This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Report’s Key Features
• PDF >130 slides
• Excel file with >3,800 patents
• Competitive landscape from a patent perspective, offering a very complementary vision to market research.
• Key patent owners, their IP and technology strategies and their future intents.
• New entrants, their technology and their market areas of interest.
• Know competitors’ strengths and weaknesses in terms of patents and technologies.
• Follow technology developments, identify emerging technologies and know key technical solutions to solve hot technical issues.
• Identify free technologies which can be used safely and to mitigate the risks of patent infringement.
• Identify technologies to acquire and potential R&D partners.
• Benefit from a useful Excel database with all patents analyzed in the report, including technology segmentation.
1) The Internet of Things (IoT) market is projected to grow significantly from $120 billion in 2016 to $253 billion in 2021. Patent activity and acquisitions in IoT are also increasing substantially.
2) Samsung, Qualcomm, Microsoft, and Intel are the top patent holders in key IoT technologies such as sensors, processors, and network infrastructure. China is the largest source of IoT patent applications.
3) Major acquisitions in IoT have involved companies in applications such as home automation, wearables, and industrial automation technologies. These acquisitions are helping companies expand into new IoT business areas.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
GaN Power Device Market by Device Type (Power, RF Power), Voltage Range, Application (Power Drives, Supply & Inverter, and RF), Vertical (Telecommunications, Consumer, Automotive, Military, Defense, Aerospace), and Geography
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
This document provides an overview and table of contents for a report on edge emitting laser diode market and technology trends from 2019. It includes a 3-page executive summary that analyzes the global EEL market, key applications such as optical communication, sensing, material processing and displays. The report also examines the EEL technology, industry landscape and major players. It aims to give insights into driving forces for the EEL laser source market, technologies and industry in the short, medium and long term.
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
This document provides an overview of the types of reports that will be available in 2019 from Yole Développement and its partner companies, System Plus Consulting and KnowMade. A total of over 125 reports will cover 18 technology fields across 6 end markets, including mobile/consumer, automotive, medical, industrial, telecom/infrastructure, and defense/aerospace. The reports will provide market analysis, technology trends, reverse costing analyses, and patent landscape investigations. Custom consulting services are also available to provide more in-depth insights into specific topics.
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends 2017 Re...Yole Developpement
The GaN power device supply chain is acting to support market growth.
THE SUPPLY CHAIN FOR POWER GAN PREPARES FOR PRODUCTION
The supply chain is close to being settle for the Power GaN market and deals during 2017 show confidence that GaN will be a successful market. First of all, there have been big investments from the main foundries to increase their capacity to handle mass production. Navitas just announced the partnership with TSMC and Amkor to ramp production capacity. Moreover, BMW i Ventures has just invested in GaN Systems. The Taiwan’s Ministry of Economic Affairs is also interested in using GaN for clean and green technologies, also in collaboration with GaN Systems.
GaN manufacturers continue developing new products and provide samples to customers, as is the case with EPC and its wireless charging line. During 2017, Panasonic announced the mass production of its 650 V products and Exagan successfully produced its first high voltage devices on 8-inch wafers. Other players are in the final phase of R&D or qualification for their GaN products to be launched in 2018. In both cases, manufacturers and clients are pushing to use GaN HEMTs in emerging technologies.
Yole Développement differentiates the Power GaN supply chain into two main models: the Integrated Device Manufacturer (IDM) model and the foundry model. We think that both IDM and foundry models will co-exist while there are different needs on the market, for example in consumer and industrial applications. In addition to the existing models, China is introducing a model with an R&D research center or design center, an external epitaxial supplier and a foundry for manufacturing, to support large-scale demand in the future.
This report furnishes an overview of the GaN power industry, covering the value chain from epitaxy and device design to device processing. It updates the supply chain and there is an overview of the year’s investments.
More information on that report at http://www.i-micronews.com/reports.html
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends - 20...Yole Developpement
GaN power devices: a promising, fast-growing market
A GROWING MARKET WITH LOTS OF EXCITING NEWS IN 2015 - 2016
2015 - 2016 has been an exciting year for the gallium nitride (GaN) power business. Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from Efficient Power Conversion (EPC), but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.
Also, a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea
of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.
Despite these exciting developments, the GaN power market remains small compared to the gigantic $335B silicon semiconductor market. In fact, according to Yole Développement (Yole) investigation the GaN power business was less than $10M in 2015. But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market.
The first GaN devices were not commercially available until 2010, so we are talking about an industry that is only six years old. What is most important is the GaN market’s future potential – and Yole expects the GaN power business to grow, reaching a market size of around $300M in 2021 at a 2016 – 2021 CAGR of 86%.
This report provides a structured vision of the GaN power device market in terms of uses, applications, and potential trends.
