 28GHz (PAM4)
• The bandwidth of interest is assumed to be 10MHz – 56GHz
• The Insertion Loss/Return Loss requirements were extrapolated using a
combination of,
– Historical trends in data rate leaps, using current 50G targets as reference
– Successful demonstrations of actual channels at 50G (PAM4 and NRZ)
19
Assumptions to Determine 100G Targets
22. 22
10”, PWB trace
Connector with footprint 1” PWB trace
4”, PWB trace
Improved Connector with footprint
0.4” PWB trace
2”, PWB trace
Board mounted
cable connector
18” of 33AWG or 23” of 30 AWG cable
Improved Connector
with footprint
Two Possible Paths for Improvement
Reduce Channel Length Use Lower Loss Channel
~10 dB gap
N4000-13SI PWB material
0.4” PWB trace
Existing VSR Channel vs New Limits
23. - 3.5mm thick
- 8mil stub
- Long via barrel
Conclusions:
• Passes up to the Nyquist frequency but may be impractical lengths
• Footprint is critical. FP causes significant degradation beyond 33GHz
23
4”, PWB trace
0.7” PWB trace
Megtron6
EM888
Improved Connector with footprint
Meg6 provides
2” of additional
trace on DC
Shorter VSR Channels
24. 24
2”, PWB trace
Board mounted cable connector
18” of 33 AWG cable
OR
23” of 30 AWG Cable
Improved Connector with footprint
0.7” PWB trace
Conclusions:
• Passes up to the Nyquist frequency with margin
• Utilizing cable provides extended reach and flexibility
Megtron6, Typical FP
Megtron6, Short FP
- 3.5mm thick
- 8mil stub
- Long via barrel
Using Cables to Extend Channel Length
31. 31
6”, PWB trace
• Reduce 10” to 6” DC Traces
• Backdrill = 9mil stubs
• Improved connector
• Improved PWB material
o Meg6 = 6” DC
o EM-888 = 6” DC
• Retimers for shorter lengths
Meg6 provides
6” of additional
trace on each DC
Meg6 PWB material
EM-888 PWB material Conclusions:
• Passes through 40GHz
with reasonable reaches
• Single retimers could
extend reach with minimal
impact
Shorter Orthogonal Channel
32. 32
2”, PWB trace with
8” cable+conn
• 16” Cable x 2 + Connector
• 2” DC Trace x 2
• 6/6/6 Traces in low cost FR4
• 6” DC Trace
• 6/6/6 Traces in
low cost FR4
Conclusion:
• Passes through 50GHz
with good reaches
Cabled Orthogonal Channel
33. • 4” DC Traces
• 9mil Stubs
• 1m Cable
• Improved Whisper Connector
• Improved PWB Traces
o Meg6
o EM-888
33
Meg6 provides
3.5” of additional
trace on each DC
Conclusions:
• Passes through 40GHz
with reasonable reaches
(7.5” DC with Meg6)
• Single retimers could
extend reach with minimal
impact
Cable BP Channel
34. 34
4” DC Traces
6/6/6 Traces in FR4
8” Cable + Conn
2” PWB Traces
6/6/6 Traces in FR4
Conclusions:
• Passes through 50GHz with
10” reaches and
inexpensive material (FR4)
Improving the Cable BP Channel
35. 35
• Orthogonal and Cable
Backplane LR channel noise
with Meg6 daughtercards
• Both channels have an SNR >
20dB @ 28GHz
Cable BP
Orthogonal Insertion Loss
PowerSum NEXT
PowerSum FEXT>20dB SNR
@ 28 GHz
>20dB SNR
@ 28 GHz
Noise in 100G LR Channels — PWB DC’s
36. 36
Cable BP
Orthogonal
25mil Via Stubs
15mil Via Stubs
12mil Via Stubs
9mil Via Stubs
Orthogonal Channel:
• 6” DC traces
• Meg6 material
Cable Channel
• 4” DC traces
• Meg6 material
• 1m cable backplane
100G LR Channel - Via Stub Length Impact
37. 37
Cable BP
Orthogonal
HVLP Foils
VLP Foils
Standard Foils
Orthogonal Channel:
• 6” DC traces
• Meg6 material
Cable Channel
• 4” DC traces
• Meg6 material
• 1m cable backplane
100G LR Channel-PWB Foil Roughness Impact
38. • Don’t bet against 112Gbps copper for LR channels
• 100G LR and VSR channels are possible
• New lower loss techniques will need to be
implemented
• Manufacturing consistency will be even more
critical
• Need better definition of silicon requirements
Conclusions
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TITLE
CEI-112G-VSR
Challenges and needed improvements
Tom Palkert
MACOM
49. Channel Challenges: Signal Impairments
