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Digital VLSI Design
• Full Automation
• Maximum benefit of scaling
• High speed ,
• low power
• Robustness
• Full Automation
• Maximum benefit of scaling
• High speed ,
• low power
• Robustness
Need of simple delay model
• Delay depends on many factors—charge,
discharge, parasitic, w/L, fan in- fanout,
topology
• Existing delay models do not give clear
indication of contribution of each factor
• Circuit designers waste too much time
simulating and tweaking circuits
2
• Delay depends on many factors—charge,
discharge, parasitic, w/L, fan in- fanout,
topology
• Existing delay models do not give clear
indication of contribution of each factor
• Circuit designers waste too much time
simulating and tweaking circuits
Using LE in design of inverter
chain
3
Using LE in design of inverter
chain
CKT DESIGN PROBLEMS
• Chip designers face a bewildering array of
choices.
• What is the best circuit topology for a
function?
• How large should the transistors be?
• How many stages of logic give least
delay?
4
• Chip designers face a bewildering array of
choices.
• What is the best circuit topology for a
function?
• How large should the transistors be?
• How many stages of logic give least
delay?
Need of simple delay model
• Circuit designers waste too much time
simulating and tweaking circuits
• High speed logic designers need to know
where time is going in their logic
• CAD engineers need to understand
circuits to build better tools
5
• Circuit designers waste too much time
simulating and tweaking circuits
• High speed logic designers need to know
where time is going in their logic
• CAD engineers need to understand
circuits to build better tools
Delay in a Logic Gate
6
Delay contributors
• τ is speed of basic transistor
• p-intrinsic delay of the gate due to its own
internal capacitances
• h—combines the effect of external load
with sizes of transistors
• g– effect of circuit topology
7
• τ is speed of basic transistor
• p-intrinsic delay of the gate due to its own
internal capacitances
• h—combines the effect of external load
with sizes of transistors
• g– effect of circuit topology
Observations
• Logical effort describes relative ability of gate
topology to deliver current [defined to be 1(best
av. of charge and discharge both] for an
inverter)
• Electrical effort is the ratio of output to input
capacitance
• Delay increases with electrical effort
• Delay increases ---More complex gates have
greater logical effort and parasitic delay
8
• Logical effort describes relative ability of gate
topology to deliver current [defined to be 1(best
av. of charge and discharge both] for an
inverter)
• Electrical effort is the ratio of output to input
capacitance
• Delay increases with electrical effort
• Delay increases ---More complex gates have
greater logical effort and parasitic delay
Estimation of Estimation of 
CMOS Ring Oscillator Circuit
• An odd number of inverter circuits
connected serially with output
brought back to input will be astable
and can be used an an oscillator
(called a ring oscillator)
• Ring oscillators are typically used to
characterize a new technology as to
its intrinsic device performance
• Frequency and stage are related as
follows:
f = 1/T = 1/(2nP)
where n is the number of stages
and
P is the stage delay
• An odd number of inverter circuits
connected serially with output
brought back to input will be astable
and can be used an an oscillator
(called a ring oscillator)
• Ring oscillators are typically used to
characterize a new technology as to
its intrinsic device performance
• Frequency and stage are related as
follows:
f = 1/T = 1/(2nP)
where n is the number of stages
and
P is the stage delay
Ring Oscillator—COMPARING
DIFFERENT TECHNOLOGIES
v0 v1 v5
v1 v2v0 v3 v4 v5
v0 v1 v5
v1 v2v0 v3 v4 v5
T = 2  tp  N 2 N tp >> tf +tr
Computing Logical Effort
12
Different gates
13
Observations
• More complex gates have larger logical
efforts
• Logical efforts grow with increase in no. of
inputs
• Complex gates exhibit high g, greater
delay
14
• More complex gates have larger logical
efforts
• Logical efforts grow with increase in no. of
inputs
• Complex gates exhibit high g, greater
delay
Parasitic delay
• It is fixed for a gate
• More complex gate—higher parasitic delay
• Ref. Pinv=1 (inverter parasitic delay )
• For other gates , parasitic delay is written
in terms of pinv
15
• It is fixed for a gate
• More complex gate—higher parasitic delay
• Ref. Pinv=1 (inverter parasitic delay )
• For other gates , parasitic delay is written
in terms of pinv
Parasitic delay
16
How to compute Pinv
• For inv. g=1, dabs= τ(h+pinv)
• In a given tech., plot d vs. h
• Plot would be st. line with slope τ, & intercept-
(pinv × τ)
• Pinv can be estimated after obtaining τ
• Draw similar plot for other gates
• Once τ is obtained , g and p of other gates can
be found out.
