1) The document discusses using logical effort to estimate delay in CMOS chips. Logical effort allows estimating delay without simulating specific transistor sizes.
2) Delay has two components - effort delay proportional to load and parasitic delay independent of load. Effort delay depends on logical effort and electrical effort.
3) Logical effort measures a gate's ability to source current relative to an inverter. Electrical effort is the ratio of output to input capacitance.
This document presents a new CMOS voltage divider based current mirror and compares it to basic and cascode current mirrors. The basic current mirror has limitations like finite output resistance and channel length modulation effects. The cascode current mirror improves output resistance but wastes threshold voltage. The new CMOS voltage divider current mirror uses an NMOS and PMOS transistor voltage divider to bias an NMOS transistor and control the output current. It consumes less power than the basic current mirror and is well-suited for low current biasing applications.
This presentation discusses the basics of Pass Transistor Logic, its advantages, limitation and finally implementation of Boolean functions/Combinational Logic circuits using Pass Transistor Logic.
1. The document provides instructions for laboratory experiments involving operational amplifiers. It includes procedures for measuring op-amp parameters, designing basic circuits like inverting and non-inverting amplifiers, and setting up more advanced circuits like integrators, differentiators, and instrumentation amplifiers.
2. Key circuits and components are explained theoretically before providing diagrams and step-by-step procedures to build and test each circuit. Characteristics like gain, frequency response, and output waveforms are analyzed.
3. The goal is to design and set up basic and advanced op-amp circuits, make voltage and waveform measurements, and analyze frequency responses to understand circuit behavior.
I have prepared it to create an understanding of delay modeling in VLSI.
Regards,
Vishal Sharma
Doctoral Research Scholar,
IIT Indore
vishalfzd@gmail.com
This document discusses dynamic logic circuits. It notes that dynamic logic circuits offer advantages over static logic circuits by temporarily storing charge in parasitic capacitances rather than relying on steady-state behavior. Dynamic logic circuits require periodic clock signals to control charge refreshing and allow for simple sequential circuits with memory. They can implement logic in smaller areas and thus consume less power than static logic. The document then discusses several examples of dynamic logic circuits like dynamic CMOS TG logic, domino CMOS logic, NORA logic, and their operating principles. It also covers issues like charge leakage and charge sharing that need to be addressed in dynamic logic circuits.
The document discusses different types of time base generators used to generate output voltage or current waveforms that vary linearly with time. It describes voltage time base generators and current time base generators. It then discusses various circuits used to implement these generators, including exponential sweep circuits, constant current sweep circuits, UJT sweep circuits, and Miller and bootstrap time base generators. The Miller and bootstrap generators aim to produce a linear output by using feedback to keep the capacitor charging current constant. Transistor implementations of Miller and bootstrap generators are also covered.
Low power VLSI design has become an important discipline due to increasing device densities, operating frequencies, and proliferation of portable electronics. Power dissipation, which was previously neglected, is now a primary design constraint. There are several sources of power dissipation in CMOS circuits, including switching power due to charging and discharging capacitances, short-circuit power during signal transitions, and leakage power from subthreshold and gate leakage currents. Designers have some control over power consumption by optimizing factors such as activity levels, clock frequency, supply voltage, transistor sizing and architecture.
This document presents a new CMOS voltage divider based current mirror and compares it to basic and cascode current mirrors. The basic current mirror has limitations like finite output resistance and channel length modulation effects. The cascode current mirror improves output resistance but wastes threshold voltage. The new CMOS voltage divider current mirror uses an NMOS and PMOS transistor voltage divider to bias an NMOS transistor and control the output current. It consumes less power than the basic current mirror and is well-suited for low current biasing applications.
This presentation discusses the basics of Pass Transistor Logic, its advantages, limitation and finally implementation of Boolean functions/Combinational Logic circuits using Pass Transistor Logic.
1. The document provides instructions for laboratory experiments involving operational amplifiers. It includes procedures for measuring op-amp parameters, designing basic circuits like inverting and non-inverting amplifiers, and setting up more advanced circuits like integrators, differentiators, and instrumentation amplifiers.
2. Key circuits and components are explained theoretically before providing diagrams and step-by-step procedures to build and test each circuit. Characteristics like gain, frequency response, and output waveforms are analyzed.
3. The goal is to design and set up basic and advanced op-amp circuits, make voltage and waveform measurements, and analyze frequency responses to understand circuit behavior.
I have prepared it to create an understanding of delay modeling in VLSI.
Regards,
Vishal Sharma
Doctoral Research Scholar,
IIT Indore
vishalfzd@gmail.com
This document discusses dynamic logic circuits. It notes that dynamic logic circuits offer advantages over static logic circuits by temporarily storing charge in parasitic capacitances rather than relying on steady-state behavior. Dynamic logic circuits require periodic clock signals to control charge refreshing and allow for simple sequential circuits with memory. They can implement logic in smaller areas and thus consume less power than static logic. The document then discusses several examples of dynamic logic circuits like dynamic CMOS TG logic, domino CMOS logic, NORA logic, and their operating principles. It also covers issues like charge leakage and charge sharing that need to be addressed in dynamic logic circuits.
The document discusses different types of time base generators used to generate output voltage or current waveforms that vary linearly with time. It describes voltage time base generators and current time base generators. It then discusses various circuits used to implement these generators, including exponential sweep circuits, constant current sweep circuits, UJT sweep circuits, and Miller and bootstrap time base generators. The Miller and bootstrap generators aim to produce a linear output by using feedback to keep the capacitor charging current constant. Transistor implementations of Miller and bootstrap generators are also covered.
Low power VLSI design has become an important discipline due to increasing device densities, operating frequencies, and proliferation of portable electronics. Power dissipation, which was previously neglected, is now a primary design constraint. There are several sources of power dissipation in CMOS circuits, including switching power due to charging and discharging capacitances, short-circuit power during signal transitions, and leakage power from subthreshold and gate leakage currents. Designers have some control over power consumption by optimizing factors such as activity levels, clock frequency, supply voltage, transistor sizing and architecture.
