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Contrive Datum Insights
Global Research And Consulting
A complete solution to explore all the potential aspect to
drive the growth of the business industries.
v
ABOUT US
Contrive Datum Insights (CDI) is a market intelligence company providing global business
information reports and services. Our exclusive blend of quantitative forecasting and trends
analysis provides forward-looking insight for thousands of decision makers. CDI’s experienced
team of Analysts, Researchers, and Consultants uses proprietary data sources and various
tools and techniques to gather, and analyse information. Our business offerings represent the
latest and the most reliable information indispensable for businesses to sustain a competitive
edge.
Each CDI syndicated research report covers a different sector — such as chemicals, materials,
metals & mining, pharmaceuticals, energy, automotive, food and beverages, semiconductors,
med-devices, consumer goods and information technology. These reports provide in-depth
analysis and deep segmentation to possible micro levels. With wider scope and stratified
research methodology, our syndicated reports strive to serve the overall research requirement
of clients.
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Services Offered :
 Market Intelligence & Market Opportunity
Assessment
 Market Size & Segmentation
 Market Entry Strategy
 Competitor Benchmarking
 Pricing Intelligence
 Customer Intelligence
 Sourcing Intelligence
 New-Generation Products & Technologies
 Distribution & Sales Channel Assessment
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CLIENTELE:
Some of the global leading clients that we have served:
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CLIENTELE:
Some of the global leading clients that we have served:
v
The Global Ceramic Substrates in Electronic Packaging Market Size Is Expected To Grow From USD
1.05 Billion In 2021 To 2030 At A CAGR Of 5.2% During The Forecast Period.
Market Overview
A ceramic substrate in an electronic package is a material used in an electronic package as an insulating layer
between a semiconductor die and a lead frame or printed circuit board (PCB). Ceramic substrates can be made
from a variety of materials, the most common being aluminum oxide (Al₂O₃), aluminum nitride (AlN), beryllium
oxide (BeO), and silicon nitride (Si₃N₄). Due to their excellent thermal, electrical, and mechanical properties,
they are widely used in power electronics, electronic packaging, hybrid microelectronics, and multi-chip
modules. The growth of this market can be attributed to the growing demand for miniaturized and high-
performance electronic devices. Furthermore, the trend towards the use of advanced materials in electronic
packaging is also driving the growth of this market.
v
North America has a well-developed electronics industry and is an important consumer of thin-film ceramic
substrates. The United States and Canada are the main markets in the region. The growth in demand for hybrid
microelectronics and power electronics is driving the growth of thin-film ceramic substrates North American thin-film
ceramic substrate market European thin-film ceramics The substrate market is expected to grow at a moderate rate
over the forecast period Increasing demand for hybrid microelectronics and power electronics is driving the growth
of the thin film ceramic substrate market in Europe. The key drivers for the market growth are the presence of key
players, growing electronics industry and government initiatives. Brazil is expected to be the largest contributor to
market growth in the region, followed by Mexico and Argentina. In Europe, the thin film ceramic substrate in the
electronic packaging market is expected to grow at a significant rate during the forecast period. Market Growth The
key drivers for the market growth are the presence of key players, growing electronics industry, and government
initiatives.
Regional Analysis:
v
The Global
Ceramic Substrates in Electronic Packaging Market has been segmented into:
By Type
•Alumina(Al2O3), Aluminium Nitride(AlN),
Beryllium Oxide(BeO), Silicon Nitride(Si3N4)
By Application:
•Power Electronics, Electronic Packaging, Hybrid
Microelectronics, Multi-Chip Modules
v
• In the process of electronic packaging, the substrate mainly plays the role of mechanical support and protection
and electrical interconnection (insulation). With the development of electronic packaging technology in the
direction of miniaturization, high density, multi-function, and high reliability, the power density of electronic
systems is increasing. The bigger the , the more serious the heat dissipation problem. There are many factors
that affect the heat dissipation of the device, and the choice of substrate material is also a key link.
• At present, there are four main types of substrate materials commonly used in electronic packaging: polymer
substrates; metal substrates; composite substrates; ceramic substrates.
Market Dynamics
v
• Rogers Germany,
• Murata Manufacturing,
• Anaren,
• CeramTec,
• Ortech Advanced Ceramics,
• Kyocera,
• NIKKO, CoorsTek, TOSHIBA,
• Maruwa, Leatec Fine Ceramics,
• TA-I Technology,
• Chaozhou Three-Circle,
• Tong Hsing Electronic Industries,
• ICP TECHNOLOGY,
• KOA Speer Electronics,
• And Others.