17
• For inv. g=1, dabs= τ(h+pinv)
• In a given tech., plot d vs. h
• Plot would be st. line with slope τ, & intercept-
(pinv × τ)
• Pinv can be estimated after obtaining τ
• Draw similar plot for other gates
• Once τ is obtained , g and p of other gates can
be found out.
Delay equation plot
18
Choice Of Standard Reference
Calculating delay of an inverter
20
Delay of 2 input Nand gate
Delay of 2 input NOR gate
MINIMUM POSSIBLE DELAY
Computing Intrinsic Transistor
Capacitance
• Intrinsic PN junction capacitance of the
driving circuit must be added to the load
capacitance Cload
• Consider the inverter example at left:
– Area and perimeter of the PMOS and
NMOS transistors are calculated from
the layout and inserted into the circuit
model
• NMOS drain area = Wn x Ddrain
• PMOS drain area = Wp x Ddrain
• NMOS drain perimeter = 2 (Wn + Ddrain)
• PMOS drain perimeter = 2 (Wp + Ddrain)
• SPICE simulations were done (bottom
left) for a fixed extrinsic load of 100fF
with increasing transistor width (Wp/Wn
= 2.75)
– Results show diminishing returns
beyond a certain Wn (say about 6 um)
due to effect of the increasing drain
capacitance on the overall capacitive
load
• Intrinsic PN junction capacitance of the
driving circuit must be added to the load
capacitance Cload
• Consider the inverter example at left:
– Area and perimeter of the PMOS and
NMOS transistors are calculated from
the layout and inserted into the circuit
model
• NMOS drain area = Wn x Ddrain
• PMOS drain area = Wp x Ddrain
• NMOS drain perimeter = 2 (Wn + Ddrain)
• PMOS drain perimeter = 2 (Wp + Ddrain)
• SPICE simulations were done (bottom
left) for a fixed extrinsic load of 100fF
with increasing transistor width (Wp/Wn
= 2.75)
– Results show diminishing returns
beyond a certain Wn (say about 6 um)
due to effect of the increasing drain
capacitance on the overall capacitive
load
MINIMUM DELAY ~ ZERO DELAY
R= Wp/Wn
Non zero value
Area x Delay Figure of Merit
• Increasing device width shows
diminishing returns on propagation
delay time
• Define a figure of merit as area x delay
for the inverter circuit
– Increasing device width Wn shows a
minimum in area x delay product
• Unconstrained increase in transistor
width in order to improve circuit delay
is often a poor tradeoff due to the high
cost of silicon real estate on the wafer!!
• Increasing device width shows
diminishing returns on propagation
delay time
• Define a figure of merit as area x delay
for the inverter circuit
– Increasing device width Wn shows a
minimum in area x delay product
• Unconstrained increase in transistor
width in order to improve circuit delay
is often a poor tradeoff due to the high
cost of silicon real estate on the wafer!!