This document discusses and analyzes the voltage gain, input resistance, and output resistance of cascode and cascade amplifiers. It shows that cascode amplifiers have a voltage gain of -gm1gm2rπ2(1+β2)(RcRL) and input resistance of R2R3rπ1. Cascade amplifiers have an overall voltage gain that is the product of the individual stage gains, gm1gm2RC2RLRC1Ri2(Ri1/(Ri1+RS)), and output resistance of RC2. Cascode amplifiers have higher gain than single stage amplifiers, while cascade amplifiers have multiple stages to further increase gain.
Current sources, current mirrors, and current steering circuits are important components in integrated circuit design for providing stable bias currents. A constant current is first generated and then replicated across the circuit using current mirrors. Current mirrors use identical MOS transistors such that if the gate-source potentials are equal, the drain currents will be equal, allowing the reference current to be copied. There are various types of current mirror circuits that have different advantages and applications. Current can also be steered between paths using multiple current mirrors, with some mirrors acting as current sources and others as current sinks.
Single Sideband Suppressed Carrier (SSB-SC)Ridwanul Hoque
Single-sideband suppressed carrier (SSB-SC) modulation improves spectral efficiency by transmitting only one sideband. It requires a bandwidth equal to the signal bandwidth. SSB-SC can be detected coherently using multiplication by the carrier. Quadrature amplitude modulation (QAM) transmits two baseband signals over the same bandwidth using in-phase and quadrature carriers that are 90 degrees out of phase. Vestigial sideband (VSB) modulation is a compromise between DSB and SSB that inherits advantages of both while requiring only slightly greater bandwidth than SSB. It is used for broadcast television transmission.
This document provides an introduction to semi-custom integrated circuit design and different types of application-specific integrated circuits (ASICs). It discusses the evolution of IC scale and complexity from SSI to VLSI. The main types of ASICs are described as full-custom, cell-based, and gate-array based. Full-custom ASICs have all layers customized, cell-based ASICs use predefined standard cells, and gate-array based ASICs have predefined transistors with customized interconnect. Channeled and channel-less gate arrays are subtypes that differ in routing architecture. The document aims to outline the design approaches and tradeoffs of semi-custom IC design.
This presentation gives an overview of FPGA devices. An FPGA is a device that contains a matrix of re-configurable gate array logic circuitry. When a FPGA is configured, the internal circuitry is connected in a way that creates a hardware implementation of the software application.
FPGA devices can deliver the performance and reliability of dedicated hardware circuitry.
The document discusses single-stage amplifiers, specifically common source amplifiers. It covers the basics of common source amplifiers and different types of loads that can be used, including resistive loads. It analyzes the gain of common source amplifiers with resistive loads using both small-signal and large-signal models, taking into account effects such as channel length modulation. The analysis shows tradeoffs between gain, bandwidth, and voltage swing that must be considered in amplifier design.
The document presented an overview of operational amplifiers (OP-AMPs) given by Group 12. It defined an OP-AMP as an integrated circuit that amplifies input voltage through high gain. It described OP-AMP characteristics like high open-loop gain, large input resistance, and small output resistance. Common OP-AMP applications presented included comparators, integrators, differentiators, filters, and oscillators. Circuit diagrams were provided for low-pass filters, high-pass filters, and band-pass filters built using OP-AMPs.
This document contains solved examples related to information theory. It begins with examples calculating the information rate of a telegraph source with dots and dashes. It then provides examples calculating the entropy, message rate, and information rate of a PCM voice signal quantized into 16 levels. Further examples calculate the source entropy and information rate for a message source that generates one of four messages. Finally, it constructs the Shannon-Fano code for a source with five symbols of varying probabilities.
This document discusses CMOS VLSI design and MOS transistors. It introduces MOS transistors as the basic building blocks of integrated circuits and describes their four terminals - source, gate, drain, and body. It explains how doping silicon with group III or V elements creates n-type or p-type semiconductors and how applying different voltages to the gate controls the flow of current from source to drain, allowing MOS transistors to function as electrically controlled switches. The document presents the three operating regions for MOS transistors - cutoff, linear, and saturation - and how their I-V characteristics change based on the voltages applied to each terminal.
S-parameters are a useful method for representing a circuit as a "black box" whose external behavior can be predicted without knowledge of its internal contents. S-parameters are measured by sending a signal into the black box and detecting the waves that exit each port. They depend on the network, source and load impedances, and measurement frequency. Common S-parameters include S11 for the reflected signal at port 1 and S21 for the signal exiting port 2 due to a signal entering port 1.
This document discusses MOS transistor theory, including MOS structure, ideal and non-ideal I-V characteristics, capacitance models, and delay models. It describes how MOS transistors operate in different modes depending on terminal voltages and how carrier mobility and channel charge determine current in linear and saturation regions. Non-ideal effects like velocity saturation, body effect, and leakage currents are also covered. The document concludes with discussions of pass transistors, tri-state inverters, and using resistor-capacitor models to estimate delay.
This document provides an introduction to FPGA design fundamentals including:
- Programmable logic devices like PLDs, CPLDs, and FPGAs which allow for reconfigurable logic circuits.
- The basic architecture of FPGAs including configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable interconnect structure.
- Verilog and VHDL as common hardware description languages used for FPGA design entry and simulation.
- A simple example of designing a half-adder circuit in VHDL, including entity, architecture, and behavioral modeling style.
The document describes the design and simulation of half adders, full adders, multiplexers, and demultiplexers using VHDL. It includes block diagrams, truth tables, and VHDL code for implementing these circuits using dataflow, behavioral, and structural modeling in Xilinx ISE. Code examples and output waveforms are provided for half adders, full adders, 4-to-1 multiplexers, and 1-to-4 demultiplexers. The aim is to learn how to design and simulate basic digital circuits using different VHDL modeling approaches.
