2. Founded in: 2000
Location: Silicon Valley, U.S.A.
Business Scope: Be dedicated to the following Semiconductor
Equipment , Parts and Service:
Rapid Thermal Processing
Plasma Asher/Descum
Plasma Etch
Sputter Deposition
Metal Film Thickness&Sheet Resistance
Key Features:
Exclusive licensed manufacturer of Heatpulse 610
Advanced Allwin21 Software Package
Focus on production-proven process equipment
Integrated solid robotic wafer transfer technology
Experienced local engineer support
Products made in U.S.A.
2
About Allwin21
3. Allwin21 Mission
3
• Rebuild production-proven semiconductor high-tech equipment suitable
to customer preferences and needs.
• Deliver unique, high value-added solutions to our customers, using
Allwin21's proven products that are leveraged by our innovative
technologies.
• Be dedicated to providing III-V materials unique solutions that enable new
processes, improve yield, increase uptime, reduce maintenance costs, and
extend life of capital equipment for new technologies with Compound
Semiconductor.
4. Allwin21 Global Presence
Allwin21 Corp
USA
Japan
Korea
Headquarter
Subcompany or office
Agents
Allwin21 Corp
Nanjing, China
Taiwan
Britain France Germany
Israel India Vietnam
Poland
Brazil Singapore
East
USA
Russia
4
6. Industries and Customer Type
Chip Manufacture
LEDs
Biomedical
MEMS
Nanotechnology
Solar Cell
Compound Industry :GaAs, GaN, GaP, GaInP,InP and SiC (III-V)
Optronics:Planar optical waveguides,LASERs, and VCSELs
35%
5%
30%
30%
Fabs
Labs
Universities
Institutes
6
7. Key Features of Allwin21 Main Products
7
Key Feature Benefit
Made in U.S.A. Go through a series of
rigorous tests which are documented,
standardized.
High quality. Easy to cooperate with.
Guaranteed rapid start-up, lifecycle
reliability, and proven process
performance.
•46,380SquareFeet
8. Key Features of Allwin21 Main Products
8
Key Feature Benefit
Production-proven Chamber • Rapid start-up, release for production
• Not a “Guinea Pig”
AW-105R
AW-1008; AW-2001R
AW-B3000
AW-90XeR
AccuThermo AW RTPs
AccuSputter AW 4450
9. Key Features of Allwin21 Main Products
9
Key Feature Benefit
Integrated Solid Robotic Wafer Transfer:
• AW-105R (Asher/Descum)
• AW-90XeR (Etcher)
• AW-1008 (Asher)
• AW-2001R (Etcher)
Much Better Reliability
Low Particulates
Extremely Low Wafer Breakage
III-V material substrate handling
50 um thickness wafer handling
Integration of Robot and Controller
Increase MTBF, Low MTTR
10. Key Features of Allwin21 Main Products
10
Key Feature Benefit
Pentium Class PC
Controller with 15”
touch screen and
Allwin21 advanced
Software Package.
① Real time graphics display (GUI), process data acquisition, display and analysis .
② Closed-loop process parameters control.
③ Precise parameters profiles tailored to suit specific process requirements.
④ Consistent wafer-to-wafer process cycle repeatability.
⑤ Programmable comprehensive calibration of all subsystems from within the software. This
allows faster, easier calibration, leading to enhanced process results.
⑥ Recipe creation. It features a recipe editor to create and edit recipes to fully automate the
processing of wafers inside the process chamber.
⑦ Validation of the recipe so improper control sequences will be revealed.
⑧ Storage of multiple recipes, process data and calibration files so that process and calibration
results can be maintained and compared over time.
⑨ Passwords provide security for the system, recipe editing, diagnostics, calibration and setup
functions.
⑩ Simple and easy to use menu screen which allow a process cycle to be easily defined and
executed.
⑪ Troubleshooting features which allows engineers and service personnel to activate individual
subassemblies and functions. More I/O, AD/DA “expose”.
⑫ DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one
cable: the control interface cable.
⑬ The control board inside the machine that translates the computer commands to control the
machine has a watchdog timer. If this board looses communication with the control
software, it will shut down all processes and halt the system until communication is restored.
⑭ GEM/SEC II function (Optional).
⑮ Advanced Allwin21 EOP function(Optional)
11. Key Features of Allwin21 Main Products
11
Key Feature Benefit
Advanced EOP function with SLOPE
which is used our advanced algorithm
and mathematics filtering (Optional)
Very reliable and stable EOP function.
