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![1.
Indroduc3on
• Brazil
-‐
a
fast
adopter:
• R&D
at
ITA
and
USP
in
the
50’s
• First
plant
by
Philco
in
São
Paulo
for
diodes
and
transistors
in
the
60’s
• Many
back-‐end
plants
for
discrete
devices
a]er
the
60’s
• Microelectronics
Labs:
• LME/USP
–
end
of
60’s
• In
the
70’s:
LED
and
LPD
at
UNICAMP
and
CPqD
• Industries
in
the
80’s:
• Discrete
devices:
Semikron,
Aegis,
Icotron
+
many
back-‐end’s
• IC’s:
SID
Microeletrônica
(front-‐end,
back-‐end,
Design),
Itaucom
(back-‐end,
Design),
Elebra
(Design)
3](https://image.slidesharecdn.com/20160525jacobus20160519cpqd-160609143144/75/Brazilian-Semiconductor-Scenario-and-Opportuni3es-3-2048.jpg)
![IP
por|olio
• TSMC
IP
por|olio
– Std
cells,
IOs,
memory
compilers,
PLL,
PHY’s,
...
– Can
be
requested
in
TSMC
online
– Either
free
or
under
license
agreement
• Imec
IP
– State
of
the
art
IP
– Ranging
from
system
IP
to
advanced
building
blocks,
e.g.
• So]ware
Defined
Radio
IP
• Low
power
ADC
– Various
process
technologies
including
state
of
the
art
– Deliveries
and
business
models
tuned
to
your
need
• 3rd
party
IP
– Preferred
pricing
for
some
3rd
party
IP
providers
46](https://image.slidesharecdn.com/20160525jacobus20160519cpqd-160609143144/75/Brazilian-Semiconductor-Scenario-and-Opportuni3es-46-2048.jpg)
![Test
and
qualifica3on
– Test
hardware
and
so]ware
development
– Debugging
and
characteriza3on
– Qualifica3on
&
Failure
analysis
– Produc3on
volume
tes3ng
– Yield
op3miza3on
– Near-‐sourcing
for
efficient
test
program
development
and
small
volumes
produc3on
:
– Global
partners
for
high
volume
projects
:
– Qualifica3on
experience
mainly
in
Aerospace
[ESCC9000,
ESCC2269000],
Industrial
and
Medical
48](https://image.slidesharecdn.com/20160525jacobus20160519cpqd-160609143144/75/Brazilian-Semiconductor-Scenario-and-Opportuni3es-48-2048.jpg)
Uploaded byCPqD
Brazilian Semiconductor Scenario and Opportuni3es
The document discusses the Brazilian semiconductor scenario and opportunities. It outlines the main actors in the Brazilian semiconductor ecosystem, including universities and research institutes involved in fabrication and IC design. It also discusses IC design houses, semiconductor fabs, government support programs, and value chain service providers. The universities play a key role in R&D for silicon and III-V semiconductor materials and processes as well as IC and photonic design. There are also several IC design houses and some front-end and back-end semiconductor fabs in Brazil.