Design a chain of inv. for min delay
T-network Delay Model Of wire
• Star-delta-transformation
• Vout=ZBC/(ZAB+ZBC)
• Vout=[(2/RC)/(S+2/RC)]*(1/S)
• =(1/s)-1/(s+2/RC)
• =U(t)[1-exp(-2/RC)t]
• FOR V50% delay
• tp=(RC ln2)/2=0.35 RC
• Star-delta-transformation
• Vout=ZBC/(ZAB+ZBC)
• Vout=[(2/RC)/(S+2/RC)]*(1/S)
• =(1/s)-1/(s+2/RC)
• =U(t)[1-exp(-2/RC)t]
• FOR V50% delay
• tp=(RC ln2)/2=0.35 RC
Delay in the presence of long wires
Design Of Inverter Chain
For Min. Delay
Sizing a path for minimum delay
EE141 34
Branching effort along a path
→ Used for sizing
for delay
EE141 35
Where BH is
→ Used for sizing
for delay
Observations regarding F
• F depends on only topology and loading
• F is Indep. of transistor sizes
• F is unchanged if inverters are added or
removed
EE141 36
• F depends on only topology and loading
• F is Indep. of transistor sizes
• F is unchanged if inverters are added or
removed
Path Delay D
• Sum of delay of all stages
EE141 37
Condition for min. path delay
EE141 38
EE141 39
On Differentiation:
Thus, minimum stage effort of each stage reqd. for
min. delay along a path is
We shd. choose transistor
sizes such that stage effort
is same for all blocks
EE141 40
Thus, minimum delay achievable along a path is
We shd. choose transistor
sizes such that stage effort
is same for all blocks
Example
Compute for
each stage
Apply capacitance transformation backwards
i
EE141 41
Apply capacitance transformation backwards
Chain Of Inverters
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
Optimizing no of stages in a path
for min. delay
43
To find optimum N
EE14144If pinv = 0,
For Ň stages in chain with inverters
Best delay per stage , d = gh + pinv
d = ρ + pinv
45
For Ň stages in chain with inverters
Best delay per stage , d = gh + pinv
d = ρ + pinv
Graphical sol
As pinv grows, adding inverters become less advantageous
EE14146
Chain Of Inverters— BEST NO OF STAGES
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
Chain Of Inverters— BEST NO OF STAGES
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
gu= gav x [2 µ / (γ+μ)]
gd= gav x [2 γ / (γ+μ)]
C2
C1
Ci
CL
1 u u2
uN-1
In Out
uopt = e
For large N, delay expression-
49
For ρ = 4
Ď = log 4F X FO4
Where FO4 = fanout of 4 inverter delay
FO4 DELAY
50
HERE ρ = gh = 1 x 4 = 4; so d = 5τ
Thus for ρ = 4
Ď = log 4F X FO4 inverter delay
51
Wrong no of stages
52
EE14153
Wrong size, L=1
Ρ=4
W 4sW 16 W
C=1
C=4s
C=16
54
Mis-sized
Ρ=4
Ρ=4/ s
Ρ= 4s
D = ∑gh + ∑pinv
= (4s + 4/s + 4 ) + 3 pinv
= 15 units (s=1)
EE14155

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Advd lecture 7 logical effort

  • 1. Digital VLSI Design • Full Automation • Maximum benefit of scaling • High speed , • low power • Robustness • Full Automation • Maximum benefit of scaling • High speed , • low power • Robustness
  • 2. Need of simple delay model • Delay depends on many factors—charge, discharge, parasitic, w/L, fan in- fanout, topology • Existing delay models do not give clear indication of contribution of each factor • Circuit designers waste too much time simulating and tweaking circuits 2 • Delay depends on many factors—charge, discharge, parasitic, w/L, fan in- fanout, topology • Existing delay models do not give clear indication of contribution of each factor • Circuit designers waste too much time simulating and tweaking circuits
  • 3. Using LE in design of inverter chain 3 Using LE in design of inverter chain
  • 4. CKT DESIGN PROBLEMS • Chip designers face a bewildering array of choices. • What is the best circuit topology for a function? • How large should the transistors be? • How many stages of logic give least delay? 4 • Chip designers face a bewildering array of choices. • What is the best circuit topology for a function? • How large should the transistors be? • How many stages of logic give least delay?