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Status of the Power Electronics Industry 2018 report by Yole DéveloppementYole Developpement
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices to passives, packaging and integration.
More information on https://www.i-micronews.com/report/product/status-of-the-power-electronics-industry-2018.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
Report’s Key Features
• PDF >130 slides
• Excel file with >3,800 patents
• Competitive landscape from a patent perspective, offering a very complementary vision to market research.
• Key patent owners, their IP and technology strategies and their future intents.
• New entrants, their technology and their market areas of interest.
• Know competitors’ strengths and weaknesses in terms of patents and technologies.
• Follow technology developments, identify emerging technologies and know key technical solutions to solve hot technical issues.
• Identify free technologies which can be used safely and to mitigate the risks of patent infringement.
• Identify technologies to acquire and potential R&D partners.
• Benefit from a useful Excel database with all patents analyzed in the report, including technology segmentation.
1) The Internet of Things (IoT) market is projected to grow significantly from $120 billion in 2016 to $253 billion in 2021. Patent activity and acquisitions in IoT are also increasing substantially.
2) Samsung, Qualcomm, Microsoft, and Intel are the top patent holders in key IoT technologies such as sensors, processors, and network infrastructure. China is the largest source of IoT patent applications.
3) Major acquisitions in IoT have involved companies in applications such as home automation, wearables, and industrial automation technologies. These acquisitions are helping companies expand into new IoT business areas.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
GaN Power Device Market by Device Type (Power, RF Power), Voltage Range, Application (Power Drives, Supply & Inverter, and RF), Vertical (Telecommunications, Consumer, Automotive, Military, Defense, Aerospace), and Geography
GaN-on-Si Substrate Technology and Market for LED and Power ElectronicsYole Developpement
GaN-on-Si enables GaN power electronics, will LED transition as well?
GaN-ON-Si LED IS ALREADY ADOPTED BY SOME LED MANUFACTURERS, BUT COULD IT BECOME THE INDUSTRY STANDARD?
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost. Our cost simulation indicates that the differential in silicon substrate cost is not enough to justify the transition to GaN-on-Si technology. The main driver is the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”.
Despite potential cost benefits for LEDs, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Opinions regarding the chance of success for LED-on-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Virtually all major LED makers are researching GaN-on-Si LED, but few have made it the core of their strategy and technology roadmap. Among the proponents, only Lattice Power, Plessey and Toshiba have moved to production and are offering commercial LED-on-Si.
At Yole Développement, we believe that although significant improvements have been achieved, there are still some technology hurdles (performance, yields, CMOS compatibility). We consider that if the technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED manufacturers, but will not become the industry standard. We expect that Silicon will capture less than 5% of LED manufacturing by 2020.
GaN-ON-Si TECHNOLOGY WILL BE WIDELY ADOPTED BY POWER ELECTRONICS APPLICATIONS
The power electronics market addresses applications such as AC to DC or DC to AC conversion, which is always associated with substantial energy losses that increase with higher power and operating frequencies. Incumbent silicon based technology is reaching its limit and it is difficult to meet higher requirements. GaN based power electronics have the potential to significantly improve efficiency at both high power and frequencies while reducing device complexity and weight. Power GaN are therefore emerging as a substitution to the silicon based technology. Today, Power GaN remains at its early stage and presents only a tiny part of power electronics market.
We are quite optimistic about the adoption of GaN-on-Si technology for Power GaN devices. GaN-on-Si technology have brought to market the first GaN devices. Contrary to the LED industry, where GaN-on-Sapphire technology is main stream and presents a challenging target, GaN-on-Si will dominate the GaN based power electronics market because of its lower cost and CMOS compatibility. Although GaN based devices remain more expensive than Si based devices today, the overall cost of GaN devices for some applications are expected to be lower than Si devices three years from now, according to some manufacturers.
http://www.i-micronews.com/reports/GaN-on-Si-Substrate-Market-LED-Power-Electronics/3/424/
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
This document provides an overview and table of contents for a report on edge emitting laser diode market and technology trends from 2019. It includes a 3-page executive summary that analyzes the global EEL market, key applications such as optical communication, sensing, material processing and displays. The report also examines the EEL technology, industry landscape and major players. It aims to give insights into driving forces for the EEL laser source market, technologies and industry in the short, medium and long term.
Power SiC 2019: Materials, Devices, and Applications by Yole DéveloppementYole Developpement
This document provides an overview of the types of reports that will be available in 2019 from Yole Développement and its partner companies, System Plus Consulting and KnowMade. A total of over 125 reports will cover 18 technology fields across 6 end markets, including mobile/consumer, automotive, medical, industrial, telecom/infrastructure, and defense/aerospace. The reports will provide market analysis, technology trends, reverse costing analyses, and patent landscape investigations. Custom consulting services are also available to provide more in-depth insights into specific topics.
