This document is an electronics marketing publication focusing on processing and power in embedded systems, featuring insights from industry experts on ARM architecture and its extensive ecosystem. It discusses the importance of planning for power in FPGA systems, highlights emerging trends such as the consumerization of OEMs, and presents a variety of new technologies and products. The issue concludes with information about upcoming trainings, seminars, and resources available from Avnet Electronics Marketing.

1. A N AV N E T E L E C T R O N I C S M A R K E T I N G P U B L I C AT I O N
/
/
V OL U M E 1 / IS S U E 3 / O C TOB ER 2 0 1 3
Shop Smart for
Your Processing &
Power Solutions
Find Out How ARM®
Architecture Fuels
a Deep Ecosystem
for Embedded
Systems Designs
PAGE 06
When Should You
Plan for Power in
an FPGA System?
PAGE 19
Learn More About
the Consumerization
of OEMs
PAGE 46
Conferences,
Trainings &
Seminars
PAGE 48

2. Welcome to the Family!
Low-cost development tool
Off-the-shelf SOM solution
Out-of-the-box Linux support
Easy migration from
prototype to production
MicroZed™ is a low-cost development board based on the Xilinx Zynq®-7000 All Programmable
SoC. Its unique design allows it to be used as both a stand-alone evaluation board for basic SoC
experimentation, or combined with a carrier card as an embeddable system-on-module (SOM).
This combined stand-alone/SOM approach can quickly move a design idea from concept
www.microzed.org
to production, making MicroZed the ideal platform for SoC based applications. MicroZed is
supported by a community website where users can download kit documentation and reference
designs as well as collaborate with other engineers also working on Zynq designs.
© Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc.
Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.

3. PRESIDENT’S MESSAGE
Processing and power. The brains and brawn on the board. Both are critical to its
functionality and the design community has a lot of considerations surrounding both when
making decisions for the next generation of products. We bring you food for thought.
This issue of AXIOM is dedicated to processing and power and in these pages we bring
together a team of industry experts to talk about what you need to know in these areas.
Avnet’s advanced architechtures expert Jim Carver gets to the heart of the ARM processor
cores – explaining the history of ARM’s first offering through the current ecosystem of
products, as well as and their functionality. And because no one likes to be in the dark,
Chris Ammann explains why it is so critical for FPGA designers to plan for their board power
at the beginning of the design process. Doug Geisler looks at how industrial OEMs have
started to act like consumer electronics companies, or the “consumerization” of the market,
and outlines the benefits and challenges to this new experience.
We round out this issue of AXIOM with the most current seminars and trainings to keep you
up-to-date on what’s available. And, of course, we bring you the latest information on new
products and technologies from our supplier partners and the resources you have available
from Avnet Electronics Marketing. This is a comprehensive issue featuring component suppliers
from a broad spectrum of our line card – with 21 supplier technologies mentioned from nearly
A to Z, we go from Analog Devices Inc. to Renesas to Xilinx and many others in between!
There is something for everyone in this issue of AXIOM, and I hope you enjoy it. Feel free to
drop us a line at axiom@avnet.com and tell us what you think about the publication; we’d
love to hear your feedback!
Regards,
Ed Smith, Avnet Electronics Marketing Americas President

4. AXIOM
ENTS
ONT
C
OCTOBER
ISSUE 3 .
LUME 1 .
VO
6
2013
IN THIS ISSUE
46
FEATURE STORY
Consumerization of OEMs
10
PROCESSING PRODUCTS SOLUTIONS
Check out the latest offerings from our leading
line card manufacturers, including:
• Atmel
• Freescale
• Maxim
• Microsemi
• Renesas
• Silicon Labs
• Texas Instruments
• Xilinx
48
TRAINING EVENTS
Get up to speed about the latest
technology, products and solutions
50
WHAT’S NEW
ARM
®
ARCHITECTURE
FUELS DEEP
ECOSYSTEM FOR
NEXT-GENERATION
EMBEDDED
SYSTEMS
DESIGN
New product introductions
SUBMISSIONS
We encourage prospective authors
to submit articles. To obtain a
copy of AXIOM article submission
guidelines, please contact
lara.levicki-lavi@avnet.com.
Printed in the U.S.A.

5. AV N E T E L E C T R O N I C S M A R K E T I N G
19
WHEN SHOULD YOU PLAN FOR
POWER IN AN FPGA SYSTEM?
RIGHT AT THE BEGINNING
25
POWER PRODUCTS SOLUTIONS
Everything you need to know about new and focus manufacturer products and solutions, highlighting design issues,
solutions, innovations and trends. Learn more from:
Analog Devices
Renesas
Power One
TDK-Lambda
Fairchild
Semiconductor
Freescale
OSRAM Opto
Semiconductors
ON
Semiconductor
STMicroelectronics
Toshiba
Vishay
NIC Components
Bourns
Carling
Technologies
TE Connectivity
Molex
AVX
QUESTIONS, COMMENTS, SUGGESTIONS
Please forward your questions, comments and suggestions
on this issue and for any future topics to axiom@avnet.com.
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6. ARM® Architecture Fuels
Deep Ecosystem for
Next-Generation
Embedded Systems Design
By Jim Carver, Director Technology, Tech Marketing, Avnet Electronics Marketing
Electronics systems manufacturers face a growing challenge in meeting specialized market requirements across an expanding range
of embedded applications. In the past, systems design companies struggling to address disparate application requirements found
themselves driven to correspondingly disparate processor architectures, each with their own development tools and resources. Today,
however, engineers can find an extensive array of specialized processors — each designed with features tuned to specific application
areas, yet all building on a common processor core from the ARM® family.

7. With its broad support for silicon, software and systems vendors, the ARM architecture lies at the heart of the industry’s richest, most broadly
supported software and silicon ecosystem. Underlying this ecosystem, the ARM architecture ties together processor cores, memory and
other system and peripheral IP — all intercommunicating through the standard ARM Advanced Microcontroller Bus Architecture (AMBA®).
ARM’s processor IP cores build on the classic RISC architecture with a broad array of specialized types created to serve specific application
areas including embedded and general-purpose computing — each core type emphasizing different combinations of key operating
characteristics and low power, high performance and dedicated hardware functionality.
Since the ARM6 core introduced in the early 1990s, ARM has enhanced the flexibility for incorporating ARM cores with the introduction
of synthesizable cores in the late 1990s. With the introduction of the Cortex® family of cores in the mid 2000s, ARM delivered a range of
cores able to support the broadest range of applications (Figure 1).
Figure 1. The ARM Cortex family targets diverse application areas with specialized series such as the Cortex-A series (left), Cortex-R
series (middle) and Cortex-M series (right). Source: ARM
ARM Cortex-A series processors are designed to execute complex
operating systems such as Linux, Android and Microsoft Windows,
integrating a memory management unit (MMU) designed to address
OS memory requirements.
ARM Cortex-R series embedded real-time processors are designed
to deliver highly deterministic real-time behavior in a wide range of
power sensitive applications. In many applications, these processors
run a Real-Time Operating System (RTOS) alongside user-developed
code. In this class of applications, the target design typically requires
only a Memory Protection Unit (MPU) as opposed to the MMU
available in Cortex-A series cores.
At the heart of TrustZone, each physical processor core provides two
virtual cores that isolate secure from non-secure operations, using a
special monitor mode to safely time-slice operations between the two
virtual cores to ensure the protection of privileged operations while
maintaining required performance levels (Figure 2).
ARM Cortex-M series processors are optimized for deeply embedded
designs that require the lowest possible power consumption, typically
operating with application firmware to support the very specific
requirements of the targeted embedded application.
ARM builds on the Cortex-M series architecture to provide
specialized solutions such as the ARM SecurCore™
processor family, which includes dedicated hardware
security features tuned to support secure embedded
applications such as smartcards. In addition, ARM’s
TrustZone® architecture builds on the Cortex-A series
processors to provide hardware security extensions
capable of supporting a trusted execution environment
for secure applications and services.
Figure 2. ARM TrustZone augments Cortex-A series cores with
security extensions that ensure isolation of secure operations
from non-secure operations in virtual processor environments
managed by a unique monitor mode in the physical core.
Source: ARM
AVNET ELECTRONICS MARKETING 07

8. Design Advantages
For systems manufacturers, this broad range of specialized cores enables systems designers to more easily address the varied requirements
of individual subsystems in complex designs. For example, mobile computing system designers can draw on the unique capabilities of each
member of the ARM family — dramatically simplifying development thanks to the use of a consistent instruction-set architecture across the
multi-processor design (Figure 3). At the same time, the same members of the ARM family can serve in widely different applications such
as smart meters (Figure 4).
Figure 3. An optimized mobile computing system design takes advantages of specialized functionality and performance of different
member of the ARM family for example, resulting in an overall design that enjoys the development advantages of a single
instructionset architecture without compromising requirements of individual subsystems. Source: ARM
Figure 4. Designers can combine ICs based on different members of the ARM processor to meet the diverse requirements of embedded
applications such as smart meters for sensing, analysis and communications. Source: ARM
08 AXIOM

9. For IC manufacturers, the combination of ARM specifications,
design resources and extensive ecosystems of IP and tools enables
chip designers to focus on their unique value-add, sourcing
supporting IP and tools from other ARM partners. ARM IP licensees
combine specialized ARM processor cores with their own unique
combinations of cores for DSP, video processing and peripherals
configured for specific application requirements.
Tying the IP together, AMBA provides a standard interface specification
that ensures compatibility between IP components from different design
teams or vendors. AMBA encompasses a number of specifications
such as AMBA ACE™ for sharing data, AMBA AXI4™ for multiple
master architectures and ARM CHI for ensuring efficient operation
in complex architectures. In aggregate, the ARM specifications help
simplify IP integration, speeding complex design projects.
For IC manufacturers, ARM ties the various elements of an ARMbased chip design together in resources such as ARM System Design
Kits (SDK) designed to shorten the learning curve needed to design
ICs with the ARM architecture and reduce time to market for those
ICs. For example, the Cortex-M SDK (CMSDK) includes reusable IP,
hardware design examples and software examples designed to help
designers quickly develop complex SoC designs.
ARM-based Solutions
Together, the combination of high-performance core IP, system
IP, third-party IP and specifications provides a very rich source
for silicon manufacturers to create ARM-based SoCs for diverse
application areas. Indeed, nearly 100 leading IC manufacturers
have leveraged the ARM ecosystem to create processor families
targeting key application areas. As a result, systems designers can
choose from an extensive range of MCUs that combines different
ARM cores with peripherals to serve specific markets.
Among other ARM-based MCUs, designers can find
multiple product families such as the following:
•
Atmel® SAM family of embedded processors features a wide
range of offerings ranging from Cortex-A series families
designed for cost-sensitive applications to flash MCUs based
on Cortex-M series cores.
•
Freescale Semiconductor’s i.MX family builds on ARM A series
cores and other ARM cores to address embedded smart devices
for consumer, automotive and industrial markets; its Kinetis line
based on Cortex-M series cores address a wide range of energyefficient embedded design requirements; and its QorIQ family
combines Cortex-A series cores with dedicated communications
and security IP for next-generation networking systems designs.
•
STMicroelectronics bases its broad STM32 family of 32-bit flash
MCUs on ARM cores with a number of families designed to
meet specific requirements for performance and functionality —
ranging from its entry-level STM32 F0 series based on the
ARM Cortex-M0 to ARM Cortex-M4-based high-performance
STM32 F4 MCUs with DSP and FPU functionality.
•
Texas Instruments addresses different application markets with an
extensive set of ARM-based MCU families such as its Tiva™ family
for increased connectivity integration, Sitara™ family for embedded
designs, DaVinci™ family for video applications, Hercules™ series
for safety applications in medical and industrial markets, and
OMAP™ platform for multimedia-rich mobile applications.
•
The Zynq®-7000 All Programmable SoC from Xilinx offers
designers the unmatched performance of a dual core processing
subsystem based on the Cortex-A9 running up to 1 GHz,
paired with a programmable logic subsystem containing block
memory, DSP blocks and high-performance interconnect. This
processor subsystem includes a DDR3 memory controller, dual
10/100/1000 Ethernet MACs along with a full complement of
standard peripherals offering engineers the best of both hard
and soft logic functionality.
•
ARM cores form the centerpiece in advanced FPGA SoCs that
combine an ARM processor core with an FPGA fabric and
specialized peripheral blocks. For example:
•
The Microsemi SmartFusion™2 offers a unique combination of
ARM-based MCU for high-performance software execution,
DSP blocks for specialized computing and flash-based FPGA
fabric for implementation of speed-critical algorithms. Along
with on-chip SRAM, memory controllers, communications
peripherals, the Microsemi FPGA SoC includes specialized
security features including security-processing accelerators
and secure storage needed in critical applications in industrial,
military, aviation, communications and medical segments.
MBEDDED MARKETPLACE
E
RINGING DEVELOPERS
B
ND SOFTWARE VENDORS
A
TOGETHER WITH SOLUTIONS
HAT SUPPORT ARM
T
RCHITECTURE
A
Working across the broad ARM hardware base, software in
the ARM ecosystem spans the complete range of application
development requirements. Engineers can find support for ARMbased development in familiar IDEs and draw on an extensive array
of hardware development tools including emulators, logic analyzers,
evaluation boards and reference designs for ARM-based design.
Along with development tools, the ARM ecosystem encompasses
a broad range of software offerings including low-level software
such as from BIOS, device drivers and board support packages
as well as high-level systems software including RTOS, hypervisors
and Java virtual machines. Available middleware offerings address
a broad range of applications with libraries including audio and
voice software, communications protocols, database, power
management, security and video codecs, among others. At the
application level, third-party software packages target specific
requirements including applications in automotive, communications,
consumer and industrial. ARM partners also provide a wide variety
of training options for companies and individual engineers looking
to explore more specific ARM-based solutions.
Conclusions
The unique combination of standard processor core architectures
and specification provides a rich environment for development of
ARM-based design solutions and tools that continually expand the
extensive ARM ecosystem of ICs, systems and software. As a result,
designers can find ARM-based MCUs, tools and software able to
meet an increasingly diverse set of market requirements. Drawing
from this consistent ecosystem, engineers can rapidly build systems
capable of addressing a broad set of designs ranging from deeply
embedded smart devices to mobile systems and high-performance
computing platforms. Contact your local Avnet Electronics Marketing’s
sales representative to learn more about our ARM solutions portfolio
or visit www.em.avnet.com/axiom_embeddedprocessing.
AVNET ELECTRONICS MARKETING 09

10. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
SAM D20 Family Brings the Best
of MCUs to Cortex®-M0+ Devices
em.avnet.com/axiom_atlsamd20
PROBLEM
SOLUTION
• With developers demanding more computational power than ever before the Cortex®-M0+ market is rapidly growing.
• Atmel recently launched the SAM D20, based on the Cortex ®-M0+. This family expands Atmel’s already
formidable ARM®-based portfolio as it joins the Cortex-M3, Cortex-M4 and Cortex-A5.
• This new microcontroller series combines the performance and energy efficiency of an ARM Cortex-M0+ based
MCU with an optimized architecture and peripheral set, offering a truly differentiated general-purpose lineup
that is ideal for a wide range of low-power, cost-sensitive devices, including GPS trackers, appliance controllers,
intelligent remotes and optical transceivers.
• Notable power-saving techniques include an event system that allows peripherals to communicate directly with
each other without involving the CPU, while SleepWalking peripherals wake up the CPU only upon a pre-qualified
event, thereby reducing overall power consumption.
• In terms of peripheral flexibility, a serial communication module (SERCOM) is fully software configurable to
handle I2C, USART/UART and SPI communications. With multiple SERCOM modules on a device, designers can
precisely tailor the peripheral mix to their applications.
• The SAM D20’s QTouch® Peripheral Touch Controller offers integrated hardware support for buttons, sliders,
wheels and proximity. It also supports both mutual and self-capacitive touch (without the need for external
components), while providing noise tolerance and self-calibration.
• Additional key hardware specs include a high-precision, 12-bit 350 ksps ADC and a 10-bit DAC, allowing
switching between external and internal oscillators on the fly. There are eight 16-bit timer/counters; a 32-bit
real time clock and calendar; 48 MHz operation (1.77 CoreMark/MHz), single-cycle IO access; and six serial
communication modules (SERCOM) that can be configured to act as a USART, UART, SPI or I2C.
Atmel SAM D20E
Atmel SAM D20G
Atmel SAM D20J
14
15
16
17
14
15
16
17
18
14
15
16
17
18
Flash (KB)
16
32
64
128
16
32
64
128
256
16
32
64
128
256
SRAM (KB)
2
4
8
16
2
4
8
16
32
2
4
8
16
32
SERCOM
(I2C, USART, SPI)
4
6
6
Timer/Counter
6
6
8
PWM channels
10
12
16
12-bit 350 ksps ADC
10 ch
14 ch
20 ch
10-bit 350 ksps DAC
1 ch
1 ch
1 ch
GPIO
Capacitive
touch channels
Pin count
10 AXIOM
26
38
52
Up to 60
Up to 120
Up to 256
32
48
64

11. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
i.MX 6 Series
Applications Processors
em.avnet.com/axiom_frsiMX6
PROBLEM
• The market for intelligent, multimedia-centric, touch-based devices is increasing exponentially. Tomorrow’s batterypowered smart devices, auto infotainment, in-flight entertainment systems, medical systems, personal and enterprise
class intelligent control, data systems and new classes of devices never seen before now need to present data and
user interface choices to the end user primarily through rich sound, video, voice, pictures and touch, rather than
keyboards and mice.
• The need for manufacturers to quickly provide multiple devices to fit specific market segments or niches and provide
their customers with a broader range of choices is rapidly increasing.
SOLUTION
• The i.MX 6 series from Freescale was designed specifically to enable this new market
by bringing together high-performance scalable multimedia processing, a software
compatible family of five processors, all pin-compatible solutions with integrated
power management so that a manufacturer can deploy a full portfolio of products
with a single hardware design.
• Integrating one, two or four ARM® Cortex®-A9 cores running up to 1.2 GHz,
these products represent the industry’s only ARM-based applications processor
series featuring software, power and pin compatibility across single-, dual- and
quad-core implementations.
• Product capabilities include dual-stream 1080p H.264 video processing for 3D class
video decoding, Freescale’s Triple Play graphics architecture consisting of console-style
3D graphics with 200 MT/s for exceptional display resolution, separate 2D BLT engine
for UI acceleration and separate 2D OpenVG engine for vector-based graphics.
TREND
em.avnet.com/
axiom_frsiMX6
• As the trend for rich sound, video, voice, pictures and touch continues in industrial, consumer and automotive
applications, Freescale continues to innovate with feature-rich processors that fulfill application needs.
i.MX 6 Series Applications Processor Block Diagram
AVNET ELECTRONICS MARKETING 11

12. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Kinetis® KL02
Microcontroller Family
em.avnet.com/axiom_frskinetis
PROBLEM
• ow price point and ease-of-use requirements are critical for entry-level designs that are frequently a barrier to
L
developers considering 32-bit microcontroller (MCU) solutions.
SOLUTION
• The Kinetis KL02 family of 32-bit MCUs offers a new level of processing performance and energy efficiency for a
range of applications and helping expand the Internet of Things (IoT).
• Applications may include portable consumer devices, sensing nodes, wearable devices and even ingestible healthcare
sensing. As more of these products add intelligence and become part of the IoT ecosystem, designers need to maintain
a small footprint, in terms of size and power consumption, while also delivering a level of connectivity users have come
to expect from more traditional connected devices, such as tablets and smartphones.
• The tiny KL02 devices have a small appetite for power – six times more efficient than a leading competitor – making
them ideal for ultra-small-form-factor and battery-powered products.
• Kinetis L series MCUs are powered by a 32-bit ARM® Cortex®-M0+ processor, for which Freescale was a lead
partner in definition and development. The Kinetis KL02 MCU family builds upon the energy efficiency of the
Cortex-M0+ core and reduces the power consumption of the Kinetis L series to an even lower entry point.
• The ultra-efficient KL02 family delivers 15.9 CM/mA and, like the other Kinetis MCUs, includes autonomous, powersmart peripherals – an ADC, UART and timer, 10 flexible power modes and wide clock and power gating to minimize
power loss.
• A low-power boot mode reduces power spikes during the boot sequence or deep-sleep wakeup. This is useful for
systems where battery chemistry limits the allowable peak current, such as those employing lithium-ion batteries
frequently used in portable devices.
• The Kinetis KL02 family is supported by the FRDM-KL02Z Freescale Freedom development platform and Processor
Expert software including an MQX™ Lite RTOS component, along with third-party development resources from the
extensive ARM ecosystem.
Kinetis KL0 MCU Family Block Diagram
12 AXIOM

13. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Tiva™ C Series Microcontrollers
em.avnet.com/axiom_tislaunchpad
PROBLEM
SOLUTION
• Design engineers are looking for an MCU that features ARM® Cortex ®-M in
advanced 65 nm process technology that provides the right balance between higher
performance and low power consumption.
• The Tiva C Series ARM MCUs from TI provide a broad portfolio of connected
Cortex-M4F microcontrollers.
Associated
Products:
EK-TM4C123GXL
LaunchPad
Evaluation Kit
• Designers who migrate to the Tiva C Series MCUs benefit from a balance between
the floating-point performance needed to create highly responsive mixed-signal
applications and the low power architecture required to enable increasingly
aggressive power budgets.
• The ARM Cortex-M4F with floating point accelerates math-intensive operations and
simplifies digital signal processing implementations.
• The devices’ 12-bit ADC accuracy is achievable at the full 1 MSPS rating without
any hardware averaging, eliminating performance tradeoffs.
• Range of pin-compatible memory and package configurations enables optimal
selection of devices.
• Additional features include
TO SE
E
T
–– Up to 256 KB Flash.
L ATE HE
PRO ST TIVA
–– Up to 32 KB single-cycle SRAM.
D
FROM UCT S
–– Two high-speed 12-bit ADCs up to 1 MSPS.
EM.AV TI VISIT
NET.C
–– Up to two CAN 2.0 A/B controllers.
OM/
AX
TISL A IOM_
–– Optional full-speed USB 2.0 OTG/Host/Device.
UNCH
PAD
–– Up to 40 PWM outputs.
–– Serial communication with up to 8 UARTs, 6 I2Cs, 4 SPI/SSI.
–– Intelligent low-power design power consumption as low as 1.6 μA.
• Tiva C Series MCUs are supported by TivaWare™ for C Series software, designed
specifically for those customers who want to get started easily, write productionready code quickly, and minimize their overall cost of software ownership.
TM4C123x
ARM®
Cortex®-M4F
Up to 80 MHz
FPU
ETM
NVIC
MPU
SWD/T
Temperatures
Memory
Up to 256 KB Flash
Up to 32 KB SRAM
2 KB EEPROM
ROM
85°C
105°C
Power Clocking
Precision Oscillator
RTC
Battery-Backed Hibernate
DMA (32 ch)
System Modules
Debug
6× 32-bit Timer/PWM/CCP
6× 64-bit Timer/PWM/CCP
Systick Timer
Real-time JTAG
2× Watchdog Timer
Control Peripherals
Comms Peripherals
Analog
2× Quadrature Encoder
Inputs
8× UART
4× SSI/SPI
2
6× I C
2× CAN
USB Full Speed
(Host/Device/OTG)
12ch, 1 S/H 12-bit 1 MSPS ADC
16× PWM Outputs
12ch, 1 S/H 12-bit 1 MSPS ADC
LDO Voltage Regulator
3× Analog Comparators
Temperature Sensor
AVNET ELECTRONICS MARKETING 13

14. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
C8051F85x/6x
Microcontroller Family
em.avnet.com/axiom_sllmcu
PROBLEM
• Motor control and other sensor based applications are driven by cost, device size, performance and ease of use.
SOLUTION
• he C8051F85x/6x from Silicon Labs has a 25 MHz CPU that is 50% faster than other competing solutions. The
T
CPU supports a highly-efficient enhanced 8051 pipelined architecture, allowing it to perform 70% of instructions in
1-2 system clock cycles. Additional interrupt priorities enable fast interrupt handling for real-time applications.
• igh-performance analog capabilities include a 12-bit multi-channel analog-to-digital converter (up to 16 ADC
H
channels available), two analog comparators with programmable hysteresis and response time, a precision
internal voltage reference and a temperature sensor.
• mall package size, high level of integration and patented crossbar architecture provide for an extremely efficient
S
implementation. The high level of integration eliminates the need for several external components such as a crystal,
temperature sensor, level shifters and ADCs, further reducing BOM cost and PCB footprint. The innovative crossbar
technology allows developers to choose their desired peripherals and provides flexibility in determining the pin
location of those peripherals thus simplifying the layout.
• The easiest way to begin development with the C8051F85x/6x AEC-Q100 qualified, low-cost microcontroller
family is with the fully functional C8051F850DK development kit. This comprehensive development kit is designed
to give customers an out-of-box experience and comes with everything developers need to evaluate hardware
and develop code.
• Additionally, the TOOLSTK-860-B-SK is offered as a low cost alternative for quick evaluation. It allows designers
to develop and debug application firmware directly on the target C8051F85x/6x MCU using the Silicon Labs
Integrated Development Environment (IDE). The ToolStick Base Adapter provides a USB debug interface and data
communications path between a Windows PC and a target microcontroller.
TREND
• Though use of 32-bit architectures is on the rise for many embedded applications, 8-bit solutions can offer smaller
footprints, better cost and simplified development. It is important to understand the trade-offs with these options in
considering the complete system solution.
• Peripheral subsystems are most critical in many low end control applications. These will become more
sophisticated (analog, timers) taking the performance burden off of the core MCU.
C8051F85x/86x
14 AXIOM

15. TRUELow Power RXRX100 MCUs FOR
LOW POWER™ 100 MCUs, for Low-cost,
True
LOW-COST, HIGH-PERFORMANCE APPLICATIONS
High-performance Applications
™
The RX100 is the RX Family’s new entry level 32-bit
MCU, extending the RX portfolio to the low end
of the spectrum in terms of pin count and flash
memory size. This new family is a great fit for those
who want to benefit from the higher performance
RX 32-bit architecture at the lowest possible cost.
The RX111 group is the market’s first 32-bit MCU
to feature True Low Power, as well as fast wake-up,
zero wait-state flash, multiple safety functions and
integrated USB 2.0 host, device and OTG support.
mobile health care, smart meters, sensors/
detectors, and industrial and building
automation. It consumes only 350nA in
sleep mode and snaps into full operation in
just 4.8μs. Memory size ranges from 16KB
to 128KB and compact, low-pin-count
packages are available starting at 36 pins.
Wakeup
100μA/MHz*
350nA standby, 4.8μs wake-up
USB Connectivity
Host, device and OTG
High Performance
3.08 CoreMark/MHz
50 DMIPS @ 32MHz
Digital Signal Processing
RX100 MCUs are great design choices for
embedded systems that must minimize
power consumption by running in sleep
mode whenever possible, yet must wake
up quickly whenever there is a need to perform computing or control tasks. Renesas’
True Low Power capability offers designers
the lowest possible power consumption
across the entire temperature and voltage
range, including all peripherals and Flash
memory, while also providing maximum
flexibility with multiple operational and
sleep modes. Wake-up time in low-power
mode ranges from less than 1μs to 4.8μs.
Zero wait-state Flash
1KB Block size
Erase/Write operation down to 1.8V
BGO Data Flash (Programmable
while code is executed)
Designed to support a broad range of markets, the
new RX111 group delivers a combination of ultralow-power consumption, on-chip connectivity and
superior performance at attractive price points for
low-end 32-bit embedded applications, including
Safety Features
Built in safety features (CAC, DOC,
I-WDT, GPIO)
Temperature sensor
Scalable
Fully compatible with RX600 and
RX200
Low Pin Count (36 -100 pins),
16KB to 128KB
Multifunction Pin Controller (MPC)
Memory
Zero-wait Flash
up to 256KB
SRAM
up to 24 KB
RX100 versus 32-bit Cortex MCUs
Data Flash
Family/Group
8 KB
System
Communication
Timers
Event Link
Controller
I2C
MTU2
Data Mgmt.
DTC/DMA
Interrupt Cont.
16 levels
Clocks
SCI/UART
3 ch
SPI
4 ch
USB 2.0
Host/Device/OTG
GPIO
Safety
CAC DOC CRC
Analog
Temp. Sensor
STM32L
STM32F0
K10
KL0
EFM32G
32-bit
32-bit
32-bit
32-bit
32-bit
32-bit
(Cortex-M0) (Cortex-M3) (Cortex-M0) (Cortex-M4) (Cortex-M0+) (Cortex-M3)
32MHz
50MHZ
32MHz
48MHz
100MHz
48MHz
32MHz
1.56
Yes
0.85
1.03
0.85
1.25
0.93
1.25
No
Yes
No
Yes
No
No
DSP
Instructions
Yes
No
No
No
Yes
No
No
3.08
50
5 cycles
1.62
2.17
1.62
2.19
1.77
2.17
DMIPS/MHz
CMT
16-bit 2 ch
I-WDT
RTC
Calendar
ADC
12-bit 14 ch
DAC
8-bit 2 ch
Coremarks/MHz
Max. DMIPS*
Interrupt
Latency
Run μA/MHz
(Lowest Number)
Lowest Power
Mode with RTC
on (μA)
Wake-up time from
previous mode
RX111 Renesas Promotion Board (RPB)
The board was designed to showcase RX111 low power modes,
featuring Pmod and energy harvesting connectors, and comes
loaded with software and tools.
Integrated J-Link debugger
Power measurement built in
Applilet
e2 studio toolchain
USB Demo
LPC11xx
MAC/DIV
16-bit 6 ch
OSC PLL IRC
POR/LVD
(RX)
Max. Frequency
Performance
Multifunction
Pin Controller
4 ch
RX100
32-bit
CPU
45
33
38
125
45
40
16 cycles
12 cycles
16 cycles
12 cycles
16 cycles
12 cycles
100
140
290
239
450
89
180
0.6
0.22
(No RTC)
0.9
2.6
2.45
(VLLS1+
RTC)
0.96
(VLLS1+
RTC)
0.9
5µs
56µs
2.6ms
8.05µs
134µs
93µs
2µs
(Fast interrupt)
RX111 Renesas Starter Kit (RSK)
This complete RX111-based hardware/software platform for
in-depth application design includes the E1 Debugger,
a trial version of the e2 studio and Renesas RX compiler and
demonstration firmware.
RSK Part Number: YR0K505111S000BE
am.renesas.com/RSKRX111
RPB Part Number: YRPBRX111
am.renesas.com/RPBRX111
Learn more at em.avnet.com/axiom_renrx100

16. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
SmartFusion®2 SoC FPGAs
em.avnet.com/axiom_mswsmartfusion2
PROBLEM
• mbedded networked systems control an ever-increasing amount of modern systems. Many systems are involved
E
in controlling complex and sensitive installations and must not be compromised by cyber attacks. Such attacks
could originate in the form of software code that has been altered to achieve a malicious goal, i.e., passing
control to a third party or compromising a safety system.
• To ensure an embedded system is not at risk from these attacks it must be brought in to service via a secure boot process.
SOLUTION
• he secure boot of a system is a multi-part process and relies on a “Root-of-Trust” — a hardware device that is
T
immutably trusted and can perform the early stages of the boot process. One of the functions it must provide is the
ability to ensure the software that will run in the next highest level is valid BEFORE it is executed. For a fully valid
system, code in the “n-1” phase must always perform this check before code in phase “n” is executed. (See Figure 1).
• The SmartFusion®2 SoC FPGA provides the most advanced design and data security capabilities, starting with
a robust root-of-trust device with secure key storage capability using the SoC FPGA industry’s only physically
unclonable function (PUF) key enrolment and regeneration capability from Intrinsic ID.
• SmartFusion2 is also the only SoC FPGA resistant to differential power analysis (DPA) attacks using technology from
Cryptography Research Incorporated (CRI) portfolio.
• Offering user access to a number of several encryption services such as AES-256 and SHA-256, this FPGA can also be
used to store and compare the mechanism of validation.
• The operation of the SmartFusion2 SoC FPGA for a secure boot process is only used at select times — typically
at startup and then possibly by diagnostics in the event of a failure in the system. By using the device as the
programmable logic element, you get the validation function included without the need for an additional component.
• The FPGA integrates a non-volatile flash based FPGA with a full feature microcontroller subsystem, enhanced FPGA fabric
and high speed serial and memory interfaces — making it ideal for logic functions that control the secure boot function.
• The FPGA fabric is composed of 4-input LUT logic elements and includes embedded memories and mathblocks
for DSP processing capabilities.
TREND
• The requirement for security in an embedded system is forever growing, but this need must be met while still
meeting financial budgets. By using a SmartFusion2 SoC FPGA that is a hardware root-of-trust, it is possible to
integrate the logic and secure boot functions into one device. This reduces the system component and real estate
cost, and provides the secure boot function for free. SmartFusion2 devices are the only SoC FPGAs available that
meet the requirements for a hardware root-of-trust.
Figure 1: A Secure Boot Process
Validate
Phase 1 Code
Phase 0
Immutable
Boot Loader
Validate
Phase 2 Code
Validate
Phase 4 Code
Phase 1
Phase 2
Phase 3
Phase 4
BIOS
OS Loader
OS
Application(s)
Initial root-of-trust
stems from immutable
trusted hardware
16 AXIOM
Validate
Phase 3 Code
Code for phases 1-n is validated
by already trusted system before
execution is transferred to it

17. Analog for Xilinx® FPGAs
Streamline your Xilinx FPGA design
with the latest from TI
Texas Instruments is the approved and tested vendor for the analog solution around the Xilinx®
FPGAs and CPLDs. TI works closely with Xilinx to recommend the best power management,
clocking, data converter, and other analog solutions for a wide variety of applications.
• ADCs and DACs
• Temperature Sensors
• Retimers and Redrivers
• Power Reference Designs
• Serial Digital Interface (SDI) Solutions
• Power Solutions for Xilinx FPGAs
• Ethernet Solutions
• Clocking Solutions for FPGAs
To learn more about TI’s analog solutions for Xilinx FPGAs go to: em.avnet.com/axiom_tixilinxattach
The platform bar is a trademark of Texas Instruments. © 2013 TI

18. Optimize Design Size
and Performance
Maxim Integrated Power Architecture Featured on ZedBoard™
ZedBoard™ provides an excellent starting point for both hardware and software designers
interested in exploring the many uses of the Xilinx® Zynq®-7000 All Programmable SoC.
The Maxim Integrated power architecture chosen for ZedBoard addresses the two highest
priorities for the design: small size and low cost. Maxim meets these design parameters
and delivers a solution that is compliant with the regulation accuracy, start up and
sequencing requirements of the Xilinx Zynq-7000 AP SoC.
Learn more at em.avnet.com/axiom_maximzedboard

19. WHAT YOU CAN EXPECT?
WHAT YOU CAN EXPECT?
Full-day, how-to training for FPGA embedded systems designers
Full-day, how-to training for FPGA embedded systems designers
Multiple learning tracks including Xilinx Zynq™-7000 All
Programmable SoC, 7 Series Applications, Vivado™ Design Flow,
based on the “A Generation Ahead Seminar Series” from Xilinx
Multiple learning tracks including Xilinx Zynq™-7000 All
Programmable SoC, 7 Series Applications, Vivado™ Design Flow,
based on the “A Generation Ahead Seminar Series” from Xilinx
Choose from a dozen hour long training courses devoted to design
solutions for FPGA design applications
Choose from a dozen hour long training courses devoted to design
solutions for FPGA design applications
Practical, real-world design examples with
an emphasis on:
Practical, real-world design examples with
an emphasis on:
• Xilinx ARM Processor solutions
• Xilinx ARM Processor solutions
• Processor debugging operating system support
• Processor debugging operating system support
• Design tool flow and verification
• Design tool flow and verification
• Memory interfaces
• Memory interfaces
• Agile Mixed signal solutions
• Agile Mixed signal solutions
By Chris Ammann, Global Technical Marketing Engineer, Avnet Electronics Marketing
As FPGAs continue to become increasingly powerful, adequately
powering these devices becomes even more critical to unlock their
full potential, yet often times the power design is left until nearly
the end of the design process. The trend of lower voltages relative
to shrinking process geometries is prevalent. Some of today’s devices
now run at voltage levels under 1V. Lower voltage requirements for
FPGAs and processors create additional challenges, especially at
higher currents, that require serious attention when designing the
power architecture for a new platform. It’s important to think about
and plan for a power system at the outset of the design. Supply
placement, passive component selection and PCB design become
even more critical as voltage drops across components and even PCB
traces and planes can introduce substantial error into your system.
It’s not uncommon for each FPGA family to consist of a wide range
of products. The smallest FPGA may clock in at less than 100 MHz,
and require less than 1 Amp of peak current for core logic, while
the largest in the family may need 14 Amps or more for core logic
clocked at 300 MHz. FPGAs with lower core voltage needs will
require a large amount of current, which must be supplied with a
low noise floor and a minimum amount of ripple voltage.
Why then isn’t power tackled immediately?
FPGA-based board designers may not feel they have sufficient
information. They face uncertainty, for example, about actual
power requirements of the system since the gate-level design is
usually not finalized before the hardware is generated. They also
need to deal with dynamic load requirements, as load may move
rapidly from an inactive, low current situation to a full processing
state and the extent of these requirements may not be appreciated
at the onset of design. Since FPGAs are more flexible than the power
supply circuits that power them, it is beneficial to consider a worstcase power system at the beginning of the design process.
Once the FPGA family is selected, and the core logic supply voltage
is set, tools are in place to determine the current consumption of
the core logic on the FPGA manufacturer’s website and maximum
current estimates can be found in FPGA power applications guides.
Power supply design challenges inherent in all designs boil down to
cost, size, noise and efficiency, and the tradeoffs between the four.
Power design is all about tradeoffs, there is no one golden solution
for all applications. While industrial and medical markets typically
favor size over cost, wireless tends to favor low noise, handheld and
battery applications usually prioritize efficiency, and in consumer
apps cost tends to be king.
A key part of the design process is to determine the voltage
requirements needed and the current requirements of each
voltage rail. Xilinx provides assistance by making available power
estimation spreadsheets for estimating the power requirements of
an FPGA device, based on the required functionality of the FPGA.
It is important that designers access and use these spreadsheets
to ensure the use of appropriate power-supply and thermalmanagement components. A variety of power supply manufacturers
offer complete power solutions for Xilinx FPGAs and have resources
available to aid in device selection.
Avnet has worked with several power supply manufacturers to
create a series of paper designs for different 7 Series and Zynq
devices. These designs were created around realistic power budgets
and are intended to provide a starting point for the overall power
architecture selection of your system. The Avnet Power Solutions
Video Series is an educational resource available to guide designers
through the power-system maze. Covering such topics as power
supply testing, component selection, technology overviews and
more, the series is a collection of valuable tutorials designed to let
you ramp up your designs rapidly.
FPGA development boards from Xilinx are designed with digitally
controlled power supplies that make regulation adjustments
to ensure supply voltages are within spec. The Mini Module Plus
development system from Avnet uses a modular power supply that
is available from multiple manufacturers. Remote voltage sensing
is used on these power modules to achieve greater regulation
accuracy at the load. Comprised of a modular MMP baseboard that
supports an MMP FPGA/SoC module, an MMP power supply module,
and a Low-Pin-Count (LPC) FPGA Mezzanine Card (FMC), the Mini
Module Plus system provides flexibility for FPGA/SoC evaluation
and prototyping. Each MMP component is sold separately so that
designers can configure their Mini-Module Plus System to meet their
particular prototyping needs. At the same time, a path exists for
easy upgrading or migration through the replacement of the MMP
FPGA or SoC module, while keeping the same MMP baseboard and
MMP power module.
AVNET ELECTRONICS MARKETING 19
AVNET ELECTRONICS MARKETING 19

20. MMP
FPGA
/SoC
Module
FMC
Module
(Optional)
The kit includes one Avnet Kintex-7 Mini Module Plus with a
Kintex-7 K325T-1FFG676 or K410T-1FFG676 FPGA and a Xilinx ISE®
Design Suite: Logic Edition Device locked to XC7K325T or XC7K410T
and bundled with the Kintex-7 Mini-Module Plus.
MMP
Power
Module
MMP Baseboard II
Figure 1. MMP Baseboard II
The modular MMP allows designers to prototype and easily move
the MMP FPGA/SoC module or MMP power module to a custom
baseboard. By using off-the-shelf MMP FPGA/SoC or MMP power
modules, risk is reduced by using a fully tested module.
An example is the Xilinx Zynq®-7000 All Programmable SoC MiniModule Plus, a small system-on-a-module (SOM), with all the
necessary functions and interfaces for a Zynq-7000 AP SoC system.
The module can be combined with the Mini-Module Plus Baseboard II
and a Mini-Module Plus Power Supply for an out-of-box development
system ready for prototyping.
USB 2.0
Connector
USB 2.0
ULPI PHY
RJ45
Connector
Ethernet
PHY
1 GB DDR3
USB
Connector
USB-UART
8 KB I2C
EEPROM
32 MB QSPI
XC7Z045
FFG900
Real-Time
Clock
Processing
System
PS Clock
@ 33 MHz
Programmable
Logic
PJTAG Header
LVDS OSC @ 200 MHz
JX1
Connector
4 GTXs and
66 User I/O
Programmable
LVDS Clock
128 MB Flash
Power,
GTX,
User I/O,
and
Configuration
Signals
JX2
Connector
4 GTXs and
66 User I/0
Figure 2. The Xilinx Zynq®-7000 All Programmable SoC Mini-Module Plus
The kit includes the Zynq-7000 AP SoC Mini-Module Plus with a
Zynq-7000 AP SoC XC7Z045-1FFG900 FPGA and the Xilinx ISE®
Design Suite: Embedded Edition (device locked to XC7Z045 FPGA)
Another example is the Kintex-7 FPGA Mini-Module Plus, a small
system-on-a-module (SOM), with all necessary functions and interfaces
for a Kintex-7 FPGA system. The FPGA module is a complete system
on a module, packaging all the necessary functions needed for an
embedded processor system onto a small footprint.
Crystal
@19.2 MHz
EEPROM
(16 KB)
USB 3.0
MAC/PHY
USB 3.0
Connector
Kintex-7
XC7K325T
or
XC7K410T
FFG676
BPI
64 MB Flash
256 MB DDR3
8 KB
I2C EEPROM
Programmable
LVDS Clock
ARM JTAG
Header
RJ45
Connector
LVDS OSC
@200 MHz
Ethernet
PHY
LVCMOS OSC
@50 MHz
XADC Header
JX1
Connector
4 GTXs and
66 User I/O
Miscellaneous
Voltage Regulaors
Power,
GTX,
User I/O,
and
Configuration
Signals
JX2
Connector
4 GTXs and
66 User 1/0
Figure 3. The Xilinx Kintex-7 FPGA Mini-Module Plus Block Diagram
20 AXIOM
Voltage Bank
Voltage (V)
Vcco
Vccaux/Vccaux_io/Vccadc/Vcco/
MGTVccaux
Current (A)
1
6
3.00%
1.5/1.35
Vccint/Vccbram
Vccaux_io
Micro SD Card Socket
PS Reset
The Avnet Power modules are available from several manufacturers.
Each partner designed their board to meet a common set of design
requirements, making them interchangeable to the user. Providing
solutions from multiple partners allows the customer to choose their
preferred vendor, as well as choosing the design implementation
they feel most comfortable with. Since the intent was to have these
power modules work with a variety of boards, the first step was
creating a worst case power budget that could support all of our
development board needs. After defining the system, the following
table was created to represent the worst case current draw for each
required rail.
Tolerance
4
5.00%
1.8
6
5.00%
2
2
3.00%
Vcco
2.5
8
5.00%
Vcco
3.3
8
5.00%
1
6
3.00%
1.2
4
2.50%
MGTAVcc
MGTAVtt/MGTAVTTrcal
Figure 4. MMP Power Module requriements table
The table defines not only the voltages, currents and voltage banks
they power, but also the overall tolerance the supplies needed to be
designed to. With tolerance requirements down a low as 2.5%, extra
design measures were needed to ensure regulation accuracy. In an
ideal design scenario, the power supplies would be placed right next
to the load they supply, however in our system architecture that
placement was not feasible. As a result, remote sense capability was
added, which senses the voltage at your load and makes regulation
adjustments to maintain your set point. Remote sense is not trivial
and adds its own set of unique challenges, but is one tool available
to designers when optimal supply placement isn’t available. Design
files are available for each power module as well so that these
designs can be reproduced in customer applications.
AVNET POWER SOLUTIONS VIDEO SERIES
www.youtube.com/playlist?list=
PL8GuerdulPltBrHsnLmSJtoj1xsg8XRWG
AVNET POWER DESIGN ZONE
em.avnet.com/axiom_powerdesignzone
XILINX REFERENCE DESIGNS
em.avnet.com/axiom_xlxpowerdesigns
AVNET KINTEX-7 KIT
em.avnet.com/axiom_xlxkintex7kit
AVNET ZYNQ-7000 MINI-MODULE
PLUS DEVELOPMENT KIT
em.avnet.com/axiom_xlxzynq7000mmp
AVNET MINI-MODULE PLUS POWER MODULES
em.avnet.com/axiom_avtpowermodules

21. Unlock Your
System’s True
Potential
Xilinx® Zynq®-7000 AP SoC
Mini-Module Plus System
The Xilinx® Zynq®-7000 All Programmable SoC Mini-Module Plus designed by Avnet, is a
small system-on-module (SOM) that integrates all the necessary functions and interfaces
for a Zynq-7000 AP SoC system. For development purposes, the module can be combined
with the Mini-Module Plus Baseboard II and a Mini-Module Plus Power Supply to provide an
em.avnet.com/
axiom_MMP-7Z045-G
out-of-box development system ready for prototyping. The modular concept also allows the
same Zynq-7000 AP SoC to be placed on a user-created baseboard, simplifying the user’s
baseboard design and reducing the development risk.
© Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc.
Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.

22. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Avnet Mini-Module Plus
System on Modules
PROBLEM
SOLUTION
• In today’s competitive market, all product providers strive to shorten product development time, reduce the
overall cost and minimize technical risk. However, most products in the market require a high level of hardware
complexity that challenges many developers in meeting the product development requirements.
• A System on Module (SoM) offers an innovative path to product development. It helps system designers and
architects implement a fully customized product with custom interfaces and form factor without the overhead of a
fully customized design. An off-the-shelf SoM can easily be integrated into a custom baseboard to create a fully
customized end-product. This approach shortens product development time, reduces overall product development
cost and minimizes technical risk.
• The Avnet Virtex ®-5, Kintex ®-7 and Zynq ®-7000 All Programmable SoC series of Mini-Module Plus SoM offerings
provide the ultimate programmable system that packages all the functionality required of an embedded processor
system in a small form factor. These modules provide on-board CPU, RAM, Flash, USB, Ethernet, serial port and
access to 132 user IOs along with eight high-speed Gigabit transceivers via the SoM connectors.
TREND
• Today more system designers and architects rely on integrating an off-the-shelf SoM to their custom baseboard
for implementing the processing engine and standard interfaces while using their engineering resources to focus
on the company’s core competency and implementing customized interfaces on the baseboard. Using an offthe-shelf SoM results in a much simpler baseboard design, which shortens development time and reduces overall
development costs.
Xilinx Kintex-7 FPGA Mini-Module Plus
em.avnet.com/axiom_avtkintex7kit
Xilinx Zynq-7000 AP SoC Mini-Module Plus
em.avnet.com/axiom_avtzynq7000mmp
Xilinx Virtex-5 FTX Mini-Module Plus
em.avnet.com/axiom_avtv5mmp
22 AXIOM

24. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
New Product Program
em.avnet.com/axiom_ananewproducts
PROBLEM
• How to communicate what new products are appropriate for broad market, and what are relevant supporting
collateral for ADI’s new products.
• How to keep designers informed of new products relevant to their new designs.
SOLUTION
• ADI issues a quarterly “Select” list of new products that Avnet fully stocks and supports.
• This Select list is promoted on Avnet’s site and updated quarterly, see em.avnet.com/axiom_ananewproducts.
THE FOLLOWING ARE JUST SOME OF THE NEWEST PRODUCT ANNOUNCEMENTS:
• AD8232 Single-Lead Heart Rate Monitor Analog Front End
• AD8422 Low Power High Performance Instrumentation Amplifier
• ADuM3190/ADuM4190 Isolated Error Amplifiers with iCoupler ® Technology
• AD7091 Low Power, 12-bit 1 MSPS SAR
• AD9102/AD9106 180 MSPS, Fully-Programmable Integrated Waveform Generators
• ADIS16228 Digital Triaxial MEMS Vibration Sensor with FFT Analysis and Storage
• ADP5052 Fully Integrated Quad Buck and LDO in LFCSP
• ADL5511 DC to 6 GHz Envelope and TruPwr™ RMS Detector
TREND
• ADI will continue to release and promote New Products with Avnet to aid designers in their mission of making
their new designs.
• ADI’s New Products will continue to be supported by eval boards, videos, reference circuits.
• Avnet will continue to promote and stock ADI’s New Products.
24 AXIOM

25. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
ADP5052 Fully Integrated
Quad Buck + LDO
em.avnet.com/axiom_anaadp5052
PROBLEM
SOLUTION
• Today’s more advanced electronics demand higher power densities with shrinking board space and power budget.
• The ADP5052 from Analog Devices is the industry’s first integrated power management solution, integrating a
Quad Buck and a general-purpose LDO, to provide a five-rail system power supply (4 x buck regulators and
1 x 200 mA LDO) from a 5 or 12 V input in an LFCSP (48 lead LFCSP 7 x 7 mm).
• All five regulator outputs can be fixed or adjustable via resistor programmable output voltages.
–– Channel 1 and Channel 2 integrate high-side power MOSFETs and low-side MOSFET drivers. External
NFETs can be used in low-side power devices to achieve an efficiency optimized solution and deliver
a programmable output current of 1.2, 2.5 or 4 A. Combining Channel 1 and Channel 2 in a parallel
configuration can provide a single output with up to 8 A of current. Channel 3 and Channel 4 integrate both
high-side and low-side MOSFETs to deliver output current of 1.2 A.
–– Channel 5: 200 mA low dropout (LDO) regulator.
• The switching frequency can be programmed or synchronized to an external clock.
• Individual precision-enable pins allow easier power supply sequencing or adjustable UVLO threshold.
• ±1.5% output accuracy over full temperature range.
• 250 kHz to 1.4 MHz adjustable switching frequency.
• Always alive 5.1 V LDO supply for tiny load demand.
• Ideal for small cell base stations, medical, FPGA and processor, and security and surveillance applications.
• Dedicated power good pin.
TREND
• As designs become smaller and smaller and power budgets becoming tighter customers are turning to more
integrated and efficient power solutions to help support some of the higher functioning needs such as FPGA,
embedded processors and digital basebands for applications such as small cell basestations (femtocell, picocelll
and macrocell) and point-to-point applications to mention just a few.
Quad Buck Switching Regulator with LDO in LFCSP
1
Resistor programmable current limit (4 A, 2.5 A or 1.2 A).
ADP5052 solution size only 28.3 mm x 21.2 mm.
AVNET ELECTRONICS MARKETING 25

26. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
isoPower® Integrated,
Isolated DC/DC Converters
em.avnet.com/axiom_anaisopower
PROBLEM
• esigns that need isolated data often need isolated power but lack the board space
D
to do both in a cost effective manner.
SOLUTION
• The chip-scale transformers of Analog Devices’ proprietary iCoupler ® technology
not only isolate data, they can also be used to create isolated DC/DC converters
integrated in a single package with data isolation – saving board space, reducing
component count and lowering overall solution cost.
• Ideal for the following appications: power supply start-up bias and gate drives,
isolated sensor interfaces, industrial PLCs and RS-232 transceivers.
• Customers looking for options to large, bulky and expensive isolated DC/DC modules.
EVAL-ADUMQSEBZ
$25 value
• Discrete solutions including optocouplers take up area, reduce reliability and take
time to design.
TREND
Visit em.avnet.com/
axiom_anaisopower and
register to qualify for one
of three boards:
EVAL-ADUM5010EBZ
$59 value
EVAL-ADuM5211EBZ
$69 value
Device
2.5 kVrms
3.75 kVrms
Channel Directionality
10 K OEM Price
ADuM5010
X
0
$1.40
ADuM5210
X
2/0
$2.10
ADuM5211
X
1/1
$2.10
ADuM5212
X
0/2
$2.10
ADuM6010
X
0
$2.02
ADuM6210
X
2/0
$3.04
ADuM6211
X
1/1
$3.04
ADuM6212
X
0/2
$3.04
26 AXIOM

27. TWO NEW FAMILIES OF LOW-POWER,
HIGH-CURRENT DENSITY POWER MANAGEMENT
ICs REDUCE COMPONENT COUNT AND BOARD
AREA WHILE IMPROVING EFFICIENCY
Renesas Electronics offers a complete portfolio of
Power Management Solutions for MCUs, SOCs, FPGAs
and embedded systems.
Key Features
J Compact design
J 2 or 4 channels
J Integrated LDO
J Low power
The Simple DC/DC family (RAA230xx) offers one or
three PWM channels with switching frequency up
to 2MHz and currents up to 3A, and one ultra-low
power LDO for added efficiency and flexibility.
Simple DC/DC Lineup
Products
RAA230211
RAA230212
RAA230213
RAA230214
Ch
2
Input
Voltage
(V)
Circuit
ch1:
DC/DC
(Stepdown)
3.0 5.5
ch2: LDO
RAA230215
RAA230401
RAA230402
RAA230403
RAA230404
RAA230405
4
RAA230406
ch1, ch3,
ch4:
DC/DC
(Stepdown)
2.5 5.5
ch2: LDO
RAA230407
RAA230408
Output
Current
Output
Voltage (V)
1.8 (ch1, 2)
2.7 (ch1, 2)
3.0 (ch1, 2)
3.3 (ch1, 2)
Adj.1 (different voltage can
be set between ch1, ch2)
1.8 (ch1, 2) / 3.3 (ch3) /
1.2 or Adj.1) (ch4)
2.5 (ch1, 2) / 3.3 (ch3) /
1.2 or Adj. (ch4)
3.0 (ch 1,2) / 3.3 (ch3) /
1.2 or Adj. (ch4)
3.3 (ch1,2) / 3.3 (ch3) /
1.2 or Adj. (ch4)
1.8 (ch1,2) / Adj. (ch3) /
1.2 or Adj. (ch4)
2.5 (ch1, 2) / Adj. (ch3) /
1.2 or Adj. (ch4)
3.0 (ch1,2) / Adj. (ch3) /
1.2 or Adj. (ch4)
3.3 (ch1,2) / Adj. (ch3) /
1.2 or Adj. (ch4)
Input Voltage
Simple DC/DC
16V
Package
Sequence
Ultra Low
Power
Mode
ch1:
3A
20-pin
6.4 x
6.5mm
HTSSOP
Yes
Yes
(LDO)
–
Yes
(Low
power
mode
by
freq.
change)
– Ultra Small Package
– Light Load Mode
– High Efficiency
– High Power Density
Simple DC/DC
3V
– Compact Design
– 2 or 4 Channels
– Integrated LDO
– Low Power
2.5V
3A
2 Channel
Evaluation Board
Simple DC/DC Efficiency (2ch)
ch1:
0.5A
ch2:
0.1A
ch3:
1.5A
ch4:
1.5A
32-pin
5x5mm
VQFN
or
32-pin
9 x9mm
TQFP
Outside2
4 Channel
Evaluation Board
Simple DC/DC Efficiency (4ch)
Adj. (ch1,2,3) /
1.2 or Adj. (ch4)
RAA230409
1) Adjustable (by using external resistors) 2) Control ON/OFF of each channel by external signal
mini-POL
The mini-POL family (RAA20770X) achieves the industry‘s highest
level of miniaturization and power density (up to 1.4 A/mm2) with six
products with currents up to 15A.
mini-POL Lineup
Part Name
Features
RAA207700
No LDO
RAA207703
Built-in 5V LDO
RAA207701
No LDO
RAA207704
Built-in 5V LDO
RAA207702
No LDO
RAA207705
Built-in 5V LDO
MAX
Current
15A
10A
5A
15A
Output Current
–
ch2:
0.5A
Low
Power
Mode
mini-POL
5.5V
Input
Voltage
3V to 16V*
5.5V to 16V**
3V to 16V*
5.5V to 16V**
3V to 16V*
5.5V to 16V**
Key Features
J Power density up to 1.4 A/mm2
J Wafer-level chip-size package (WLCSP)
J Light load efficiency for long battery life
J Integrated LDO version available
Package
mini-POL Efficiency
CSP
35-pin
2.67 mm x
3.87 mm
CSP
30-pin
2.67 mm x
3.37 mm
CSP
20-pin
2.67 mm x
2.37 mm
mini-POL
Evaluation Baord
* Separate 5V supply needed. ** With internal LDO, 4.5V to 16V with separate 5V supply.
Learn more at em.avnet.com/axiom_renpower

28. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
MBC300 Medical
AC-to-DC Converter
em.avnet.com/axiom_ponconverters
PROBLEM
• Medical equipment designers require a high quality AC-to-DC converter with high convection rating to minimize fan use.
• The power supply must also operate with high efficiency to reduce size and minimize temperatures in the system.
• In addition, the converter must be able to meet the latest Emission and Safety Agency standards for medical equipment.
SOLUTION
• Power One’s MBC series of efficient medical equipment open-frame power supplies utilizes a universal
90-264 Vac input range with active power factor correction (PFC) and 250 W of output power.
• The MBC300 converter features:
––
––
––
––
––
––
––
TREND
300 W with air, 200 W convection rated.
Small 3 x 5 x 1.5 inch size.
2 x MOPP safety spacing.
EN60601-1 3rd edition certifications.
Inhibit signal to improve efficiencies and minimize system temperatures.
Auxiliary outputs of 5 Vdc @ 2 A and 12 Vdc @ 0.5 A for flexibility.
EMI to level be for both conducted and radiated emissions
• Convection rating is critical to eliminate fans with reduced system reliability and induced noise.
• Small footprints allow designers to increase system functionality so that they can provide a superior product to their customers.
• Meeting the latest Safety certifications reduce end system design and certification time, which allows customers to
get to market faster.
• Reduced emissions meet system qualification standards.
ABC150 Industrial
AC-to-DC Converter
em.avnet.com/axiom_ponconverters
PROBLEM
• Industrial product designers face myriad applications that require an economically priced, compact power supply that
provides fast prototyping.
• Charging system requirements demand a power supply that is flexible in meeting various output voltages, as well as
difficult EMI and Safety standards.
SOLUTION
• Power One’s ABC Series of open-frame power supplies, with its wide universal 90-264 Vac input range and high power
density, is available from 40 up to 400 W of output power and a variety of single and multiple output voltages.
• The ABC150 converter features:
––
––
––
––
––
––
TREND
150 W with air, 110 W convection rated.
Tiny 2 x 4 x 1.3 inch fits the smallest applications.
EN60950-1 2nd edition meets latest Safety standards.
Auxiliary 12 Vdc @ 0.5 A for fan or peripheral devices.
EMI to level B for both radiated and conducted emissions.
Stocking available through Avnet Electronics Marketing.
• Technology advancements require power conversion devices to be as small as possible.
• Reduced system airflow, with a preference towards no moving air.
• System designers require power flexibility with system design.
28 AXIOM

29. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
HFE Power Supply Series
em.avnet.com/axiom_lmdpowersupplies
PROBLEM
• Designers needing high wattage power supplies (10 kW+) often turn to power supplies designed for high volume
server applications because of their low cost.
• Industrial equipment has longer product life cycles than datacom equipment, leading to potential end of life
notices on power supplies when the original datacom customers change architecture.
• The life cycle for industrial products tends to be around 15 years, compared to 7 years for a server product.
SOLUTION
• The HFE series of 1600 and 2500 W power supplies are designed as standard catalog products and are not
based on the needs of a high volume OEM.
• The AC-DC HFEs are rack mounted and are paralleled to provide up to 10 kW in a 1U 19” enclosure.
• The units are available in 12, 24, 32 or 48 V outputs and have a similar set of mechanical and electrical
specifications across the range.
TREND
• Rack mounted plug in power supplies are now being used in many industrial applications due to their power
density, availability and attractive pricing. This solution also gives redundant operation so a power supply failure
will not shut down a system, and the failed module can be replaced while the system is still in use.
• Users are enhancing their systems with the added features of the HFE series, including PMBus communications,
which allows remote read back and programming.
RFE Power Supply Series
em.avnet.com/axiom_lmdpowersupplies
PROBLEM
• Engineers like the power density of the HFE series, but often only need lower power levels (1600-2500 W). As the HFE
series is plug in, the user has to either design a back plane or utilize a full 19” enclosure, which takes up system space.
• In addition, many 19” racks are not configurable to support different output voltages.
SOLUTION
• TDK-Lambda introduced the RFE1600 series of stand-alone AC-DC 1600 W power supplies, available with output
voltages of 12, 24, 32 and 48 V.
• These power supplies are based on the rack mounted HFE, but in place of the connector, the RFE has bus bars
and terminal blocks for the output and input connectors, allowing regular cable harnesses to be used.
TREND
• Bulky standalone industrial power supplies are now being replaced with smaller, higher efficiency units based
on the latest technologies. Two or three units can be easily deployed in the system, mounted close to the load to
minimize cable drops.
AVNET ELECTRONICS MARKETING 29

30. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Integrated Dual-Coil Relay Drivers
Simplify Smart-Meter Design
em.avnet.com/axiom_fscrelaydrivers
PROBLEM
• Smart meters connect the household to the smart grid, which in turn optimizes the production, distribution and
usage of energy.
• Smart e-meters need the ability to remotely disconnect the loads from the grid to better manage the system
during high demand usage or during a shortage of power sources. The function must be tolerant of the noisy
environment of the smart meter as it is directly connected to the incoming feed from the grid and controlled by
a micro-controller. The best solutions integrate service disconnect switches with accurate input filter timing, XOR
input protection, the maximum output pulse-width to protect the relay, and the configurability of either following
the input or to always put out a pre-defined maximum pulse width.
SOLUTION
• Fairchild Semiconductor’s FAN3240 and FAN3241 solutions are designed to drive dual-coil polarized latching
relays that connect and disconnect power in smart electronic meters, solar inverter, energy generation, and
building and home control applications.
• 8 to 60 V operating range for use with 12, 24 or 48 V relays.
• Strong DC current to break through welded contacts without using external switches.
• Accurate timer pulses regardless of input pulse variations and glitches.
–– Accurate input filter time (factory adjustable) and XOR input protection.
–– Accurate maximum output pulse width (factory adjustable).
• Output can follow input width or give maximum limit (mode factory adjustable).
• Internal thermal shutdown protection for switches.
• Single bias voltage design for the chip allows isolated and non-isolated designs.
• Inputs compatible with 3.3 or 5 V square-wave logic signals.
• Enable pin for operational flexibility.
• Small overall PCB footprint
TREND
• With a smaller overall PCB footprint, the integrated FAN3240 and FAN3241 solutions save space and cost as well
as add timers and protection functions to make the relay driving solutions safer and smarter in noisy environments.
Part Number
Minimum Input Pulse
Maximum Output Pulse
Output Pulse Width
Package
FAN3240TMX
15 ms
150 ms
Follows input width
SO-8L NB
FAN3241TMX
1 ms
30 ms
Always maximum
SO-8L NB
FAN324xTMX
Factory adjustable (0.12 ms – 20 ms)
Factory adjustable (1 ms – 350 ms)
Factory adjustable between two modes
SO-8L NB
Relays Driving Smart Meter Disconnect Switch
30 AXIOM

31. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Freescale Xtrinsic Sensors
em.avnet.com/axiom_frssensors
PROBLEM
SOLUTION
• Design engineers need a sensing solution with local computing and sensors management capability in an open,
easy-to-use architecture.
• Freescale’s Xtrinsic MMA955xL and Xtrinsic FXLC95000L are breakthrough, intelligent, motion-sensing devices
that integrate a 3-axis MEMS accelerometer and a 32-bit ColdFire ® MCU.
• Xtrinsic family features include:
–– 1.71 to 1.89 V supply voltage
–– Output data rate (ODR) 488 Hz
–– ±2 g, 4 g, 8 g configurable dynamic ranges available
–– 14/12/10/8 bit resolution available
• The user’s firmware, together with the hardware device, can make system-level decisions required for sophisticated
applications, such as gesture recognition, pedometer, and e-compass tilt compensation and calibration.
• The embedded microcontroller allows sensor integration, initialization, calibration, data compensation, and
computation functions to be added to the platform, thereby offloading those functions from the host processor.
• Total system power consumption is significantly reduced because the application processor stays powered down
for longer periods of time.
• The Xtrinsic MMA955xL family offers 16 K Flash, 2 K RAM.
• The Xtrinsic FXLC95000L offers 128 K Flash, 16 K RAM.
• The Xtrinsic FXLC95000CL hardware is user-programmable to create an intelligent high-precision, flexible,
motion-sensing platform, and the device is programmed and configured with CodeWarrior Development Studio
for Microcontroller (Eclipse IDE).
• The FXLC95000 platform can act as an intelligent sensing hub and a highly configurable decision engine. Using
the Master I2C or SPI module, the FXLC95000 platform can manage secondary sensors such as pressure sensors,
magnetometers and gyroscopes.
TREND
• The marketplace trend is to fuse sensor capabilities with other functions creating combination devices, solutions
that have not been seen before.
FXLC95000CL Xtrinsic Intelligent Motion Sensing Platform
INT_I
BKGD/MS
Interrupt Controller
16 KB ROM
16 KB RAM
3-Axis
Accelerometer
Transducer
ColdFire V1
Reduced Product
Platform
128 KB Flash Memory
Drive circuit
SSB
SCLK
MOSI
MISO
SDAO
SCL0
ADC
C2V
Temperature
Sensor
Trim
SPI Slave
Interface
Control and
Mailbox
Register Set
RESET B
8
System Integration
Module
8
SP_SCR[PS]
Freescale Technology
16
8
16
8
8
I2C Slave
Interface
External Clock Domain
16
Analog
Front End
Temperature
Sensor
Internal Clock Domain
16
8
8
16
Flash Controller
I2C Master
SDA1, SCL1
SPI Master
MOSI, MISO
SCLK2, SSB2
2 x 8 Port Control
16-bit Modulo Timer
Programmable Delay Block
Two-Channel TPM
Clock Module (16 MHz)
RGPIO [15:0]
AVNET ELECTRONICS MARKETING 31

32. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
OSLON® Square LED
em.avnet.com/axiom_oososlon
PROBLEM
• Powerful, narrow color binning with perfect color quality LEDs are needed for indoor lighting applications.
• Compact, environmentally friendly LEDs that feature low thermal resistance are desired for portable lighting designs.
• Robust, long lasting and energy efficient LEDs are required for outdoor lighting applications.
SOLUTION
• OSLON ® Square from OSRAM Opto Semiconductors provides the most compact, high-power LED in its class.
• With a maximum driving current of 1.5 A and a broad range of color rendering indexes, the OSLON Square
product family is perfect for a large variety of indoor, outdoor and portable applications.
• OSLON Square is available in different color temperatures from warm white 2400 to cool white 6500 K.
OSRAM’s fine white binning system covers the area of 2-step MacAdams ellipse, ensuring perfect color
consistency for all lighting applications.
• With a footprint of only 3 x 3 mm, the OSLON Square is one of the smallest high-power LEDs on the market.
• White reflective layer of the package allows more useable lumens in the application.
• With robust thermal management, lifetimes of more than 50,000 hours are easily obtained – even at high driving currents.
OSLON® SSL LED
em.avnet.com/axiom_oososlon
PROBLEM
SOLUTION
• ompact and energy efficient LEDs are needed for indoor, outdoor and architectural lighting applications.
C
• The compact OSLON® SSL 80 and 150 offer beam angles optimized for use with lenses and reflectors. This revolutionary
feature, combined with a broad range of color temperatures and color rendering indexes, opens up new possibilities for
cost-effective, sustainable lighting solutions.
• A full color portfolio is available — from Deep Blue 450 nm to Hyper-Red 645 nm.
• With a footprint of only 3 x 3 mm, this is one of the smallest high-power lensed LEDs on the market today, enabling
compact LED arrays and maximizing flux over area.
• OSLON SSL 80 and 150 can be driven up to 1000 mA while OSRAM’s latest power chip technology remains efficient
even at the highest drive currents.
• A low thermal resistance of 7 K/W ensures cool running and a highly efficient product.
• A lifetime of more than 50,000 hours is easily obtainable, even at high drive currents.
32 AXIOM

33. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
SFH 7770 E6 Two-in-One
Digital Sensor
em.avnet.com/axiom_oosdigitalsensors
PROBLEM
SOLUTION
• s portable end products like smartphones continue to evolve, engineers need a sensor that measures reflections
A
to detect horizontal and vertical movements, enabling users to simply flick through photos, or other usable
features, without even touching the display.
• The SFH 7770 E6 from OSRAM Opto Semiconductors combines the functions of a digital ambient light sensor
with those of a digital proximity sensor.
• The ambient light sensor, which closely matches the sensitivity of the human eye, features high accuracy from
0.03 – 65,000 lx, a low temperature coefficient of photosensitivity, insensitivity to 50-60 Hz flickering and
excellent linearity.
• The device determines the ambient brightness, detects the presence of an object nearby (with horizontal or
vertical movements) or whether the object is moving closer or further away.
• By using two or three IR LEDs instead of one, it is possible to detect gestures with measurements repeated
within milliseconds.
• The proximity sensor is capable of driving a maximum of three IR LEDs with up to
200 mA and features a detection range of up to 300 mm. In addition, it is optimized
for 850 nm emitters and is insensitive to ambient light.
• With the high sensitivity of the SFH 7770 E6, the entire cover can now be made of
colored plastic with only minimal loss of sensor detection range. As a result, there
is no longer any need for transparent windows.
• SFH 7770 E6 is contained in a small 2.8 x 2.8 x 0.9 mm package.
• I²C bus interface features 100 kbit/s, 400 kbit/s and 3.4 Mbit/s.
• Measurement modes are programmable as stand-by, triggered and free-running.
• There is very low power consumption in stand-by mode.
TREND
• As the trend to increase user functionality in mobile phones, cameras, PDAs, notebooks, consumer products
and automotive applications continue to expand and include new features like touch free control, OSRAM
Opto Semiconductors is at the forefront of the industry by providing the extremely small size and low power
consumption SFH 7770 E6 two-in-one proximity and ambient light sensor.
AVNET ELECTRONICS MARKETING 33

34. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Automotive Grade
Non-Synchronous Boost Controller
em.avnet.com/axiom_onsboostcontroller
PROBLEM
• Automotive battery voltage distribution is subject to significant voltage transient events in Start/Stop applications.
• To maintain reliable operation, point of load DC/DC regulators have minimum input voltage requirements. Boost voltage
converters are commonly used in front of DC/DC regulators to convert a low input voltage to a higher voltage.
SOLUTION
• ON Semiconductor’s NCV8876 factory adjustable non-synchronous boost controller with automatic wake up
and shutdown function supplies a minimum output voltage during start-stop conditions to counteract any sag in a
vehicle’s battery voltage.
• The device is enabled when the supply voltage drops below 7.3 V, then boost operation is initiated once this
voltage goes under 6.8 V.
• Protection features include cycle-by-cycle current limiting, thermal shutdown (with a 170 °C threshold) and hiccupmode over-current protection.
• Targeted for the automotive segment, the device is ideal for instrument clusters, radios, navigation systems, engine
control units and lighting applications.
• The AEC qualified device, available in an SOIC-8 package, offers a simple design solution offering reduction of
component count and design cost.
• Support tools include NCV887601 Evaluation Board, Excel-based design aids and design verification using
PSPICE large signal average behavioral modeling.
• Features:
––
––
––
––
––
––
––
34 AXIOM
2 V to 45 V operation.
Logic output switch monitoring.
-40 to 150 °C operation.
±2.0% output voltage accuracy over temperature.
Low shutdown current (11 µA typ.).
Adjustable current limit, internal soft-start and slope compensation.
Peak current mode control.

35. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
600 V Series IGBTs
em.avnet.com/axiom_stmpowermesh
PROBLEM
SOLUTION
• Power electronics designers are looking to improve the reliability and efficiency in applications like welding, solar
inverters, UPS, induction heating and SMPS.
• The revolutionary V series of IGBTs from STMicroelectronics guarantees a max junction temperature (Tj max) of
175 ˚C, increasing device reliability and lifetime.
• Featuring tail-less turn off waveforms and co-packing a very fast freewheeling diode tailored for very low Eon,
the new V series offers several benefits in high switching frequency applications demanding superior efficiency,
such as welding, solar inverters, induction heating, UPS, PFC and SMPS.
• This series has been designed to meet the requirements for higher efficiency and reliability in power. Additional
features include:
––
––
––
––
––
––
Positive VCE(sat) temperature coefficient allow safer paralleling operation.
Very high speed switching.
Low saturation voltage: VCE(sat) = 1.85 V (typ.) @ IC = ICN.
Low thermal resistance.
Co-packed tailored diode.
UL Recognized TO-220F package.
Ultra Low Dropout Linear
Regulators
em.avnet.com/axiom_stmpowermesh
PROBLEM
SOLUTION
• Providing multiple voltages needed for many small and portable applications while maintaining high efficiency in
a minimum space with the fewest external components.
• ST’s low dropout (LDO) regulators offer an optimal combination of low dropout voltage, low quiescent current,
fast transient response, low noise and good ripple rejection.
• Depending on the application requirements, LDOs have been optimized for:
––
––
––
––
Ultra low dropout down to 50 mV
Low quiescent current down to 1.4 µA
Low noise/high PSRR down to 6.3 µVRMS
Miniature packages offer space savings to minimize board space. Devices ion these packages are particularly
well suited for smart phones, health and fitness monitoring, Bluetooth and remote and other small portable
electronic devices.
mains
External adapter
or
internal AC/DC
DC buses
24 V
12 V
5V
DC-DC
POST-REGULATION
LDOs,
Switching Controllers
or Converters
5V
3.3 V
1.2 V
...
...
2.5 V
....
....
s
ASIC
s
Amp
o
Audi
µC
ory
Mem
RF
...
AVNET ELECTRONICS MARKETING 35

36. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
SuperJunction MOSFETs
Deliver Ultra-Low RDS(ON)
mosfet.toshiba.com
PROBLEM
• Increases in output power result in efficiency loss and temperature increases.
• Space limitation due to downsizing and density growth.
SOLUTION
• Toshiba’s DTMOS IV SuperJunction MOSFETs deliver a combination of high conduction and switching efficiency,
small die area and high breakdown voltage that conventional devices cannot achieve.
• Small packages sizes provide designers with greater flexibility to optimize energy efficiency and power density.
• Optimized switching characteristics: easy to control, low EMI.
• Wide on-resistance R DS(ON) 0.9 to 0.018 Ω max range.
• Improved RDS(ON) x area.
• Packages include: DPAK, IPAK, D2PAK, 8 x 8 mm DFN, I2PAK, TO-220, TO-220SIS, TO-247, TO-3P(N) and TO-3P(L).
600 V DTMOS IV SUPERJUNCTION MOSFETS
Current
Rating
(A)
RDS(ON)
max.
(Ω)
DPAK
(TO-252)
IPAK
(TO-253)
5.4
0.9
TK5P60W
TK5Q60W
TK5A60W
10.5
380
6.2
0.75 –
0.82
TK6P60W
(0.82 Ω)
TK6Q60W
(0.82 Ω)
TK6A60W
12
390
7
0.6
TK7P60W
TK7Q60W
TK7A60W
13
490
8
0.5
TK8P60W
TK8Q60W
TK8A60W
16
530
I2PAK
(TO-262)
D2PAK
(TO-263)
8 x 8 mm
DFN
TO-220
TO-220SIS
TO-3P
(N)
TO-247
TO-3P
(L)
Ciss
Qg
(VDS=300 V)
(nC)
(pF)
9.8
0.38 –
0.43
TK10P60W TK10Q60W
(0.43 Ω)
(0.43 Ω)
TK10V60W
TK10E60W TK10A60W
20
700
11.5
0.3 –
0.34
TK12P60W TK12Q60W
(0.34 Ω)
(0.34 Ω)
TK12V60W
TK12E60W
TK12A60W TK12J60W
25
890
15.8
0.19
TK16C60W TK16G60W TK16V60W
TK16E60W
TK16A60W TK16J60W TK16N60W
38
1350
TK20V60W
TK20E60W TK20A60W TK20J60W TK20N60W
(0.17 Ω)
50
1700
20
0.1550.17
30.8
0.088–
0.098
TK31V60W
TK31E60W TK31A60W TK31J60W TK31N60W
(0.098 Ω)
86
3000
38.8
0.065
TK39A60W TK39J60W TK39N60W
110
4100
61.8
0.04
TK62J60W TK62N60W
180
6500
100
0.018
TK100L60W 360
15000
36 AXIOM
TK20C60W TK20G60W

37. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Redefining the Figure of Merit (FOM) for
MOSFETs in Power Conversion Applications
em.avnet.com/axiom_vismosfets
PROBLEM
• Switch mode power supplies (SMPS) in many applications need to work with higher efficiency levels as power
and current levels increase.
SOLUTION
• Vishay Siliconix E Series SuperJunction MOSFETs offer better conduction and switching losses compared to
different high-volume production silicon technology on the market today. The E Series achieves this new standard
of performance by minimizing gate charge (Q g), gate-to-source charge (Q gs), gate-to-drain charge (Q gd), output
capacitance/charge (C oss/Q oss) and on-resistance (Ron) in a way optimized for power conversion applications.
TREND
• There is a move away from a one-size-fits-all FOM for MOSFETs used in power conversion applications. Instead
of just looking at on-resistance multiplied by typical gate charge, the new trend is toward more topology-specific
analysis that takes into account additional specifications of the device, such as gate-to-source charge (Q gs),
gate-to-drain charge (Q gd), and output capacitance/charge (C oss/Q oss). These do a better job of representing the
actual losses that occur within the MOSFET. More than ever, device development continues to be a multi-variable
balancing of specifications to achieve optimum performance.
Isolated, High-Voltage MOSFET Driver
with Integrated Fast Turn-Off Circuit
em.avnet.com/axiom_vismosfets
PROBLEM
Mechanical relays suffer from contact wear and
• are highly susceptible to shock and vibration.
• suffer from contact bounce.
• offer limited electrical and noise isolation.
• generate electrical and acoustic noise.
SOLUTION
PCB implemented MOSFET based SSR solutions from Vishay
• remove contacts and moving parts.
• eliminate noise generating arcing.
• offer up to 5000 V or isolation in an SOP4 package.
TREND
• Industrial controls and appliances are finding mechanical relays to be less and less compatible for the increasing
demand of high reliability, small package sizes and more intelligent solutions for low power microcontrollerbased systems. The VOM1271 allows engineers to design highly reliable solid state solutions in extremely small
packages that can be driven directly from microcontroller-based digital circuits, all while providing an extremely
high level of isolation and decoupling from lethal voltages and noise.
AVNET ELECTRONICS MARKETING 37

38. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Power Passives by Design
em.avnet.com/axiom_nicprotection
PROBLEM
• Power supplies and convertors require high performance from reduced size components.
Associated
Series:
SOLUTION
• NIC’s use of alternative and new technologies focus upon the best-in-performance of
low ESR capacitors and power inductors.
NPIS
• Polymer hybrid construction NSPE series of aluminum electrolytic capacitors provide
10X improvement in ESR and impedance at low operating temperatures, compared
to standard liquid construction, while offering higher voltage ratings and lower
leakage current benefits when compared to solid polymer construction.
NSPE
NPIM
• Transition to automated component production process in multilayer, shielded and
metal composite inductors provides high current performance with lower unit costs.
• Offering over 20 different case size variations, down to 2 x 2 mm footprints, NIC’s
power inductor offering provides power supply designers with a wide range of
component solutions for any power design.
TREND
• Continued trend towards increased performance in the smallest component sizes will
increase use of alternative technologies to meet the demands of power designs.
• Development of expanded hybrid capacitor technologies focus on meeting the
requirements of next-generation power designs. Automated component production
assembly allows reduction in component size, while at the same time increasing
performance, quality, and in the end, reducing costs.
BU
YOU ILD
R OW
PA
N
PEFO SSIVE
R
K I T T M A N CE
EM.AV ODAY!
NET.C
A XIOM OM/
_
NICPR
OTECT
ION
Over Voltage
Current Protection
em.avnet.com/axiom_nicprotection
PROBLEM
• ower designs place increased demand upon over-current and over-voltage circuit
P
protection components.
SOLUTION
• Expanded circuit protection product offerings from NIC Components include safety
agency approved SMT fuses and leaded (LDD) varistors.
• The newly released NVR series of large disc metal oxide varistors (MOVs) provide
fast-acting absorption of transient energy on 50 or 60 Hz power circuits, with rated
operation to 1000 VAC.
• Recently added NFVC series of SMT chip fuses feature fast-acting, high inrush
withstanding performance in industry-standard 6125 (2410) case sizes, with current
ratings up to 20 A and voltage ratings up to 125 VDC.
• Both series are UL safety agency (USA Canada) listed.
TREND
• Rapid development for mobile devices is driving demand for high-performance
circuit protection into smaller component sizes.
• For AC circuit applications, standard format LDD MOVs continue to see
requirements to provide high energy transient absorption at low cost.
• While fast acting chip fuses are seen as commodity type product with strong
requirements and a wide range of design-in, engineers can expect to see an increase in
trend towards resettable fuse technologies verses traditional one-time use components.
38 AXIOM
Associated
Series:
NVR
NFVC
NCT

39. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Transient Current Suppressor (TCS™)
High-Speed Protectors (HSPs)
em.avnet.com/axiom_bnstcs
PROBLEM
• Excessive voltage levels across TVS diodes limit their effectiveness in protecting
vulnerable integrated circuits (ICs).
Associated
Products:
• Keeping the cost of the protection circuit low while also providing adequate
protection without degrading performance is a significant challenge.
CDSOD323-T03C
CDSOD323-T05
CDSOS323-T05C
SOLUTION
• The Bourns family of dual channel TCS HSPs work in conjunction with an
overvoltage protection device and the ESD structure of an IC to minimize the energy
absorbed by the IC during a surge event.
™
• The voltage level at the IC input/output (IO) is determined by the response of its ESD
structure to the limited current through the TCS HSP rather than the response of the
TVS diode to the surge event.
CDSOD323-T05LC
CDSOT23-S2004
SM51589L
PT61020L
• Each device in the TCS HSP family provides up to 40 V of isolation between the
overvoltage protector and the IO of the protected IC. This allows the use of low-cost
rail clamp diodes to the supply and ground instead of higher cost TVS diodes.
• The low series impedance of the TCS HSP has a minimal impact on performance.
The series resistance between channels is well-matched.
• Use the links below to access the Bourns® TCS™ HSP training video, as well as two
informative white papers:
• www.bourns.com/TrainingDetail.aspx?name=tcs_training
• www.bourns.com/data/global/pdfs/tcs_vdsl_white_paper.pdf
• www.bourns.com/data/global/pdfs/Bourns_TCS_GBE_White_Paper.pdf
20
18
PEAK SURGE CURRENT (A)
16
14
“Ideal” diode response of a
TVS Diode with the TCS™
HSP device at the interface
requiring protection
12
10
8
1/2 TCS-DL004-XXX-WH
To Connector
CDSOD323-T05C
IDEAL DIODE (5.5 V)
NEW APPROACH
6
4
Interface
Requiring
Protection
2
CDSOD323-T05C
Overvoltage
Device
0
0
2
4
6
8
10
12
14
PEAK VOLTAGE AT INTERFACE (V)
16
18
20
The above graph compares the surge response of a TVS diode and Bourns’ new approach, which uses a TCS™ HSP device/overvoltage protection device combination, to that of an ideal
diode. Note, when the new approach is used, the voltage at the protected interface is almost independent of the peak surge current and the voltage across the overvoltage device.
AVNET ELECTRONICS MARKETING 39

40. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
L-Series Circuit Breaker
em.avnet.com/axiom_clgcircuitbreaker
PROBLEM
• Datacom systems require maximum circuit protection to ensure continued data transmission services.
• Power distribution units and rack systems are limited to confined spaces, and traditional circuit breakers take up
too much valuable space and are sensitive to ambient temperature.
• Circuit protection products must comply with all industry regulations.
SOLUTION
• The L-Series high-performance, compact hydraulic-magnetic circuit breaker from Carling provides up to 240 VAC
ratings protection regardless of ambient temperature.
• Its low profile design is ideally suited for the rigors and confined spaces found in today’s telecom/datacom power
distribution units and rack systems.
• With TUV certification, EN60934 approval and as a UL 489 Listed circuit breaker, the L-series exceeds current
worldwide telecom and datacenter capability requirements.
TREND
• The telecom/datacom industry will continue to require optimum circuit protection in innovative packages that
promote spatial reduction objectives while improving performance.
MS-Series Circuit Breaker
em.avnet.com/axiom_clgcircuitbreaker
PROBLEM
• Military grade power generation and communication equipment requires reliable circuit protection products that
ensure continuous equipment performance and functionality.
• Harsh environments demand sealed and temperature stable circuit protection.
• Military communication equipment requires rugged, high performance components in a compact design.
SOLUTION
• The MS-Series was designed in accordance with the requirements of MIL-PRF-39019F, MIL-PRF-55629 and
MIL STD 202, making it the best compact COTS circuit protection product available.
• The MS-Series is an environmentally sealed, hydraulic/magnetic circuit breaker that withstands extreme
temperatures, shock and vibration.
• Its compact size and reliability make it ideal for ruggedized communication equipment and other mission
critical equipment.
TREND
• The military equipment industry requires reliable, high-performance components that withstand the most
demanding operation environments.
• COTS (Commercial-Off-The-Shelf) products offer cost-effective solutions while meeting military requirements.
40 AXIOM

41. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Power Triple Lock Connectors
em.avnet.com/axiom_tyctriplelockconnectors
PROBLEM
SOLUTION
Associated
Products:
• Improved connector mating and latching provides performance assurance for
improved power and signal applications.
Universal
MATE-N-LOK
Connectors
• TE Connectivity’s power triple lock connectors provide cap and plug mating
confirmation with audible latch.
Commercial
MATE-N-LOK
Connectors
• These connectors eliminate wire snags with ribs designed to protect the latch.
• They ensure connector system engagement in high vibration applications with
optional Connector Position Assurance (CPA).
Power Key
Connectors
• And, they confirm contacts are fully seated while providing an added measure
against contact backout with optional Terminal Position Assurance (TPA).
TREND
Economy Power II
Connectors
• Increased reliability and functionality, security and ease of use.
Economy Power (EP) II
2.5 Connectors
em.avnet.com/axiom_tycepconnectors
PROBLEM
Associated
Products:
• Reduced connector size helps deliver power to a PC board when space is at a premium.
SOLUTION
• Connectors with Terminal Position Assurance (TPA) plug housings and molded TPA
devices are needed to help prevent terminal back-out.
AMP CT Connectors
Signal Double Lock
Connectors
• EP II and EP 2.5 connectors help prevent terminal back-out with TPA terminal plug
housings and molded TPA devices.
AMP Power Series
Connectors
• A positive external locking latch helps ensure complete system mating.
• Anti-snag feature helps prevent wire from snagging on the latch.
• Polarization tabs help prevent mismating with corresponding header.
• These connectors are designed to mate with current designs and newly designed EP
headers, allowing inventory standardization.
TREND
• Support mechanical and electrical reliability with a positive locking latch and TPA device
AVNET ELECTRONICS MARKETING 41

42. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
MULTI-BEAM XLE Connectors
em.avnet.com/axiom_tycmultibeam
PROBLEM
• Industry demands for higher power capabilities in the same amount of PCB space.
• Connectors often feature limited power.
SOLUTION
• MULTI-BEAM XLE connectors provide for greater angular mis-alignment between
mating connectors.
• Their hot-pluggable contacts allow for high power rated at 75 A/low power rated at
40 A – that’s 35% more power over other connectors in the same space.
Associated
Products:
MULTIGIG RT 2-R
Connectors
Mid-Range
PCB Relays
ET Power Connectors
• The connectors feature sequenced contacts for mate-first-break-last operation.
• They achieve up to 500 mating cycles with high durability design.
• Meet industry reliability requirements for telecom equipment.
• Dissipate heat with ventilated housings.
• Provide lower contact resistance with redundant contact points.
• Accommodate a variety of configurations with a modular tooling platform design.
TREND
• Higher current carrying capability in the same connector footprint.
IMPACT Connectors
em.avnet.com/axiom_tycimpact
PROBLEM
SOLUTION
• Difficulty in finding connectors that are designed for increased speed and density
to help meet future system upgrades and next generation requirements of data
networking and telecommunications equipment.
• TE Connectivity’s IMPACT connectors feature a unique broad-edge coupled
design that utilizes low impedance, localized ground return path in an optimized
differential pair array.
• Differential pairs are tightly coupled and surrounded by ground structures to isolate
the pairs, reducing crosstalk and increasing overall bandwidth performance with
minimal performance variance.
• The backplane header construction on IMPACT connectors offers air pockets
selectively placed in the header floor to isolate signal pairs.
TREND
42 AXIOM
• Offers value add approach of speed, density, cost and long term reliability for next
generation application requirements
Associated
Products:
STRADA Mesa
Mezzanine
Connectors
ICCON Power
Connectors
Mini SAS HD
Interconnect

43. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Motorman Connectors
em.avnet.com/axiom_tycmotorman
PROBLEM
SOLUTION
• How to integrate communication, signal and power transmission of locally controlled
motors within a single compact rectangular connector, all while providing significant
space savings in comparison with traditional rectangular industrial connectors.
• Motorman connectors feature the compact size of a traditional rectangular
connector and hybrid construction (power, communication, signal), and integrate the
needed communication, signal and power transmission within a single connector.
• All signals are bundled into one interface which means only one cable for the customer.
• Offers space for two 4-pin Ethernet sockets, five power sockets, five signal sockets
and one protection earth contact.
Associated
Products:
Universal
MATE-N-LOK
Connectors
HTS Heavy Duty
Connectors
Ter minal Blocks
Strips
Dynamic Series
Connectors
• Spacious, side internal access assists easy and safe configuration.
TREND
• Reduction of space and costs due to integration of communication, signal and power
transmission of locally controlled motors within a single compact rectangular connector.
Power PCB RTX Relays
em.avnet.com/axiom_tycrtx
PROBLEM
SOLUTION
• Finding a relay that is specifically developed to meet the requirements of IEC 60669
with up to 16 A/250 V AC rated load. The key requirement of this standard is the
ability to switch high inrush currents from lighting loads.
Associated
Products:
• The RTX relay not only solves the above problem, but it also features high inrush
capability due to its tungsten pre-make contact and silver tin oxide carry/break contact.
Mini IO Connectors
• 16 A/250 VAC make and break capacity according to IEC 60699-1.
• Energy efficient with the bi-stable (lathing) DC coil system utilizing one or two coils.
• Reinforced insulation helps provide additional safety protection.
Corcom FB
Series Filters
Universal
MATE-N-LOK
Connectors
CoolSplice
Connectors
• Small product dimensions of 29.1 x 12.7 x 16 mm to meet industry standard.
• RoHS compliancy and cadmium free design meet market requirements.
TREND
• Saves energy with bi-stable DC coil system.
• Provides additional safety protection with reinforced insulation.
AVNET ELECTRONICS MARKETING 43