This presentation discusses MOSFET scaling and its challenges. It begins by covering Moore's Law, which states that the number of transistors on a chip doubles every 18 months. As sizes shrink due to scaling, short channel effects like drain-induced barrier lowering and hot carrier effects emerge. The presentation covers two types of scaling: constant field scaling, which keeps electric fields constant but increases power density; and constant voltage scaling, which is preferred as it avoids increased power density but reduces threshold voltage. Narrow width effects also occur when channel widths shrink and depletion regions overlap. Overall, the presentation provides an overview of MOSFET scaling techniques and the short channel effects that emerge as sizes shrink.
Double Side band Suppressed carrier (DSB-SC) Modulation and Demodulation.SAiFul IslAm
This document describes an experiment on double sideband suppressed carrier (DSB-SC) modulation and demodulation performed by electrical engineering students at the University of Asia Pacific. The objectives were to observe DSB-SC modulation using an MC1496 modulator and examine synchronous demodulation of DSB-SC signals. The experiment involved generating a message signal, carrier signal, and DSB-SC modulated signal. A balanced modulator was used to produce the DSB-SC signal. Synchronous demodulation using a balanced multiplier, low-pass filter, and same carrier signal as the modulator recovered the original message signal from the DSB-SC signal. The students observed input and output waveforms and discussed the circuit connections and results
This document discusses pass transistor logic, which uses MOS transistors to transfer charge between circuit nodes under gate control. It describes how nMOS and pMOS transistors can pass strong or weak signals depending on their configuration. Threshold voltage drops, charge sharing problems, and sneak paths that can occur in pass transistor logic circuits are also covered. The document provides examples of analyzing charge distribution before and after transistors turn on, and presents a general design for pass transistor logic gates that ensures both charging and discharging paths exist. Exercises are included on analyzing charge sharing and designing pass transistor logic circuits like majority gates and decoders.
This report details the design of a two-stage operational amplifier (op-amp) in Cadence. It begins with hand calculations of component parameters. A schematic is plotted and simulated for DC and AC analysis. The initial design does not meet specifications, so component parameters are modified through several iterations until specifications are met. Finally, geometry optimization using Mosek in MATLAB is presented, though long calculation times prevented results. The report demonstrates the op-amp design process from initial calculations through simulation and optimization to meet specifications.
This document discusses transmission line propagation coefficients including reflection coefficient and transmission coefficient. It defines the reflection coefficient as the ratio of reflected to incident voltage or current. Reflection and transmission coefficients are derived for a transmission line terminated by a load impedance. Standing wave patterns on transmission lines are also analyzed. Key properties of standing waves include maximum and minimum voltages occurring at intervals of half wavelength and voltages/currents being 90 degrees out of phase.
This document discusses delay modeling and analysis in CMOS VLSI circuits. It defines various delay metrics like propagation delay, rise/fall times, and contamination delay. RC delay models are presented to estimate delay where transistors are modeled as resistors and capacitances. Logical effort and parasitic delay linear models are also introduced for estimating gate delays based on their structure and fanout. Elmore delay calculations and minimizing diffusion capacitance through layout are covered as techniques for analyzing transient response and optimizing speed.
The document provides an introduction to the method of logical effort, which can be used to estimate delay in CMOS circuits. The method uses a simple delay model to allow rapid comparison of different logic structures and help select the fastest design. It defines the concept of logical effort to characterize the delay properties of different logic gates independent of load and transistor size. Logical effort, along with electrical effort and parasitic delay, is used to formulate a delay equation for logic gates. Examples are provided to demonstrate calculating logical effort values for common gates.
This document discusses and analyzes the voltage gain, input resistance, and output resistance of cascode and cascade amplifiers. It shows that cascode amplifiers have a voltage gain of -gm1gm2rπ2(1+β2)(RcRL) and input resistance of R2R3rπ1. Cascade amplifiers have an overall voltage gain that is the product of the individual stage gains, gm1gm2RC2RLRC1Ri2(Ri1/(Ri1+RS)), and output resistance of RC2. Cascode amplifiers have higher gain than single stage amplifiers, while cascade amplifiers have multiple stages to further increase gain.
Current sources, current mirrors, and current steering circuits are important components in integrated circuit design for providing stable bias currents. A constant current is first generated and then replicated across the circuit using current mirrors. Current mirrors use identical MOS transistors such that if the gate-source potentials are equal, the drain currents will be equal, allowing the reference current to be copied. There are various types of current mirror circuits that have different advantages and applications. Current can also be steered between paths using multiple current mirrors, with some mirrors acting as current sources and others as current sinks.
Single Sideband Suppressed Carrier (SSB-SC)Ridwanul Hoque
Single-sideband suppressed carrier (SSB-SC) modulation improves spectral efficiency by transmitting only one sideband. It requires a bandwidth equal to the signal bandwidth. SSB-SC can be detected coherently using multiplication by the carrier. Quadrature amplitude modulation (QAM) transmits two baseband signals over the same bandwidth using in-phase and quadrature carriers that are 90 degrees out of phase. Vestigial sideband (VSB) modulation is a compromise between DSB and SSB that inherits advantages of both while requiring only slightly greater bandwidth than SSB. It is used for broadcast television transmission.
This document provides an introduction to semi-custom integrated circuit design and different types of application-specific integrated circuits (ASICs). It discusses the evolution of IC scale and complexity from SSI to VLSI. The main types of ASICs are described as full-custom, cell-based, and gate-array based. Full-custom ASICs have all layers customized, cell-based ASICs use predefined standard cells, and gate-array based ASICs have predefined transistors with customized interconnect. Channeled and channel-less gate arrays are subtypes that differ in routing architecture. The document aims to outline the design approaches and tradeoffs of semi-custom IC design.
This presentation gives an overview of FPGA devices. An FPGA is a device that contains a matrix of re-configurable gate array logic circuitry. When a FPGA is configured, the internal circuitry is connected in a way that creates a hardware implementation of the software application.
FPGA devices can deliver the performance and reliability of dedicated hardware circuitry.
The document discusses single-stage amplifiers, specifically common source amplifiers. It covers the basics of common source amplifiers and different types of loads that can be used, including resistive loads. It analyzes the gain of common source amplifiers with resistive loads using both small-signal and large-signal models, taking into account effects such as channel length modulation. The analysis shows tradeoffs between gain, bandwidth, and voltage swing that must be considered in amplifier design.