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends 2017 Re...Yole Developpement
The GaN power device supply chain is acting to support market growth.
THE SUPPLY CHAIN FOR POWER GAN PREPARES FOR PRODUCTION
The supply chain is close to being settle for the Power GaN market and deals during 2017 show confidence that GaN will be a successful market. First of all, there have been big investments from the main foundries to increase their capacity to handle mass production. Navitas just announced the partnership with TSMC and Amkor to ramp production capacity. Moreover, BMW i Ventures has just invested in GaN Systems. The Taiwan’s Ministry of Economic Affairs is also interested in using GaN for clean and green technologies, also in collaboration with GaN Systems.
GaN manufacturers continue developing new products and provide samples to customers, as is the case with EPC and its wireless charging line. During 2017, Panasonic announced the mass production of its 650 V products and Exagan successfully produced its first high voltage devices on 8-inch wafers. Other players are in the final phase of R&D or qualification for their GaN products to be launched in 2018. In both cases, manufacturers and clients are pushing to use GaN HEMTs in emerging technologies.
Yole Développement differentiates the Power GaN supply chain into two main models: the Integrated Device Manufacturer (IDM) model and the foundry model. We think that both IDM and foundry models will co-exist while there are different needs on the market, for example in consumer and industrial applications. In addition to the existing models, China is introducing a model with an R&D research center or design center, an external epitaxial supplier and a foundry for manufacturing, to support large-scale demand in the future.
This report furnishes an overview of the GaN power industry, covering the value chain from epitaxy and device design to device processing. It updates the supply chain and there is an overview of the year’s investments.
More information on that report at http://www.i-micronews.com/reports.html
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends - 20...Yole Developpement
GaN power devices: a promising, fast-growing market
A GROWING MARKET WITH LOTS OF EXCITING NEWS IN 2015 - 2016
2015 - 2016 has been an exciting year for the gallium nitride (GaN) power business. Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from Efficient Power Conversion (EPC), but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.
Also, a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea
of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.
Despite these exciting developments, the GaN power market remains small compared to the gigantic $335B silicon semiconductor market. In fact, according to Yole Développement (Yole) investigation the GaN power business was less than $10M in 2015. But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market.
The first GaN devices were not commercially available until 2010, so we are talking about an industry that is only six years old. What is most important is the GaN market’s future potential – and Yole expects the GaN power business to grow, reaching a market size of around $300M in 2021 at a 2016 – 2021 CAGR of 86%.
This report provides a structured vision of the GaN power device market in terms of uses, applications, and potential trends.
Bulk GaN Substrate Market 2017 Report by Yole DeveloppementYole Developpement
Optoelectronics applications are driving the bulk GaN substrate market
Optoelectronics applications, particularly GaN-based laser diodes and GaN-on-GaN LEDs, are expected to drive the bulk GaN susbtrate market from 2016 - 2022.
Specific to the laser diode market, the Blu-ray segment, which in the past was the GaN-based laser industry’s main driver, continues to decline. In recent years, a much greater percentage of movies were viewed via streaming than on optical discs, and in many cases flash memory is replacing optical discs and magnetic storage. The current crop of mobile phones, netbooks, tablets, and even laptops lack a Blu-ray/DVD/CD drive. UHD Blu-ray’s recent development is expected to have only a novelty effect on sales - not enough to reverse the general downward trend we will see in the coming years. However, decreasing Blu-ray demand is expected to be offset by nascent, growing segments like projectors (office projector, mobile pico projector, head-up display (HUD), etc.) and automotive lighting, leading to new growth opportunities for bulk GaN substrates.
In the LED market, improvements in GaN substrate manufacturing have lowered substrate prices enough for various niche LED applications. In addition to Soraa (US) and Panasonic (JP), this seems to have revived the interest of other LED manufacturers which are beginning to seriously consider using GaN substrates for either spotlighting or automotive lighting. New GaN-on-GaN LED players are expected in the market in the coming years.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
The document analyzes the power consumption of an end device in a ZigBee mesh network by measuring the current draw of an end device transmitting and receiving data packets of varying sizes. Empirical measurements were taken to develop a power consumption model and estimate the impact on battery life. The results provide useful information for building low power ZigBee applications suited for wireless sensor networks.
Surface Chemistry and Device Response of AlGaN/GaN SensorsJeremy Gillbanks
A copy of the presentation I delivered in September 2015 as part of my Final Year Project for the Master of Professional Engineering (Mechanical) at the University of Western Australia.
Please note: This was simply uploaded after the presentation was delivered as an example to friends studying engineering and what to expect in a final year presentation. Therefore, it lacks the full explanation required to understand the project in significant detail. Further information is available by contacting me directly.
This research furthered the development of micro-electro-mechanical sensors for use in recycled water monitoring and lab-on-a-chip medical devices. AlGaN/GaN sensors are superior to traditional ion-selective field effect transistor sensors because the are more stable, cost less and do not require a reference electrode.
