1. The document describes COMSOL Multiphysics software, which is an interactive environment for modeling and solving scientific and engineering problems based on partial differential equations.
2. It can model coupled physics phenomena simultaneously using finite element analysis. It has various application modules for topics like acoustics, electromagnetics, heat transfer, fluid flow, and more.
3. An example is provided of modeling laminar fluid flow between two parallel plates to study inlet effects using the Chemical Engineering Module of COMSOL Multiphysics.
IEEE MULTIPHYSICS SIMULATION in COMSOLkhalil fathi
DO YOUR SIMULATION results really tell you if your design
is going to work? Accuracy sounds like an obvious thing to expect from the software you’re using. But it’s not something you can take for granted. That’s why multiphysics makes such a big difference: It is essential for capturing and coupling all the physical effects that interact in a realistic simulation.
This slide deals with different aspects of Comsol Multiphysics and it's possibility in the future as multiple physics properties can be studied simultaneously with the help of different inbuilt or user-defined modules in this software.
COMSOL Multiphysics: Simulation and Development Toolbox for ClustersIntel IT Center
This document discusses using COMSOL Multiphysics software for simulation and development on computer clusters. COMSOL Multiphysics allows users to build virtual prototypes through multiphysics modeling and simulation. It is well-suited for research and development applications where virtual prototyping can save time and money compared to physical testing. COMSOL supports parallel computing on computer clusters which enables larger simulations and parametric sweeps for applications such as design optimization. The document provides an example live demo of using COMSOL to optimize the frequency of a balanced patch antenna through a parametric sweep on a computer cluster.
This document summarizes various methods for self-assembly of photonic crystals, including opals and inverse opals. It discusses how self-assembly provides an alternative to top-down fabrication for creating 3D periodic structures. Specifically, it describes how sedimentation, centrifugation, and physical confinement can be used to assemble colloidal spheres into crystalline structures. It also introduces methods like vertical deposition and floating assembly that rely on capillary forces and evaporation. The document concludes by presenting examples of using atomic layer deposition of TiO2 to infiltrate opal templates and coat ZnO nanorod arrays, creating novel 2D and 3D photonic crystal structures through self-assembly approaches.
This document provides an overview of Microelectromechanical Systems (MEMS). It describes MEMS as systems that combine electrical and mechanical components on a chip to produce miniature devices that can sense, control and actuate on a micro scale. The key components of MEMS are microelectronics, microsensors, microstructures and microactuators. Common fabrication processes for MEMS include deposition, patterning, etching, and lithography. MEMS have a wide range of applications in areas like automotive, medical, and defense.
This document discusses giant magnetoresistance (GMR) in magnetic multilayer systems. It begins by introducing the discovery of GMR in 1988 and describes how the resistance of these systems depends on whether the magnetic moments of adjacent ferromagnetic layers are parallel or antiparallel. The rest of the document presents a model for understanding GMR using the Boltzmann equation approach. It describes how the resistance changes when an external magnetic field switches the layers from an antiparallel to parallel configuration.
This slide deals with different aspects of Comsol Multiphysics and its possibility in the future as multiple physics properties can be studied simultaneously with the help of software
Mems & nems technology represented by k.r. bhardwajBKHUSHIRAM
This document provides an overview of microelectromechanical systems (MEMS) and nanotechnology. It discusses the history and basic concepts of MEMS, fabrication techniques, current applications in areas such as sensors and biomedical devices, and emerging fields including nanoelectromechanical systems (NEMS). The document also addresses potential impacts and challenges of continued miniaturization, such as material toxicity issues and job disruptions, as well as opportunities for further research and engineering advances.
IEEE MULTIPHYSICS SIMULATION in COMSOLkhalil fathi
DO YOUR SIMULATION results really tell you if your design
is going to work? Accuracy sounds like an obvious thing to expect from the software you’re using. But it’s not something you can take for granted. That’s why multiphysics makes such a big difference: It is essential for capturing and coupling all the physical effects that interact in a realistic simulation.
This slide deals with different aspects of Comsol Multiphysics and it's possibility in the future as multiple physics properties can be studied simultaneously with the help of different inbuilt or user-defined modules in this software.
COMSOL Multiphysics: Simulation and Development Toolbox for ClustersIntel IT Center
This document discusses using COMSOL Multiphysics software for simulation and development on computer clusters. COMSOL Multiphysics allows users to build virtual prototypes through multiphysics modeling and simulation. It is well-suited for research and development applications where virtual prototyping can save time and money compared to physical testing. COMSOL supports parallel computing on computer clusters which enables larger simulations and parametric sweeps for applications such as design optimization. The document provides an example live demo of using COMSOL to optimize the frequency of a balanced patch antenna through a parametric sweep on a computer cluster.
This document summarizes various methods for self-assembly of photonic crystals, including opals and inverse opals. It discusses how self-assembly provides an alternative to top-down fabrication for creating 3D periodic structures. Specifically, it describes how sedimentation, centrifugation, and physical confinement can be used to assemble colloidal spheres into crystalline structures. It also introduces methods like vertical deposition and floating assembly that rely on capillary forces and evaporation. The document concludes by presenting examples of using atomic layer deposition of TiO2 to infiltrate opal templates and coat ZnO nanorod arrays, creating novel 2D and 3D photonic crystal structures through self-assembly approaches.
This document provides an overview of Microelectromechanical Systems (MEMS). It describes MEMS as systems that combine electrical and mechanical components on a chip to produce miniature devices that can sense, control and actuate on a micro scale. The key components of MEMS are microelectronics, microsensors, microstructures and microactuators. Common fabrication processes for MEMS include deposition, patterning, etching, and lithography. MEMS have a wide range of applications in areas like automotive, medical, and defense.
This document discusses giant magnetoresistance (GMR) in magnetic multilayer systems. It begins by introducing the discovery of GMR in 1988 and describes how the resistance of these systems depends on whether the magnetic moments of adjacent ferromagnetic layers are parallel or antiparallel. The rest of the document presents a model for understanding GMR using the Boltzmann equation approach. It describes how the resistance changes when an external magnetic field switches the layers from an antiparallel to parallel configuration.