44. AXIOM
MANUFACTURER
PRODUCTS SOLUTIONS
Mini-Fit® Plus HMC (High
Mating Cycle) Crimp Terminals
PROBLEM
SOLUTION
• Mid-range power applications now require connectors that can achieve higher mating cycles and higher current
without increasing the connector’s footprint to meet industry reliability requirements.
• Rated up to 1500 mating cycles and 13.0 A per circuit, the Molex Mini-Fit ® Plus HMC crimp terminals are
produced from a proprietary, high-current alloy.
• The terminal’s patented, elongated dimple design provides a longer wipe length and increased contact area over
standard Mini-Fit terminals.
• The Mini-Fit Plus HMC female crimp terminals are used with existing Min-Fit receptacle and plug housings and
can be used with existing Mini-Fit and Mini-Fit Plus headers, eliminating the need for additional crimp housings
and headers.
TREND
• Medical, appliance and power supply device manufacturers are seeking commercially available products that
meet industry reliability requirements for higher current. The Mini-Fit Plus HMC terminals achieve the greatest
durability and current per circuit without increasing the design footprint.
Magnetic Jacks – PoE Plus
Integrated PDJack™ Connector
em.avnet.com/axiom_mlxpdjack
PROBLEM
• Integrating Power over Ethernet (PoE) controller circuitry, magnetics and Ethernet connectivity into an electronic
device is a challenging undertaking that can cause lengthy product release delays.
• Until now, PoE power device designs required the entire circuit to be laid out on the PC board, increasing space
constraints, adding multiple discrete components and intensifying engineering efforts.
SOLUTION
• The PoE Plus Integrated PDJack™ connector provides a drop-in single port solution that includes all PoE
functionality within the connector – eliminating PoE circuitry on the PCB.
• Up to 75% board space saving versus discrete component solution.
• IEEE802.3at compliant operating detection and classification.
• Gigabit Ethernet magnetics with common-mode choke designed to operate with industry-leading PHY chip
vendors at 10/100/1000 Mbps.
• Drop in solution offering reduced design risk and greater opportunity for time to market release.
• Isolated 12 V DC-DC drop down reference design available.
TREND
• PoE-enabled networks are now prevalent offering centralized and managed, safe power and communications
solutions for low power applications.
• Network connected devices are increasingly being powered by PoE, including video surveillance, VOIP phones,
Wireless Access Points and thin clients.
• Designs in telecommunication, industrial and commercial applications are becoming more complex due to the
embedded circuitry and power requirements.
44 AXIOM

45. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S
Advanced Power Solutions
em.avnet.com/axiom_avxpower
PROBLEM
• Power systems ranging from milliwatts to megawatts require myriad, reliable power products.
SOLUTION
• AVX provides a full spectrum of power solutions from RF broad-band DC block for power amplifiers, to DC
hold-up and pulse-power supercapacitors – covering all ranges of power filtering and decoupling applications in
between. The following are just a few examples of AVX’s product offerings:
• GX Ultra Broadband DC Blocks. The GX Series was developed specifically to address DC blocking issues from
160 KHz (-3 dB roll-off) to 40 GHz. Most applications will experience resonance-free insertion loss of 0.5 dB thru at
least 40 GHz. Using AVX’s patented precision thin film termination process, the device is designed to be completely
orientation insensitive with a standard EIA 0201 footprint to minimize board space requirements. Both Ni/Sn and Ni/
Au terminations are available to cover a wide range of attachment processes. All GX parts are RoHS compliant.
• Advanced Ceramic Capacitors for Switch-Mode Power Supplies. High speed SMPS place high demands on the
capacitors used in the input or output filters of Resonant DC?DC or Pulse Modulated DC/DC converters. AVX has
developed several MLC capacitor styles for these switcher applications. These capacitors have been extensively
tested and characterized and found to have almost ideal performances to meet the stringent requirements of these
applications. The standard SM series is extremely configurable, with six footprint options, each of which has stacking
options from one to five units tall, covering a wide CV range in X7R dielectric. SMPS capacitors are also available in
several alternate package types and supplied to commercial, automotive, MIL-PRF and space level specifications.
• FB/FE DC Link Polypropylene Film Capacitors. For higher current industrial applications, the FB series (2-leaded)
and FE series (4-leaded) use a non-impregnated metallized polypropylene dielectric specially treated to have
a very high dielectric strength in operating conditions up to 100 °C. These capacitors have been designed for
PCB mounting, and their performance characteristics make them a viable alternative to aluminum electrolytic
technology due to much lower ESR and much higher surge voltage capability (dv/dt).
• BestCap ® Pulse Supercapacitors. Representing the latest in pulse-supercapacitor technology, BestCap addresses
conventional supercapacitor limitations - high ESR in the tens of Ohms range and high capacitance loss when
required to supply very short duration current pulses. In BestCap, a unique proton polymer membrane is used –
proton mobility is orders of magnitude greater than organic molecules and gives charge-transfer characteristics
similar to the “dielectric” capacitor technologies noted above. This results in small size BestCap having the
equivalent capacitance value of a much larger aluminum electrolytic capacitor or capacitor bank.
Advanced Ceramic Capacitors
for Switch-Mode Power Supplies.
GX01 Series - Insertion Loss (S21)
CHIP SEPARATION
0.254 (0.010) TYP.
E
D
2.50
2.00
1.50
1.00
B
0.50
1.397 (0.055)
±0.254 (0.010)
A
0.00
-0.50
-1.00
6.35
(0.250)
MIN.
0.254
(0.010)
TYP.
0.508 (0.020) TYP.
2.54 (0.100) TYP.
2.54 (0.100) MAX
0.635 (0.025) MIN.
C
-1.50
(Typical)
-2.00
-2.50
0.4
8
16
24
Frequency (GHz)
32
40
AVNET ELECTRONICS MARKETING 45

46. The
Consumerization of OEMs

47. By Doug Geisler, Business Development Team Manager for Avnet’s
Embedded Software and Services Group (ESSG)
Consumerization can mean many different things to different audiences. For me, it is
the changing expectations in the industrial space that are the direct result of some of the
technology available in the consumer space, such as cell phones and tablets. The changing
consumer expectation is causing an increase in pressure to be placed on industrial OEMs to
up their game and bring new products to market more quickly. Consumers are carrying an
iPhone or Android device to work, and then looking at industrial machines whose interface,
features, ease of use and overall user experience seems to be from 20 years ago.
The interesting part for me is that the OEMs that feel this pressure may have a perfectly
good product with no shortcomings at all. The issue is not that there is a problem with their
product, but rather a whole new set of expectations are being placed on them by users. User
perceptions of the devices are such that if they see a user interface (UI) that appears to be
old, they believe the underlying device is old and ineffective compared with something that
carries a ‘slicker’ interface.
Over the last 10-20 years, there have been these
perception vs. reality judgments happening in the
electronics business. But the cell phone and tablet
markets alone have accelerated this dramatically.
So what is an OEM to do when their product design
cycles are 3-5 years compared to design cycles of
consumer products that are measured in months?
I
have noticed OEMs fall into one of two major camps.
The “Hurry Up” Camp
This group seems to think that all they need to do is cut their design
cycles, move faster and all will be good. The challenge with this
is that the entire company, the processes, the people, the product
requirements, etc. are all built on certain assumptions that can
only be sped up so fast. These people, processes and requirements
take time. Industrial products are intended to last life cycles of
many years, unlike the two years and trash seen by consumers.
The “Hurry Up” folks are still trying to win the battle by taking the
existing processes and just speeding them up.
Benefits
Challenge
Quicker and less expensive to implement than
some other options.
The “If You Can’t Beat ‘Em,
J
oin ‘Em” Camp
Interesting wisdom is forcing some into this camp, whether
management likes it or not. This type of approach at least
acknowledges that there are limitations to speeding up an existing
system that may be better serviced by changing the rules all together.
But often, these OEMs are hugely affected by the consumer space
and are being forced in this direction. As an example of this group,
medical instrument companies are being asked to develop iPad
applications and interfaces for their machines. Why? Because
doctors already carry iPads and know how to use them. If the OEM
wants to add product features that will be successfully received by
their most influential audience (i.e. doctors), the OEMs need to be
able to tell customers that “There’s an app for that!” In essence, the
OEMs need to leverage an infrastructure that they did not sell (i.e.
the consumer devices owned by their product users).
Benefits
Can bring new products and features to market
quickly, and at a lower cost since it relies on the
customer’s own hardware. Customers are also more
likely to perceive the OEM as being progressive.
Challenge
The OEM is likely to have to find external expertise
to write the applications. OEMs will be subject to
shorter life cycles of the consumer hardware and
will need to make more frequent and constant
revisions to software for continued support.
OEMs are limited with how much incremental gain
they can achieve. They will quickly reach a point
of diminishing returns.
So where is all this change taking an OEM? There is certainly no right or
wrong answer. Some industries are less impacted by the consumer affect, and
simply speeding up their design cycles will be enough to stay at the forefront of
technology in their industry. And for other OEMs that feel the consumerization
effects more acutely, the answer may be to go with the “join ‘em” trend.
READ MORE ABOUT THIS TOPIC IN
The Executive’s Guide to BYO
and the Consumerization of IT
A FREE EBOOK FROM ZDNET + TECHREPUBLIC AT
www.zdnet.com/the-executives-guide-to-byod-and-theconsumerization-of-it-free-ebook-7000010871/
expert resources
If you’re an OEM looking for expert resources
on application development for smartphones,
tablets or other devices, Avnet’s Embedded
Software Services Group (ESSG) can
help you reduce time to market and stay focused
on your core solutions, while eliminating the
fixed costs of adding new headcount.
Contact services@avnet.com to get started
47

48. AXIOM
TRAINING EVENTS
Embedded Vision Summit
• October 2, 2013 at the Westford Regency Inn and Conference Center in Westford, Massachusetts
• Technical educational forum for engineers interested in incorporating visual intelligence into electronic systems and software
REGISTER www.embedded-vision.com/summit/oct2013/overview
Xilinx and Avnet Electronics Marketing’s Smarter Vision Workshop
• October 3, 2013, afternoon session, at Westford Regency Inn Conference Center in Westford, Massachusetts, following
Embedded Vision Summit.
• This course introduces students to SoC application development with a specific focus on embedded vision using the Xilinx
Vivado® Design Suite to target the Xilinx Zynq®-7000 All Programmable SoC.
• The hands on labs will use a camera design, implemented with Vivado IP Integrator and SmartCORE™ IP cores. The
student will be guided on how to move a software OpenCV algorithm to hardware using Vivado High-Level Synthesis and
included video libraries.
REGISTER em.avnet.com/axiom_smartervisionworkshop
ES Live
• October 3, 2013 at the Hyatt Regency Hotel, Downtown Boston, Massachusetts.
• Professionals can discuss their sourcing and supply chain requirements in a relaxed atmosphere.
• Over 55 exhibitors.
REGISTER em.avnet.com/axiom_eslive
Analog Devices Design Conference 2013
• October through December dates throughout N. America.
• Analog Devices and event partners Xilinx and MathWorks invite you to a one-day conference featuring leading industry experts
presenting complete signal chain and system-ready solutions for your most complex design challenges.
• Technical sessions delivered by experts, live demo exhibition of ADI, partner and sponsor technology solutions, and collaboration on
complex ecosystems involving analog, FPGAs/embedded processing and software modeling tools.
REGISTER em.avnet.com/axiom_anadesigncon2013
48 AXIOM

49. TRAINING EVENTS
Designing with Freescale Seminar Series
• October through December dates throughout N.America.
• Instructor-led training courses enable embedded engineers to accelerate the development of innovative end products using Freescale technologies.
• These free technical training seminars, offered over one or two days, provide hands-on workshops, updates on the latest Freescale and
ecosystem technologies as well as real-world demonstrations from Freescale and its ecosystem partners.
REGISTER em.avnet.com/axiom_designing-with-freescale
Texas Instruments Technology Days 2013
• October through December dates throughout N. America.
• See the latest cutting-edge analog and digital technologies across a wide range of applications.
• Hear in-depth insights, receive hands-on training and walk away with samples and discounted tools to help solve your technical design
challenges and accelerate your time-to-market.
REGISTER em.avnet.com/axiom_ti-techdays-2013
Connecting the Internet of Things Using TI Wireless Technology SpeedWay™ Design Workshop
• October through December dates throughout N. America.
• These full day workshops are designed to help customers kick start the development of WiFi, BT/BTLE and 802.15.4 enabled Internet of
Things (IoT) applications.
• Using a system level approach, customers will receive an overview of TI’s wireless technologies, education on the applications spaces for
different protocols and enjoy an extensive hands-on demo experience into WiFi connectivity. In addition, available development tools,
technical documentation, product road maps, reference designs and third-party programs will be covered.
REGISTER em.avnet.com/axiom_ti-connecting-to-IoT
AND, DON’T MISS THE UPCOMING
• Training for the ZedBoard-based Motor Control Kit featuring Analog Devices
• Power Forum 2013
Check out these events and more at em.avnet.com/axiom_training
AVNET ELECTRONICS MARKETING 49

50. AXIOM
WHAT’S NEW
Texas Instruments CC2538
ZigBee®/IEEE 802.15.4 SoC
The CC2538 delivers the industry’s first ZigBee single-chip solution with integrated
ARM® Cortex®-M3 microcontroller (MCU) for smart energy infrastructure, home and
building automation, and intelligent lighting systems.
em.avnet.com/axiom_npitis
TE Connectivity Solderless LED Socket
This small, low profile, flexible LED holder provides a quick and easy solderless
connection to the Citizen Electronics Co. CLL array family. The low cost, straight
forward design provides reliable power connection, mechanical attachment and
proper thermal hold down force necessary for the LED array.
em.avnet.com/axiom_npityc
TAIYO YUDEN Multilayer Ceramic Capacitors (MLCCs)
TAIYO YUDEN has added a new high-reliability application series (AEC-Q200 qualified) to its existing
MLCC product line up. This series combines advanced materials and processing technologies to produce
a wide range of high-performance MLCCs for high-reliability market applications.
em.avnet.com/axiom_npityu
Silicon Labs Timing CMEMS® Oscillators
Silicon Labs offers a comprehensive portfolio of CMEMS oscillators, which are MEMS-based
replacements of crystal oscillators. These devices feature any frequency from 32 kHz to 100 MHz
(single, dual, quad, any-frequency) and are available in an industry-standard footprint of 2 x 2.5,
2.5 x 3.2 or 3.2 x 5mm.
em.avnet.com/axiom_npisll
Panasonic Passive Devices
Panasonic manufactures passive components such as capacitors, resistors and inductors in a broad
range of technologies that can be used in the most demanding applications. Panasonic’s industry
leading capacitor technologies offer a broad range of capacitors from aluminum electrolytic to new
hybrid products; resistors have a wide range of features and specifications including conventional thick
film chip resistors or specialized type; and electromechanical products detect user input and other menu
or function selections and generate an electrical output to notify the internal circuitry.
em.avnet.com/axiom_npipic
Murata Power Solutions MTE1 MVAC400 Converters
The MTE1 highly efficient series of isolated 1 W single output DC-DC converters is suitable for a broad
range of industrial and automation applications. The MVAC400 power converter models accommodate
the universal AC input voltage range from 90 to 264 VAC with active power factor correction (PFC) and
active inrush protection.
em.avnet.com/axiom_npicdt
50 AXIOM

51. NEW PRODUCT INTRODUCTIONS
Molex GbX I-Trac Backplane
Connector System
The MTE1 highly efficient series of isolated 1 W single output DC-DC converters
is suitable for a broad range of industrial and automation applications. The
MVAC400 power converter models accommodate the universal AC input voltage
range from 90 to 264 VAC with active power factor correction (PFC) and active
inrush protection.
em.avnet.com/axiom_npimlx
MicroZed™ Evaluation Kit
MicroZed is a low-cost development board based on the Xilinx Zynq®-7000 All
Programmable SoC. Its unique design allows it to be used as both a stand-alone
evaluation board for basic SoC experimentation, or combined with a carrier card
as an embeddable SOM. This kit includes the MicroZed board, micro USB cable,
4 GB μSD card, Xilinx Vivado® Design Edition license voucher (device locked to
7Z010) and a Getting Started Card.
em.avnet.com/axiom_npiavt
Microsemi IGLOO ®2 FPGAs
Microsemi’s IGLOO2 FPGAs, targeted at the cost-optimized FPGA market, integrate fourth generation
flash-based FPGA fabric and high performance communications interfaces on a single chip. The
IGLOO2 FPGAs offer a cost optimized FPGA with best-in-class feature integration coupled with the
lowest power, highest reliability and most advanced security in the industry.
em.avnet.com/axiom_npimsw
Microchip 16-bit PIC® MCUs
Microchip’s 16-bit PIC24 MCUs and dsPIC® Digital Signal Controllers provide designers with an easy
upgrade path from 8-bit PIC MCUs and a cost-effective option to 32-bit MCUs. The broad product line
includes everything from eXtreme Low Power microcontrollers to high performance digital signal controllers.
em.avnet.com/axiom_npimcc
ITT 38999 Composite and 5015 Firewall Interconnect Solutions
The D38999 series III composite KJB is a lightweight standard circular connector ideal for use in
military and aerospace environments. The 5015 Firewall spin lock variable angle back shell enables
straight, 45° and 90° cable terminations with the same part.
em.avnet.com/axiom_npiitt
Infineon Authentication Solutions
As the leader for hardware-based security with extensive knowledge of embedded control
requirements, Infineon enables customers to build security models based on best-in-class hardware
in customized solutions. Learn more about Infineon’s OPTIGA™ Trust family, authentication and brand
protection products and solutions.
em.avnet.com/axiom_npiinf
AVNET ELECTRONICS MARKETING 51

52. Your Express Connection to Power Products.
1.800.408.8353
Avnet Express:
Your one-stop
resource for
power solutions!
With Avnet Express, in addition to the largest electronics
catalog on the web, you’ll have access to these Power resources:
Dedicated Support Resources
Dedicated team of product and material specialists,
business development managers, field application engineers
(FAEs) and regional power specialists help customers select
and source power supplies.
Inventory
Massive online power SKU aggregation with access to the
widest and deepest inventory in the channel.
Design Chain Support
Regional Power Specialists, FAEs and Featured
Web Promotions highlight new Power products and
Technology Trends.
Technology Coverage
Whether a design requires an off-the-shelf or a custom
solution, Avnet has the technical expertise and value-add
services to meet any design requirement.
Specialized IPE Web Features
Avnet is a VAR partner of Emerson Network Power,
Power-One and TDK-Lambda Americas.
Supply Chain Support
Leveraging internal competencies of global warehousing,
logistics and asset management with objective, industrywide data, Avnet helps customers introduce and sustain
cost-effective, differentiated products.
To view our full catalog, visit AvnetExpress.com and click on
‘Power Supplies’ or ‘Power Management’ in the Products dropdown menu.