Completing this project involved using the Australian Synchrotron to measure the molecular contact angle of three molecules, glycine, 6-amino-2-naphthoic acid in benzil, on the surface of an AlGaN/GaN high electron mobility transistor-based chemical sensor. The project was able to determine the angle for two out of the three chemicals used, which was a great success given the experimental difficulty of conducting near-edge x-ray absorption fine structure spectroscopy.
In this work, the performances of a solar cell based on InGaN were simulated under the illumination conditions of one sun by employing SILVACO software.
SiC & GaN - Technology & market knowledge updatePntPower.com
Wide Band Gap semiconductor are more and more used in power electronics. Silicon Carbide and Gallium Nitride are now involved in the race to replace silicon. With huge R&D investments and start-ups facing historical players, market and technology knowledge becomes key. Point The Gap presented a SiC & GaN market knowledge update. All the information needed to understand this market, gathered in a few slides by a power electronics market intelligence specialist. Also available on www.PointThePower.com.
Including company names like Transphorm, Infineon, EPC corp., Cambridge electronics, Rohm, Cree, Toyota, Finsix, Zolt, Avogy, etc...
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
The document discusses silicon carbide (SiC) as a material for high temperature power applications. SiC has several advantages over silicon, including higher thermal stability, lower intrinsic carrier concentration, and lower leakage current at high temperatures. These advantages allow SiC devices to operate at higher junction temperatures compared to silicon. The document outlines the crystal structure of SiC, its material properties, and why it can operate at higher temperatures. Commercial SiC devices are currently available as Schottky diodes up to 1200V. SiC has potential to improve power converter efficiency and allow for smaller components in high temperature applications like electric vehicles.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
Non invasive Glucose Patent Landscape sampleKnowmade
The report provides essential patent data for non-invasive glucose monitoring including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration
• Relative strength of main companies IP portfolio
• Non-invasive glucose monitoring IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy
The report also provides an extensive Excel database with all patents analyzed in the study
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
• IP trends including time evolution of patent publications and patent filings countries
• Current legal status of patents (granted, pending application, abandoned, expired)
• Main patent assignees (ranking, time evolution, geographical coverage) • Joint developments and IP collaboration network of main patent assignees
• Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including:
- Technology and market data for TSV stacked memory
- Key patents
- Cross link analysis between teardown analysis, process flow and patents
- Technical challenges and relevant solutions found in the patents
- Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung)
• Excel database with all patents analyzed for the 5 key players, including technology segmentation
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
Microfluidic technologies for diagnostic applications - SampleKnowmade
The report provides essential patent data for microfluidic technologies for diagnostic applications including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network
• Key patents and granted patents near expiration
• Relative strength of main companies IP portfolio
• IP profiles of 15 major companies
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
This report provides a detailed picture of the patent landscape for III-nitride materials grown on silicon substrate.
This report covers patents published worldwide up to December 2013. More than 560 patent families relevant to the scope of this report have been selected. Those have been manually segmented by type and organized in various technology segments as described below.
Market data from Yole Développement are also provided to add some context regarding business trends and metrics.
The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation
density reduction and stress management for preventing crack generation and warpage of the wafer.
It identifies more than 50 holders of GaN-on-Si related intellectual property. It provides in-depth analysis of key technology
segments and key players including:
– Time evolution of patent publications and countries of patent filings.
– Current legal status of patents.
– Ranking of main patent applicants.
– Joint developments and IP collaboration network of main patent applicants.
– Key patents.
– Granted patents near expiration.
– Relative strength of main companies IP portfolio.
– Overview of patent litigations.
– Matrix applicants/technology issues for more than 20 companies.
A special focus is provided on key issues and approaches:
– Buffer type
– Defect reduction
– Stress management
– Non/Semi polar
– (001)-oriented silicon substrate
– Layer Transfer Technology
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
Yole led phosphor_qd_ip_january_2016_sampleClotilde Fabre
This document provides an overview of the patent landscape report on phosphors and quantum dots for LED applications. The report analyzes over 7,500 relevant patent families and provides an in-depth examination of the major patent holders, key technologies, litigation and licensing activities, and emerging trends. It identifies the leading companies in different patent segments, such as phosphor compositions and quantum dots, and analyzes the strengths and weaknesses of their intellectual property portfolios.
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Cree (Wolfspeed) has the strongest patent portfolio in RF GaN technology, especially for GaN-on-SiC devices, well ahead of competitors like Sumitomo Electric and Fujitsu. The report provides an analysis of over 3,750 patents related to GaN devices for radio frequency applications, identifying the key patent holders and technology trends. It examines the intellectual property landscape for GaN semiconductors, integrated circuits, packaging, and key applications like power amplifiers, switches, and filters. The analysis shows American and Japanese companies dominating the RF GaN patent landscape, with growing activity from Chinese firms like HiWafer and new entrants focusing on areas like GaN-on-Silicon technology.