This slide deals with different aspects of Comsol Multiphysics and its possibility in the future as multiple physics properties can be studied simultaneously with the help of software
Mems & nems technology represented by k.r. bhardwajBKHUSHIRAM
This document provides an overview of microelectromechanical systems (MEMS) and nanotechnology. It discusses the history and basic concepts of MEMS, fabrication techniques, current applications in areas such as sensors and biomedical devices, and emerging fields including nanoelectromechanical systems (NEMS). The document also addresses potential impacts and challenges of continued miniaturization, such as material toxicity issues and job disruptions, as well as opportunities for further research and engineering advances.
Lithography is a process that uses light to transfer geometric patterns from a photomask to a light-sensitive chemical "photoresist" on a semiconductor substrate. The key steps in the lithography process include cleaning and preparing the wafer surface, depositing and spinning photoresist, soft baking to evaporate solvents, aligning the mask and exposing the photoresist to light, developing to remove exposed or unexposed areas of photoresist, hard baking to harden the photoresist, plasma etching or depositing additional layers, cleaning, and inspecting the final patterned wafer. Lithography is critical for manufacturing integrated circuits and is capable of printing ever smaller semiconductor features.
Electrochemical sensor 01 mm 717 iit b 2016Muzzamil Eatoo
Electro-chemical sensors principle, working, problems, sensing properties, selection of electrode for these sensors, electrode synthesis and properties, and best electrodes.
The presentation is made as part of introducing some novel technologies in Chemical Engineering. It aims at conveying an overall idea about the Sol-Gel Technology, its underlying processes, applications as well as its future possibilities.
Fullerenes were discovered in 1985 at Rice University and consist of closed hollow cages of carbon atoms arranged in pentagonal and hexagonal rings. The most common fullerene is buckyball (C60), but others include C70, C72, etc. Fullerenes can be produced by vaporizing carbon in a gas medium and spontaneously forming in the condensing vapor. They are very stable due to their structure, with the highest tensile strength of any known material. Research shows fullerenes have applications as strong, resilient materials for armor and inhibiting HIV viruses due to antiviral properties when bonded to other elements.
1. Biochemical sensors combine biology, chemicals, and sensors to study chemical substances and vital processes in living organisms.
2. Biosensors convert biological responses into electrical signals and can be used to monitor things like electrolyte concentration, pH, and specific proteins in small samples.
3. They are typically constructed using enzyme-based biochemical reactions connected to ion-selective field-effect transistors or chemically-sensitive field-effect transistors for detection and can take the form of microreactors with immobilized enzymes.
Microfluidics involves the study and manipulation of small volumes of fluids circulating in artificial microsystems. Key concepts in microfluidics include fluid dynamics at small scales, micromachining techniques like photolithography and etching to fabricate microstructures, and the unique physics that occur at the microscale. A brief history of microfluidics is provided, from early developments in integrated circuits and MEMS to the emergence of the field in the 1990s. Fundamental micromachining processes for silicon like photolithography, film deposition, etching, and bonding/sealing are summarized.
This document provides an overview of microfluidics presented by Rajan Arora. It defines microfluidics as manipulating small amounts of fluids using channels 10-100 micrometers in size. Typical microfluidic systems are described including a DNA separation system and lab-on-a-chip for diagnosing heart attacks. The origins and history of microfluidics are discussed from Richard Feynman's 1959 talk to developments in the 1990s. Key components, physics principles, and flow mechanisms of microfluidic systems are explained. Various applications are highlighted such as lab-on-a-chip, low-cost paper and plastic-based microfluidics, and emerging uses in textiles, optofluidics and acou
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
This includes what is Quantum Dots and their properties ,types of synthesis methods of nano materials such as top down, bottom up etc.It includes few things about Carbon Quantum Dots.
This document provides information about the sol-gel method process, which consists of several steps: 1) formation of a sol through hydrolysis and condensation reactions, 2) gel formation through further condensation and polycondensation, 3) drying to produce aerogels or xerogels, 4) calcination to remove organic species and densify the gel, and 5) heat treatment to shape the material. The sol-gel method allows production of monosized nanoparticles and synthesis of glasses and ceramics at lower temperatures but controlling particle growth and agglomeration can be challenging.
Microchip capillary electrophoresis coupled with mass spectrometry (MCE-MS) provides advantages like shorter analysis times, lower sample volumes, and higher separation efficiencies compared to conventional capillary electrophoresis. MCE uses microfabricated chips with channels and reservoirs. Effective ionization interfaces like electrospray ionization are required to couple the microchip separation to MS detection. Applications of MCE-MS include analysis of amino acids, peptides, proteins, and other biomolecules. Further development is needed to establish universal ionization methods for both micro- and macroscale analyses.
This presentation contains a basic introduction to quantum dots,their discovery, properties, applications,advantages,limitations and future prospects.It also contains a brief overview of experimental work carried out and results obtained during my summer term project.
The document provides highlights of new features in COMSOL Multiphysics 4.3. Key additions include nonlinear material models, 1D pipe flow and network simulations, electrochemical corrosion simulations, faster CAD import and meshing, AC/DC electromagnetics for rotating machinery, improved nonlinear solvers, and new modules for thermoacoustics and piezoresistivity. The product suite now supports additional CAD formats and LiveLink products provide tighter integration with CAD software.
Fullerenes are spherical or tubular molecules composed entirely of carbon, with the best known being buckminsterfullerene (C60). C60 is highly symmetric, resembling the pattern of a soccer ball with 12 pentagons and 20 hexagons. While the sp2 carbon bonds give fullerenes stability, there is also some angle strain due to the curved structure. Fullerenes can be made more stable through electrophilic addition that changes some carbons to sp3 hybridization. Potential applications of fullerenes include cancer treatment by attaching drugs to their surface, use as superconductors, and inhibiting HIV enzymes.
Fundamentals and applications of microfluidics - ch1明輝 劉
This document discusses the history and fundamentals of microfluidics. It begins with a brief history of microfluidics starting in the 1950s and developments in microelectronics, MEMS, and early microfluidic devices in subsequent decades. It then defines microfluidics as handling small fluid volumes typically on the microscopic scale and discusses commercial and scientific applications of microfluidics like human genome sequencing, medical diagnostics, and new chemical reactions. Key milestones are also outlined such as miniaturization of devices in earlier decades and exploration of new effects and applications in more recent decades.