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Similar to Brazilian Semiconductor Scenario and Opportuni3es
Brazilian Semiconductor Scenario and Opportuni3es
- 1. Brazilian Semiconductor Scenario and Opportuni3es Jacobus W. Swart Imec, Leuven, Belgium and UNICAMP, Campinas, Brazil
- 2. Outline 1. Introduc3on 2. Main Actors 1. Universi3es, Ins3tutes, INCT’s 2. IC Design Houses 3. Semiconductor Fabs 4. Value Chain Services 3. Government Support 4. The ASIC Ecosystem for Innova3on 5. Imec IC-‐Link 6. Conclusions 2
- 3. 1. Indroduc3on • Brazil -‐ a fast adopter: • R&D at ITA and USP in the 50’s • First plant by Philco in São Paulo for diodes and transistors in the 60’s • Many back-‐end plants for discrete devices a]er the 60’s • Microelectronics Labs: • LME/USP – end of 60’s • In the 70’s: LED and LPD at UNICAMP and CPqD • Industries in the 80’s: • Discrete devices: Semikron, Aegis, Icotron + many back-‐end’s • IC’s: SID Microeletrônica (front-‐end, back-‐end, Design), Itaucom (back-‐end, Design), Elebra (Design) 3
- 4. ROM 2 kBit, 1978, nMOS (LME, EPUSP)
- 5. 90’s • Opening of boarders for import • Deindustrializa3on started • Increasing electronics trade deficit • But con3nuous R&D at academy. 5
- 6. 2000’s • New industrial policies • New lows and incen3ves • Airac3on of new industries: front-‐end and back-‐ end • IC Brazil program: DH’s and training 6
- 7. 2. Main Actors 1. Universi3es, Ins3tutes, INCT’s 2. IC Design Houses 3. Semiconductor Fabs 4. Value Chain Services 7
- 8. 2. Main Actors – Universi3es & Ins3tutes • Fabrica3on: Materials and Processes – Silicon based: USP, UNICAMP, UFRGS, UFPE – III-‐V based: USP, UNICAMP, PUC-‐RJ, UFMG – Ins3tutes: CBPF, CETENE, CTI, INPE and LNNano • IC Design and EDA tool: – FEI, ITA, PUC-‐RS, UFAM, UFCG, UFMG, UFPE, UFPel, UFPB, UFPR, UFRGN, UFRGS, UFRJ, UFSC, UFSM, UnB, UNESP, UNICAMP, UNIFEI, UNIPampa, Univali, USP • Photonic IC – ITA, CTI, UNICAMP, USP and others 8
- 9. Centro de Componentes Semicondutores – UNICAMP ( www.ccs.unicamp.br) Gap 120 nm With resonant frequency of 1.55 µm Without resonant frequency
- 10. • control separately ion energy (RF power) and ion flux (µW power). • operate at low pressure (1-‐100 mTorr) ⇒ reduce ion surface spuiering • A 2.45GHz µW source generates the plasma at high power • A 13.56 MHz RF power source biases separately the sample chuck. ECR (Electron Cyclotron Resonance) ECR System
- 11.
- 12. 2.1 Main Actors – INCT networks • INCT NAMITEC – 124 researches, 23 ins3tu3ons – Silicon micro and nanoelectronics systems – Concluded degrees (6.5 years): 120 PhD, 300 MSc – 600 papers ISI journals, 1500 papers at conferences • INCT DISSE – 12 researchers, 8 ins3tu3ons – III-‐V semiconductor devices • INCT INEO – 42 researchers, 26 ins3tu3ons – Organic electronics & optoelectronics • FOTONICOM 12
- 13. 2.2 Main Actors – IC Design Houses Ins2tu2on Aprox number of Designers Loca2on CEITEC 70 Porto Alegre CETENE 20 Recife Chipus 25 Florianópolis CIMATEC/Senai Salvador CPqD 30 Campinas CTI 30 Campinas DFChip 10 Brasília Eldorado 50 Campinas Idea! 12 Campinas LSITec 40 São Paulo NXP 145 Campinas SiliconReef 10 Recife Unitec 60 Ribeirão das Neves Von Braun 20 Campinas 13
- 14. 2.2 Main Actors – Training Centers • One year intense training program – based on Cadence material and tools. • One year on the job training • Support by MCTI through CNPq and FINEP • Two training centers: – CT1 at UFRGS, Porto Alegre – CT3 at USP, São Paulo. • Now in danger due to lack of budget. 14
- 15. 2.3 Main Actors – Semiconductor Fabs Company Ac2vity Loca2on BrPhotonics Photonic IC’s Campinas CEITEC SA Front-‐end CMOS + Fabless Porto Alegre HTMicron Back-‐end memories São Leopoldo Mul3laser Back-‐end memories Extrema Semikron Power discrete devices Carapicuiba Smart Back-‐end memories A3baia SUNEW OPV Belo Horizonte Unitec Front-‐end CMOS Ribeirão das Neves 15