This document discusses improving substation reliability and availability. It describes electrical events that occurred after an expansion at a refinery, highlighting issues with microprocessor relays, control power supplies, and time synchronization. The importance of substation documentation, automation, data retrieval, monitoring, and critical auxiliaries is discussed. Reliability calculations are shown to not fully account for hidden failures and varying operating conditions. Overall recommendations are made to establish best practices for documentation, configuration, monitoring, and addressing reliability more holistically.
Gate Driver Unit Market for Power Transistors 2014 Report by Yole DeveloppementYole Developpement
This document provides an overview and market analysis of gate driver units (GDUs) for power transistors from 2010 to 2020:
- GDUs are an integral part of power module "brains" and will integrate more features over the next five years to improve performance. The total GDU market is forecast to reach $250 million by 2020, growing at 10% annually.
- The market includes both integrated GDUs inside power modules and standalone plug-and-play units. Multiple business models exist among pure-play, integrated device manufacturer, and systems company suppliers.
- Key applications driving GDU demand include electric vehicles, renewable energy, and smart grids. However, price pressures in consumer markets may
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Report’s Key Features
• PDF with > 200 slides
• Excel file > 2,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Patent segmentation per application: Optoelectronics and Photonics, Power, RF, PV and Sensors
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Established players and new entrants
• IP profile of key players, their key patents and their recent IP activity
• Patents recently expired and patents near expiration date
• Excel database containing all patents analyzed in the report, including technology and application segmentations
This report provides an analysis of the RF GaN technology and market from 2010 to 2020. It discusses the increasing demand for high-power, high-frequency transistors and how GaN devices can meet this demand by offering higher efficiency, bandwidth, linearity, and temperature tolerance compared to existing silicon and GaAs technologies. The report examines the applications of GaN devices in markets like wireless infrastructure, CATV, satellite communications, and defense. It also analyzes the industrial landscape, including mergers and acquisitions, as well as forecasts the potential growth of the RF GaN device market over the next decade under different scenarios.
This document outlines TechIPm's methodology for analyzing wireless and mobile patents. It discusses their approaches to patent landscaping, essentiality analysis, portfolio evaluation, valuation, acquisition feasibility analysis, and developing essential patents. The methodologies involve searching patent databases, categorizing patents by technology and standards, comparing claims to specifications, and evaluating portfolios for quality, strengths/weaknesses, market value, and risks. The overall aim is to provide clients insights into technology innovations, competitive landscapes, intellectual property strategies, and business acquisition opportunities in wireless industries.
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Antenna for 5G patent landscape 2019 flyerKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
1. Several hardware companies announced new products including more intelligent inverters, combiner boxes, and microinverters.
2. Software and monitoring services were also introduced to provide performance monitoring, analytics, and remote monitoring of photovoltaic systems.
3. Emerging trends in the solar industry include a greater focus on actual system performance through improved monitoring and diagnostics.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
Gamma Nu Theta is a mobile communication antenna company with strong R&D, production, and logistics capabilities. It has over 23 employees in its R&D center including 5 PhDs. The company has a long history starting in 1997 and has locations in both Korea and the US. It provides a wide range of antenna products and has been a top supplier for major Korean carriers. Gamma Nu Theta invests heavily in R&D including electromagnetic simulation tools, an anechoic chamber for testing, and a simultaneous PIM measurement system. It has a quality management system certified to TL9000 and ISO14001 standards.
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Blockchain patents can provide insights regarding the state of the art and technical details of the Blockchain innovations. Following patent analysis is based on TechIPm’s patent research for the most promising Blockchain startups that are listed in CB Insights’ 2017 Blockchain Startups ICO Report
Similar to GaN Devices for Power Electronics: Patent Investigation (20)
Cancer diagnostics startup identification 2020 sampleKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Cancer diagnostics startup identification 2020 flyerKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Microneedles for drug delivery patent landscape 2020 flyerKnowmade
Report’s Key Features
• PDF with > 140 slides
• Excel file > 2,450 patent families
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to applications: Cancer therapy, Cosmetic, Diabetes, Ophthalmic, Pain management and Vaccine.
• Summary of the IP related to technologies: Applicators, housing, Coated, Hollow, Porous, Soluble, Hydrogel and Solid microneedles.
• Analysis of patent oppositions (Europe) and review of key patents.
• Excel database containing all patents analyzed in the report, including applications and technologies segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 160 slides
• Excel file > 5,500 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to the physical isolation: size, deformability, electrical charges or density.
• Summary of the IP related to the biological isolation: positive or negative enrichment.
• Summary of the IP related to the CTC detection: nucleic acid, protein or functional assay.