The document provides an overview of Session 1 of a COMSOL training series, which introduces COMSOL software. It discusses multiphysics simulation, which involves modeling multiple interacting physical phenomena, like fluid flow, heat transfer, and electrodynamics. It gives examples of why simulation is useful, such as design validation, optimization, and analysis. It then outlines the basic steps of simulation: defining physical phenomena with PDEs, discretizing the domain, solving the PDEs, and visualizing results. Finally, it previews the example simulation of a microfluidic mixer.
This file contains the notes on the basics of COMSOL, using the software and different implementations done on it.
Applications in Mechanical, MEMS and other fields is seen.
Making a capacitor, microgripper, cantilever etc.
Lithography is a process that uses light to transfer geometric patterns from a photomask to a light-sensitive chemical "photoresist" on a semiconductor substrate. The key steps in the lithography process include cleaning and preparing the wafer surface, depositing and spinning photoresist, soft baking to evaporate solvents, aligning the mask and exposing the photoresist to light, developing to remove exposed or unexposed areas of photoresist, hard baking to harden the photoresist, plasma etching or depositing additional layers, cleaning, and inspecting the final patterned wafer. Lithography is critical for manufacturing integrated circuits and is capable of printing ever smaller semiconductor features.
Electrochemical sensor 01 mm 717 iit b 2016Muzzamil Eatoo
Electro-chemical sensors principle, working, problems, sensing properties, selection of electrode for these sensors, electrode synthesis and properties, and best electrodes.
The presentation is made as part of introducing some novel technologies in Chemical Engineering. It aims at conveying an overall idea about the Sol-Gel Technology, its underlying processes, applications as well as its future possibilities.
Fullerenes were discovered in 1985 at Rice University and consist of closed hollow cages of carbon atoms arranged in pentagonal and hexagonal rings. The most common fullerene is buckyball (C60), but others include C70, C72, etc. Fullerenes can be produced by vaporizing carbon in a gas medium and spontaneously forming in the condensing vapor. They are very stable due to their structure, with the highest tensile strength of any known material. Research shows fullerenes have applications as strong, resilient materials for armor and inhibiting HIV viruses due to antiviral properties when bonded to other elements.
1. Biochemical sensors combine biology, chemicals, and sensors to study chemical substances and vital processes in living organisms.
2. Biosensors convert biological responses into electrical signals and can be used to monitor things like electrolyte concentration, pH, and specific proteins in small samples.
3. They are typically constructed using enzyme-based biochemical reactions connected to ion-selective field-effect transistors or chemically-sensitive field-effect transistors for detection and can take the form of microreactors with immobilized enzymes.
Microfluidics involves the study and manipulation of small volumes of fluids circulating in artificial microsystems. Key concepts in microfluidics include fluid dynamics at small scales, micromachining techniques like photolithography and etching to fabricate microstructures, and the unique physics that occur at the microscale. A brief history of microfluidics is provided, from early developments in integrated circuits and MEMS to the emergence of the field in the 1990s. Fundamental micromachining processes for silicon like photolithography, film deposition, etching, and bonding/sealing are summarized.
This document provides an overview of microfluidics presented by Rajan Arora. It defines microfluidics as manipulating small amounts of fluids using channels 10-100 micrometers in size. Typical microfluidic systems are described including a DNA separation system and lab-on-a-chip for diagnosing heart attacks. The origins and history of microfluidics are discussed from Richard Feynman's 1959 talk to developments in the 1990s. Key components, physics principles, and flow mechanisms of microfluidic systems are explained. Various applications are highlighted such as lab-on-a-chip, low-cost paper and plastic-based microfluidics, and emerging uses in textiles, optofluidics and acou
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
This includes what is Quantum Dots and their properties ,types of synthesis methods of nano materials such as top down, bottom up etc.It includes few things about Carbon Quantum Dots.
This document provides information about the sol-gel method process, which consists of several steps: 1) formation of a sol through hydrolysis and condensation reactions, 2) gel formation through further condensation and polycondensation, 3) drying to produce aerogels or xerogels, 4) calcination to remove organic species and densify the gel, and 5) heat treatment to shape the material. The sol-gel method allows production of monosized nanoparticles and synthesis of glasses and ceramics at lower temperatures but controlling particle growth and agglomeration can be challenging.
Microchip capillary electrophoresis coupled with mass spectrometry (MCE-MS) provides advantages like shorter analysis times, lower sample volumes, and higher separation efficiencies compared to conventional capillary electrophoresis. MCE uses microfabricated chips with channels and reservoirs. Effective ionization interfaces like electrospray ionization are required to couple the microchip separation to MS detection. Applications of MCE-MS include analysis of amino acids, peptides, proteins, and other biomolecules. Further development is needed to establish universal ionization methods for both micro- and macroscale analyses.
This presentation contains a basic introduction to quantum dots,their discovery, properties, applications,advantages,limitations and future prospects.It also contains a brief overview of experimental work carried out and results obtained during my summer term project.
The document provides highlights of new features in COMSOL Multiphysics 4.3. Key additions include nonlinear material models, 1D pipe flow and network simulations, electrochemical corrosion simulations, faster CAD import and meshing, AC/DC electromagnetics for rotating machinery, improved nonlinear solvers, and new modules for thermoacoustics and piezoresistivity. The product suite now supports additional CAD formats and LiveLink products provide tighter integration with CAD software.
Fullerenes are spherical or tubular molecules composed entirely of carbon, with the best known being buckminsterfullerene (C60). C60 is highly symmetric, resembling the pattern of a soccer ball with 12 pentagons and 20 hexagons. While the sp2 carbon bonds give fullerenes stability, there is also some angle strain due to the curved structure. Fullerenes can be made more stable through electrophilic addition that changes some carbons to sp3 hybridization. Potential applications of fullerenes include cancer treatment by attaching drugs to their surface, use as superconductors, and inhibiting HIV enzymes.
