Linx Consulting provides insights into the electronic materials supply chain and helps clients succeed through experience in industries such as semiconductors, LCDs, packaging, photovoltaics, and nanotechnology. They analyze challenges for the future including 3D packaging, 450mm wafers, new memory technologies, EUV lithography, and changes in the global market drivers as mobile devices surpass desktop and laptop computers. Process complexity is driving higher materials demand growth than wafer start growth, with segments such as photoresist and ancillaries showing stronger increases than overall wafer production.
Implementing the latest embedded component technology from concept-to-manufac...Zuken
This document discusses implementing embedded components in printed circuit boards from concept to manufacturing. It begins with an overview of embedded component technologies and their advantages like increased density and performance. Common challenges are then addressed such as meeting tolerance requirements for formed components and impact on thermal behavior. The document emphasizes the importance of considering manufacturability early in the design process and working closely with manufacturers to define dedicated design rules. It concludes that a true 3D design approach is necessary to effectively implement embedded component technologies.
3D Embedded Substrate Technologies Increase Density and Performance of Power ...Design World
This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
Indiana Integrated Circuits is commercializing Quilt Packaging technology, which was invented at Notre Dame. Quilt Packaging allows for chips to be directly connected along their edges in a "quilt-like" assembly for improved performance, cost, size and functionality compared to traditional packaging. IIC licenses the Quilt Packaging process, supports early adopters in defense applications, and plans to transition to commercial applications. Quilt Packaging can integrate disparate materials like silicon and gallium arsenide and is implemented using standard fabrication processes.
The document discusses the evolution of data center cabling standards to support higher bandwidth needs. It notes that multi-fiber push on (MPO) cabling has increased relevance for enabling migration paths to 40G, 100G, and potential 400G connectivity while reusing existing horizontal cabling infrastructure. The document emphasizes that using PanMPO connectors can help raise performance certainty, support faster testing and installation, and reduce capital expenses during upgrades from 10G to 40G/100G and beyond.
World Class Cable Solutions from Habia CableHabia Cable
Habia Cable is a leading European manufacturer of specialized wires, cables, and cable systems. They have a reputation for designing high-performance standard and custom cables for demanding applications in nuclear, defense, telecommunications, and industrial sectors. Habia Cable has sales offices across Europe and Asia, and production facilities in multiple countries, allowing them to sell products in over 50 countries worldwide. They specialize in innovative cable solutions through their expertise in materials and ability to customize designs to meet customers' technical and environmental requirements.
Presented by Mark Boxer & Jeff Bush of OFS
Agenda:
• Why Fiber?
• Fiber Feeds Everything
• Nuts and Bolts -The Components
• Installation Techniques
• Network Architectures and Planning
Challenges of Silicon Photonics Testing from a Foundry's Perspective_SEMICON2016Tiong Leh (Johnny) YAP
Silicon photonics is poised to revolutionize data communications and served as the leading technological solution for applications like data center and long-haul communication. Big internet companies are forecasted to be the driving force pushing the silicon photonics to large volume production. By leveraging existing wafer foundry infrastructures, silicon photonics would benefit from economies of scale. To enable volume production for silicon photonics, foundries need to establish a systematic methodology of testing silicon photonics devices. Design of optical process control monitoring (PCM) test structure for silicon photonics and setup of fully automated optical test equipment are still at the research stage. The characterization of the fundamental silicon photonic building blocks and the challenge of wafer-level testing will be discussed in the presentation.
Semiconductor Communication Applications by Naill Shakeshaft of ON SemiconductorON Semiconductor
1. The document discusses ON Semiconductor's communications segment, which generated $395M in revenue in 2012. It provides an overview of key growth drivers like the rising smartphone and tablet market.
2. ON Semiconductor has leading positions in areas like RF tuning, optical image stabilization, and power supplies that are essential for communications devices. It offers a broad portfolio of solutions for enabling hardware differentiation in smartphones and tablets.
3. Key takeaways are that both communications equipment volumes and ON Semiconductor's market opportunity are growing, and it has strong offerings in areas like RF tuning and camera modules that position it well in this segment.
Implementing the latest embedded component technology from concept-to-manufac...Zuken
This document discusses implementing embedded components in printed circuit boards from concept to manufacturing. It begins with an overview of embedded component technologies and their advantages like increased density and performance. Common challenges are then addressed such as meeting tolerance requirements for formed components and impact on thermal behavior. The document emphasizes the importance of considering manufacturability early in the design process and working closely with manufacturers to define dedicated design rules. It concludes that a true 3D design approach is necessary to effectively implement embedded component technologies.