The document presented an overview of operational amplifiers (OP-AMPs) given by Group 12. It defined an OP-AMP as an integrated circuit that amplifies input voltage through high gain. It described OP-AMP characteristics like high open-loop gain, large input resistance, and small output resistance. Common OP-AMP applications presented included comparators, integrators, differentiators, filters, and oscillators. Circuit diagrams were provided for low-pass filters, high-pass filters, and band-pass filters built using OP-AMPs.
This document contains solved examples related to information theory. It begins with examples calculating the information rate of a telegraph source with dots and dashes. It then provides examples calculating the entropy, message rate, and information rate of a PCM voice signal quantized into 16 levels. Further examples calculate the source entropy and information rate for a message source that generates one of four messages. Finally, it constructs the Shannon-Fano code for a source with five symbols of varying probabilities.
This document discusses CMOS VLSI design and MOS transistors. It introduces MOS transistors as the basic building blocks of integrated circuits and describes their four terminals - source, gate, drain, and body. It explains how doping silicon with group III or V elements creates n-type or p-type semiconductors and how applying different voltages to the gate controls the flow of current from source to drain, allowing MOS transistors to function as electrically controlled switches. The document presents the three operating regions for MOS transistors - cutoff, linear, and saturation - and how their I-V characteristics change based on the voltages applied to each terminal.
S-parameters are a useful method for representing a circuit as a "black box" whose external behavior can be predicted without knowledge of its internal contents. S-parameters are measured by sending a signal into the black box and detecting the waves that exit each port. They depend on the network, source and load impedances, and measurement frequency. Common S-parameters include S11 for the reflected signal at port 1 and S21 for the signal exiting port 2 due to a signal entering port 1.
This document discusses MOS transistor theory, including MOS structure, ideal and non-ideal I-V characteristics, capacitance models, and delay models. It describes how MOS transistors operate in different modes depending on terminal voltages and how carrier mobility and channel charge determine current in linear and saturation regions. Non-ideal effects like velocity saturation, body effect, and leakage currents are also covered. The document concludes with discussions of pass transistors, tri-state inverters, and using resistor-capacitor models to estimate delay.
This document provides an introduction to FPGA design fundamentals including:
- Programmable logic devices like PLDs, CPLDs, and FPGAs which allow for reconfigurable logic circuits.
- The basic architecture of FPGAs including configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable interconnect structure.
- Verilog and VHDL as common hardware description languages used for FPGA design entry and simulation.
- A simple example of designing a half-adder circuit in VHDL, including entity, architecture, and behavioral modeling style.
The document describes the design and simulation of half adders, full adders, multiplexers, and demultiplexers using VHDL. It includes block diagrams, truth tables, and VHDL code for implementing these circuits using dataflow, behavioral, and structural modeling in Xilinx ISE. Code examples and output waveforms are provided for half adders, full adders, 4-to-1 multiplexers, and 1-to-4 demultiplexers. The aim is to learn how to design and simulate basic digital circuits using different VHDL modeling approaches.
This presentation discusses MOSFET scaling and its challenges. It begins by covering Moore's Law, which states that the number of transistors on a chip doubles every 18 months. As sizes shrink due to scaling, short channel effects like drain-induced barrier lowering and hot carrier effects emerge. The presentation covers two types of scaling: constant field scaling, which keeps electric fields constant but increases power density; and constant voltage scaling, which is preferred as it avoids increased power density but reduces threshold voltage. Narrow width effects also occur when channel widths shrink and depletion regions overlap. Overall, the presentation provides an overview of MOSFET scaling techniques and the short channel effects that emerge as sizes shrink.
Double Side band Suppressed carrier (DSB-SC) Modulation and Demodulation.SAiFul IslAm
This document describes an experiment on double sideband suppressed carrier (DSB-SC) modulation and demodulation performed by electrical engineering students at the University of Asia Pacific. The objectives were to observe DSB-SC modulation using an MC1496 modulator and examine synchronous demodulation of DSB-SC signals. The experiment involved generating a message signal, carrier signal, and DSB-SC modulated signal. A balanced modulator was used to produce the DSB-SC signal. Synchronous demodulation using a balanced multiplier, low-pass filter, and same carrier signal as the modulator recovered the original message signal from the DSB-SC signal. The students observed input and output waveforms and discussed the circuit connections and results
This document discusses pass transistor logic, which uses MOS transistors to transfer charge between circuit nodes under gate control. It describes how nMOS and pMOS transistors can pass strong or weak signals depending on their configuration. Threshold voltage drops, charge sharing problems, and sneak paths that can occur in pass transistor logic circuits are also covered. The document provides examples of analyzing charge distribution before and after transistors turn on, and presents a general design for pass transistor logic gates that ensures both charging and discharging paths exist. Exercises are included on analyzing charge sharing and designing pass transistor logic circuits like majority gates and decoders.
This report details the design of a two-stage operational amplifier (op-amp) in Cadence. It begins with hand calculations of component parameters. A schematic is plotted and simulated for DC and AC analysis. The initial design does not meet specifications, so component parameters are modified through several iterations until specifications are met. Finally, geometry optimization using Mosek in MATLAB is presented, though long calculation times prevented results. The report demonstrates the op-amp design process from initial calculations through simulation and optimization to meet specifications.
This document discusses transmission line propagation coefficients including reflection coefficient and transmission coefficient. It defines the reflection coefficient as the ratio of reflected to incident voltage or current. Reflection and transmission coefficients are derived for a transmission line terminated by a load impedance. Standing wave patterns on transmission lines are also analyzed. Key properties of standing waves include maximum and minimum voltages occurring at intervals of half wavelength and voltages/currents being 90 degrees out of phase.