Fundamentals and applications of microfluidics - ch1明輝 劉
This document discusses the history and fundamentals of microfluidics. It begins with a brief history of microfluidics starting in the 1950s and developments in microelectronics, MEMS, and early microfluidic devices in subsequent decades. It then defines microfluidics as handling small fluid volumes typically on the microscopic scale and discusses commercial and scientific applications of microfluidics like human genome sequencing, medical diagnostics, and new chemical reactions. Key milestones are also outlined such as miniaturization of devices in earlier decades and exploration of new effects and applications in more recent decades.
The document provides an overview of Session 1 of a COMSOL training series, which introduces COMSOL software. It discusses multiphysics simulation, which involves modeling multiple interacting physical phenomena, like fluid flow, heat transfer, and electrodynamics. It gives examples of why simulation is useful, such as design validation, optimization, and analysis. It then outlines the basic steps of simulation: defining physical phenomena with PDEs, discretizing the domain, solving the PDEs, and visualizing results. Finally, it previews the example simulation of a microfluidic mixer.
This file contains the notes on the basics of COMSOL, using the software and different implementations done on it.
Applications in Mechanical, MEMS and other fields is seen.
Making a capacitor, microgripper, cantilever etc.
Tonal Innovation Center (TONIC) hosted the second annual International Musical Instruments Seminar in Joensuu, Finland on 14th September- 16th September 2011.
OptiFDTD is a finite-difference time-domain (FDTD) simulation software that enables the design and simulation of photonic components. It solves Maxwell's equations to model light propagation and interactions with materials. OptiFDTD provides a comprehensive set of materials, excitation sources, and analysis tools. New features include 64-bit support for larger simulations, heating absorption modeling, plane wave phase control, and band solvers. It is suited for applications like photonic crystals, nonlinear optics, integrated photonics, and more.
Studying photnic crystals in linear and nonlinear mediaIslam Kotb Ismail
This document outlines a presentation on photonic crystals and nonlinear optics. It discusses:
- What photonic crystals are and how they inhibit light propagation through periodic refractive index patterns. Maxwell's equations are used to model light propagation in these structures.
- Common photonic crystal topologies in 1D, 2D and 3D, including photonic bandgap properties. Applications like mirrors and waveguides are mentioned.
- How nonlinear optical effects like the Pockels and Kerr effects modify a material's refractive index with an electric field. Nonlinear photonic crystals combine these effects.
- The document concludes by proposing nonlinear photonic crystals can act as optical limiters that regulate light transmission intensity.
Surbhi Verma completed an internship at the Indian Institute of Technology in Delhi studying photonic crystals under Professor Joby Joseph. She used the Crystal Wave simulation software to model a one-dimensional photonic crystal sensor with two defects. Her results showed that the time-averaged energy density changed linearly with the refractive index of the second defect when its radius was 800nm, indicating potential for an optical refractive index sensor. She also found non-linear changes in energy density when varying the second defect's radius.
Photonic materials manipulate photons to achieve certain functions. Photonic crystals are a type of photonic material that displays unusual properties in interacting with light due to a periodic modulation of refractive index. They can trap light in cavities and waveguides by creating photonic band gaps that prevent light from propagating in certain directions. Potential applications of photonic crystals include photonic integrated circuits, lasers, sensors, and replacing conventional optical fibers.
This document discusses photonic crystal fibers (PCFs). PCFs are composed of nanostructures that affect photon propagation through periodic refractive indices, similar to how semiconductor crystals affect electron motion. PCFs can guide light through two mechanisms: index guiding and photonic bandgap guiding. They have properties like endless single mode operation, large mode areas, and tunable dispersion. Special PCFs include double core fibers, highly birefringent fibers, and hollow core bandgap fibers. PCFs offer advantages over standard fibers like flexibility in core size and wavelengths used. Challenges include difficult fabrication and limited operating frequencies.
*(PPT was prepared for a 15 min presentation)
The topic "Photonic Integrated circuit technology" is in itself very vast that it cant be explained completely in a matter of minutes, so it is better to focus on a particular type of PIC throughout the presentation .(because,based on substrate material,the technology changes and it is always important to maintain a flow throughout the presentation).
Research well on the topic,do your best and leave the rest
:)
L’influence de l’écoute de la musique lors d’une séance de réadaptation pulmo...Florian Mottart
Mémoire présenté en vue de l'obtention du titre de Master en Kinésithérapie et Réadaptation, à l'Université Catholique de Louvain-la-Neuve (UCL), en Belgique.
Il fut l'objet d'une présentation :
- lors du 28 ème congrès de Médecin Physique et Réadaptation, à Reims
- lors de la 7ème Journée de Recherche en Kinésithérapie Respiratoire, à Paris
This document presents simulations and analysis of three different microelectromechanical systems (MEMS) devices using COMSOL Multiphysics: 1) a tunable MEMS capacitor with a movable plate, 2) an integrated square-shaped spiral inductor, and 3) a capacitive pressure sensor with a movable diaphragm. It provides the modeling, computations and results for each device.
ABB uses COMSOL Multiphysics to model electromagnetic, acoustic, and mechanical effects in power transformers to minimize noise levels. They have created custom simulation apps using the Application Builder to analyze transformer design parameters and core resonances. These apps allow designers to efficiently test configurations and check for issues. By distributing apps with COMSOL Server, ABB shares simulation capabilities throughout the company to improve transformer designs.
The Phase Field Methods Workshop was held at Northwestern University on January 9, 2015. The workshop brought together researchers from national laboratories, universities, and industry to discuss phase field modeling tools and methods. The agenda included sessions on current phase field codes and capabilities, large-scale computing approaches, potential focus areas for research, and how to structure a community code. Attendees discussed formulating standard benchmark problems and organizing a community repository to enable further collaboration on phase field modeling code development.
Compit 2013 - Torsional Vibrations under Ice ImpactSimulationX
- The document discusses bridging the gap between steady-state and transient simulation for torsional vibrations under ice impact.
- It introduces modeling methods that allow both transient and steady-state analysis to operate on the same model base using a unified framework based on ordinary differential equations.
- It also discusses propeller modeling that incorporates established steady-state and transient methods and is being certified by classification societies for compliance with ice class simulation requirements.