• Analysis of patent litigations and review of key patents.
• Excel database containing all patents analyzed in the report, including biological and physical isolation and detection segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Solid electrolytes for lithium ion solid state batteries patent landscape 201...Knowmade
Report’s Key Features
• PDF with > 250 slides
• Excel file > 5,800 patents
• IP trends, including time-evolution of published patents, legal status, countries of patent filings, etc.
• Ranking of main patent assignees
• Patent categorization by type of electrolyte (polymer, inorganic, inorganic/polymer) and inorganic electrolyte materials (sulfide glass ceramics, Thio-LISICON, argyrodite, oxide glass ceramics, NASICON, perovskite, garnet, anti-perovskite, hydride)
• For each technical segment: IP dynamics, ranking of main patent assignees, newcomers, key IP players (leadership, blocking potential, portfolio strength), key patents, and recent development trends
• For each key IP player (100+ companies): Time-evolution of patenting activity, legal status of patents and countries of patent filings, patent segmentation by electrolyte material, IP strengths and weaknesses by electrolyte material
• Excel database containing all patents analyzed in this report, including technology and material segmentations
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape sampleKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape flyerKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
This document provides a summary of a patent landscape analysis report on nanopore sequencing technologies. The analysis found that patent publications on nanopore sequencing have significantly increased from 2008-2013, following early work proving the concept. While industrial players are increasingly active, Harvard University's portfolio remains the strongest, followed by Illumina, Agilent, University of California, and Roche. Oxford Nanopore Technologies' portfolio is not the strongest but the company benefits from university partnerships. Several microelectronics companies have also recently filed solid-state nanopore patents. Most major assignees have an international IP strategy with a strong US and European presence. The report provides a detailed analysis of patents segmented by nanopore technology and application, as well as profiles of key
I phone X proximity sensor and food illuminator patent to product mapping sa...Knowmade
Report’s Key Features
• PDF > 110 slides
• Link between key product features and patents owned by STMicroelectronics, Lumentum, and Philips
• Essential patent portfolio analysis for STMicroelectronics, Lumentum, and Philips, related to VCSEL and ToF sensors. Includes:
– Time evolution of patent publications, and countries of patent filings
– Current legal status of patents
– Citation network and competitive IP networks
• Deep insight into technology data, including teardown analysis of:
– STMicroelectronics ToF sensor
– Philips’ VCSEL source
– Lumentum’s VCSEL array
3D NAND Flash Memory devices appeared on the market in 2015 with 3D V-NAND – 32L of Samsung Electronics, followed in 2016 with 3D NAND V2 – 36L of SK Hynix, 3D NAND – 48L of Toshiba/SanDisk and 3D NAND – 32L of Micron/Intel. In recent times, it happens a lot in the 3D non-volatile memory (3D NVM) field with the acquisition of SanDisk by Western Digital, The investments of Chinese government in memory, or the Intel announcement of the Intel/Micron separation for further development of 3D NAND. We witnessed these evolves in the IP landscape through the recent increase of 3D NVM-related patents filed by Chinese players (YMTC/YRST) and the numerous Samsung’s patents published the latest months in China, USA and Korea, reflecting its willing to strengthen its 3D NVM IP portfolio. Also, we observed non-practicing entities (NPEs) like Conversant IP and WiLAN are entering the landscape. The presence of such companies is a tangible sign of the market explodes, heralding future IP battles when they will assert their patents to make money.
In this report, KnowMade has thoroughly investigated the patents related to 3D non-volatile memories and draws a picture of the current patent landscape and its potential evolution. SanDisk/Western Digital, Samsung and Toshiba are leading the 3D NVM patent landscape. They hold together more than 65% of the patents, Western Digital and Toshiba signed a JV extension until 2029, and Samsung and Western Digital renewed a patent cross-license agreement until 2024. On the other hand, we witness the emergence of Chinese players in the IP landscape. Patent activity related to 3D non-volatile memory (3D NVM) emerged in the 1990s with Toshiba and SanDisk. They signed Joint Venture agreement on Flash Memory in 1999. In the end 2000s, the research and development of 3D architectures appeared with IP related to BiCS (Bit Cost Scalable, SanDisk and Toshiba), TCAT (Terabit Cell Array Transistor, Samsung Electronics) and FG (Floating Gate, SK Hynix). Few years later Micron Technology developed also FG architecture, and Macronix International developed in 2015 SGVC architecture (Single Gate Vertical Channel). Since 2008, the number of patents related to 3D NVM has continuously increased, and today the 3D NVM patent landscape represents over 3,400 patent families including more than 9,400 patents. The landscape is very competitive, with several big companies and the entrance of Chinese players these last years.