This document discusses delay modeling and analysis in CMOS VLSI circuits. It defines various delay metrics like propagation delay, rise/fall times, and contamination delay. RC delay models are presented to estimate delay where transistors are modeled as resistors and capacitances. Logical effort and parasitic delay linear models are also introduced for estimating gate delays based on their structure and fanout. Elmore delay calculations and minimizing diffusion capacitance through layout are covered as techniques for analyzing transient response and optimizing speed.
The document provides an introduction to the method of logical effort, which can be used to estimate delay in CMOS circuits. The method uses a simple delay model to allow rapid comparison of different logic structures and help select the fastest design. It defines the concept of logical effort to characterize the delay properties of different logic gates independent of load and transistor size. Logical effort, along with electrical effort and parasitic delay, is used to formulate a delay equation for logic gates. Examples are provided to demonstrate calculating logical effort values for common gates.
Very Large Scale Integration (VLSI) is a solid career choice and offers job opportunities for ECE freshers pursuing core employment. In India and overseas, VLSI provides a variety of employment roles featuring outstanding professional growth and salary incentives.
What is design VLSI?
Image result for vlsi design
VLSI Design - Digital System. Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining thousands of transistors into a single chip. VLSI began in the 1970s when complex semiconductor and communication technologies were being developed. The microprocessor is a VLSI device.
The document discusses CMOS transistor theory, including:
1) It describes the MOS capacitor structure and its operating modes of accumulation, depletion, and inversion.
2) It analyzes the I-V characteristics of nMOS and pMOS transistors in the cutoff, linear, and saturation regions based on the channel charge and carrier velocity.
3) It explains the gate, source, and drain capacitances of MOS transistors and how they impact speed. The gate capacitance contributes to channel charge while other capacitances are parasitic.
This document discusses designing combinational logic circuits using static complementary CMOS design. It explains how to construct static CMOS circuits for logic gates like NAND and NOR by using pull-up and pull-down networks of PMOS and NMOS transistors respectively. Issues related to pass-transistor design like noise margins and static power consumption are also covered. The document provides details on implementing various logic functions using pass-transistor logic and differential pass-transistor logic. It discusses solutions to overcome the disadvantages of pass-transistor logic like level restoration and use of multiple threshold transistors.
This document provides an overview of VLSI circuits and design. It discusses the evolution from transistors to integrated circuits, highlighting advantages like reduced size and cost. The VLSI design process involves problem specification, architecture definition, functional design, logic design, and physical design. CMOS technology is described, including transistor operation, fabrication, and basic gates. Dynamic CMOS uses precharge and evaluation phases to conditionally discharge outputs. Programmable logic devices like PLA, PAL, and FPGA are also summarized.
This document discusses CMOS digital integrated circuits and combinational logic circuits. It covers static CMOS circuits, NMOS and PMOS transistors, threshold calculations for logic gates like NOR and NAND, layout of logic gates, and device sizing in complex gates. The key points are:
- Static CMOS circuits have a continuous low-resistance path between outputs and power/ground.
- Threshold calculations allow NOR and NAND gates to switch at VDD/2.
- Layout and stick diagrams show transistor positions and connections for logic gates.
- Device sizing methods ensure all signal paths can support switching.
CMOS Analog IC design by Dr GS Javed - Refresher Course - Batch 1Javed G S, PhD
Topics covered in the course
1. DC Biasing of the circuits
2. Circuits for reference voltage and current generation
-Voltage Regulator
-BGR
-LDO
-V-to-I
3. Precision Current References
4. Opamp design for Analog to digital converters
- OTA
- Buffer
- Unity Feedback OTA
- Layout design strategies – 2stage opamp + CMFB
5. Sense and Return mechanisms in Feedback circuits
- Current and Voltage circuits
6. Sub-Threshold Conduction
- Low voltage Operation
7. ADC Design and Simulation
-Near Nyquist performance of Opamp for ADC Circuits
-Spectral Analysis and No. of FFT Points for simulation
-Simulation time for performance
-Resistors – their variation and Calibration
-Switch design for S/H
-CDAC
8. On-Chip Inductors
ER Publication,
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International Journals,
High Impact Journals,
Monthly Journal,
Good quality Journals,
Research,
Research Papers,
Research Article,
Free Journals, Open access Journals,
erpublication.org,
Engineering Journal,
Science Journals,
This document summarizes power in CMOS VLSI circuits. It discusses different sources of power consumption including dynamic power from switching capacitances and static power from leakage currents. Dynamic power is proportional to the activity factor, capacitance, supply voltage, and frequency. Static power comes from subthreshold leakage, gate leakage, junction leakage, and other leakage currents. The document provides examples of estimating power consumption and discusses techniques for reducing both dynamic and static power, such as clock gating, multi-threshold voltage techniques, and power gating.
This document discusses CMOS VLSI digital design. It covers physical principles of CMOS including dopants, nMOS and pMOS transistor operation, and CMOS inverters. It then discusses circuit-level CMOS design including combinational logic, sequential logic, datapaths, and memories. Fabrication steps for building CMOS circuits are outlined including oxidation, photolithography, etching, and diffusion. Circuit performance factors like capacitance, RC delay models, and crosstalk are also covered. Different circuit styles like dynamic logic and pass transistor logic are introduced. Finally, sequencing elements like latches and flip-flops used for sequential logic are discussed.
This chapter discusses static CMOS circuits. It covers the goals of optimizing gate metrics like area, speed, energy and robustness. It discusses static CMOS logic families and high-performance circuit design techniques. Static CMOS circuits keep each gate output connected to either VDD or VSS at all times, unlike dynamic circuits which rely on temporary signal storage. The chapter explains how to construct static CMOS gates using pull-up and pull-down networks and discusses transistor sizing to optimize performance.
This document summarizes key concepts in designing high-speed, broadband amplifiers for communication circuits. It discusses the need to amplify signals to boost levels and provide isolation. Common amplifier configurations are analyzed, including their gain, bandwidth, and frequency of operation. Factors that influence amplifier speed like transistor sizing and biasing are covered. Different amplifier topologies are presented, such as the resistor-loaded amplifier, which can achieve high bandwidth by avoiding Miller multiplication. Design tradeoffs around speed, power usage, and cascading multiple stages are also summarized.