Nanometric Modelization of Gas Structure, Multidimensional using COMSOL Soft...IJECEIAES
In structures with GaAs, which are the structures most used, because of their physical and electronic proprieties, nevertheless seems a compromise between the increase of doping and reduced mobility. The use of quantum hetero structures can overcome this limitation by creating a 2D carrier gas. Using the COMSOL software this work present three models: the first model computes the electronic states for the heterojunction AlGaAs/GaAs in 1D dimension, the second model computes the electronic states for the heterojunction AlGaAs/GaAs but in 2D dimension (nanowire) and the third model we permitted the study of this hetero junction (steep) wich inevitably involves the resolution of the system of equations Schrödinger-Poisson due to quantum effects that occur at the interface. The validity of this model can be effectuated with a comparison of our results with the result of different models developed in the literature of the related work, from this point of view the validity of our model is confirmed.
This thesis extends the electromagnetic field calculation capabilities of the open-source CFD software OpenFOAM. It develops new solvers within OpenFOAM to solve magnetostatic problems for materials like copper, steel, and permanent magnets. Two formulations (A-V and A-J) are derived from Maxwell's equations and implemented as OpenFOAM solvers through custom C++ code. Force calculation methods are also implemented to calculate Lorenz force and Maxwell stress. Simple test cases are modeled and solved to validate the new solvers. Results are compared to COMSOL Multiphysics and good agreement is found. The developed solvers could be applied to the design of electromagnetic devices like electric machines.
High End Solution for Advanced Civil Engineering ProjectsIJMER
Civil FEM performs the best customization of the well-known Finite Element Program ANSYS.
The combination of both programs, totally integrated, provides the Construction and Civil Engineering
fields with the possibility of applying high-end technology to a wide range of projects. Using the same
windows graphic user interface and sharing input data and results, makes it very easy for the user to
apply them for solving difficult Civil Engineering problems. The ability to generate finite element models
of any complex three-dimensional civil structure with non-linear behaviour and construction process
simulation means a new and efficient approach to run advanced analysis on PC’s.
Digital Wave Simulation of Quasi-Static Partial Element Equivalent Circuit Me...Piero Belforte
This is an extended version of the paper published on IEEE Transactions on EMC, October 2016. PEEC modeling is a well established technique for obtaining a circuit equivalent for an electromagnetic problem. The time domain solution of such models is usually performed using nodal voltages and branch currents, or sometimes charge and currents. The present paper describes a possible alternative approach which can be obtained expressing and solving the problem in the waves domain. The digital wave theory is used to find an equivalent representation of the PEEC circuit in the wave domain. Through a pertinent continuous to discrete time transformation, the constitutive relations for partial inductances, capacitances and resistances are translated in an explicit form. The combination of such equations with Kirchhoff laws allows to achieve a semi-explicit resolution scheme. Three different physical configurations are analyzed and their extracted Digital Wave PEEC models are simulated at growing sizes using the general-purpose Digital Wave Simulator (DWS). The results are compared to those obtained by using standard SPICE simulators in both linear and nonlinear cases. When the size of the model is manageable by SPICE, an excellent accuracy and a speed-up factor of up to three orders of magnitude are observed with much lower memory requirements. PEEC model sizes manageable by DWS are also an order of magnitude larger than SPICE. A comparative analysis of results including the effect of parameters like the simulation time step choice is also presented.
This document contains lecture material on mechatronics systems from Dr. V. Kandavel. It defines mechatronics as the synergistic integration of mechanical engineering with electronics and computer control. It describes the key elements of mechatronics systems including sensors, actuators, signal conditioning, power electronics, control algorithms, and computer hardware and software. It also explains what a system is, showing a diagram of a spring system with an input force producing an output extension. Finally, it briefly discusses CAD/CAM/CAE software used for computer-aided design, manufacturing, and engineering.
This document summarizes a research article about a capacitance-to-digital converter (CDC) designed for capacitive MEMS sensors. The CDC uses a two-step process: 1) A switched-capacitor preamplifier converts the capacitance to a voltage. 2) A self-oscillated noise-shaping integrating dual-slope converter digitizes the output into a multi-bit digital stream by using time resolution rather than amplitude resolution. Experimental results on a prototype show the CDC achieves 17-bit resolution while consuming 146 μA from a 1.5V power supply, allowing pressure sensing at 1 Pa resolution.
This document discusses advances in the field of mechatronics. It begins by defining mechatronics as the synergistic combination of mechanical engineering, electrical engineering, and computer science. Mechatronic systems provide advantages over individual mechanical, electrical, and electronic systems by being simpler, more economical, reliable, and versatile. Examples of mechatronic systems include cars, consumer electronics, manufacturing systems, and more. The document then surveys developments in modeling, code generation, analysis tools, and challenges in tightly integrating the various engineering disciplines involved in mechatronic systems design and analysis.
This document discusses various computer-aided design (CAD) tools used for microelectromechanical systems (MEMS) simulation and design. It describes SUGAR, a MEMS simulation software that uses a nodal analysis approach. Examples of simulating a cantilever and micro mirror are provided. IntelliSuite is introduced as an integrated MEMS design tool with modules for mask design, fabrication simulation, and electro-mechanical analysis. COMSOL Multiphysics is summarized as a multiphysics simulation software with dedicated MEMS and microfluidic modules for modeling common devices.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Modeling and Simulation of Electrical Power Systems using OpenIPSL.org and Gr...Luigi Vanfretti
Title:
Modeling and Simulation of Electrical Power Systems using OpenIPSL.org and GridDyn
Presenters:
Luigi Vanfretti (RPI) & Philip Top (LNLL)
luigi.vanfretti@gmail.com, top1@llnl.gov
Abstract:
The Modelica language, being standardized and equation-based, has proven valuable for the for model exchange, simulation and even for model validation applications in actual power systems. These important features have been now recognized by the European Network of Transmission System Operators, which have adopted the Modelica language for dynamic model exchange in the Common Grid Model Exchange Standard (v2.5, Annex F).