3D Embedded Substrate Technologies Increase Density and Performance of Power ...Design World
This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
Indiana Integrated Circuits is commercializing Quilt Packaging technology, which was invented at Notre Dame. Quilt Packaging allows for chips to be directly connected along their edges in a "quilt-like" assembly for improved performance, cost, size and functionality compared to traditional packaging. IIC licenses the Quilt Packaging process, supports early adopters in defense applications, and plans to transition to commercial applications. Quilt Packaging can integrate disparate materials like silicon and gallium arsenide and is implemented using standard fabrication processes.
The document discusses the evolution of data center cabling standards to support higher bandwidth needs. It notes that multi-fiber push on (MPO) cabling has increased relevance for enabling migration paths to 40G, 100G, and potential 400G connectivity while reusing existing horizontal cabling infrastructure. The document emphasizes that using PanMPO connectors can help raise performance certainty, support faster testing and installation, and reduce capital expenses during upgrades from 10G to 40G/100G and beyond.
World Class Cable Solutions from Habia CableHabia Cable
Habia Cable is a leading European manufacturer of specialized wires, cables, and cable systems. They have a reputation for designing high-performance standard and custom cables for demanding applications in nuclear, defense, telecommunications, and industrial sectors. Habia Cable has sales offices across Europe and Asia, and production facilities in multiple countries, allowing them to sell products in over 50 countries worldwide. They specialize in innovative cable solutions through their expertise in materials and ability to customize designs to meet customers' technical and environmental requirements.
Presented by Mark Boxer & Jeff Bush of OFS
Agenda:
• Why Fiber?
• Fiber Feeds Everything
• Nuts and Bolts -The Components
• Installation Techniques
• Network Architectures and Planning
Challenges of Silicon Photonics Testing from a Foundry's Perspective_SEMICON2016Tiong Leh (Johnny) YAP
Silicon photonics is poised to revolutionize data communications and served as the leading technological solution for applications like data center and long-haul communication. Big internet companies are forecasted to be the driving force pushing the silicon photonics to large volume production. By leveraging existing wafer foundry infrastructures, silicon photonics would benefit from economies of scale. To enable volume production for silicon photonics, foundries need to establish a systematic methodology of testing silicon photonics devices. Design of optical process control monitoring (PCM) test structure for silicon photonics and setup of fully automated optical test equipment are still at the research stage. The characterization of the fundamental silicon photonic building blocks and the challenge of wafer-level testing will be discussed in the presentation.
Semiconductor Communication Applications by Naill Shakeshaft of ON SemiconductorON Semiconductor
1. The document discusses ON Semiconductor's communications segment, which generated $395M in revenue in 2012. It provides an overview of key growth drivers like the rising smartphone and tablet market.
2. ON Semiconductor has leading positions in areas like RF tuning, optical image stabilization, and power supplies that are essential for communications devices. It offers a broad portfolio of solutions for enabling hardware differentiation in smartphones and tablets.
3. Key takeaways are that both communications equipment volumes and ON Semiconductor's market opportunity are growing, and it has strong offerings in areas like RF tuning and camera modules that position it well in this segment.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
The document summarizes key points from the Fiber Connect 2023 conference in Orlando, including a panel discussion with Corning. Some of the main topics discussed were the current state and future trends of the fiber optic broadband industry, such as a projected 50% market penetration of FTTH by 2024. Corning representatives provided details on their tip-to-tip planning solutions and expectations that 100G networks will gain more market share by 2030. Standards organizations and their role in developing specifications to support new applications were also covered. Contact information was provided for experts that could address additional questions.
Koonsys is a network optimization company that launched its iNOP software in 2004. iNOP uses advanced algorithms and optimization techniques to analyze telecom network data and identify opportunities to reduce costs and improve network performance. It provides customized optimization plans and reports for clients. Case studies showed iNOP optimized networks by reducing microwave hops by 5-33%, freeing up tower space, increasing link capacities by 27-262%, and reducing costs per Mbps transferred by 16-51%.