Pumps for microfluidic devices patent landscape 2017 SAMPLEKnowmade
The worldwide market for pumps for microfluidic devices is growing quickly. Pumps are the cornerstone of microfluidic systems. They are the key component that allows the motion of fluids in an accurate and reliable manner through a device’s reservoirs, chambers and microchannels. According to Market Research Future, the global micropump market should reach $5.28 billion by 2027, with a compound annual growth rate (CAGR) of 17.2%. The biomedical and pharmaceutical industries are driving the market. Micropumps are essential in DNA chips, lab-on-a-chip and drug delivery. They are also used in other domains, including flow chemistry, inkjet printing or electronic cooling. The intellectual property (IP) landscape related to pumps for microfluidic devices involves both industrial applicants like Epson, Baxter, Debiotech, Honeywell and Medtronic, and academic ones like Caltech, Stanford and Fraunhofer. This indicates that technologies for micropumps are still in development. This development is driven in particular by an increasing number of biomedical devices but also by the increasing need for micropumping systems for microelectronic components. To match all the various applications, many different technologies have been developed. Mechanical pumps include electrostatic, electromagnetic, piezoelectric, thermopneumatic, shape memory alloy, bimetallic and ion polymer conducting film technology. Non-mechanical pumps include magneto-hydrodynamic, electro-hydrodynamic, electroosmotic, electrowetting, electrochemical and bubble-type. This patent landscape report analyzes IP activity for each technology. The analysis of the technical issues addressed by patents related to pumps for microfluidic devices supports what we observe in the market. Mechanical pumps dominate, but new applicants, in particular from China, could accelerate the development of non-mechanical pumps for microfluidics.
Learn SQL from basic queries to Advance queriesmanishkhaire30
Dive into the world of data analysis with our comprehensive guide on mastering SQL! This presentation offers a practical approach to learning SQL, focusing on real-world applications and hands-on practice. Whether you're a beginner or looking to sharpen your skills, this guide provides the tools you need to extract, analyze, and interpret data effectively.
Key Highlights:
Foundations of SQL: Understand the basics of SQL, including data retrieval, filtering, and aggregation.
Advanced Queries: Learn to craft complex queries to uncover deep insights from your data.
Data Trends and Patterns: Discover how to identify and interpret trends and patterns in your datasets.
Practical Examples: Follow step-by-step examples to apply SQL techniques in real-world scenarios.
Actionable Insights: Gain the skills to derive actionable insights that drive informed decision-making.
Join us on this journey to enhance your data analysis capabilities and unlock the full potential of SQL. Perfect for data enthusiasts, analysts, and anyone eager to harness the power of data!
#DataAnalysis #SQL #LearningSQL #DataInsights #DataScience #Analytics
Analysis insight about a Flyball dog competition team's performanceroli9797
Insight of my analysis about a Flyball dog competition team's last year performance. Find more: https://github.com/rolandnagy-ds/flyball_race_analysis/tree/main
Predictably Improve Your B2B Tech Company's Performance by Leveraging DataKiwi Creative
Harness the power of AI-backed reports, benchmarking and data analysis to predict trends and detect anomalies in your marketing efforts.
Peter Caputa, CEO at Databox, reveals how you can discover the strategies and tools to increase your growth rate (and margins!).
From metrics to track to data habits to pick up, enhance your reporting for powerful insights to improve your B2B tech company's marketing.
- - -
This is the webinar recording from the June 2024 HubSpot User Group (HUG) for B2B Technology USA.
Watch the video recording at https://youtu.be/5vjwGfPN9lw
Sign up for future HUG events at https://events.hubspot.com/b2b-technology-usa/
Open Source Contributions to Postgres: The Basics POSETTE 2024ElizabethGarrettChri
Postgres is the most advanced open-source database in the world and it's supported by a community, not a single company. So how does this work? How does code actually get into Postgres? I recently had a patch submitted and committed and I want to share what I learned in that process. I’ll give you an overview of Postgres versions and how the underlying project codebase functions. I’ll also show you the process for submitting a patch and getting that tested and committed.
Codeless Generative AI Pipelines
(GenAI with Milvus)
https://ml.dssconf.pl/user.html#!/lecture/DSSML24-041a/rate
Discover the potential of real-time streaming in the context of GenAI as we delve into the intricacies of Apache NiFi and its capabilities. Learn how this tool can significantly simplify the data engineering workflow for GenAI applications, allowing you to focus on the creative aspects rather than the technical complexities. I will guide you through practical examples and use cases, showing the impact of automation on prompt building. From data ingestion to transformation and delivery, witness how Apache NiFi streamlines the entire pipeline, ensuring a smooth and hassle-free experience.
Timothy Spann
https://www.youtube.com/@FLaNK-Stack
https://medium.com/@tspann
https://www.datainmotion.dev/
milvus, unstructured data, vector database, zilliz, cloud, vectors, python, deep learning, generative ai, genai, nifi, kafka, flink, streaming, iot, edge
Global Situational Awareness of A.I. and where its headedvikram sood
You can see the future first in San Francisco.