- 16. 2.4 Main Actors – Value Chain Aggregators • Imec Representa3ve Office Brazil – access to foundries, packaging, tes3ng, logis3cs, consultancy, training • FastCompany Brazil – represent ARM and Synopsys. • Other providers of services: – directly abroad 16
- 17. 3. Governmental Support • Incen3ves lows: – PADIS – Informa3cs Low – Lei do Bem – Portaria 950 • Project funds, loans and equi3es: – BNDES, BNDESPar – FINEP – FAPESP: PIPE and PITE programs – FUNTELL and other agencies. – Embrapii 17
- 18. 4. The ASIC Ecosystem for Innova3on 18
- 19. ASICs – Applica3on Specific IC’s • ASICs are needed in many applica3ons : – High volumes (consumer) – Portability (medical, consumer, ...) – Large SoC – Mixed Signal ICs – Low Power (Baiery applica3ons) – Sensor applica3ons – IoT – Confiden3ality – .... Those applica3ons where unit cost is not an issue at low volumes, ex. High-‐end servers, high performance computers, space, ... 19
- 20. Use of FPGA vs ASIC • Economical only for few thousands of units • Technical solu3on only if power and size is no concern. 20
- 21. Use of ASSP vs ASIC • Semiconductor market numbers 2012 • Brazil: product development mainly with ASSP • Great opportunity and importance for ASIC for similar to interna3onal innova3on level 21 Semiconductor Market 2012 World US$ Bi1 % Brazil US$ Bi2 Total 299,9 100 5,1 ASSP 83,7 28 ~x ASIC 21,3 7,1 ~0,0x ASIC/ASSP ra3o 0,25 25 ~ 0 1 Gartner 2 ABINEE + MDIC
- 22. Up-‐coming revolu3on: power consump3on dilemma!!! • Mobile products • Dependence on power harves3ng sources • Need for very low power ASICs (FPGA are not viable and ASSP are not op3mized for each case) • Need for large quan3ty of skilled IC designers • Educa3on, training programs and MPW access is essen3al to par3cipate and be successful. 22
- 23. 23 Consumer, compu3ng, telecom and mobile have driven semiconductor usage In terms of volume, they s3ll do today Market Evolu3on
- 24. 24 Innova3on was driven mainly by large companies SMEs in suppor3ng mode
- 25. 25 Security, Medical & Wearables, Smart Home, Smart Car, Vision, Industrial, and …. IoT The new growth markets Segmenta3on and differen3a3on
- 26. 26 Very difficult to navigate for large companies Playground for many SMEs
- 27. 27 “Innova.on is usually with people who are small and gi9ed with a good idea.” Chris Neil, Maxim Senior Vice President, Industrial and Medical Solu.ons Group • Innova3on in this new and segmented market is diverse • Change occurs through collec3ve interac3on • SME’s apply collabora3ve research, and find crea3ve funding methods • We observe a strong 2011-‐2015 increase in ASIC demand by SMEs, reversing a decade long decline • Differen3a3on and IP protec3on provided by ASICs are main incen3ves • “Substream Innova2on” is the collec3ve SME innova3on ac3vity
- 28. 28 Observing substream flows Radio access Automo2ve Datacom Connected home Imaging & Vision Systems Security Innovation Domains Medical & Wearables Industrial
- 29. 29 RF design complexity BB design complexity .6 11ac 11ah -‐MTC 2G 3G 11ad 11n Playground for SME’s Radio access
- 30. Micro projector Drones BSI X ray Strong center of vision expertise around Leuven Touchless interac3on Video processor unit IP camera Hyperspectral Imaging andVision Systems
- 31. 31 Medical & Wearables …many of them developed by SME’s From “hearing aids” to a myriad of devices
- 32. ULP radios, and ULP design technology for baiery operated wearables 32 Medical & Wearables (UK) (F, HKG) (NL) (I)
- 33. 33 Industrial Connectedhome Source : Greenpeak, at GSA Munich 2014 Many technologies and more emerging Technology in essence “not yet” affordable but…. 25$ ultimate IoT module