Optical Module
Host ASIC
Module connector
AC coupling
capacitorTrace vias
50. Higher data rates challenges traditional retimer methods
Legacy channels
– Not well characterized for higher performance
Power constraints from higher density modules
– i.e. QSFP-DD provides 2x bandwidth vs QSFP but uses same module size
Silicon Challenges
53. System level improvements 2:Define
asymmetric Switch to Server connections
Define end to end budgets that take advantage of short NIC traces
Switch ports require long
host to module traces
Server ports have very short
host to module traces
8-12in
1in
58. Signal Impairments improvements: BipassTM cables
Stacked Optical Modules
Host
ASIC twinax
Optical Module
Host ASIC
Module connector
Trace vias
Signal integrity improved with BipassTM cables
AC coupling
capacitor
59. DSP
Use COM ‘like’ specification to
allow flexible silicon design
Silicon Improvements
Noise Available
signal
Margin
Courtesy:
Rich Mellitz
Samtec
60. 100G serial 2km optical link demonstrated
What will we see this week?
MACOM
DSP
61. VSR channel demonstrated
What will we see this week?
DSP
World’s first 100G serial VSR electrical
link demonstration using an APM DSP
over a TE channel with TE COBO
connector. BER < 6e-7
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TITLE
The CEI-112G in MCM Project
Brian Holden, Kandou Bus
OIF MA&E Co-Chair
KANDOU reinventing the BUS
64. On 1/19/17, the OIF started the CEI-112G in MCM project
– The goal of this project is to support high rate interconnect within Multi-
Chip Modules (MCMs)
– The project is defined to support the interconnection of large logic
devices with both:
• Small driver devices
• Other large logic devices
• More than one clause may be created as a part of this project
o .
The OIF CEI-112G in MCM Project
KANDOU BUS
65. The agreed-upon properties in the project start:
– 0-1 cm reach
– DC coupled path, on-die AC coupling optional
– 1E-15 Error Ratio (high-latency FEC may not be used
to accomplish this)
– Forwarded clock used
o .
CEI-112G in MCM Project Properties
KANDOU BUS
66. The rest of this presentation presents Kandou’s ideas for this
interface
The reach is not the only question
Two distinct applications exist:
– Logic-Logic - Large logic chip to medium/large logic chip
• In these applications, 1 to 10 Tb/s need to be transferred between
two logic dies
– Logic-Driver - Large logic chip to small driver
• In these applications, a main logic ASIC needs to connect at 100 to
112 Gb/s to many small SiGe or GaAs driver devices
Kandou’s ideas for the CEI-112G in MCM interface
KANDOU BUS
68. Example dies that could be connected, typically using a packet
mechanism:
– Packet I/O subsystem
– Packet inspection/forwarding engine
– Traffic manager
– In-package switch fabric
– CPU, GPU, NPU, TPU, DSP processor dies
– Processor coherency fabric
– Processor I/O bus
– HPC fabric
o .
Example dies to connect with
the Logic-Logic application
KANDOU BUS
70. Five key questions exist for each application:
1. Use DC or AC coupling (or on-die only AC coupling)
in order to support a Silicon-to-SiGe (or III-V)
connection
2. Use a shared forwarded clock or use Clock-Data
Recovery (CDR)
3. Rely on the FEC of the I/O subsystem or not
4. Require pair orientation or not
5. Use CNRZ-5 or PAM-4 for the modulation technique
o .
Key questions for the CEI-112G in MCM interface
KANDOU BUS
71. Logic-Logic:
– Wants to have DC coupling to minimize the area required and
signal integrity impairment produced by AC coupling.
– It also wants to save power by not using a line code and
scrambling.
Logic-Driver:
– Often requires AC coupling to marry the common-mode
voltage levels of devices made from very different
semiconductor processes such as SiGe or GaAs.
– A compromise is to restrict the AC coupling to on-die AC
coupling.