Following previous FP7 project results, within the ITEA 3 openCPS project, the presenters have continued the efforts of using the Modelica language for power system modeling and simulation, by developing and maintaining the OpenIPSL library: https://github.com/SmarTS-Lab/OpenIPSL
This seminar first gives an overview of the origins of the OpenIPSL and it’s models, it contrasts it against typical power system tools, and gives an introduction the OpenIPSL library. The new project features that help in the OpenIPSL maintenance (use of continuous integration, regression testing, documentation, etc.) are also described.
Finally, the seminar will present current work at LNLL that exploits OpenIPSL in coordination with other tools including ongoing work integrating openIPSL models into GridDyn an open-source power system simulation tool, as well as a demos of the use of openIPSL libraries in GridDyn.
Bios:
Luigi Vanfretti (SMIEEE’14) obtained the M.Sc. and Ph.D. degrees in electric power engineering at Rensselaer Polytechnic Institute, Troy, NY, USA, in 2007 and 2009, respectively.
He was with KTH Royal Institute of Technology, Stockholm, Sweden, as Assistant 2010-2013), and Associate Professor (Tenured) and Docent (2013-2017/August); where he lead the SmarTS Lab and research group. He also worked at Statnett SF, the Norwegian electric power transmission system operator, as consultant (2011 - 2012), and Special Advisor in R&D (2013 - 2016).
He joined Rensselaer Polytechnic Institute in August 2017, to continue to develop his research at ALSETLab: http://alsetlab.com
His research interests are in the area of synchrophasor technology applications; and cyber-physical power system modeling, simulation, stability and control.
Philp Top (Lawrence Livermore National Lab)
PhD 2007 Purdue University. Currently a Research Engineer at Lawrence Livermore National Laboratory in Livermore, CA. Philip has been involved in several projects connected with the DOE effort on Grid Modernization including projects on modeling and simulation, co-simulation and smart grid data analytics. He is the principle developer on the open source power system simulation tool GridDyn, and a key contributor to the HELICS open source co-simulation framework.
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3. 3
COMSOL Multiphysics
COMSOL Multiphysics is a powerful interactive
environment for modeling and solving all kinds of scientific
and engineering problems based on partial differential
equations (PDEs).
With this software you can easily extend conventional
models for one type of physics into multiphysics models
that solve coupled physics phenomena - and do so
simultaneously.
4. 4
COMSOL Multiphysics
It is possible to build models by defining the physical quantities
- such as material properties, loads, constraints, sources, and
fluxes - rather than by defining the underlying equations.
You can always apply these variables, expressions, or numbers
directly to solid domains, boundaries, edges, and points
independently of the computational mesh.
COMSOL then internally compiles a set of PDEs representing
the entire model. You access the power of COMSOL through a
flexible graphical user interface, or by script programming in
the COMSOL Script language.
5. 5
COMSOL Multiphysics
PDEs form the basis for the laws of science and provide the
foundation for modeling a wide range of scientific and
engineering phenomena.
When solving the PDEs, COMSOL Multiphysics uses the
finite element method (FEM). The software runs the finite
element analysis together with adaptive meshing and error
control using a variety of numerical solvers.
6. 6
COMSOL Application
You can use COMSOL Multiphysics in many application
areas, just a few examples being:
Chemical reactions
Diffusion
Fluid dynamics
Fuel cells and electrochemistry
Bioscience
Acoustics
Electromagnetics
Geophysics
7. 7
COMSOL Application
Heat transfer
Microelectromechanical systems (MEMS)
Microwave engineering
Optics
Photonics
Porous media flow
Quantum mechanics
Radio-frequency components
Semiconductor devices
Structural mechanics
Transport phenomena
Wave propagation
8. 8
COMSOL M-file
You can build models of all types in the COMSOL user
interface. For additional flexibility, COMSOL also provides
its own scripting language, COMSOL Script, where you can
access the model as a Model M-file or a data structure.
COMSOL Multiphysics also provides a seamless interface to
MATLAB. This gives you the freedom to combine PDE-based
modeling, simulation, and analysis with other modeling
techniques. For instance, it is possible to create a model in
COMSOL and then export it to Simulink as part of a control-
system design.
9. 9
COMSOL Multiphysics
Many real-world applications involve simultaneous couplings
in a system of PDEs - multiphysics.
COMSOL Multiphysics offers modeling and analysis power
for many application areas. For several of the key application
areas optional modules are provided. These application-
specific modules use terminology and solution methods
specific to the particular discipline, which simplifies creating
and analyzing models. The COMSOL 3.4 product family
includes the following modules:
10. 10
The COMSOL Modules
1. AC/DC Module
2. Acoustics Module
3. Chemical Engineering Module
4. Earth Science Module
5. Heat Transfer Module
6. MEMS Module
7. RF Module
8. Structural Mechanics Module
The optional modules are optimized for specific application
areas. They offer discipline standard terminology and
interfaces, materials libraries, specialized solvers, elements,
and visualization tools.
11. 11
The AC/DC Module
The AC/DC Module provides a unique environment for
simulation of AC/DC electromagnetics in 2D and 3D. The
AC/DC Module is a powerful tool for detailed analysis of coils,
capacitors, and electrical machinery. With this module you can
run static, quasi-static, transient, and time-harmonic simulations
in an easy-to-use graphical user interface.
12. 12
The AC/DC Module
The available application modes cover the following types of
Electromagnetics field simulations:
Electrostatics
Conductive media DC
Magnetostatics
Low-frequency electromagnetics
13. 13
The Acoustics Module
The Acoustics Module provides an environment for modeling of
acoustics in fluids and solids. The module supports time-
harmonic, modal, and transient analyses for fluid pressure as
well as static, transient, eigenfrequency, and frequency-response
analyses for structures. The available application modes
include:
Pressure acoustics
Aeroacoustics (acoustics in an ideal gas with an irrotational
mean flow)
Compressible irrotational flow
14. 14
The Acoustics Module
Typical application areas for the Acoustics Module include:
Modeling of loudspeakers and microphones
Aeroacoustics
Underwater acoustics
Automotive applications such as mufflers and car interiors
15. 15
The Chemical Engineering Module
The Chemical Engineering Module presents a powerful way of
modeling equipment and processes in chemical engineering.