MARKET PLAYERS
v
Customer Experiences
“Very happy with the service. Report quality as well as response time
for my custom market study was great. I am looking forward to work
with Contrive Datum Insights (CDI) in future. “
G. Luca, A+ Outsourced Marketing
“We are satisfied with research report offered by Contrive Datum
Insights (CDI) .” We appreciate your support throughout the project.”
Consulting Company (privacy requested)
"You and your team did a terrific job on this project.” CDI will be at the
top of our list in the future for market research projects.”
Europe based Fortune 500 Company (privacy requested)
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Benefits of
Association
By associating with Contrive Datum Insights (CDI) , customer can enjoy following
benefits:
 One-Stop-Destination for all research needs (Syndicate and Custom Reports)
 Reduced Budget and Faster Turnaround Time
 Focused Research Team - Contrive Datum Insights (CDI) can arrange a dedicated team of
2-3 resources with 1 Research Manager , who will look after any ad-hoc needs of the client
 Dedicated Account Manager
 24/7 availability for any custom needs of the client
 Flexible Partnering Model to accommodate client’s research needs
 Access to Data-Cuts related to required Market for global region
 ▪ Industry Update on Weekly/Bi-Weekly/Monthly basis
 ▪ Market Trend Analysis on Monthly/Quarterly basis
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To know more about us, please visit our website:
www.contrivedatuminsights.com
For sales queries or new topics email us on:
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Thank You!

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Ceramic Substrates in Electronic Packaging Market

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  • 6. v The Global Ceramic Substrates in Electronic Packaging Market Size Is Expected To Grow From USD 1.05 Billion In 2021 To 2030 At A CAGR Of 5.2% During The Forecast Period. Market Overview A ceramic substrate in an electronic package is a material used in an electronic package as an insulating layer between a semiconductor die and a lead frame or printed circuit board (PCB). Ceramic substrates can be made from a variety of materials, the most common being aluminum oxide (Al₂O₃), aluminum nitride (AlN), beryllium oxide (BeO), and silicon nitride (Si₃N₄). Due to their excellent thermal, electrical, and mechanical properties, they are widely used in power electronics, electronic packaging, hybrid microelectronics, and multi-chip modules. The growth of this market can be attributed to the growing demand for miniaturized and high- performance electronic devices. Furthermore, the trend towards the use of advanced materials in electronic packaging is also driving the growth of this market.
  • 7. v North America has a well-developed electronics industry and is an important consumer of thin-film ceramic substrates. The United States and Canada are the main markets in the region. The growth in demand for hybrid microelectronics and power electronics is driving the growth of thin-film ceramic substrates North American thin-film ceramic substrate market European thin-film ceramics The substrate market is expected to grow at a moderate rate over the forecast period Increasing demand for hybrid microelectronics and power electronics is driving the growth of the thin film ceramic substrate market in Europe. The key drivers for the market growth are the presence of key players, growing electronics industry and government initiatives. Brazil is expected to be the largest contributor to market growth in the region, followed by Mexico and Argentina. In Europe, the thin film ceramic substrate in the electronic packaging market is expected to grow at a significant rate during the forecast period. Market Growth The key drivers for the market growth are the presence of key players, growing electronics industry, and government initiatives. Regional Analysis:
  • 8. v The Global Ceramic Substrates in Electronic Packaging Market has been segmented into: By Type •Alumina(Al2O3), Aluminium Nitride(AlN), Beryllium Oxide(BeO), Silicon Nitride(Si3N4) By Application: •Power Electronics, Electronic Packaging, Hybrid Microelectronics, Multi-Chip Modules
  • 9. v • In the process of electronic packaging, the substrate mainly plays the role of mechanical support and protection and electrical interconnection (insulation). With the development of electronic packaging technology in the direction of miniaturization, high density, multi-function, and high reliability, the power density of electronic systems is increasing. The bigger the , the more serious the heat dissipation problem. There are many factors that affect the heat dissipation of the device, and the choice of substrate material is also a key link. • At present, there are four main types of substrate materials commonly used in electronic packaging: polymer substrates; metal substrates; composite substrates; ceramic substrates. Market Dynamics
  • 10. v • Rogers Germany, • Murata Manufacturing, • Anaren, • CeramTec, • Ortech Advanced Ceramics, • Kyocera, • NIKKO, CoorsTek, TOSHIBA, • Maruwa, Leatec Fine Ceramics, • TA-I Technology, • Chaozhou Three-Circle, • Tong Hsing Electronic Industries, • ICP TECHNOLOGY, • KOA Speer Electronics, • And Others. MARKET PLAYERS
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