Wafer to Wafer Repeatability, No
need many recipes
AW-105R
AW-1008; AW-2001R
AW-B3000
AW-90XeR
12. Key Features of Allwin21 Main Products
12
Key Feature Benefit
Software has been using on different
models of thousands of equipment for
customers from 40 countries all over
the world for more than 20 years.
Good Reliability
Low cost
Low risk
Not a “Guinea Pig”
13. Key Features of Allwin21 Main Products
13
Other Features/Technologies Benefit
New air cooled RF Generator No Chiller, low cost, reliable
New temperature control technologies Precise control, good repeatability
New Closed-Loop Temperature Control Precise control, good repeatability
Microwave power plasma etcher low damage for III-V applications
Multiple wafer sizes for one equipment Low cost, flexible, easy operation
Lamp Tower function (Optional) Safety, easy operation
Fixed Cassette Stations More Reliable
More gas lines with MFC Low cost, flexible
Wafer center aligner function III-V wafers. Good repeatability
Add pressure measure and control Good uniformity and repeatability
CE Mark if necessary For all fabs/labs
14. 14
Allwin21 Main RTP/RTA/RTO/RTN
Models Type Wafer Load Wafer Size Highest Temperature
AccuThermo AW 410 Desktop Atmospheric Manual ~ 4” 1250 °C
AccuThermo AW 610* Desktop Manual ~ 6” 1250 °C
AccuThermo AW 810 Desktop Manual ~8” 1250 °C
AccuThermo AW 820 Stand Alone Manual ~8” 1250 °C
AccuThermo AW 610V Desktop
Vacuum
Manual ~ 6” 1050 °C
AccuThermo AW 820V Stand Alone Manual ~ 8” 1250 °C
AW 410
AW610*
AW 810
AW610V
AW 820
AW 820V
* The most popular RTP model all over the world.
15. 15
Allwin21 Main Sputter Deposition
Models Condition Cathodes Shape Wafer Size Wafer Load
AccuSputter AW 4450 New Delta or Circle ~ 8” Manual
Perkin-Elmer 4400
Fully
Refurbished
andUpgraded
byAllwin21
Circle (Up to 4) ~ 6” Manual
Perkin-Elmer 4410 Delta (Up to 3) ~8” Manual
Perkin-Elmer 4450 Delta (Up to 3) ~8” Manual
16. 16
Allwin21 Main Rebuilt Plasma Asher/Descum
Models Plasma Power Wafer Size Wafer Load Process Type
AW-105R* 13.56MHz RF 2”,3”,4”,5”,6” Automatic, Single wafer
AW-1008 2.45GHz Microwave 3”,4”,5”,6” Automatic Single wafer
AW-B3000 13.56MHz RF 2”,3”,4”,5”,6”,8” Manual Barrel, Batch
* Mainly for GaAs and III-V Materials.
17. 17
Allwin21 Main Rebuilt Plasma Etcher/RIE
Models Plasma Power Wafer Size Etch Material Process Type
AW- 901eR 13.56Mhz RF 3”,4”,5”6” Poly Si, Nitride Single wafer
AW-903eR 13.56Mhz RF 3”,4”,5”6” Oxide Single wafer
AW-901eR TTW 13.56Mhz RF 3”,4”,5”6” Poly Si, Nitride Single wafer
AW-903e TTW 13.56Mhz RF 3”,4”,5”6” Oxide Single wafer
AW-2001R* 2.45GHz Microwave 3”,4”,5”6” Poly Si, Nitride, Oxide Single wafer
* Microwave Etch for low gate damage.
18. 18
Allwin21 Main Rebuilt Metal Thin Film
Thickness& Sheet Resistance
Models Wafer Size Measurement Range
Awgage-150 2”,3”,4”,5”6” 1m /square to 19,990 /square
Awgage-200 6”, 8” 1m /square to 19,990 /square
19. 19
Allwin21 Upgrade Kits for Asher and Etcher
Matrix 10X /30X Tegal 90Xe Branson/IPC 3000 Heatpulse 210/410/610
Gasonics Aura 3010/L3510 Gasonics 1000/2001 Lam AutoEtch X90 Perkin-Elmer 44XX
• PC controller with new PCBs and SW
• Integrated solid Robotic Wafer Transfer Plug-and-Play(Except Heatpulse RTP)
Same input / output connectors
Same definition of each connector
20. 20
Why Allwin21 Upgrade Kits
① Low cost solution of obsolete components and parts.
② Increase stability of the system.
③ Network function (GEM/SECII).
④ PC control for data storage .
⑤ GUI function
⑥ More precise control.
⑦ Better repeatability, uniformity.
⑧ Easier maintenance, calibration and trouble shooting.
⑨ Special Requirement of III-V Materials