VLSI affords IC designers the ability to design utilizing less space. Typically, electronic circuits incorporate a CPU, RAM, ROM, and other peripherals on a single PCBA. However, very large-scale integration (VLSI) technology affords an IC designer the ability to add all of these into one chip.
Introduction to CMOS VLSI Design:
This Presentations is design in way to provide basic summary of CMOS Vlsi design
This Presentation is Made at Eutectics.blogspot.in
the following is the structure of presentation :
2: Outline
3: Introduction
4: MOS capacitor
5: Terminal Voltage
6: nMOS Cutoff
7: nMOS Linear
8: nMOS Saturation
9: I-V Characteristics
10 : Channel Charge
11: Carrier velocity
12: nMOS Linear I-V
13: nMOS Saturation
14: nMOS I-V Summary
15: Example
16: pMOS I-V
17: Capacitance
18: Gate Capacitance
19: Diffusion Capacitane
20: Pass Transistor
21: Pass transistor ckts
22: Effective Resistance
23: RC Delay Model
24: RC values
25: Inverter Delay Estimate
- The document discusses various techniques for designing fast complex logic gates in VLSI circuits.
- Two transistor sizing techniques are presented: progressive transistor sizing and transistor ordering to reduce signal delay.
- Alternative logic structures, buffer insertion, and reducing voltage swing are additional techniques described.
- The concept of logical effort is introduced as a way to optimize logic paths for speed based on the topology rather than transistor sizing.
Advd lecture 09 - microsoft power point - lec-9-inverte-rpart4 [compatibili...Hardik Gupta
This document discusses static CMOS logic design. It can be made pipelined by inserting latches between combinational logic stages. Static CMOS uses complementary signals and requires both NMOS and PMOS transistors. The propagation delay increases with higher fan-in because of increased capacitive loading on internal nodes. Other logic styles discussed include pseudo-NMOS, dynamic CMOS, pass transistor logic, and switch logic.
The document discusses delay modeling in digital VLSI circuits. It notes that circuit delay depends on many factors like charge, discharge, parasitics, transistor width-to-length ratio, fan-in, fan-out and topology. Existing delay models do not clearly indicate the contribution of each factor. This wastes circuit designers' time in simulation and tweaking. The document then presents a delay model based on logical effort that estimates delay based on the topology of the gate and relative sizes of its transistors. It shows how to compute logical effort values and parasitic delays for different gates. Applying this model helps optimize circuit design parameters like transistor sizes, number of stages in a path and topology for minimum delay.
This document provides an overview of different types of capacitors used in CMOS technology, including PN junction capacitors, MOSFET gate capacitors, and conductor-insulator-conductor capacitors. It discusses the characteristics and structures of each type of capacitor, as well as experimental results on their quality factors and variations in capacitance with voltage. PN junction capacitors are formed from diffusions and exhibit higher quality factors when using smaller island sizes. MOSFET gate capacitors have nonlinear capacitance depending on the voltage between the gate and other terminals. Conductor-insulator-conductor capacitors such as poly-poly and metal-insulator-metal capacitors provide linear capacitance with low parasitic effects.
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Delay Calculation in CMOS Chips Using Logical Effort by Prof. Akhil Masurkar
1. Delay Calculation in CMOS Chips Using
Logical Effort
By
Prof. Akhil U Masurkar (AUM)
B.E. Electronics, M.E. Electronics
Department of Electronics Engineering
Vidyalankar Institute of Technology, Mumbai
2. CMOS VLSI Design
Outline
RC Delay Estimation
Logical Effort
Delay in a Logic Gate
Multistage Logic Networks
Choosing the Best Number of Stages
Example
Summary
3. CMOS VLSI Design
RC Delay Model
Use equivalent circuits for MOS transistors
– Ideal switch + capacitance and ON resistance
– nMOS having unit width has resistance R
– pMOS having unit width has resistance 2R
(since µp< µn and µn = 2 µp)
– Therefore a pMOS transistor having double unit
width will have resistance R (since R α 1/w)
Capacitance proportional to width
Resistance inversely proportional to width
8. CMOS VLSI Design
Example: 3-input NAND
Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall resistances
equal to a unit inverter (R).
9. CMOS VLSI Design
Example: 3-input NAND
Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall resistances
equal to a unit inverter (R).
10. CMOS VLSI Design
Example: 3-input NAND
Sketch a 3-input NAND with transistor widths
chosen to achieve effective rise and fall resistances
equal to a unit inverter (R).
3
3
222
3
11. CMOS VLSI Design
3-input NAND Caps
Annotate the 3-input NAND gate with gate and
diffusion capacitance.
2 2 2
3
3
3
13. CMOS VLSI Design
3-input NAND Caps
Annotate the 3-input NAND gate with gate and
diffusion capacitance.
9C
3C
3C3
3
3
222
5C
5C
5C
14. CMOS VLSI Design
Elmore Delay
ON transistors look like resistors
Pullup or pulldown network modeled as RC ladder
Elmore delay of RC ladder
R1
R2
R3
RN
C1
C2
C3
CN
nodes
1 1 1 2 2 1 2... ...
pd i to source i
i
N N
t R C
R C R R C R R R C
15. CMOS VLSI Design
Example: 2-input NAND
Estimate worst-case rising and falling delay of 2-
input NAND driving h identical gates.
h copies
2
2
22
B
A
x
Y
16. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
17. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
R
(6+4h)C
Y
pdrt
18. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
R
(6+4h)C
Y 6 4pdrt h RC
19. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
20. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
pdft (6+4h)C2CR/2
R/2x Y
21. CMOS VLSI Design
Example: 2-input NAND
Estimate rising and falling propagation delays of a 2-
input NAND driving h identical gates.
h copies6C
2C2
2
22
4hC
B
A
x
Y
2 2 22 6 4
7 4
R R R
pdft C h C
h RC
(6+4h)C2CR/2
R/2x Y
22. CMOS VLSI Design
Delay Components
Delay has two parts
– Parasitic delay
• 6RC or 7RC
• Independent of load
– Effort delay
• 4hRC
• Proportional to load capacitance
23. CMOS VLSI Design
Delay Components After Scaling
Delay has two parts
– Parasitic delay
• 6RC or 7RC
• Independent of load
– Effort delay
• 4hRC/k
• Proportional to load capacitance
24. CMOS VLSI Design
NOTE
Parasitic delay of 6 or 7 is determined by the gate driving its
own internal diffusion capacitance.