It provides customized interfaces and formulations for
momentum, mass, and heat transport coupled with chemical
reactions for applications such as:
Reaction engineering and design
Heterogeneous catalysis
Separation processes
Fuel cells and industrial electrolysis
Process control together with Simulink
16. 16
The Chemical Engineering Module …
COMSOL Multiphysics excels in solving systems of coupled
nonlinear PDEs that can include:
Heat transfer
Mass transfer through diffusion and convection
Fluid dynamics
Chemical reaction kinetics
Varying material properties
The multiphysics capabilities of COMSOL can fully couple and
simultaneously model fluid flow, mass and heat transport, and
chemical reactions.
17. 17
The Chemical Engineering Module …
In fluid dynamics you can model fluid flow through porous media
or characterize flow with the Navier-Stokes equations.
It is easy to represent chemical reactions by source or sink terms
in mass and heat balances.
All formulations exist for both Cartesian and Cylindrical
coordinates (for axisymmetric models) as well as for stationary
and time-dependent cases.
18. 18
The Chemical Engineering Module …
The available application modes are:
1. Momentum balances
Incompressible Navier-Stokes equations
Darcy’s law
Brinkman equations
Non-Newtonian flow
Nonisothermal and weakly compressible flow
Turbulent flow, k-ε turbulence model
Turbulent flow, k-ω turbulence model
Multiphase flow
19. 19
The Chemical Engineering Module …
2. Energy balances
Heat conduction
Heat convection and conduction
3. Mass balances
Diffusion
Convection and diffusion
Electrokinetic flow
Maxwell-Stefan diffusion and convection
Nernst-Planck transport equations
20. 20
The Earth Science Module
The Earth Science Module combines application modes for fundamental
processes and structural mechanics and electromagnetics analyses.
Available application modes are:
Darcy’s law for hydraulic head, pressure head, and pressure
Solute transport in saturated and variably saturated porous media
Richards’ equation including nonlinear material properties.
Heat transfer by conduction and convection in porous media with
one mobile fluid, one immobile fluid, and up to five solids
Brinkman equations
Incompressible Navier-Stokes equations
21. 21
The Heat Transfer Module
The Heat Transfer Module supports all fundamental mechanisms
of heat transfer.
Available application modes are:
General heat transfer, including conduction, convection, and
surface-to-surface radiation
Bioheat equation for heat transfer in biomedical systems
Highly conductive layer for modeling of heat transfer in thin
structures.
Nonisothermal flow appliction mode .
Turbulent flow, k-ε turbulence model
applications in electronics and power systems, process
industries, and manufacturing industries.
22. 22
The MEMS Module
One of the most exciting areas of technology to emerge in
recent years is MEMS (microelectromechanical systems),
where engineers design and build systems with physical
dimensions of micrometers.
These miniature devices require multiphysics design and
simulation tools because virtually all MEMS devices
involve combinations of electrical, mechanical, and fluid-
flow phenomena.
23. 23
The MEMS Module
Available application modes are:
Plane stress
Plane strain
Electrokinetic flow
Axisymmetry, stress-strain
Piezoelectric modeling in 2D plane stress and plane strain,
axisymmetry, and 3D solids.
3D solids
General laminar flow
24. 24
The RF Module
The RF Module provides a unique environment for the
simulation of electromagnetic waves in 2D and 3D.
The RF Module is useful for component design in virtually all
areas where you find electromagnetic waves, such as:
Optical fibers
Antennas
Waveguides and cavity resonators in microwave engineering
Photonic waveguides
Photonic crystals
Active devices in photonics
25. 25
The RF Module
The available application modes cover the following types of
electromagnetics field simulations:
In-plane wave propagation
Axisymmetric wave propagation
Full 3D vector wave propagation
Full vector mode analysis in 2D and 3D
26. 26
The Structural Mechanics Module
The Structural Mechanics Module solves problems in structural
and solid mechanics, adding special element types—beam, plate,
and shell elements—for engineering simplifications.
Available application modes are:
Plane stress/ strain
Axisymmetry, stress-strain
Piezoelectric modeling
2D beams, Euler theory
3D beams, Euler theory
3D solids
Shells
27. 27
The Modeling Process
The modeling process in COMSOL consists of six main steps:
1. Selecting the appropriate application mode in the Model
Navigator.
2. Drawing or importing the model geometry in the Draw
Mode.
3. Setting up the subdomain equations and boundary conditions
in the Physics Mode.
4. Meshing in the Mesh Mode.
5. Solving in the Solve Mode.
6. Postprocessing in the Postprocessing Mode.
28. 28
1. The Model Navigator
When starting COMSOL Multiphysics, you are greeted by the
Model Navigator. Here you begin the modeling process and
control all program settings. It lets you select space dimension
and application modes to begin working on a new model, open
an existing model you have already created, or open an entry in
the Model Library.
COMSOL Multiphysics provides an integrated graphical user
interface where you can build and solve models by using
predefined physics modes
29. 29
2. Creating Geometry
An important part of the modeling process is creating the
geometry. The COMSOL Multiphysics user interface contains
a set of CAD tools for geometry modeling in 1D, 2D, and 3D.
The CAD Import Module provides an interface for import of
Parasolid, SAT (ACIS), STEP, and IGES formats.
In combination with the programming tools, you can even use
images and magnetic resonance imaging (MRI) data to create a
geometry.
30. 30
Axes and Grid
In the COMSOL Multiphysics user interface you can set limits
for the model axes and adjust the grid lines. The grid and axis
settings help you get just the right view to produce a model
geometry. To change these settings, use the Axes/Grid
Settings dialog box that you open from the Options menu.
You can also set the axis limits with the zoom functions.
31. 31
Axes and Grid
The default names for coordinate systems vary with the space
dimension:
Models that you open using the space dimensions 1D, 2D,
and 3D use the Cartesian coordinates x, y, and z.
In 1D axisymmetric geometries the default coordinate is r,
the radial direction. The x-axis represents r.
In 2D axisymmetric geometries the x-axis represents r, the
radial direction, and the y-axis represents z, the height
coordinate.
32. 32
3. Modeling Physics and Equations
From the Physics menu you can specify all the physics and
equations that define a model including:
Boundary and interface conditions
Domain equations
Material properties
Initial conditions
33. 33
4. Creating Mesh
When the geometry is complete and the parameters are defined,
COMSOL Multiphysics automatically meshes the geometry.