Thin Film Semiconductor Deposition Market, Size, Share 2022Radhika Patil
Thin Film Semiconductor Deposition Market is segmented by deposition technology and industry verticals. Thin film market is expected to get $22 bn by 2022
This document summarizes Koonsys' iNOP network optimization software and service. It describes Koonsys' history and timeline, the traditional and innovative services it offers to wireless and wired network operators, its customers and partners. It then discusses trends in the telecom industry requiring cost savings and network expansion. iNOP is presented as the unique solution that addresses both needs through a techno-economic model combining technical and financial optimization of transmission networks. The document outlines how iNOP works through advanced algorithms, potential project results, deliverables and sample case studies showing capacity increases, cost savings and other benefits achieved for various mobile operators.
This document provides an overview of additive manufacturing (AM), also known as 3D printing. It defines AM as a process of joining materials layer by layer to make objects from 3D model data, as opposed to subtractive manufacturing methods. The document discusses different AM technologies including liquid-based, solid-based, powder bed fusion, and binder jetting. It also covers applications of AM in the medical and automotive industries, benefits of AM including design freedom and reduced material waste, and limitations such as part size restrictions.
This document discusses electronic inks and pastes produced by Intrinsiq Materials for applications such as packaging, batteries, sensors, displays, and touchscreens. It provides an overview of Intrinsiq Materials' facilities for nanoparticle production and development, including rapid prototyping systems, a pilot plant, and analytical equipment. Examples are given of Intrinsiq's copper inks being used in applications like circuit development, biosensors, LEDs, and OLED lighting through printing and laser sintering processing. The document emphasizes the need for low-cost, high-quality conductive inks combined with cost-effective sintering to increase adoption of printed electronics.
1) Mobile phone growth has slowed and image sensor price reductions are no longer sufficient, leading suppliers to seek new opportunities.
2) Multi-camera solutions are growing rapidly but risks saturating, so suppliers must pursue "smart sensors/cameras" that sense and process images.
3) This shift requires a move from centralized processing to distributed edge processing that filters data and provides answers rather than just data. It enables new applications and opportunities for all ecosystem players.
The document discusses NEC Electronics, a semiconductor company that provides products like microcontrollers, memory, and integrated circuits. It focuses on key aspects of the company's operations including its products, critical success factors, quality initiatives, flexibility, innovation, and strategies to reduce production cycle times. The company aims to offer cost-effective, high-quality solutions while maintaining a flexible and innovative approach.
DesignCon 2019 112-Gbps Electrical Interfaces: An OIF Update on CEI-112GLeah Wilkinson
DesignCon 2019
112-Gbps Electrical Interfaces: An OIF Update on CEI-112G
Brian Holden, Kandou Bus
Cathy Liu, Broadcom
Steve Sekel, Keysight
Nathan Tracy, TE Connectivity
Virtual Retinal Display: their falling cost and rising performanceJeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to analyze the increasing economic feasibility of virtual retinal displays. These displays focus light on a person’s retina using LEDs, digital micro-mirrors and lenses, which are all encased in a head-set about the size of glasses. They enable high resolution 3D video images with a large field of view that are far superior to existing displays. Rapid improvements in LEDs and digital micro-mirrors (one type of MEMS) are enabling these displays to experience rapid reductions in cost and improvements in performance.
The document analyzes RevolutionFibres' strategy for entering the specialty films market with its nanofibre technology. It identifies supercapacitors as the strongest initial customer segment due to opportunities for nanofibres to create highly functional electrodes and separators. The technology strategy recommends establishing a partnership with a supercapacitor manufacturer to gain expertise in components, then expanding into other energy applications like piezoelectric generators and DSSCs which have material and process similarities. Upgrades to production technology and acquiring additional post-production expertise will support customized product development as the strategy progresses.
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
The document summarizes key points from the Fiber Connect 2023 conference in Orlando, including a panel discussion with Corning. Some of the main topics discussed were the current state and future trends of the fiber optic broadband industry, such as a projected 50% market penetration of FTTH by 2024. Corning representatives provided details on their tip-to-tip planning solutions and expectations that 100G networks will gain more market share by 2030. Standards organizations and their role in developing specifications to support new applications were also covered. Contact information was provided for experts that could address additional questions.
Koonsys is a network optimization company that launched its iNOP software in 2004. iNOP uses advanced algorithms and optimization techniques to analyze telecom network data and identify opportunities to reduce costs and improve network performance. It provides customized optimization plans and reports for clients. Case studies showed iNOP optimized networks by reducing microwave hops by 5-33%, freeing up tower space, increasing link capacities by 27-262%, and reducing costs per Mbps transferred by 16-51%.
Thin Film Semiconductor Deposition Market, Size, Share 2022Radhika Patil
Thin Film Semiconductor Deposition Market is segmented by deposition technology and industry verticals. Thin film market is expected to get $22 bn by 2022
This document summarizes Koonsys' iNOP network optimization software and service. It describes Koonsys' history and timeline, the traditional and innovative services it offers to wireless and wired network operators, its customers and partners. It then discusses trends in the telecom industry requiring cost savings and network expansion. iNOP is presented as the unique solution that addresses both needs through a techno-economic model combining technical and financial optimization of transmission networks. The document outlines how iNOP works through advanced algorithms, potential project results, deliverables and sample case studies showing capacity increases, cost savings and other benefits achieved for various mobile operators.
This document provides an overview of additive manufacturing (AM), also known as 3D printing. It defines AM as a process of joining materials layer by layer to make objects from 3D model data, as opposed to subtractive manufacturing methods. The document discusses different AM technologies including liquid-based, solid-based, powder bed fusion, and binder jetting. It also covers applications of AM in the medical and automotive industries, benefits of AM including design freedom and reduced material waste, and limitations such as part size restrictions.
This document discusses electronic inks and pastes produced by Intrinsiq Materials for applications such as packaging, batteries, sensors, displays, and touchscreens. It provides an overview of Intrinsiq Materials' facilities for nanoparticle production and development, including rapid prototyping systems, a pilot plant, and analytical equipment. Examples are given of Intrinsiq's copper inks being used in applications like circuit development, biosensors, LEDs, and OLED lighting through printing and laser sintering processing. The document emphasizes the need for low-cost, high-quality conductive inks combined with cost-effective sintering to increase adoption of printed electronics.
1) Mobile phone growth has slowed and image sensor price reductions are no longer sufficient, leading suppliers to seek new opportunities.
2) Multi-camera solutions are growing rapidly but risks saturating, so suppliers must pursue "smart sensors/cameras" that sense and process images.
3) This shift requires a move from centralized processing to distributed edge processing that filters data and provides answers rather than just data. It enables new applications and opportunities for all ecosystem players.
The document discusses NEC Electronics, a semiconductor company that provides products like microcontrollers, memory, and integrated circuits. It focuses on key aspects of the company's operations including its products, critical success factors, quality initiatives, flexibility, innovation, and strategies to reduce production cycle times. The company aims to offer cost-effective, high-quality solutions while maintaining a flexible and innovative approach.
DesignCon 2019 112-Gbps Electrical Interfaces: An OIF Update on CEI-112GLeah Wilkinson
DesignCon 2019
112-Gbps Electrical Interfaces: An OIF Update on CEI-112G
Brian Holden, Kandou Bus
Cathy Liu, Broadcom
Steve Sekel, Keysight
Nathan Tracy, TE Connectivity
Virtual Retinal Display: their falling cost and rising performanceJeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to analyze the increasing economic feasibility of virtual retinal displays. These displays focus light on a person’s retina using LEDs, digital micro-mirrors and lenses, which are all encased in a head-set about the size of glasses. They enable high resolution 3D video images with a large field of view that are far superior to existing displays. Rapid improvements in LEDs and digital micro-mirrors (one type of MEMS) are enabling these displays to experience rapid reductions in cost and improvements in performance.
The document analyzes RevolutionFibres' strategy for entering the specialty films market with its nanofibre technology. It identifies supercapacitors as the strongest initial customer segment due to opportunities for nanofibres to create highly functional electrodes and separators. The technology strategy recommends establishing a partnership with a supercapacitor manufacturer to gain expertise in components, then expanding into other energy applications like piezoelectric generators and DSSCs which have material and process similarities. Upgrades to production technology and acquiring additional post-production expertise will support customized product development as the strategy progresses.
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.
THOUGH THE SI PHOTONICS MARKET HAS JUST KICKED OFF, VOLUME PRODUCTION IS ALREADY CLOSE
Big data is getting bigger by the second, and transporting it with existing technologies will push the limits of power consumption, density and weight. Yole Développement analysts are convinced that photons will replace electrons, and that Si photonics will be the mid-term platform to assist this transition.
Si photonics offers the advantages of silicon technology: low cost, higher integration, more embedded functionalities and higher interconnect density. It also provides two other key advantages:
1. Low power consumption: particularly when compared to copper-based solutions, which are expensive and require high electrical consumption.
2. Reliability: especially important for data centers, where a typical rack server’s lifespan is two years before replacement.
