a brief review on vlsi

1. VLSI TECHNOLOGYVLSI TECHNOLOGY
Presented byPresented by
K.SANJEEVA DINESHK.SANJEEVA DINESH
dineshkota007@gmail.comdineshkota007@gmail.com
&&
3rd ECE :3rd ECE :

2. PrefacePreface
 Day-to-day the usage of the IC’s are increasing.With outDay-to-day the usage of the IC’s are increasing.With out
an IC no electronic device can work.an IC no electronic device can work.
 Such improtance came to our daily life.Then this IC’s canSuch improtance came to our daily life.Then this IC’s can
be called as “Processor”be called as “Processor”
 Microprocessors are essential to many of the productsMicroprocessors are essential to many of the products
we use every day such as TVs, cars, radios, homewe use every day such as TVs, cars, radios, home
appliances and of course, computers. Transistors are theappliances and of course, computers. Transistors are the
main components of microprocessors.main components of microprocessors.
 One problem was the size of the circuits. A complexOne problem was the size of the circuits. A complex
circuit, like a computer, was dependent on speed. If thecircuit, like a computer, was dependent on speed. If the
components of the computer were too large or the wirescomponents of the computer were too large or the wires
interconnecting them too long, the electric signalsinterconnecting them too long, the electric signals
couldn't travel fast enough through the circuit, thuscouldn't travel fast enough through the circuit, thus
making the computer too slow to be effectivemaking the computer too slow to be effective

3. ContentsContents
HistotyHistoty
DevelopmentsDevelopments
FabricationFabrication
AdvantagesAdvantages
UtilizationUtilization
ReferencesReferences
GreetingGreeting

4. HISTORYHISTORY
 With the invention of transistors in BELLWith the invention of transistors in BELL
laboratories is the basic pillar of an IC.laboratories is the basic pillar of an IC.

5. Jack Kilby at Texas Instruments found a solution to this problem in 1958.
Kilby presented his idea to his superiors, and was allowed to build a test
version of his circuit. In September 1958, he had his first integrated circuit
ready.Although the first integrated circuit was crude and had some
problems, the idea was groundbreaking. By making all the parts out of the
same block of material and adding the metal needed to connect them as a
layer on top of it, there was no need for discrete components. No more
wires and components had to be assembled manually. The circuits could
be made smaller, and the manufacturing process could be automated.

6. DEVELOPMENTSDEVELOPMENTS
 The first IC developed by JACK KILLBYThe first IC developed by JACK KILLBY
was 5 transistors on single board,but nowwas 5 transistors on single board,but now
it was developed upto 976 millionit was developed upto 976 million
transistors in single processor(INTEL i7P)transistors in single processor(INTEL i7P)

7. Different technologies across IC’sDifferent technologies across IC’s

8.  The first semiconductor chips held two transistors each.The first semiconductor chips held two transistors each.
Subsequent advances added more transistors, and as aSubsequent advances added more transistors, and as a
consequence, more individual functions or systems wereconsequence, more individual functions or systems were
integrated over time.integrated over time.
 The first integrated circuits held only a few devices,The first integrated circuits held only a few devices,
perhaps as many as ten diodes, transistors, resistors andperhaps as many as ten diodes, transistors, resistors and
capacitors, making it possible to fabricate one or morecapacitors, making it possible to fabricate one or more
logic gates on a single device.logic gates on a single device.
 Now known retrospectively as small-scale integrationNow known retrospectively as small-scale integration
(SSI), improvements in technique led to devices with(SSI), improvements in technique led to devices with
hundreds of logic gates, known as medium-scalehundreds of logic gates, known as medium-scale
integration (MSI).integration (MSI).
 Further improvements led to large-scale integration (LSI),Further improvements led to large-scale integration (LSI),
i.e. systems with at least a thousand logic gates. Currenti.e. systems with at least a thousand logic gates. Current
technology has moved far past this mark and today'stechnology has moved far past this mark and today's
microprocessors have many millions of gates and billionsmicroprocessors have many millions of gates and billions
of individual transistors.of individual transistors.

9.  As of early 2008, billion-transistor processors areAs of early 2008, billion-transistor processors are
commercially available. This became morecommercially available. This became more
commonplace as semiconductor fabrication advancedcommonplace as semiconductor fabrication advanced
from the then-current generation of 65 nm processes.from the then-current generation of 65 nm processes.
 Current designs, unlike the earliest devices, useCurrent designs, unlike the earliest devices, use
extensive design automation and automated logicextensive design automation and automated logic
synthesis to lay out the transistors, enabling highersynthesis to lay out the transistors, enabling higher
levels of complexity in the resulting logic functionality.levels of complexity in the resulting logic functionality.
Certain high-performance logic blocks like the SRAMCertain high-performance logic blocks like the SRAM
(static random-access memory) cell, are still designed by(static random-access memory) cell, are still designed by
hand to ensure the highest efficiency.hand to ensure the highest efficiency.
 VLSI technology may be moving toward further radicalVLSI technology may be moving toward further radical
miniaturization with introduction of NEMS technology.miniaturization with introduction of NEMS technology.

10. FABRICATION of an ICFABRICATION of an IC
 The IC fabrication isThe IC fabrication is
done in highlydone in highly
resistive and 100resistive and 100
times neater thantimes neater than
hospitalshospitals

11.  Based on IC ,there are many techniquesBased on IC ,there are many techniques
are used,in them the most commonly usedare used,in them the most commonly used
one isone is
N-well fabricationN-well fabrication

12.  The fabrication steps that involving areThe fabrication steps that involving are
EGS-Electronic Grade Silicon-99.999%EGS-Electronic Grade Silicon-99.999%
pure siliconpure silicon
Evolving solid siliconeEvolving solid silicone
Finding defectsFinding defects
SiOSiO22 protected layerprotected layer
Photo lithographic layerPhoto lithographic layer
MetalisationMetalisation

13.  SiOSiO22 layer protects thelayer protects the
substrate fromsubstrate from
involving chemicalinvolving chemical
reactions withreactions with
atmosphereatmosphere
 Photolithograpic layerPhotolithograpic layer
involves in protectinginvolves in protecting
diffusionsdiffusions
 Metalisations processMetalisations process
uses for evolvinguses for evolving
terminalsterminals

14. PackagesPackages
 This IC’s can be found in ceramic,metalThis IC’s can be found in ceramic,metal
can,dual pin packagescan,dual pin packages

15. ADVANTAGESADVANTAGES
 Minituring the size ofMinituring the size of
equipmentequipment

16. Reduce power lossReduce power loss
Low powerLow power
consumptionconsumption
Highly realiableHighly realiable
Modern day computers are
getting smaller, faster, and
cheaper and more power
efficient every progressing
second.

17. UTILIZATIONUTILIZATION
 Semi conductor manufacturingSemi conductor manufacturing
 3D system integration technologies3D system integration technologies
 For space communicationsFor space communications
 As a processor in electronic devicesAs a processor in electronic devices

18. REFERENCESREFERENCES
 www.vlsi.wikipedia.ac.inwww.vlsi.wikipedia.ac.in
 www.vlsi.Google images.blogwww.vlsi.Google images.blog

19. GreetingGreeting
 Thanks for giving such a wonder fulThanks for giving such a wonder ful
opportunityopportunity