53. AXIOM
WHAT’S NEW
Digi International ConnectCard
Based on the Freescale i.MX28 processor family, the ConnectCard for i.MX28 is
an ideal embedded platform solution for connected applications in medical and
healthcare, energy, transportation and industrial/building automation. It offers
easy design integration and unique peripheral/interface flexibility in an extremely
compact and cost-effective form factor.
em.avnet.com/axiom_npidgi
Analog Devices Field Instrument Solutions
Designing field instruments that include additional processing and diagnostic
capability within the constraints of power budget and board space can be
challenging. Save time with Analog Devices’ field instrument reference circuits,
engineered and tested by Analog Devices’ technology and application experts.
em.avnet.com/axiom_npiana
Amphenol Connex Fixed Length RF Cable Assemblies
The Connex cable assemblies are available in standard lengths with common connector styles and
cable types. Fixed length RF cable assemblies are available with AMC, BNC, MMCX, MCX, N Type,
SMA, SMB and other commercially available RF connector series.
em.avnet.com/axiom_npiaao
AMD G-Series SoC
AMD is transforming the embedded computing experience with the combination of a CPU, integrated
GPU and IO controller onto a single chip. The benefits of using this small form factor SoC include lower
power design, high-performance parallel processing, stunning HD multimedia, error-correction code
(ECC) memory support and a scalable, flexible platform.
em.avnet.com/axiom_npiamd
Advantech Interactive Digital Signage
The Advantech Ubiquitous Touch Computer (UTC) 5 Series of all-in-one computers ensures the successful
delivery of dynamic content in any application, from retail point-of-sale to factory automation. With 15.6”,
21.5” and now 32” displays available, they provide scalable computing options including AMD® T40E,
Intel® Atom D2550, and Intel® Core™ i7 and their front panel complies with IP65 protection standard.
em.avnet.com/axiom_npiati
7-inch Zed Touch Display Kit
This kit includes everything you need to develop products with interactive GUIs and touchscreen
capabilities. The kit combines an 800 x 480 WVGA TFT-LCD display with an industrial projective
capacitive touch sensor, I2C-based touch controller, LED backlight supply and all the necessary cables.
em.avnet.com/axiom_npiavt2
AVNET ELECTRONICS MARKETING 53

54. AXIOM
A QUICK GLANCE
Links and page references to the big ideas and industry trends, products, solutions, trainings and more featured in this issue.
BIG IDEAS AND INDUSTRY TRENDS
ARM® Architecture Fuels Deep Ecosystem for
Next-Generation Embedded Systems Design. . . . . 6
em.avnet.com/axiom_embeddedprocessing
Consumerization of OEMs. . . . . . . . . . . . . . . . . 46
www.zdnet.com/the-executives-guide-tobyod-and-the-consumerization-of-it-freeebook-7000010871/
MANUFACTURER PRODUCTS
SOLUTIONS, CONTINUED
NIC Components Fuses, Varistors and
Power Passives. . . . . . . . . . . . . . . . . . . . . . . . . . 38
em.avnet.com/axiom_nicprotection
ON Semiconductor Automotive Grade
Non-Synchronous Boost Controller. . . . . . . . . . . 34
em.avnet.com/axiom_onsboostcontroller
TRAINING EVENTS,
CONTINUED
Embedded Vision Summit. . . . . . . . . . . . . . . . . . 48
embedded-vision.com/summit/oct2013/overview
ES LIVE 2013. . . . . . . . . . . . . . . . . . . . . . . . . . . 48
em.avnet.com/axiom_eslive
Smarter Vision Design Workshop. . . . . . . . . . . . 48
em.avnet.com/axiom_smartervisionworkshop
Texas Instruments Technology Days 2013 . . . . . . 49
When Should You Plan for a Power in an
FPGA System?. . . . . . . . . . . . . . . . . . . . . . . . . . 19
OSRAM Opto Semiconductors OSLON SSL
Square LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
MANUFACTURER PRODUCTS
SOLUTIONS
OSRAM Opto Semiconductors SFH 7770 E6
Digital Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Analog Devices Software Defined Radio Kit . . . . 23
Power One MCB300 and ABC150 Converters. . . 28
7-inch Zed Touch Display Kit. . . . . . . . . . . . . . . . 53
Analog Devices Innovative New Products. . . . . . 24
Renesas RX100 32-bit MCUs . . . . . . . . . . . . . . . 15
Advantech Interactive Digital Signage. . . . . . . . . 53
Analog Devices ADP5052 Fully Integrated
Quad Buck + LDO. . . . . . . . . . . . . . . . . . . . . . . 25
Renesas Power Management ICs . . . . . . . . . . . . 27
AMD Embedded G-Series SOC. . . . . . . . . . . . . 53
Silicon Labs C8051F85x/6x
Microcontroller Family. . . . . . . . . . . . . . . . . . . . 14
Amphenol Connex Fixed Length
RF Cable Assemblies. . . . . . . . . . . . . . . . . . . . . 53
STMicroelectronics IGBTs LDO
Linear Regulators. . . . . . . . . . . . . . . . . . . . . . . . 35
Analog Devices Field Instrument Solutions. . . . . . 53
em.avnet.com/axiom_powerdesignzone
analog.com/milcomm
em.avnet.com/axiom_ananewproducts
em.avnet.com/axiom_anaadp5052
Analog Devices isoPower® Integrated Isolated
DC/DC Converters. . . . . . . . . . . . . . . . . . . . . . 26
em.avnet.com/axiom_anaisopower
Atmel SAM D20 ARM Cortex -M0+
Microcontrollers. . . . . . . . . . . . . . . . . . . . . . . . . 10
®
®
®
em.avnet.com/axiom_atlsamd20
Avnet Mini-Module Plus System on Modules . . . . 22
em.avnet.com/axiom_avtkintex7kit
em.avnet.com/axiom_oososlon
em.avnet.com/axiom_oosdigitalsensors
em.avnet.com/axiom_ponconverters
em.avnet.com/axiom_renrx100
em.avnet.com/axiom_renpower
em.avnet.com/axiom_sllmcu
em.avnet.com/axiom_stmpowermesh
TDK-Lambda HFE RFE Power Supplies. . . . . . . 29
em.avnet.com/axiom_lmdpowersupplies
AVX Advanced Power Solutions. . . . . . . . . . . . . 45
TE Connectivity Power
Triple Lock Connectors. . . . . . . . . . . . . . . . . 41, 56
Bourns Dual Channel Transient
Current Suppressors. . . . . . . . . . . . . . . . . . . . . . 39
TE Connectivity Economy Power II
2.5 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . 41
Carling Technologies L MS Series
Circuit Breakers. . . . . . . . . . . . . . . . . . . . . . . . . 40
TE Connectivity MULTI-BEAM XLE Connectors. . . 42
em.avnet.com/axiom_avxpower
em.avnet.com/axiom_bnstcs
em.avnet.com/axiom_clgcircuitbreaker
Fairchild Semiconductor Integrated Dual-Coil
Relay Drivers. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
em.avnet.com/axiom_fscrelaydrivers
Freescale i.MX 6 ARM® Cortex® Processors. . . . . 11
em.avnet.com/axiom_frsiMX6
Freescale Kinetis KL02 ARM® Cortex®
Microcontrollers. . . . . . . . . . . . . . . . . . . . . . . . . 12
em.avnet.com/axiom_frskinetis
Freescale Xtrinsic Sensors. . . . . . . . . . . . . . . . . . 31
em.avnet.com/axiom_frssensors
Maxim Integrated Power Architecture featured
on ZedBoard™. . . . . . . . . . . . . . . . . . . . . . . . . . 18
em.avnet.com/axiom_maximzedboard
Microchip Digitally Enhanced Power Analog. . . . 55
microchip.com/depa
Microsemi SmartFusion®2 SoC FPGAs . . . . . . . . 16
em.avnet.com/axiom_mswsmartfusion2
Microsemi Leading-Edge Semiconductor
System Solutions . . . . . . . . . . . . . . . . . . . . . . . . 57
www.microsemi.com
MicroZed™ Development Board . . . . . . . . . . . . . . 2
microzed.org
Molex Mini-Fit Modular Jacks. . . . . . . . . . . . . . 44
®
em.avnet.com/axiom_mlxpdjack
54 AXIOM
em.avnet.com/axiom_tyctriplelockconnectors
em.avnet.com/axiom_tycepconnectors
em.avnet.com/axiom_tycmultibeam
TE Connectivity IMPACT Connectors. . . . . . . . . . 42
em.avnet.com/axiom_tycimpact
TE Connectivity Motorman Connectors. . . . . . . . 43
em.avnet.com/axiom_tycmotorman
TE Connectivity Power PCB RTX Relays . . . . . . . . 43
em.avnet.com/axiom_tycrtx
Texas Instruments Tiva™ C Series
Microcontrollers. . . . . . . . . . . . . . . . . . . . . . . . 13
em.avnet.com/axiom_tislaunchpad
Texas Instruments Analog Products for
Xilinx FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
em.avnet.com/axiom_tixilinxattach
Toshiba SuperJunction MOSFETs. . . . . . . . . . . . . 36
mosfet.toshiba.com
Vishay MOSFETs and MOSFET Drivers. . . . . . . . 37
em.avnet.com/axiom_vismosfets
Xilinx Zynq -7000 All Programmable SoC
Mini-Module Plus System. . . . . . . . . . . . . . . . . . 21
®
®
em.avnet.com/axiom_mmp-7z045-g
TRAINING EVENTS
Analog Devices Design Conference 2013. . . . . . 48
em.avnet.com/axiom_anadesigncon2013
Designing with Freescale . . . . . . . . . . . . . . . . . . 49
em.avnet.com/axiom_designing-with-freescale
em.avnet.com/axiom_ti-techdays-2013
Connecting the Internet of Things using TI Wireless
Technology SpeedWay™ Design Workshop. . . . . 49
em.avnet.com/axiom_ti-connecting-to-IoT
WHAT’S NEW
em.avnet.com/axiom_npiavt2
em.avnet.com/axiom_npiati
em.avnet.com/axiom_npiamd
em.avnet.com/axiom_npiaao
em.avnet.com/axiom_npiana
Digi International ConnectCard . . . . . . . . . . . . . 53
em.avnet.com/axiom_npidgi
Infineon Authentication Solutions . . . . . . . . . . . . 51
em.avnet.com/axiom_npiinf
ITT 38999 Composite and 5015 Firewall
Interconnect Solutions . . . . . . . . . . . . . . . . . . . . 51
em.avnet.com/axiom_npiitt
Microchip 16-bit PIC® Microcontrollers . . . . . . . . 51
em.avnet.com/axiom_npimcc
Microsemi IGLOO®2 FPGAs. . . . . . . . . . . . . . . . 51
em.avnet.com/axiom_npimsw
MicroZed™ Evaluation Kit. . . . . . . . . . . . . . . . . . 51
em.avnet.com/axiom_npiavt
Molex GbX I-Trac Backplane Connector System. . 51
em.avnet.com/axiom_npimlx
Murata Power Solutions MTE1
MVAC400 Converters. . . . . . . . . . . . . . . . . . . . 50
em.avnet.com/axiom_npicdt
Panasonic Passive Devices . . . . . . . . . . . . . . . . . 50
em.avnet.com/axiom_npipic
Silicon Labs CMEMS® Oscillators. . . . . . . . . . . . 50
em.avnet.com/axiom_npisll
TAIYO YUDEN Multilayer Ceramic Capacitors. . 50
em.avnet.com/axiom_npityu
TE Connectivity Solderless LED Socket. . . . . . . . . 50
em.avnet.com/axiom_npityc
Texas Instruments CC2538 ZigBee®/
IEEE 802.15.4 SoC. . . . . . . . . . . . . . . . . . . . . . . 50
em.avnet.com/axiom_npitis
RESOURCES
Avnet Express Power Solutions. . . . . . . . . . . . . . 52
AvnetExpress.com

55. The world’s first digitally enhanced power analog controller
New analog-based power management controller with
integrated microcontroller
Combine the flexibility and I2C communication of digital DC/DC power
conversion, with the speed, performance and resolution of analog-based
control, by using Microchip’s new MCP19111 power management controller.
The MCP19111 is a new hybrid, mixed-signal controller which combines analog
and digital power management into a single chip. By integrating an analog-based
PWM controller, a Flash-based 8-bit PIC® microcontroller, and MOSFET drivers for
synchronous, step-down applications, the MCP19111 enables configurable, highefficiency power conversion.
With transient performance of analog power conversion, the MCP19111 eliminates
the need for a high-MIPS microcontroller or a high-speed A/D converter,
minimizing solution cost and power consumption.
GET STARTED IN
3 EASY STEPS:
1. Evaluate the MCP19111 using the
low-cost ADM00397 board
2. Combine with SMPS-optimized
MCP87xxx MOSFETs
3. Customize DC/DC conversion to
match your application
To support even higher efficiency, the MCP19111 can be used to drive Microchip’s
latest MCP87xxx high-speed, SMPS-optimized MOSFETs. These logic-level 25V
MOSFETs offer a low Figure of Merit (FOM) with on-state resistance from 1.8 mΩ to
13 mΩ to deliver higher DC/DC power conversion efficiency.
For more information, go to: www.microchip.com/depa
The Microchip name and logo, and MPLAB are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.
©2013 Microchip Technology Inc. All rights reserved. DS25169A. ME1058Eng02.13D

57. Leading-edge Embedded
System Solutions