DC or AC Coupling
KANDOU BUS
72. Logic-Logic:
– Since Logic-Logic applications are almost always outside of the
I/O subsystem and use packet mechanisms, there are no
relevant line clocks to work with.
• Power can be saved by using a shared forwarded clock
Logic-Driver:
– With the rise of 25GE and the future single lane 50GE & 100GE,
for VSR the incoming clocks on the different lanes can be
different since the links can come from different chassis.
• This makes it inconvenient to use a shared forwarded clock when
those multiple clocks have to be carried, so CDR is a more universal
choice
• Intra-system uses can often use a shared forwarded clock
Shared Forwarded Clock or CDR
KANDOU BUS
73. Logic-Logic:
– Are typically outside of the I/O subsystem and thus cannot rely
on its Forwarding Error Correcting block.
– Often use credit-based flow control that cannot tolerate a high-
latency FEC
Logic-Driver:
– The location w.r.t. the I/O subsystem can be mixed. The lanes
bound for outside of the system are protected by the FEC, but
intra-system lanes may not be.
Both applications generally need good native error
performance.
FEC or not
KANDOU BUS
74. Logic-Logic:
– Just wants the most throughput for the least power
• Does not care about pair-orientation.
– Wide packet busses are common.
Logic-Driver:
– Typically wants the data kept within pairs
• The data is often bound for an optical device.
Pair-orientation or not
KANDOU BUS
75. Logic-Logic:
– CNRZ-5 is an excellent choice given its NRZ-shaped eyes, high
native signal integrity, and low power.
– CNRZ-5’s eyes are ~ 70% wider and 95% taller than those of
PAM-4 in the included simulations. Implementations need much
less equalization.
Logic-Driver:
– PAM-4 is a good choice to allow a driver device to have the
same modulation on both of its sides.
NRZ is not likely to be viable for either given its excessive
switching speed, which looks to exceed what is possible in silicon
Modulation technique: CNRZ-5 or PAM-4
KANDOU BUS
76. • 5 bits on 6 wires
• 5 comparators
• Ideal for shorter connections
including die-to-die interconnect
inside a package
• Delivers NRZ shaped eyes at the
decision point
• 69.6 GBaud delivers 116 Gb/s
equivalent
• 50 GBaud delivers a useful
product
CNRZ-5
KANDOU BUS
77. Channel
– Real 1.2 cm MCM channel, extended
to 100GHz
– Uses GX13 substrate (er = 3.1, tandD =
0.019 @ 10GHz)
– Assumed 0.4ps skew between wires
• For example, PAM4 uses 2 wires. The
skew between the 2 wires is 0.4ps.
CNRZ5 uses 6 wires. The skew between
every wire and its neighbor is 0.4ps. The
total skew across the 6 wires is 2ps
Noise and jitter
– Gaussian noise with std dev of 2mV
– Rj (1 sigma) = 1% UI
– Dj p-p = 10% UI
Simulation setup
KANDOU BUS
78. Baud rate
– CNRZ5 (EE-DR variant): 69.6GBd (50 GBd also shown)
– PAM4: 58GBd
Impedance
– 50 ohms throughout
Tx
– Trise/Tfall = 5 ps
– Tx peak-to-peak single ended = 0.3V
– No FIR filter
Rx
– Auto-adaptive CTLE used
– Ranges from 0 to 12 dB (1.2 cm only needed 2 dB)
Simulation configuration
KANDOU BUS
83. This example bump
map is runs at 25 GBd
with little equalization
It gets 500 Gb/s per
direction over 26 wires
per direction in 2.4mm
of chip beachfront
– Uses 150 um
conventional bumps
Example bump map from 25 GBd implementation
KANDOU BUS
84. CNRZ-5 is the best choice for the Logic-Logic application.
Here is a good set of answers to our five key questions:
Logic-Logic:
1. DC coupling, silicon to silicon only
2. Shared forwarded clock
3. 1E-15 raw BER
4. Not pair-oriented
5. CNRZ-5
Logic-Driver:
1. DC coupled path, on-die AC coupling optional, silicon to SiGe (and III-V)
2. Clock-Data Recovery (CDR)
3. 1E-15 raw BER
4. Pair oriented
5. PAM-4
Conclusions
KANDOU BUS