By increasing the width the resistance value decreases
whereas the capacitance value increases by the same factor.
Hence the transistors Parasitic gate Delay is Independent of
the transistors width.
The effort delay of (4h/k)C depends on the ratio (h) of external
load capacitance to input capacitance and hence changes
with the transistors width.
The factor 4 is set by the complexity of the gate.
The capacitance ratio is called as the electrical effort or fan-
out.
The term indicating gate complexity is called the logical
effort.
25. CMOS VLSI Design
Introduction
Chip designers face a bewildering array of choices
– What is the best circuit topology for a function?
– How many stages of logic give least delay?
– How wide should the transistors be?
Logical effort is a method to make these decisions
– Uses a simple model of delay
– Allows back-of-the-envelope calculations
– Helps make rapid comparisons between alternatives
– Emphasizes remarkable symmetries
? ? ?
26. CMOS VLSI Design
Delay in a Logic Gate
Express delays in process-independent unit
Delay has two components
abs
d
d
d f p
27. CMOS VLSI Design
Delay in a Logic Gate
Express delays in process-independent unit
Delay has two components
Effort delay f = gh (a.k.a. stage effort)
– Again has two components
absd
d
d pf
28. CMOS VLSI Design
Delay in a Logic Gate
Express delays in process-independent unit
Delay has two components
Effort delay f = gh (a.k.a. stage effort)
– Again has two components
g: logical effort
– Measures relative ability of gate to deliver current
– g 1 for inverter
absd
d
d f p
29. CMOS VLSI Design
Delay in a Logic Gate
Express delays in process-independent unit
Delay has two components
Effort delay f = gh (a.k.a. stage effort)
– Again has two components
h: electrical effort = Cout / Cin
– Ratio of output to input capacitance
– Sometimes called fanout
absd
d
d f p
30. CMOS VLSI Design
Delay in a Logic Gate
Express delays in process-independent unit
Delay has two components
Parasitic delay p
– Represents delay of gate driving no load
– Set by internal parasitic capacitance
absd
d
d pf
31. CMOS VLSI Design
Delay Plots
d = f + p
= gh + p
ElectricalEffort:
h = Cout
/ Cin
NormalizedDelay:d
Inverter
2-input
NAND
g =
p =
d =
g =
p =
d =
0 1 2 3 4 5
0
1
2
3
4
5
6
32. CMOS VLSI Design
Delay Plots
d = f + p
= gh + p
What about
NOR2?
ElectricalEffort:
h = Cout
/ Cin
NormalizedDelay:d
Inverter
2-input
NAND
g = 1
p = 1
d = h +1
g = 4/3
p = 2
d = (4/3)h +2
EffortDelay:f
Parasitic Delay: p
0 1 2 3 4 5
0
1
2
3
4
5
6
33. CMOS VLSI Design
Computing Logical Effort
DEF: Logical effort is the ratio of the input
capacitance of a gate to the input capacitance of an
inverter delivering the same output current.
Measure from delay vs. fanout plots
Or estimate by counting transistor widths
A Y
A
B
Y
A
B
Y
1
2
1 1
2 2
2
2
4
4
Cin
= 3
g = 3/3
Cin
= 4
g = 4/3
Cin
= 5
g = 5/3
34. CMOS VLSI Design
Catalog of Gates
Logical effort of common gates
Gate type Number of inputs
1 2 3 4 n
Inverter 1
NAND 4/3 5/3 6/3 (n+2)/3
NOR 5/3 7/3 9/3 (2n+1)/3
Tristate / mux 2 2 2 2 2
XOR, XNOR 4, 4 6, 12, 6 8, 16, 16, 8
35. CMOS VLSI Design
Catalog of Gates
Parasitic delay of common gates
– In multiples of pinv (1)
Gate type Number of inputs
1 2 3 4 n
Inverter 1
NAND 2 3 4 n
NOR 2 3 4 n
Tristate / mux 2 4 6 8 2n
XOR, XNOR 4 6 8
36. CMOS VLSI Design
Example: FO4 Inverter
Estimate the delay of a fanout-of-4 (FO4) inverter
Logical Effort: g =
Electrical Effort: h =
Parasitic Delay: p =
Stage Delay: d =
d
37. CMOS VLSI Design
Example: FO4 Inverter
Estimate the delay of a fanout-of-4 (FO4) inverter
Logical Effort: g = 1
Electrical Effort: h = 4
Parasitic Delay: p = 1
Stage Delay: d = 5
d
The FO4 delay is about
200 ps in 0.6 mm process
60 ps in a 180 nm process
f/3 ns in an f mm process
38. CMOS VLSI Design
Multistage Logic Networks
Logical effort generalizes to multistage networks
Path Logical Effort
Path Electrical Effort
Path Effort
iG g
out-path
in-path
C
H
C
i i iF f g h
10
x
y z
20
g1 = 1
h1
=x/10
g2 =5/3
h2
=y/x
g3 =4/3
h3
=z/y
g4 = 1
h4
=20/z
39. CMOS VLSI Design
Multistage Logic Networks
Logical effort generalizes to multistage networks
Path Logical Effort
Path Electrical Effort
Path Effort
Can we write F = GH?
iG g
out path
in path
C
H
C
i i iF f g h
40. CMOS VLSI Design
Paths that Branch
No! Consider paths that branch:
G =
H =
GH =
h1 =
h2 =
F = GH?