Back in 2006, VOA were the market’s first Si photonics products. Today, there are still a few Si photonics products on the market (i.e. VOA, AOC and transceivers from Luxtera, Kotura/Mellanox and Cisco/Lightwire) but big companies (i.e. Intel, HP and IBM) are close to realizing silicon photonics products. Yole Développement also sees big OEMs such as Facebook, Google and Amazon developing their own optical data center technology in partnership with chip firms (such as Facebook with Intel).
In this report Yole Développement shows that, in the short-term, silicon photonics will be the platform solution for future high-power, high-bandwidth data centers. Silicon photonics chips will be deployed in high-speed signal transmission systems, which greatly exceed copper cabling’s capabilities, i.e. for data centers and high-performance computing (HPC). As silicon photonics evolves and chips become more sophisticated, we expect the technology to be used more often in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Analysts also analyzed silicon photonics’ chances of being used for telecom, consumer, medical and biosensors applications, compared with competing technologies.
More information on that report at http://www.i-micronews.com/reports/Silicon-Photonics-2014-report/1/445/
2. www.linx-consulting.com
617.273.8837• 973.698.2331
2
Linx Consulting
1. We create knowledge and develop unique insights at the
intersection of electronic thin film processes and the chemicals
industry
2. We help our clients to succeed through our:
• Experience in global electronics and advanced materials and thin film
processing industries:
• Experience in the global chemicals industry
• Experience at Device Producers
• Experience at OEMs
• Global network and capabilities
• Advanced modeling capabilities
– Semi
– LCD
– Packaging
– PV
– Nano Technology
– Other
SEE BEYOND THE HORIZON
3. www.linx-consulting.com
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3
Another Below-trend Year for Global Growth
-4
-2
0
2
4
6
95
96
97
98
99
00
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
%Change
Forecast
Long-term Trend
World Real GDP Growth
Relative to 2012: slightly weaker in US; mild recession in Eurozone continues;
slightly stronger in Asia, with positive spillovers to other emerging economies
SEE BEYOND THE HORIZON
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5
Changing Market Drivers
• Desktop PC market slowed and has matured
• Laptop PC market growing , but at a lower rate
• Chipsets for smartphones and tablets are analogous
• High growth as penetration increases
The Growth of Mobile
SEE BEYOND THE HORIZON
Source: Qualcomm, IDC
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9
Is Moore’s Law Broken?
• Current process technology
diverges from the historic
cost per bit curve as
multipatterning and process
complexity increase.
• EUV reduces this
divergence by reducing litho
complexity and saving
some patterning cost
• Combining EUV with
450mm allows the cost per
bit to stay on trend.
SEE BEYOND THE HORIZON
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10
Lithography Drivers
• The introduction of Immersion 193nm
scanners was the last major wavelength
improvement
• Off-axis illumination, phase shift
masking, assist features, etc have
extended lithography capability
• Self Aligned Double Patterning, multi-
layer resists, multi-patterning, and source
mask optimization have extended
process capability significantly
• Given current trends EUV may provide a
significant capability increase after 2015
• Indications are that NXE 3300B
shipments will commence in 2013 with
sources enabling 70 wafers per hour at
customers in mid-2014
Difficult
“Easy”
SEE BEYOND THE HORIZON
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EUV Wafer Cost Effect
• Cost in $/cm2 for a 300mm
foundry logic process in a
Taiwan foundry.
• First year of implementation
EUV is used for most critical
layers. Beginning year 3 older
EUV systems used in “mix and
match” strategy totally
eliminating all multi-patterning.
• In 2016 added cost of late
implementation could amount
$8.5Bn of 110k w/mo.
Source: Strategic Cost Model - revision 1109
SEE BEYOND THE HORIZON
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Materials Intensity by Market
$300Bn$Bn Semiconductors has the lowest
materials intensity, but requires
a high R&D input in
comparison to comparable
electronic device segments.
Materials requirements
includes substrates, and
packaging materials.
SEE BEYOND THE HORIZON
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Semiconductor Material Demand
• Process complexity is driving higher
growth in materials demand than
the wafer start growth
– The BOM component of
semiconductor sales will
increase over the next 5 years
• Photoresist and Ancillaries will
show segment growth of
15%, higher than other major
segments, and higher than the
wafer start growth.
• Vapor deposition will continue to
displace physical deposition, driving
growth of ALD and CVD materials.