- 34. 34 Industrial Industrial Li-‐Fi Vehicle M2M Agricultural surveillance Shelf tag labels Localiza3on Livestock Management Smart shopping cart
- 35. 35 How canEuropean SMEs be succesful? Suppliers FOUNDRIES EDA ASSEMBLY TEST IP PBA/PCB Large system companies Local market IDM Plessey, Philips, Siemens, Nokia, ... 300 SMEs
- 36. Government support • Financial s3mula3on to innovate • Support training of good engineers at academia, R&D centers, design houses, SMEs • Easy and affordable access to CAD tools and IC prototyping • Create VC friendly climate to create SMEs 36 How can European SMEs be succesful? 300 SMEs Suppliers FOUNDRIES EDA ASSEMBLY TEST IP PBA/PCB Design houses & IP houses Large system companies Local market WORLD MARKET
- 37. 5. Imec IC-‐LINK – ASIC services • MPW and assembly services to universi3es and companies (called “Europrac3ce”) • Access to TSMC technologies for prototyping and volume produc3on through VCA partnership with TSMC • Prototyping and volume : Assembly and Test – Design services • RTL or netlist to GDS2 place and route – physical design – Over 500 IC tape-‐outs per year – PBA services, failure analysis and packaging design – Integrated photonic solu3ons (wafers & packaging) – First ac3vi3es in 1984 37
- 38. Imec IC-‐link -‐ The team • 80 (now 95) people team of business developers, logis3c wizards consultants and technical support experts – 25 in ASIC prototyping and manufacturing services – 25 in ASIC design services – 12 in assembly, test and qualifica3on – 10 in business development and technology consultancy – 8 in PCB/PBA services, failure analysis and advanced packaging design 38
- 39. What our customers typically need – Access to leading edge technology at affordable cost – Prototyping with MPW and MLM – Advise in technology selec3on – Flexibility in business model : from COT to FTK – Logis3cs and opera3on support – Assembly, test and cer3fica3on services – Trusted supply chain partner – PCB/PBA technology and design know how – Access to leading edge IP 39
- 40. 40 IC-‐link as service provider Funding associations
- 41. Foundries and IC Technologies IHP (Germany) IHP SGB25V 0.25µ SiGe:C IHP SGB25VGOD 0.25µ SiGe:C IHP SG25H1 0.25µ SiGe:C IHP SG25H3P 0.25µ complementary SiGe:C IHP SG25H3 0.25µ SiGe:C IHP SG13B SiGe:C Bipolar/Analog IHP SG13S SiGe:C Bipolar/Analog/CMOS IHP SG13C SiGe:C CMOS 7M/MIM ON Semi (Belgium + USA) 0.7µ CMOS A/D 2M 0.5µ CMOS A/D 3M 0.35µ CMOS A/D 5M 0.7µ CMOS A/D I2T100 0.7µ CMOS A/D I2T30 0.35µ CMOS A/D I3T80/50/25 0.5µ CMOS C5 EEPROM 0.8µ CMOS A/D 0.6µ CMOS A/D 3M 0.35µ CMOS A/D 4M 0.8µ CMOS 50V 0.35µ SiGe BiCMOS 4M 0.35µ CMOS 50V 0.35µ CMOS OPTO 0.18µ CMOS + HV ams (Austria) TSMC (Taiwan) 0.25µ CMOS L/MS/RF 0.18µ CMOS L/MS/RF 0.13µ CMOS L/MS/RF 90nm CMOS L/MS/RF 65nm CMOS L/MS/RF 40nm CMOS L/MS/RF UMC (Taiwan) 0.25µ CMOS L/MMC/RF 0.18µ CMOS L/MMC/RF 0.13µ CMOS L/MMC/RF 90nm CMOS L/MMC/RF 65nm CMOS L/MMC/RF CIS : 0.18µ ARM/Ar3san (USA) Cell libraries and design kits for TSMC and UMC technologies Faraday (Taiwan) Cell libraries and design kits for UMC 0.25, 0.18, 0.13µ, 0.11µ, 90nm & 65nm CMOS Selec3on criteria Well-‐known foundry Partnership Flexible prototyping Small + medium volume
- 42. Silicon photonics, MEMS Foundries Si310-PH PiezoMUMPs MetalMUMPs SOIMUMPs PolyMUMPs Si substrate WaveGuide SiO2 Si FiberCoupler PSV ISIPP25G+ SG25_PIC
- 43. 43 High speedphotonics
- 44. Low volume access at affordable cost Prototypingcost Launch flexibility 1 ~0.8 ~0.1 ~0.025 Full Mask Size : ~ 20x30 mm Any time MPW Size : per sqmm MPW schedule mini Size : per subblock Selected runs from MPW schedule MPW MPW MPW MPW MPW mini mini MPW Size : ~ 10x15 mm Any time MLM MLM Source :TSMC