5
15
15
90
90
42. CMOS VLSI Design
Branching Effort
Introduce branching effort
– Accounts for branching between stages in path
Now we compute the path effort
– F = GBH
on path off path
on path
C C
b
C
iB b ih BH
Note:
43. CMOS VLSI Design
Multistage Delays
Path Effort Delay
Path Parasitic Delay
Path Delay
F iD f
iP p
i FD d D P
44. CMOS VLSI Design
Designing Fast Circuits
Delay is smallest when each stage bears same effort
Thus minimum delay of N stage path is
This is a key result of logical effort
– Find fastest possible delay
– Doesn’t require calculating gate sizes
i FD d D P
1
ˆ N
i if g h F
1
N
D NF P
45. CMOS VLSI Design
Gate Sizes
How wide should the gates be for least delay?
Working backward, apply capacitance
transformation to find input capacitance of each gate
given load it drives.
Check work by verifying input cap spec is met.
ˆ
ˆ
out
in
i
i
C
C
i out
in
f gh g
g C
C
f
46. CMOS VLSI Design
Example: 3-stage path
Select gate sizes x and y for least delay from A to B
8
x
x
x
y
y
45
45
A
B
47. CMOS VLSI Design
Example: 3-stage path
Logical Effort G =
Electrical Effort H =
Branching Effort B =
Path Effort F =
Best Stage Effort
Parasitic Delay P =
Delay D =
8
x
x
x
y
y
45
45
A
B
ˆf
48. CMOS VLSI Design
Example: 3-stage path
Logical Effort G = (4/3)*(5/3)*(5/3) = 100/27
Electrical Effort H = 45/8
Branching Effort B = 3 * 2 = 6
Path Effort F = GBH = 125
Best Stage Effort
Parasitic Delay P = 2 + 3 + 2 = 7
Delay D = 3*5 + 7 = 22 = 4.4 FO4
8
x
x
x
y
y
45
45
A
B
3ˆ 5f F
50. CMOS VLSI Design
Example: 3-stage path
Work backward for sizes
y = 45 * (5/3) / 5 = 15
x = (15*2) * (5/3) / 5 = 10
P: 4
N: 4
45
45
A
B
P: 4
N: 6
P: 12
N: 3
51. CMOS VLSI Design
Best Number of Stages
How many stages should a path use?
– Minimizing number of stages is not always fastest
Example: drive 64-bit datapath with unit inverter
D =
1 1 1 1
64 64 64 64
InitialDriver
DatapathLoad
N:
f:
D:
1 2 3 4
52. CMOS VLSI Design
Best Number of Stages
How many stages should a path use?
– Minimizing number of stages is not always fastest
Example: drive 64-bit datapath with unit inverter
D = NF1/N + P
= N(64)1/N + N
1 1 1 1
8 4
16 8
2.8
23
64 64 64 64
InitialDriver
DatapathLoad
N:
f:
D:
1
64
65
2
8
18
3
4
15
4
2.8
15.3
Fastest
53. CMOS VLSI Design
Derivation
Consider adding inverters to end of path
– How many give least delay?
Define best stage effort
N - n1
ExtraInverters
Logic Block:
n1
Stages
Path EffortF
11
1
1
N
n
i inv
i
D NF p N n p
1 1 1
ln 0N N N
inv
D
F F F p
N
1 ln 0invp
1
N
F
54. CMOS VLSI Design
Best Stage Effort
has no closed-form solution
Neglecting parasitics (pinv = 0), we find = 2.718 (e)
For pinv = 1, solve numerically for = 3.59
1 ln 0invp
55. CMOS VLSI Design
Sensitivity Analysis
How sensitive is delay to using exactly the best
number of stages?
2.4 < < 6 gives delay within 15% of optimal
– We can be sloppy!
– I like = 4
1.0
1.2
1.4
1.6
1.0 2.00.5 1.40.7
N / N
1.15
1.26
1.51
( =2.4)(=6)
D(N)/D(N) 0.0
56. CMOS VLSI Design
Review of Definitions
Term Stage Path
number of stages
logical effort
electrical effort
branching effort
effort
effort delay
parasitic delay
delay
iG g
out-path
in-path
C
CH
N
iB b
F GBH
F iD f
iP p
i FD d D P
out
in
C
Ch
on-path off-path
on-path
C C
Cb
f gh
f
p
d f p
g
1
57. CMOS VLSI Design
Method of Logical Effort
1) Compute path effort
2) Estimate best number of stages
3) Sketch path with N stages
4) Estimate least delay
5) Determine best stage effort
6) Find gate sizes
F GBH
4logN F
1
N
D NF P
1
ˆ N
f F
ˆ
i
i
i out
in
g C
C
f
58. CMOS VLSI Design
Limits of Logical Effort
Chicken and egg problem
– Need path to compute G
– But don’t know number of stages without G
Simplistic delay model
– Neglects input rise time effects
Interconnect
– Iteration required in designs with wire
Maximum speed only
– Not minimum area/power for constrained delay
59. CMOS VLSI Design
Summary
Logical effort is useful for thinking of delay in circuits
– Numeric logical effort characterizes gates
– NANDs are faster than NORs in CMOS
– Paths are fastest when effort delays are ~4
– Path delay is weakly sensitive to stages, sizes
– But using fewer stages doesn’t mean faster paths
– Delay of path is about log4F FO4 inverter delays
– Inverters and NAND2 best for driving large caps
Provides language for discussing fast circuits
– But requires practice to master
60. CMOS VLSI Design
References
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Brodersen, Fellow, IEEE.
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C.H. Sequin, Ed., Advanced Research in VLSI. Cambridge, MA: MIT Press, 1991.
V. G. Oklobdzija, “High-Performance System Design: Circuits and Logic”, IEEE Press, February 1999.
Jan Rabaey, “Digital Integrated Circuits: A Design Perspective”, Prentice Hall, 1996. Synopsys Library
Documentation.
H. Dao and V. G. Oklobdzija, “Comparative Delay Analysis of Representative Adders Using Logical Effort
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H. Dao and V. G. Oklobdzija, “Application of Logical Effort on Delay Analysis of 64-bit Static Carry-Look-
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Xiao Yan Yu , William W. Walker Application of Logical Effort on Design of Arithmetic Blocks
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