SEE BEYOND THE HORIZON
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18
Industry Structure, 2014
0
10,000
20,000
30,000
40,000
>1 1 0.8 0.5 0.35 0.25 0.18 0.13 0.045 0.032
0.09
0.065
DRAM
NAND
NOR
Adv Logic
Logic
Analog
Discrete
Notes:
1. Bottom axis is on a percentage basis
2. Size of box is proportional to # wafer starts
3. Source: Semico and Linx estimates
The new “Silicon Valley”
Business model changes required / desirable?
Materials innovations required
WSPY, K
Broadband
i-line
248nm
193/193i
SEE BEYOND THE HORIZON
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21
Little Consolidation in Chemicals
However, the equipment
producers have begun a recent
round of consolidation with:
• Applied Materials acquiring
Semitool and Varian
• Tokyo Electron acquiring
Nexx Systems and Oerlikon
• Lam Research acquiring
Novellus
Many indications are that this may
be to align each companies’
portfolio for through silicon via
(TSV)
Herfindahl Index example in
CMP slurries. There has
been little consolidation in
the supply of electronic
chemicals.
Consolidation is
happening at the end
user level in semi and
LCD
• Micron will likely
acquire Elpida
• Formation of Japan
Display – Sony,
Toshiba, Hitachi in
FPD
Electronic Chemicals Fab Equipment Device Producers
SEE BEYOND THE HORIZON
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22
The Quality Journey
• Quality Improvement
– Increasing number of metals and elements in CofA
• 8 to 24
– Increased Sensitivity
• ppm -> ppb -> ppt
• Inorganic chemicals regularly specified at ppt levels
– Function specifications becoming more specific
• Resolution, DOF EL, line collapse, profile, adhesion, footing, toploss, LER, LWR
• Selective etch rates
• Polish rates, defectivity, dishing
• Service Improvement
– Beyond SPC
– Ship to stock qualification
• Sub-Supplier Monitoring
– Materials component supply analysis
– Materials fingerprinting
SEE BEYOND THE HORIZON
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Advanced Materials
Learning/Characterization
• Well controlled manufacturing
at the supplier leads to product
qualification
• Changed process at the sub-
supplier changes end product
performance
• Process audit located the
change, and was rectified at
cost of time and product
Sourcing
Reaction
Purification
Packaging
Shipping
Receiving
Reaction
Formulation
Purification
Application Test
QC
Distillation
Shipping
QC
SupplierSub
Supplier
Sub
Supplier
Purification
• Sub-supplier process mapping
during product development
• Beyond CofA material
fingerprinting
• Understand and Control
variation
SEE BEYOND THE HORIZON
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Directed Self Assembly
• DSA represents a possible resolution
extension for ArFi:
– Segregating Block Co-polymers
form reduced pitch alternating
polymer films with selective etch
properties.
– Pattern transfer follows
traditional routes.
• DSA is being pursued by multiple
companies.
• DSA can be implemented with
optical, e-beam, imprint or EUV
exposure.
• Defect levels remain high, but have
been reduced to levels that indicate
production capability.
SEE BEYOND THE HORIZON
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TSV Scenarios – More Than Moore
Category 2010 - 2015 2016 - 2020 2021 - 2025
DRAM
LOGIC
NAND
Source: HMCC
MemoryCube
Stacked
DRAM
HybridCube
Consolidate
address logic
on one
device
SystemCube
Package
system
components
vertically
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27
Conclusions
• Growth returns in 2013.
• A high upside potential remains in specialty materials for Semiconductors
– This is offset by significant R&D requirements
– HKMG, FinFETs, FDSOI, 3D-NAND and STT-MRAM development programs are
already well advanced, although challenges remain at 22nm and below.
– Now is the time to place bets for the next generation architectures.
• More Moore has significant implications for both equipment and materials suppliers
– 450mm is driven by fab economics, not materials markets. Prepare for
deployment over the next 5 years.
– 450mm will probably slow materials market growth.
• EUV is needed ASAP to mitigate process complexity and keep wafer cost low.
Challenges of source power, and resist performance continue to slow implementation.
• Materials demand grows faster than Semiconductor Unit growth due to process
complexity.
– Patterning, CVD and ALD, and CMP all drive materials demand growth.
• 3D Packaging and TSV processing is a key area for focus over the next 5 years.
SEE BEYOND THE HORIZON
Editor's Notes
For a Foundry running 110,000 waf / mo in 2016Increased Cost $8.5 Bn / yrTSMC sales in 2011 were 14Bn