  • 5. Need of simple delay model • Circuit designers waste too much time simulating and tweaking circuits • High speed logic designers need to know where time is going in their logic • CAD engineers need to understand circuits to build better tools 5 • Circuit designers waste too much time simulating and tweaking circuits • High speed logic designers need to know where time is going in their logic • CAD engineers need to understand circuits to build better tools
  • 6. Delay in a Logic Gate 6
  • 7. Delay contributors • τ is speed of basic transistor • p-intrinsic delay of the gate due to its own internal capacitances • h—combines the effect of external load with sizes of transistors • g– effect of circuit topology 7 • τ is speed of basic transistor • p-intrinsic delay of the gate due to its own internal capacitances • h—combines the effect of external load with sizes of transistors • g– effect of circuit topology
  • 8. Observations • Logical effort describes relative ability of gate topology to deliver current [defined to be 1(best av. of charge and discharge both] for an inverter) • Electrical effort is the ratio of output to input capacitance • Delay increases with electrical effort • Delay increases ---More complex gates have greater logical effort and parasitic delay 8 • Logical effort describes relative ability of gate topology to deliver current [defined to be 1(best av. of charge and discharge both] for an inverter) • Electrical effort is the ratio of output to input capacitance • Delay increases with electrical effort • Delay increases ---More complex gates have greater logical effort and parasitic delay
  • 10. CMOS Ring Oscillator Circuit • An odd number of inverter circuits connected serially with output brought back to input will be astable and can be used an an oscillator (called a ring oscillator) • Ring oscillators are typically used to characterize a new technology as to its intrinsic device performance • Frequency and stage are related as follows: f = 1/T = 1/(2nP) where n is the number of stages and P is the stage delay • An odd number of inverter circuits connected serially with output brought back to input will be astable and can be used an an oscillator (called a ring oscillator) • Ring oscillators are typically used to characterize a new technology as to its intrinsic device performance • Frequency and stage are related as follows: f = 1/T = 1/(2nP) where n is the number of stages and P is the stage delay
  • 11. Ring Oscillator—COMPARING DIFFERENT TECHNOLOGIES v0 v1 v5 v1 v2v0 v3 v4 v5 v0 v1 v5 v1 v2v0 v3 v4 v5 T = 2  tp  N 2 N tp >> tf +tr
  • 14. Observations • More complex gates have larger logical efforts • Logical efforts grow with increase in no. of inputs • Complex gates exhibit high g, greater delay 14 • More complex gates have larger logical efforts • Logical efforts grow with increase in no. of inputs • Complex gates exhibit high g, greater delay
  • 15. Parasitic delay • It is fixed for a gate • More complex gate—higher parasitic delay • Ref. Pinv=1 (inverter parasitic delay ) • For other gates , parasitic delay is written in terms of pinv 15 • It is fixed for a gate • More complex gate—higher parasitic delay • Ref. Pinv=1 (inverter parasitic delay ) • For other gates , parasitic delay is written in terms of pinv
  • 17. How to compute Pinv • For inv. g=1, dabs= τ(h+pinv) • In a given tech., plot d vs. h • Plot would be st. line with slope τ, & intercept- (pinv × τ) • Pinv can be estimated after obtaining τ • Draw similar plot for other gates • Once τ is obtained , g and p of other gates can be found out. 17 • For inv. g=1, dabs= τ(h+pinv) • In a given tech., plot d vs. h • Plot would be st. line with slope τ, & intercept- (pinv × τ) • Pinv can be estimated after obtaining τ • Draw similar plot for other gates • Once τ is obtained , g and p of other gates can be found out.
  • 19. Choice Of Standard Reference
  • 20. Calculating delay of an inverter 20
  • 21. Delay of 2 input Nand gate
  • 22. Delay of 2 input NOR gate
  • 24. Computing Intrinsic Transistor Capacitance • Intrinsic PN junction capacitance of the driving circuit must be added to the load capacitance Cload • Consider the inverter example at left: – Area and perimeter of the PMOS and NMOS transistors are calculated from the layout and inserted into the circuit model • NMOS drain area = Wn x Ddrain • PMOS drain area = Wp x Ddrain • NMOS drain perimeter = 2 (Wn + Ddrain) • PMOS drain perimeter = 2 (Wp + Ddrain) • SPICE simulations were done (bottom left) for a fixed extrinsic load of 100fF with increasing transistor width (Wp/Wn = 2.75) – Results show diminishing returns beyond a certain Wn (say about 6 um) due to effect of the increasing drain capacitance on the overall capacitive load • Intrinsic PN junction capacitance of the driving circuit must be added to the load capacitance Cload • Consider the inverter example at left: – Area and perimeter of the PMOS and NMOS transistors are calculated from the layout and inserted into the circuit model • NMOS drain area = Wn x Ddrain • PMOS drain area = Wp x Ddrain • NMOS drain perimeter = 2 (Wn + Ddrain) • PMOS drain perimeter = 2 (Wp + Ddrain) • SPICE simulations were done (bottom left) for a fixed extrinsic load of 100fF with increasing transistor width (Wp/Wn = 2.75) – Results show diminishing returns beyond a certain Wn (say about 6 um) due to effect of the increasing drain capacitance on the overall capacitive load
  • 25. MINIMUM DELAY ~ ZERO DELAY
  • 28. Area x Delay Figure of Merit • Increasing device width shows diminishing returns on propagation delay time • Define a figure of merit as area x delay for the inverter circuit – Increasing device width Wn shows a minimum in area x delay product • Unconstrained increase in transistor width in order to improve circuit delay is often a poor tradeoff due to the high cost of silicon real estate on the wafer!! • Increasing device width shows diminishing returns on propagation delay time • Define a figure of merit as area x delay for the inverter circuit – Increasing device width Wn shows a minimum in area x delay product • Unconstrained increase in transistor width in order to improve circuit delay is often a poor tradeoff due to the high cost of silicon real estate on the wafer!!