- 45. Schema2c Driven Layout Layout Device Models GDS Electrical simula2on EM simula2on Process varia2on simula2on Electro-‐Op2cal simula2on LVS DRC LFD Op2cal proximity correc2on Silicon Thickness (nm) PROCESS DESIGN KIT: PDK
- 46. IP por|olio • TSMC IP por|olio – Std cells, IOs, memory compilers, PLL, PHY’s, ... – Can be requested in TSMC online – Either free or under license agreement • Imec IP – State of the art IP – Ranging from system IP to advanced building blocks, e.g. • So]ware Defined Radio IP • Low power ADC – Various process technologies including state of the art – Deliveries and business models tuned to your need • 3rd party IP – Preferred pricing for some 3rd party IP providers 46
- 47. Assembly services – Access to best in class packaging houses • Prototypes • Produc3on volumes – Imec team of assembly specialists • Selec3on, customiza3on of package, simula3ons, ... – Wide range of produc3on and prototype packages • Plas3c and ceramic • Open tool: QFN, aQFN (Mul3 row), QFP, CQFP, ... • Customized packaged: xxBGA, WLCSP, aWLP, ... 47
- 48. Test and qualifica3on – Test hardware and so]ware development – Debugging and characteriza3on – Qualifica3on & Failure analysis – Produc3on volume tes3ng – Yield op3miza3on – Near-‐sourcing for efficient test program development and small volumes produc3on : – Global partners for high volume projects : – Qualifica3on experience mainly in Aerospace [ESCC9000, ESCC2269000], Industrial and Medical 48
- 49. Test facility and capabili3es 49 Hatina Teradyne Microflex Quad Site Teradyne I-flex Teradyne J750
- 50. 50 Broaden your mind Strengthen your skills discover our por|olio @ www.imecacademy.be CMOS Process steps Packaging & 3D Memories Microsystems & MEMS Materials Modeling Characterization & reliability Photonics Beyond CMOS Digital design Analog & RF Electronics design & manufacturing Modeling of circuits & systems Energy Biomedical systems Vision systems Wireless systems Sensor systems Large Area Electronics GET TO KNOW IMEC INNOVATION AND RESEARCH Powered by Cornerston All Rights Rese MS Digital design Analog & RF Electronics design & manufacturing Modeling of circuits & systems Energy Biomedical systems Vision systems Wireless systems Sensor systems Large Area Electronics
- 51. ▸ Established in 1984 ▸ Largest independent R&D ins3tute in Europe ▸ Total 2015 revenue of 415 M€ ▸ > 2400 people ▸ published 998 prominent scien3fic papers ▸ filed a record number of 180 European patents IMEC 51
- 52. Office USA San Francisco Belgium Leuven The Netherlands Eindhoven China Shanghai Office Japan Tokyo Taiwan Hsinchu India Bangalore Worldwide presence Office Brazil Campinas 52
- 53. IMEC ac3vi3es 53 MEMS, Sensors, Photonics HETEROGENEOUS INTEGRATION Lithography Devices Interconnects CORE CMOS FLEXIBLE ELECTRONICS INTERNET OF HEALTHYTHINGS BAN Life sciences INTERNET OF POWER Photovoltaics Power devices INTERNET OF THINGS Sensing & connectivity solutions INDUSTRIALISATION FOUNDRY ACCESS TO >300 SMEs AND >700 ACADEMIA TAPES-OUT MORE THAN 500 IC DESIGNS PERYEAR Imec IC-link
- 54. 6. Conclusions • A considerable semiconductor ecosystem has developed in Brazil. • Governmental industrial policies and incen3ves are of paramount importance for the deployment of the semiconductor sector. • The new uprising markets offer great opportunity for development of new components and products for Brazilian enterprises, also SME’s. • Access to interna3onal broad range of technologies and services are needed to fulfill the needs for innova3ve and compe33ve products. 54
- 55. • Contacts: – jacobus.swart@imec.be, – jacobus@fee.unicamp.br • Sorry for possible mistakes and/or omissions. • Acknowledgment to Carl Das and Paul Malisse from IMEC for sharing some slides 55