Over the past year, the talk of the town has shifted from $10 billion compute clusters to $100 billion clusters to trillion-dollar clusters. Every six months another zero is added to the boardroom plans. Behind the scenes, there’s a fierce scramble to secure every power contract still available for the rest of the decade, every voltage transformer that can possibly be procured. American big business is gearing up to pour trillions of dollars into a long-unseen mobilization of American industrial might. By the end of the decade, American electricity production will have grown tens of percent; from the shale fields of Pennsylvania to the solar farms of Nevada, hundreds of millions of GPUs will hum.
The AGI race has begun. We are building machines that can think and reason. By 2025/26, these machines will outpace college graduates. By the end of the decade, they will be smarter than you or I; we will have superintelligence, in the true sense of the word. Along the way, national security forces not seen in half a century will be un-leashed, and before long, The Project will be on. If we’re lucky, we’ll be in an all-out race with the CCP; if we’re unlucky, an all-out war.
Everyone is now talking about AI, but few have the faintest glimmer of what is about to hit them. Nvidia analysts still think 2024 might be close to the peak. Mainstream pundits are stuck on the wilful blindness of “it’s just predicting the next word”. They see only hype and business-as-usual; at most they entertain another internet-scale technological change.
Before long, the world will wake up. But right now, there are perhaps a few hundred people, most of them in San Francisco and the AI labs, that have situational awareness. Through whatever peculiar forces of fate, I have found myself amongst them. A few years ago, these people were derided as crazy—but they trusted the trendlines, which allowed them to correctly predict the AI advances of the past few years. Whether these people are also right about the next few years remains to be seen. But these are very smart people—the smartest people I have ever met—and they are the ones building this technology. Perhaps they will be an odd footnote in history, or perhaps they will go down in history like Szilard and Oppenheimer and Teller. If they are seeing the future even close to correctly, we are in for a wild ride.
Let me tell you what we see.
ViewShift: Hassle-free Dynamic Policy Enforcement for Every Data LakeWalaa Eldin Moustafa
Dynamic policy enforcement is becoming an increasingly important topic in today’s world where data privacy and compliance is a top priority for companies, individuals, and regulators alike. In these slides, we discuss how LinkedIn implements a powerful dynamic policy enforcement engine, called ViewShift, and integrates it within its data lake. We show the query engine architecture and how catalog implementations can automatically route table resolutions to compliance-enforcing SQL views. Such views have a set of very interesting properties: (1) They are auto-generated from declarative data annotations. (2) They respect user-level consent and preferences (3) They are context-aware, encoding a different set of transformations for different use cases (4) They are portable; while the SQL logic is only implemented in one SQL dialect, it is accessible in all engines.
#SQL #Views #Privacy #Compliance #DataLake
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GaN Devices for Power Electronics: Patent Investigation (September 2015)
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personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-
how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and
including any pending registration of one of the above mentioned rights.
“License”: For the reports and databases, 2 different licenses are proposed. The buyer has to choose one license:
1. One user license: a single individual at the company can use the report.
2. Multi user license: the report can be used by unlimited users within the company. Subsidiaries are not included.
“Products”: Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Sophia Antipolis (France headquarters), Knowmade is a technology intelligence company specialized in the research and analysis of scientific and technical information. We provide patent
landscapes and scientific state of the art with high added value to businesses and research laboratories. Our intelligence digests play a key role to define your innovation and development strategy.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN
ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN
ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the
Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Knowmade’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the
absence of any confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the
work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer.
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including in cases where a new event or access to new contradictory information would require for the analyst
extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4 The mailing is operated through electronic means either by email via the sales department. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the
Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity
shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects.
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as
required under article 2.5 shall remain at the Buyer’s risk.
Terms and Conditions of Sales
54. 3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated
from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Payments due by the Buyer shall be sent by cheque payable to Knowmade, PayPal or by electronic transfer to the following account:
Banque populaire St Laurent du Var CAP 3000 - Quartier du lac- 06700 St Laurent du Var
BIC or SWIFT code: CCBPFRPPNCE
IBAN: : FR76 1560 7000 6360 6214 5695 126
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.3 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller,
the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report,
database, tool...) are delivered only after reception of the payment.
3.4 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the
use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or
information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information,
which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall
not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or
compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is
excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or
cancellation of the orders, except for non-acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a
reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of saleability and fitness for a particular purpose, with respect to the Products. Although the Seller shall
take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller
cannot guarantee that any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor
difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
Terms and Conditions of Sales
55. 6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to
use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the
Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for
respect of the copyrights and will guaranty that the Products are not disseminated out of the company.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the
Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30)
days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against
the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated
to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of
Grasse, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Terms and Conditions of Sales