  • 29. Design a chain of inv. for min delay
  • 30. T-network Delay Model Of wire • Star-delta-transformation • Vout=ZBC/(ZAB+ZBC) • Vout=[(2/RC)/(S+2/RC)]*(1/S) • =(1/s)-1/(s+2/RC) • =U(t)[1-exp(-2/RC)t] • FOR V50% delay • tp=(RC ln2)/2=0.35 RC • Star-delta-transformation • Vout=ZBC/(ZAB+ZBC) • Vout=[(2/RC)/(S+2/RC)]*(1/S) • =(1/s)-1/(s+2/RC) • =U(t)[1-exp(-2/RC)t] • FOR V50% delay • tp=(RC ln2)/2=0.35 RC
  • 31.
  • 32. Delay in the presence of long wires
  • 33. Design Of Inverter Chain For Min. Delay
  • 34. Sizing a path for minimum delay EE141 34
  • 35. Branching effort along a path → Used for sizing for delay EE141 35 Where BH is → Used for sizing for delay
  • 36. Observations regarding F • F depends on only topology and loading • F is Indep. of transistor sizes • F is unchanged if inverters are added or removed EE141 36 • F depends on only topology and loading • F is Indep. of transistor sizes • F is unchanged if inverters are added or removed
  • 37. Path Delay D • Sum of delay of all stages EE141 37
  • 38. Condition for min. path delay EE141 38
  • 40. Thus, minimum stage effort of each stage reqd. for min. delay along a path is We shd. choose transistor sizes such that stage effort is same for all blocks EE141 40 Thus, minimum delay achievable along a path is We shd. choose transistor sizes such that stage effort is same for all blocks
  • 41. Example Compute for each stage Apply capacitance transformation backwards i EE141 41 Apply capacitance transformation backwards
  • 42. Chain Of Inverters C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e
  • 43. Optimizing no of stages in a path for min. delay 43
  • 44. To find optimum N EE14144If pinv = 0,
  • 45. For Ň stages in chain with inverters Best delay per stage , d = gh + pinv d = ρ + pinv 45 For Ň stages in chain with inverters Best delay per stage , d = gh + pinv d = ρ + pinv
  • 46. Graphical sol As pinv grows, adding inverters become less advantageous EE14146
  • 47. Chain Of Inverters— BEST NO OF STAGES C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e
  • 48. Chain Of Inverters— BEST NO OF STAGES C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e gu= gav x [2 µ / (γ+μ)] gd= gav x [2 γ / (γ+μ)] C2 C1 Ci CL 1 u u2 uN-1 In Out uopt = e
  • 49. For large N, delay expression- 49 For ρ = 4 Ď = log 4F X FO4
  • 50. Where FO4 = fanout of 4 inverter delay FO4 DELAY 50 HERE ρ = gh = 1 x 4 = 4; so d = 5τ Thus for ρ = 4 Ď = log 4F X FO4 inverter delay
  • 51. 51
  • 52. Wrong no of stages 52
  • 54. Wrong size, L=1 Ρ=4 W 4sW 16 W C=1 C=4s C=16 54 Mis-sized Ρ=4 Ρ=4/ s Ρ= 4s D = ∑gh + ∑pinv = (4s + 4/s + 4 ) + 3 pinv = 15 units (s=1)