However, you can take charge of the mesh-generation process
through a set of control parameters.
For a 2D geometry the mesh generator partitions the subdomains
into triangular or quadrilateral mesh elements.
Similarly, in 3D the mesh generator partitions the subdomains
into tetrahedral, hexahedral, or prism mesh elements.
34. 34
5. Solution
Next comes the solution stage. Here COMSOL Multiphysics
comes with a suite of solvers for stationary, eigenvalue, and
time-dependent problems.
For solving linear systems, the software features both direct and
iterative solvers. A range of preconditioners are available for
the iterative solvers. COMSOL sets up solver defaults
appropriate for the chosen application mode and automatically
detects linearity and symmetry in the model.
A segregated solver provides efficient solution schemes for large
multiphysics models, turbulence modeling, and other
challenging applications.
35. 35
6. Postprocessing
For postprocessing, COMSOL provides tools for plotting and
postprocessing any model quantity or parameter:
Surface plots
Slice plots
Isosurfaces
Contour plots
Arrow plots
Streamline plots and particle tracing
Cross-sectional plots
Animations
Data display and interpolation
Integration on boundaries and subdomains
36. 36
Report Generator
To document your models, the COMSOL Report Generator
provides a comprehensive report of the entire model,
including graphics of the geometry, mesh, and postprocessing
quantities.
You can print the report directly or save it as an HTML file for
viewing through a web browser and further editing.
37. 37
Expression Variables
Add symbolic expression variables or expressions using the
dialog boxes that you open from the Expressions submenu on
the Options menu.
Global expressions are available globally in the model, and scalar
expressions are defined the same anywhere in the current
geometry.
With boundary expressions, subdomain expressions, point
expressions, and interior mesh boundary expressions you can
also create expressions that have different meanings in
different parts of the model.
38. 38
Expression Variables
Expression variables can make a model easier to understand by
introducing short names for complicated expressions.
Another use for expression variables is during postprocessing. If
you need to view a field variable throughout the model, but it
has different names in different domains, create an expression
variable made up of the different domains and then plot that
variable.
39. 39
Example 1: fluid flow between two parallel plates
This example models the developing flow between two parallel
plates. The purpose is to study the inlet effects in laminar flow
at moderate Reynolds numbers, in this case around 40.
The model’s input data are tabulated below.
40. 40
Step 1: The Model Navigator
Selecting the appropriate application mode in the Model
Navigator.
In the Model Navigator, click the New page.
Select:
Chemical Engineering Module>Momentum Transport>
Laminar Flow>Incompressible Navier-Stokes.
41. 41
Step 2: Creating Geometry
Drawing or importing the model geometry in the Draw Mode.
Simultaneously press the Shift key and click the
Rectangle/Square button.
Type the values below in the respective edit fields for the
rectangle dimensions.
Use the Draw Point button to
place two points by clicking
at (−0.01, 0.01) and (0.01, 0.01).
42. 42
Step 3: Modeling Physics and Equations
The first step of the modeling process is to create a temporary
data base for the input data. Define the constants in the
Constants dialog box in the Option menu.
Setting up the subdomain equations and boundary conditions in
the Physics Mode.
Select Subdomain Settings, select Subdomain 1, Define the
physical properties of the fluid.
43. 43
Boundary Conditions
From the Physics menu, select Boundary Settings.
Enter boundary conditions according to the following table.
44. 44
Step 4: Mesh Generation
In this case you want to customize some settings for the initial
mesh.
1. From the Mesh menu, select Free Mesh Parameters.
2. On the Boundary page, select Boundaries 3 and 6 from the
Boundary Selection list.
3. In the Maximum element size edit field, type 1e-3. This
creates elements with a maximum edge length of 10-3
m for
Edges 3 and 6.
4. Click the Remesh button.
45. 45
Step 5 : Solve
Computing the solution,
Click the Solve button on the Main toolbar.
Step 6 : Postprocessing
The resulting plots show how the velocity profile develops
along the flow direction. At the outlet, the flow is almost a
fully developed parabolic velocity profile.
47. 47
Example 2: Coupled Free and Porous Media Flow
This is a model of the coupling between flow of a gas in an open
channel and in a porous catalyst attached to one of the channel
walls. The flow is described by the Navier-Stokes equation in
the free region and the Brinkman equations in the porous region.
48. 48
Step 1: The Model Navigator
Selecting the appropriate application mode in the Model
Navigator.
In the Model Navigator, click the New page.
Select:
Chemical Engineering Module>Momentum Transport>
Laminar Flow>Incompressible Navier-Stokes.
49. 49
Step 2: Creating Geometry
Drawing or importing the model geometry in the Draw Mode.
Simultaneously press the Shift key and click the
Rectangle/Square button.
Type the values below in the respective edit fields for the
rectangle dimensions.
50. 50
Step 3: Modeling Physics and Equations
Define the constants in the Constants dialog box in the Option
menu.
Setting up the subdomain equations and boundary conditions in
the Physics Mode.
Select Subdomain Settings, select Subdomain 1, Set ρ to rho and
η to eta.
Select Subdomain 2, select the Flow in porous media (Brinkman
equations) check box.
Set ρ to rho, η to eta, εp to epsilon, and k to k.
51. 51
Boundary Conditions
From the Physics menu, select Boundary Settings.
Enter boundary conditions according to the following table.
52. 52
Step 4: Mesh Generation
In order to resolve the velocity profile close to the interface
between the open channel and the porous domain, a finer mesh
is required at this boundary.
1. From the Mesh menu, select Free Mesh Parameters.
2. Click the Custom mesh size option button.
3. In the Maximum element size edit field, type 2e-4.
4. In the Boundary tab, Select Edge 5, then type 1e-4 in the
Maximum element size edit field.
5. Click the Remesh button.
53. 53
Step 5 : Solve
Click the Solve button on the Main toolbar.
Step 6 : Postprocessing
To visualize the velocity in a horizontal cross-section across
the channel and the porous domain, follow these steps:
1. From the Postprocessing menu, select Cross-Section Plot
Parameters.
2. Specify the following
Cross-section line data: