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Branson/IPC 3000 Software Key Features
Branson/IPC 3000 Specifications*
 Wafer Size: Sample to 200mm Capability. Multiple wafer size without
hardware change
 Throughput: High Throughput. Up to 75 WPH. Process Dependent .
 Temperature: No heating function. N2 plasma can heat the substrate up
to 170 C.
 Gas Lines: Up to 5 gas lines with MFCs. Popular MFC Range: 2 SLM O2
and 1 SLM N2 .
 Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR
 Uniformity: 25%. Clear all photoresist without uniformity requirement
 Particulate: <0.05 /cm2 (0.03um or greater)
 Damage: Low damage with Faraday Cage if necessary.
 Selectivity: >1000:1
 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95%
uptime

Company Introduction and Main Products
ALLLWIN21 CORP.
Introduction
Equipment Key Features
Allwin21 Corp. is the exclusive licensed manufacturer of AG
Associates Heatpulse 610 Rapid Thermal Process tool. We are
manufacturing the new AccuThermo AW Series Atmospheric and Vacuum
Rapid Thermal Processors. Compared with traditional RTP systems,
Allwin21’s AccuThermo AW RTPs have innovative software and more
advanced real time temperature control technologies to achieve the BEST
rapid thermal processing performance (repeatability, uniformity, and stability)
with decades of research directly applicable to ours.
We focus on extending product lifecycle, providing solutions, and engineering
enhancements to many production proven semiconductor process equipment
most directly related to III-V processing. These semiconductor equipment
ha e een used in production and D since the 0 s hey ha e pro en
processes and research. Allwin21 Corp. can customize these systems with
All in2 s compara le inte rated process control system ith PC, solid
robotic wafer transfer system, and new critical components. This is to
achieve the goal of giving our customers a production edge, with right cost,
and without having to worry about obsolete parts.
Allwin21 Corp. was formed in 2000 with a focus on professionally providing
Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE,
Sputter Deposition and Metal Film Metrology high-tech semiconductor
equipment, services and technical support in Semiconductor III-V, MEMS,
Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor
to be a leader in our product lines. To achieve this, we have been providing
unique innovative and cost-effective technical solutions, high quality
equipment, and on time spare parts delivery worldwide. We have
maintained a global presence that has grown and expanded into the major
high-tech manufacturing areas of the world. We pride ourselves on
developing and continuing lasting customer relationships.
We understand that a timely responsive support and service are critical
elements in semiconductor industries. Allwin21’s experienced engineer team
is the best guarantee for high quality service and support. We provide
on-site installation, training, maintenance, system optimization, retrofits,
and/or customized upgrades
Allwin21 Overview
What sets us apart from the competition…
1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
2) Advanced Allwin21 Real Time PC Control Technology.
3) Focus on Production-Proven process technology.
4) Integrated 3-axis solid robotic wafer transfer technology.
5) Experienced local engineer support.
6) Products made in U.S.A
Plasma Asher, Plasma Descum, Dry Clean,
Semiconductor Equipment, Used
Semiconductor Equipment, Semiconductor
Process Equipment, atri 0 , atri 20 ,
atri 303, atri 403, atri 0 , atri
04, atri 02, atri 0 , atri 0
Plasma Asher, Plasma Descum, Dry Clean,
Semiconductor Equipment, Used
Semiconductor Equipment, Semiconductor
Process Equipment, Branson/IPC 2000,
Branson/IPC 3000, Branson/IPC 4000,
Barrel Asher, Barrel Etch, Barrel Etcher
Plasma Asher, Plasma Descum, Dry Clean,
Semiconductor Equipment, Used
Semiconductor Equipment, Semiconductor
Process Equipment, asonics Aura 000,
asonics Aura 2000, asonics Aura 3000,
asonics 3 0, asonics Aura 30 0
Plasma Etcher, Please Etchin , Dry
Etchin , Dry Clean, Semiconductor
Equipment, Used Semiconductor
Equipment, Semiconductor Process
Equipment, e al 0 e, e al 03e, e al
0 e , e al
Plasma Etcher, Please Etchin , Dry
Etchin , Dry Clean, Semiconductor
Equipment, Used Semiconductor
Equipment, Semiconductor Process
Equipment, asonics AE 200 , icro a e
Etcher, icro a e Plasma Etcher,
icro a e Etch
apid hermal Process, apid hermal
Processin , apid hermal Anneal, apid
hermal Annealin , apid hermal
idation, apid hermal itride, A,
P, , ,, Semiconductor
Equipment, Used Semiconductor
Equipment, Semiconductor Process
Equipment, A 2 0, A 3 0, A 4 0,
A 0, A 0I, A Associates,
eatpulse 2 0, eatpulse 4 0, inipulse
3 0, eatpulse 0, eatpulse 0I, A
eatpulse 4 0, A eatpulse 0, A
eatpulse 2 0, A inipulse 3 0,
eatpulse 4 00, eatpulse 4 0 ,
eatpulse 0 , eatpulse 00,
Atmospheric apid hermal Process,
acuum apid hermal Process, urnace,
en, hermal urnace, hermal Process,
hermal Processin
1) Rapid Thermal Process
• AccuThermo AW 610M
• AccuThermo AW 820M
• AccuThermo AW 820V
• AccuThermo AW820R
2) Sputter Deposition
• AccuSputter AW 4450
3) Plasma Asher Descum
• AW-105R
• AW-1008
• AW-B3000
4) Plasma Etch/RIE
• AW-901eR
• AW-903eR
• AW-2001R
5) Upgraded Kit for:
• Heatpulse 210,310,410,610
• Matrix X0X
• Tegal 90Xe
• Gasonics Aura 1000/2000LL/3000/3010
• Gasonics AE 2001/2000LL
• Gasonics L3510/L3500
• Perkin-Elmer 24XX,4XXX Sputter
• MRC 6XX, 9XX Sputer
• TES 6XX,9XX Sputter
• Branson/IPC 3000/2000/4000
• Lam AutoEtch 490/590/69
• Lam Rainbow 4XXX Series
6) Sheet Resistance Measurement
• AWgage-150
• AWgage-200
Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com
All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.
Sputter Deposition
ALLLWIN21 CORP.
AccuSputter AW 4450
Introduction
Allwin21 Corp. has been focusing on providing solutions and enhancements to Perkin-Elmer 4400, Perkin-
Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480 used sputter deposition semiconductor process
equipment. These OEM semiconductor equipment have been used in productions and R&D since 1990′s.
They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with
Allwin21′s comparable integrated process control system with PC and new critical components. We rebuild
AccuSputter AW 4450 Series Sputter Deposition systems with our own integrated process control system,
giving our customers the tools to achieve a production edge at very low cost impact.
AccuSputter AW 4450 Key Features
Production-proven sputter technology
Optimum AW-4450 System Control
DC 24V for Motors, Actuator, Relay, Solenoid
Efficient 8" Delta cathodes, 2 to 6" option
Full Pallet rotation control with “indexing”
High Uniformity and Yield
DC, RF Sputter, Pulse DC option
Magnetron and Diode Sputter option
RF Etch and Bias are optional
Ultra Clean vacuum system
Load lock operation
UHV design
Flexible for development or production use
Full range of substrate sizes and shapes
Various pumping and power options
Co-sputtering option
Reactive Sputtering option
AccuSputter 4450 Sputter Materials
Introduction
Al+W Cr/SiO2 SiC Ti+Au
InSnO SiO2 Ti/W Ti+Au+Ni
Al2O3 Mo SiO2+O2 Ni/Fe+Cu+SiO2
Ag MoSi2 Si+N2(Si3N4) Ti/W+Au
Au Mo2Si5 Si+N2+B4C Ti/W+Au+Ta
C Mo5Si3 Ta Ti/W+Al/Si
Cr Ni TaC Ti/W+Ni/Cr+Au
Cr/Co Ni/Cr Ta+Au Ti/W+Pt
Cr/Au Ni+Ni/Cr TaSi2 Al+Ti/W+Ag
Cr+Cu Ni/Fe Ta+SiO2 W+Al2O3
Cr/Si Pt Zr Zn
Cr/SiO TiO2 TiO2+Cr ZnO2
Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com
All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037
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RFQ for Fast Free Quotation
Sputter Deposition
ALLLWIN21 CORP.
AccuSputter AW 4450 Software Key Features
o Maintenance, Manual, Semi Automatic and Fully Automatic modes.
o Automated calibration of all subsystems.
o Troubleshooting to subassembly levels.
o Programmed comprehensive calibration and diagnostic functions.
o Recipe creation for full automatic wafer processing.
o Automatic decline of improper recipes and process data inputs.
o Multi-level password protection.
o Storage of multiple recipes and system functions.
o Real-Time process graphics, data acquisition display, and analysis.
o Process Data and Recipe storage automatically to hard drive.
o Easy TC vacuum gauge calibration.
o Positioning Deposition (optional)
o GEM/SECS II (optional)
Main Frame
28" dia. SST chamber top plate with ports and Cathodes
Configuration I II
Cathode Shape Circle Delta
Cathode Size 8 inch Delta
Cathode Quantity 1 to 4 1 to 3
Sputter Power Supply
Configuration I II III
DC Power 5 KW 10 KW
RF Power 1KW 2 KW 3 KW
Pulse DC Power 5 KW 10 KW
Process Chamber
• 8" diameter X 12" high stainless steel cylinder with 6"
• CF flange viewport and load lock port
• 28" diameter stainless steel base plate
• 11/2" air-operated roughing isolation valve
• Air-operated gas inlet valve
• Air-operated vent valve
• 11/2"blanked-off leak check port
• Removable deposition shields
• 23" diameter, 3-position water-cooled annular substrate
table with variable-speed motorized table drive
• Full circle shutter and vane shutter
• Chain drive pallet carrier transport
• Heavy duty electric hoist
Load lock
• 30" x 28" x 8" stainless steel load lock chamber with
aluminum cover
• Chain drive pallet carrier transport
• 2" air-operated roughing isolation valve
• Air-operated vent valve
• 23" diameter molybdenum annular substrate pallet
• Elevator for pallet up and down function.
Vacuum Systems for process Chamber
• 2 stage Cryo pump with 1000 l/s pumping speed for air,
including chevron, water-cooled compressor and lines,
automatic regeneration controller and plumbing kit. 71/2"
O.D. (6" ASA) aluminum air-operated gate valve
Air-operated venetian blind throttling valve.
• 36.7 cfm mechanical pump or dry pump for process chamber and
load lock (Optional)
1 gas line with MFC
① Ar, 200 SCCM; ② Customized
New Controller: Allwin21 Corp.'s AW-4450 System PC Control
New Power Distribution Box: AC380V /208V/ 3Phase
AccuSputter AW 4450 Basic Configuration
 GEM/SECS II function (Software)
 More gas lines with MFC
① N2; ② O2; ③ Customized
 Lamp tower alarm with buzzer.
 Mechanical pump or dry pump for process chamber and load lock.
 Independent mechanical pump or dry pump for process chamber.
 Chiller for Cooling plates and table.
 Turbo pump for load lock.
 Load lock Lamp Heating function, Up to 200°C
 Chamber Lamp Heating function, Up to 300°C (Use one cathode port
in SST chamber top plate).
 Plasma etch function (before sputter)
 Bias function
 Co-sputter function
 Reactive sputter function
 Transformer for AC 380V to 208V for DC Power Supply (if necessary).
Options
Production-Proven Chamber/Load lock/Vacuum
Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer
4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF
Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC
902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor
Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition,
PVD, Physical Vapor Deposition
Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com
All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037
Sputter Deposition System
Lowest Cost Upgrade Solution
No More Obsolete Controller Parts
Increase Uptime
Decrease Maintenance
Main Characteristics
Upgrade Your Perkin-Elmer 2400,44XX Series Sputter Deposition Systems
Perkin-Elmer 44XX Series Sputter Systems : ►PE 2400 ►PE 4400 ► PE 4410 ► PE 4415 ►PE 4430 ►PE 4450 ►PE 4480
The AW-4450 Sputter System Upgrade Kit includes an advanced control system with touch screen operator
interface and Allwin21 computer software. The kit is easy to incorporate (plug-and-play) into the original PE
sputter system. No need to move the to be upgraded system from its present location. All utility connections
stay in place. The new control system will enhance the entire system operation. It makes the upgraded
sputter system much more reliable, since many of the old controllers are eliminated.
Customized survey and upgrading plan
Same input/output connectors
Same definition of each connector
Plug-and-Play
Auto Pump Down Controller
Load Lock Controller
Digital Clock Timer
Maintenance, Manual, Semi Automatic and Full Automatic operation modes
Automated calibration of all subsystems
Trouble shooting to sub-assembly levels
Programmed comprehensive calibration and diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi level password protections
Storage of multiple recipes and system functions
Real-Time process data acquisition,display ,analysis
Real-Time graphics user display (GUI)
Process Data and Recipe storage on a hard drive
Easy TC vacuum gauge calibration
Positioning Deposition(optional)
GEM/SEC II functions (optional)
Table Raise / Lower Control
Throttle Valve Control System
Pressure Control System
Sputter Head Controls (optional)
Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com
All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037
.
AW-4450 System Control
Fast On-site Upgrading Replaced Obsolete Controls If Necessary
RFQ for Fast Free Quotation
Sputter Deposition System
Comparing Item AccuSputter AW 4450 AW Refurbished&Upgraded PE 44XX AW Upgraded PE 44XX Original PE 44XX
Controller Allwin21 Corp.'s AW-4450 System Control Obsolete Control Parts
Monitor Touch Screen Discrete
User Interface GUI (Graphical User Interface) Discrete
Data Storage Store in computer hard disk None
Recipe Edit Easy to edit with GUI page None
Gas Calibration Easy to do gas calibration with Software None
A/D Precision 14-16 bits None
Diagnostic Function More functions and I/O hardware "exposed" for easy maintenance and trouble shooting Limited
Positioning Sputter Yes No
Power Distribution Box New, AC380V/208V/3Phase/5Lines Used
Shutter Sensors New, Optoelectronic Sensors Used, Microswitches, mechannical
Table Raiser/Lower/ Microswitch New Used
Hoist Microswitch New Used
Gauge Controller AW-531 Gauge Controller , 3x Ion Gauge and 6x TC Gauge
Capability , GUI/Touch Screen
PE Ion Gauge Controller (DGC, WRG), 1x Ion Gauge
and 2x TC Gauge/each
Valves New Used
Gas Line New Used
Motors,Actuator,Relay,Solenoid New, DC 24V Used, AC 115V
RF Generator and RF Match New, can be installed inside the chassis Used
DC Power Supply New, can be installed
inside the chassis
Used,Fully tested, , can be installed
inside the chassis
Used, individual chassis
Reed Switch New Used,Fully tested Used
Light Tower New Optional None
Loadlock and Chamber New Fully refurbished, new if necessary Used
Other Parts New Fully refurbished, new if necessary Used
Overall Space Main Console Only Main Console, DC/RF Power, Computer (Optional)
Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com
All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037
.
Comparison between New AW 4450 AccuSputter and AW Refurbished / AW Upgraded / Original PE 44XX Series systems

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  • 1. Branson/IPC 3000 Software Key Features Branson/IPC 3000 Specifications*  Wafer Size: Sample to 200mm Capability. Multiple wafer size without hardware change  Throughput: High Throughput. Up to 75 WPH. Process Dependent .  Temperature: No heating function. N2 plasma can heat the substrate up to 170 C.  Gas Lines: Up to 5 gas lines with MFCs. Popular MFC Range: 2 SLM O2 and 1 SLM N2 .  Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR  Uniformity: 25%. Clear all photoresist without uniformity requirement  Particulate: <0.05 /cm2 (0.03um or greater)  Damage: Low damage with Faraday Cage if necessary.  Selectivity: >1000:1  MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime  Company Introduction and Main Products ALLLWIN21 CORP. Introduction Equipment Key Features Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Atmospheric and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours. We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment ha e een used in production and D since the 0 s hey ha e pro en processes and research. Allwin21 Corp. can customize these systems with All in2 s compara le inte rated process control system ith PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts. Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships. We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades Allwin21 Overview What sets us apart from the competition… 1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates. 2) Advanced Allwin21 Real Time PC Control Technology. 3) Focus on Production-Proven process technology. 4) Integrated 3-axis solid robotic wafer transfer technology. 5) Experienced local engineer support. 6) Products made in U.S.A Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, atri 0 , atri 20 , atri 303, atri 403, atri 0 , atri 04, atri 02, atri 0 , atri 0 Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics Aura 000, asonics Aura 2000, asonics Aura 3000, asonics 3 0, asonics Aura 30 0 Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, e al 0 e, e al 03e, e al 0 e , e al Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics AE 200 , icro a e Etcher, icro a e Plasma Etcher, icro a e Etch apid hermal Process, apid hermal Processin , apid hermal Anneal, apid hermal Annealin , apid hermal idation, apid hermal itride, A, P, , ,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, A 2 0, A 3 0, A 4 0, A 0, A 0I, A Associates, eatpulse 2 0, eatpulse 4 0, inipulse 3 0, eatpulse 0, eatpulse 0I, A eatpulse 4 0, A eatpulse 0, A eatpulse 2 0, A inipulse 3 0, eatpulse 4 00, eatpulse 4 0 , eatpulse 0 , eatpulse 00, Atmospheric apid hermal Process, acuum apid hermal Process, urnace, en, hermal urnace, hermal Process, hermal Processin 1) Rapid Thermal Process • AccuThermo AW 610M • AccuThermo AW 820M • AccuThermo AW 820V • AccuThermo AW820R 2) Sputter Deposition • AccuSputter AW 4450 3) Plasma Asher Descum • AW-105R • AW-1008 • AW-B3000 4) Plasma Etch/RIE • AW-901eR • AW-903eR • AW-2001R 5) Upgraded Kit for: • Heatpulse 210,310,410,610 • Matrix X0X • Tegal 90Xe • Gasonics Aura 1000/2000LL/3000/3010 • Gasonics AE 2001/2000LL • Gasonics L3510/L3500 • Perkin-Elmer 24XX,4XXX Sputter • MRC 6XX, 9XX Sputer • TES 6XX,9XX Sputter • Branson/IPC 3000/2000/4000 • Lam AutoEtch 490/590/69 • Lam Rainbow 4XXX Series 6) Sheet Resistance Measurement • AWgage-150 • AWgage-200 Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.
  • 2. Sputter Deposition ALLLWIN21 CORP. AccuSputter AW 4450 Introduction Allwin21 Corp. has been focusing on providing solutions and enhancements to Perkin-Elmer 4400, Perkin- Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480 used sputter deposition semiconductor process equipment. These OEM semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC and new critical components. We rebuild AccuSputter AW 4450 Series Sputter Deposition systems with our own integrated process control system, giving our customers the tools to achieve a production edge at very low cost impact. AccuSputter AW 4450 Key Features Production-proven sputter technology Optimum AW-4450 System Control DC 24V for Motors, Actuator, Relay, Solenoid Efficient 8" Delta cathodes, 2 to 6" option Full Pallet rotation control with “indexing” High Uniformity and Yield DC, RF Sputter, Pulse DC option Magnetron and Diode Sputter option RF Etch and Bias are optional Ultra Clean vacuum system Load lock operation UHV design Flexible for development or production use Full range of substrate sizes and shapes Various pumping and power options Co-sputtering option Reactive Sputtering option AccuSputter 4450 Sputter Materials Introduction Al+W Cr/SiO2 SiC Ti+Au InSnO SiO2 Ti/W Ti+Au+Ni Al2O3 Mo SiO2+O2 Ni/Fe+Cu+SiO2 Ag MoSi2 Si+N2(Si3N4) Ti/W+Au Au Mo2Si5 Si+N2+B4C Ti/W+Au+Ta C Mo5Si3 Ta Ti/W+Al/Si Cr Ni TaC Ti/W+Ni/Cr+Au Cr/Co Ni/Cr Ta+Au Ti/W+Pt Cr/Au Ni+Ni/Cr TaSi2 Al+Ti/W+Ag Cr+Cu Ni/Fe Ta+SiO2 W+Al2O3 Cr/Si Pt Zr Zn Cr/SiO TiO2 TiO2+Cr ZnO2 Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037 P e r k i n - E l m e r 4 4 0 0 , P e r k i n - E l m e r 4 4 1 0 , P e r k i n - E l m e r 4 4 5 0 , P e r k i n - E l m e r 4 4 8 0 , P e r k i n - E l m e r 2 4 0 0 , P e r k i n E l m e r 4 4 0 0 , P e r k i n E l m e r 4 4 1 0 , P e r k i n E l m e r 4 4 5 0 , P e r k i n E l m e r 4 4 8 0 , P e r k i n E l m e r 2 4 0 0 , S p u t t e r , M a g n e t r o n S p u t t e r , D i o d e S p u t t e r , D C S p u t t e r , R F S p u t t e r , D C M a g n e t r o n S p u t t e r , R F M a g n e t r o n S p u t t e r , C o - s p u t t e r , R e a c t i v e S p u t t e r , M R C , M R C 6 0 3 , M R C 9 0 3 , M R C 6 0 2 , M R C 9 0 2 , M R C 6 0 4 , M R C 9 0 4 , M R C 9 2 4 , P l a s m a E t c h , D r y C l e a n , B i a s F u n c t i o n , C a t h o d e , L o a d l o c k , D e g a s , S e m i c o n d u c t o r E q u i p m e n t , U s e d S e m i c o n d u c t o r E q u i p m e n t , S e m i c o n d u c t o r P r o c e s s E q u i p m e n t , , T h i n F i l m , M e t a l T h i n F i l m , T h i n F i l m D e p o s i t i o n , P V D , P h y s i c a l V a p o r D e p o s i t i o n , P V D C o a t i n g E q u i p m e n t , A p p l i e d M a t e r i a l s U L V A C O p t o r u n B u h l e r L e y b o l d O p t i c s S h i n c r o n V o n A r d e n n e E v a t e c V e e c o I n s t r u m e n t s H a n i l V a c u u m B O B S T S a t i s l o h I H I H a u z e r T e c h n o H o n g d a V a c u u m P l a t i t L u n g P i n e V a c u u m B e i j i n g P o w e r T e c h S K Y T e c h n o l o g y I m p a c t C o a t i n g s H C V A C D e n t o n V a c u u m Z H E N H U A M u s t a n g V a c u u m S y s t e m s K Y Z K , I H I H A U Z E R T E C H N O C O A T I N G B . V . , K o r v u s T e c h n o l o g y L t d , I n t l v a c T h i n F i l m , A j a i n t e r n a t i o n a l s p u t t e r i n g s y s t e m , K D F E l e c t r o n i c & V a c u u m S e r v i c e s I n c , N E X D E P P H Y S I C A L V A P O R D E P O S I T I O N , M a g n e t r o n S p u t t e r i n g , E - B e a m E v a p o r a t i o n , T h e r m a l E v a p o r a t i o n , I o n B e a m P r o c e s s i n g , A n g s t r o m E n g i n e e r i n g I n c , A M O D P H Y S I C A L V A P O R D E P O S I T I O N , E V O V A C P H Y S I C A L V A P O R D E P O S I T I O N , P l a s m a & I o n B e a m P r o c e s s i n g , N E B U L A C L U S T E R I N T E G R A T E D V A C U U M S Y S T E M , B O X C O A T E R P V D , L I N E A R S P U T T E R P V D , A J A S p u t t e r i n g A l t e r n a t i v e , T h i n - F i l m P h y s i c a l V a p o r D e p o s i t i o n E q u i p m e n t , P r o c e s s M a t e r i a l s , S p u t t e r i n g T a r g e t s , B a c k i n g P l a t e s , B o n d i n g , P V D a n d S p u t t e r i n g , K D F I n - L i n e S o l u t i o n s , K D F S p u t t e r i n g T e c h n o l o g y , S p u t t e r i n g P r o d u c t s , 6 0 0 i S e r i e s S p u t t e r i n g S y s t e m , 7 4 4 i S p u t t e r i n g S y s t e m , 8 4 4 i S p u t t e r i n g S y s t e m , 9 0 0 i S e r i e s S p u t t e r i n g S y s t e m , 9 7 4 i S e r i e s S p u t t e r i n g S y s t e m , O p u s R o b o t i c C 2 C L o a d i n g S y s t e m , P r e - O w n e d P r o d u c t s , C i C l u s t e r T o o l , O r i o n S e r i e s , A J A ’ s S t i l e t t o - O ( H V ) , A 3 0 0 - X P - O ( U H V ) , O R I O N 8 - Ⅱ C L U S T E R F L A N G E , O R I O N 8 - Ⅲ C L U S T E R F L A N G E , O R I O N 8 - Ⅱ T C L U S T E R F L A N G E , C U S T O M O R I O N C L U S T E R F L A N G E , A T C F l a g s h i p S e r i e s S p u t t e r i n g S y s t e m s , B a t c h S e r i e s S p u t t e r i n g S y s t e m s , A T C - B S e r i e s B a t c h C o a t i n g S y s t e m s , A T C - E ( E - B e a m E v a p o r a t i o n ) , A T C - T ( T h e r m a l E v a p o r a t i o n ) S y s t e m s , A T C - E U H V S e r i e s , A T C - 2 0 3 6 H V S e r i e s , A T C - T S e r i e s , O r i o n I o n M i l l i n g S y s t e m s I M S , 2 0 3 6 I o n M i l l i n g S y s t e m s I M S , H y b r i d C o a t i n g S y s t e m s , A T C - 2 2 0 0 - H Y U H V H y b r i d D e p o s i t i o n S y s t e m , A T C 1 8 0 0 - H Y , A T C - 2 0 3 6 , A T C 2 2 0 0 - H Y , M u l t i - C h a m b e r C o a t i n g S y s t e m s , A T C - M C M u l t i - C h a m b e r M a g n e t r o n S p u t t e r i n g S y s t e m , D u a l O R I O N U H V w i t h C o m m o n L o a d - L o c k , A T C - M C - H Y M u l t i - C h a m b e r H y b r i d D e p o s i t i o n T o o l , U H V T r a n s f e r T u b e , G l o v e b o x I n t e r f a c e , D u a l A T C / O r i o n S e r i e s U H V S p u t t e r i n g S y s t e m , A T C U H V D u a l S p u t t e r i n g & E l e c t r o n B e a m E v a p o r a t i o n C h a m b e r , S u b s t r a t e H o l d e r s , S p u t t e r i n g S o u r c e s , P o w e r S u p p l i e s , M a t e r i a l s , S u b s t r a t e H o l d e r s c o o l i n g , T i l t i n g , H e a t i n g , O x i d e s , B o r i d e s , N i t r i d e s , S e l e n i d e s , F l u o r i d e s , S i l i c i d e s , S u l f i d e s , C a r b i d e s , A l l o y s , P u r e M e t a l s , N o n - M e t a l s , H i P I M S G e n e r a t o r s , D C X P P u l s e d D C , A p p l i e d M a t e r i a l s I n c . B ü h l e r G r o u p L e y b o l d G m b H S a t i s l o h A G V e e c o I n s t r u m e n t s I n c . O e r l i k o n B a l z e r s U L V A C I n c . H a u z e r T e c h n o C o a t i n g B . V . M u s t a n g V a c u u m S y s t e m s A n g s t r o m E n g i n e e r i n g I n c . P V D P r o d u c t s I n c . D e n t o n V a c u u m L L C A J A I n t e r n a t i o n a l I n c . S e m i c o r e E q u i p m e n t I n c . A d v a n c e d E n e r g y I n d u s t r i e s I n c . G e n e r a t o r s , D C X S - 4 D C G e n e r a t o r s , R F G e n e r a t o r s , M a t c h i n g N e t w o r k s , N A N O C H R O M E T H I N F I L M D E P O S I T I O N , N A N O Q U E S T I O N B E A M E T C H , N A N O Q U E S T I O N B E A M S P U T T E R D E P O S I T I O N , I C A R U S I N D I U M D E P O S I T I O N , E L E C T R A U V S P U T T E R I N G , A E G I S D I A M O N D L I K E C A R B O N , M I D A S T M F I B E R M E T A L I Z A T I O N , T V A C S P A C E S I M U L A T I O N , N A N O Q U E S T P I C O , N A N O Q U E S T I , N A N O Q U E S T I I , N A N O Q U E S T I I I / I V , N A N O Q U E S T I I B S D , N A N O Q U E S T I I B S D C O M B O , N A N O Q U E S T I I I B S D , N A N O Q U E S T I I I I B S D , N A N O C H R O M E I V I B S D , H a u z e r b a t c h c o a t i n g s y s t e m s , S i n g u l u s , s i n g u l a r , p e c v d , P l a s m a E n h a n c e d C h e m i c a l V a p o r D e p o s i t i o n , S e m i c o n d u c t o r E q u i p m e n t , U s e d S e m i c o n d u c t o r E q u i p m e n t , S e m i c o n d u c t o r P r o c e s s E q u i p m e n t , F u r n a c e , M R L , M R L 4 S t a c k , S e m i c o n d u c t o r E q u i p m e n t , U s e d S e m i c o n d u c t o r E q u i p m e n t , S e m i c o n d u c t o r P r o c e s s E q u i p m e n t , s e m i c o n d u c t o r p r o c e s s e q u i p m e n t , s e m i c o n d u c t o r e q u i p m e n t , u s e d s e m i c o n d u c t o r e q u i p m e n t , f r o n t e n d e q u i p m e n t , T e m e s c a l , E v a p o r a t o r , 溅 射 台 , 蒸 发 台 , 磁 控 溅 射 台 , 直 流 电 源 溅 射 , 高 频 溅 射 , 濺 射 台 , 蒸 發 台 , 磁 控 濺 射 台 , 直 流 電 源 濺 射 , 高 頻 濺 射 RFQ for Fast Free Quotation
  • 3. Sputter Deposition ALLLWIN21 CORP. AccuSputter AW 4450 Software Key Features o Maintenance, Manual, Semi Automatic and Fully Automatic modes. o Automated calibration of all subsystems. o Troubleshooting to subassembly levels. o Programmed comprehensive calibration and diagnostic functions. o Recipe creation for full automatic wafer processing. o Automatic decline of improper recipes and process data inputs. o Multi-level password protection. o Storage of multiple recipes and system functions. o Real-Time process graphics, data acquisition display, and analysis. o Process Data and Recipe storage automatically to hard drive. o Easy TC vacuum gauge calibration. o Positioning Deposition (optional) o GEM/SECS II (optional) Main Frame 28" dia. SST chamber top plate with ports and Cathodes Configuration I II Cathode Shape Circle Delta Cathode Size 8 inch Delta Cathode Quantity 1 to 4 1 to 3 Sputter Power Supply Configuration I II III DC Power 5 KW 10 KW RF Power 1KW 2 KW 3 KW Pulse DC Power 5 KW 10 KW Process Chamber • 8" diameter X 12" high stainless steel cylinder with 6" • CF flange viewport and load lock port • 28" diameter stainless steel base plate • 11/2" air-operated roughing isolation valve • Air-operated gas inlet valve • Air-operated vent valve • 11/2"blanked-off leak check port • Removable deposition shields • 23" diameter, 3-position water-cooled annular substrate table with variable-speed motorized table drive • Full circle shutter and vane shutter • Chain drive pallet carrier transport • Heavy duty electric hoist Load lock • 30" x 28" x 8" stainless steel load lock chamber with aluminum cover • Chain drive pallet carrier transport • 2" air-operated roughing isolation valve • Air-operated vent valve • 23" diameter molybdenum annular substrate pallet • Elevator for pallet up and down function. Vacuum Systems for process Chamber • 2 stage Cryo pump with 1000 l/s pumping speed for air, including chevron, water-cooled compressor and lines, automatic regeneration controller and plumbing kit. 71/2" O.D. (6" ASA) aluminum air-operated gate valve Air-operated venetian blind throttling valve. • 36.7 cfm mechanical pump or dry pump for process chamber and load lock (Optional) 1 gas line with MFC ① Ar, 200 SCCM; ② Customized New Controller: Allwin21 Corp.'s AW-4450 System PC Control New Power Distribution Box: AC380V /208V/ 3Phase AccuSputter AW 4450 Basic Configuration  GEM/SECS II function (Software)  More gas lines with MFC ① N2; ② O2; ③ Customized  Lamp tower alarm with buzzer.  Mechanical pump or dry pump for process chamber and load lock.  Independent mechanical pump or dry pump for process chamber.  Chiller for Cooling plates and table.  Turbo pump for load lock.  Load lock Lamp Heating function, Up to 200°C  Chamber Lamp Heating function, Up to 300°C (Use one cathode port in SST chamber top plate).  Plasma etch function (before sputter)  Bias function  Co-sputter function  Reactive sputter function  Transformer for AC 380V to 208V for DC Power Supply (if necessary). Options Production-Proven Chamber/Load lock/Vacuum Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037
  • 4. Sputter Deposition System Lowest Cost Upgrade Solution No More Obsolete Controller Parts Increase Uptime Decrease Maintenance Main Characteristics Upgrade Your Perkin-Elmer 2400,44XX Series Sputter Deposition Systems Perkin-Elmer 44XX Series Sputter Systems : ►PE 2400 ►PE 4400 ► PE 4410 ► PE 4415 ►PE 4430 ►PE 4450 ►PE 4480 The AW-4450 Sputter System Upgrade Kit includes an advanced control system with touch screen operator interface and Allwin21 computer software. The kit is easy to incorporate (plug-and-play) into the original PE sputter system. No need to move the to be upgraded system from its present location. All utility connections stay in place. The new control system will enhance the entire system operation. It makes the upgraded sputter system much more reliable, since many of the old controllers are eliminated. Customized survey and upgrading plan Same input/output connectors Same definition of each connector Plug-and-Play Auto Pump Down Controller Load Lock Controller Digital Clock Timer Maintenance, Manual, Semi Automatic and Full Automatic operation modes Automated calibration of all subsystems Trouble shooting to sub-assembly levels Programmed comprehensive calibration and diagnostic functions Recipe creation for full automatic wafer processing Automatic decline of improper recipes and process data Multi level password protections Storage of multiple recipes and system functions Real-Time process data acquisition,display ,analysis Real-Time graphics user display (GUI) Process Data and Recipe storage on a hard drive Easy TC vacuum gauge calibration Positioning Deposition(optional) GEM/SEC II functions (optional) Table Raise / Lower Control Throttle Valve Control System Pressure Control System Sputter Head Controls (optional) Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037 . AW-4450 System Control Fast On-site Upgrading Replaced Obsolete Controls If Necessary RFQ for Fast Free Quotation
  • 5. Sputter Deposition System Comparing Item AccuSputter AW 4450 AW Refurbished&Upgraded PE 44XX AW Upgraded PE 44XX Original PE 44XX Controller Allwin21 Corp.'s AW-4450 System Control Obsolete Control Parts Monitor Touch Screen Discrete User Interface GUI (Graphical User Interface) Discrete Data Storage Store in computer hard disk None Recipe Edit Easy to edit with GUI page None Gas Calibration Easy to do gas calibration with Software None A/D Precision 14-16 bits None Diagnostic Function More functions and I/O hardware "exposed" for easy maintenance and trouble shooting Limited Positioning Sputter Yes No Power Distribution Box New, AC380V/208V/3Phase/5Lines Used Shutter Sensors New, Optoelectronic Sensors Used, Microswitches, mechannical Table Raiser/Lower/ Microswitch New Used Hoist Microswitch New Used Gauge Controller AW-531 Gauge Controller , 3x Ion Gauge and 6x TC Gauge Capability , GUI/Touch Screen PE Ion Gauge Controller (DGC, WRG), 1x Ion Gauge and 2x TC Gauge/each Valves New Used Gas Line New Used Motors,Actuator,Relay,Solenoid New, DC 24V Used, AC 115V RF Generator and RF Match New, can be installed inside the chassis Used DC Power Supply New, can be installed inside the chassis Used,Fully tested, , can be installed inside the chassis Used, individual chassis Reed Switch New Used,Fully tested Used Light Tower New Optional None Loadlock and Chamber New Fully refurbished, new if necessary Used Other Parts New Fully refurbished, new if necessary Used Overall Space Main Console Only Main Console, DC/RF Power, Computer (Optional) Tel.: 408-778-7788 E-mail: sales@allwin21.com Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. All used equipment trademarks belong to the OEM. Address:220 Cochrane Circle, Morgan Hill,CA95037 . Comparison between New AW 4450 AccuSputter and AW Refurbished / AW Upgraded / Original PE 44XX Series systems