SPICE MODEL of SSM3K7002F (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002F (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K7002F power MOSFET. It includes:
1) Model parameters for the MOSFET and its body diode.
2) Simulation results and comparisons to measurements for key characteristics like transconductance, Vgs-Id, Rds(on), gate charge, capacitance, switching time and output/forward/reverse characteristics.
3) Circuit schematics used to simulate the characteristics.
4) References measurement results for some characteristics.
The report summarizes the modeling of the MOSFET and validation of the model against experimental measurements for accurate circuit simulation.
SPICE MODEL of SSM3K7002AF (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002AF (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002AF (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002AF (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002FU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K35FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K35FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002F (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K7002F power MOSFET. It includes:
1) Model parameters for the MOSFET and its body diode.
2) Simulation results and comparisons to measurements for key characteristics like transconductance, Vgs-Id, Rds(on), gate charge, capacitance, switching time and output/forward/reverse characteristics.
3) Circuit schematics used to simulate the characteristics.
4) References measurement results for some characteristics.
The report summarizes the modeling of the MOSFET and validation of the model against experimental measurements for accurate circuit simulation.
SPICE MODEL of SSM3K7002AF (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002AF (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002AF (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002AF (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Professional+BDP N&P Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002FU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K7002FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K7002FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K35FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K35FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ656 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J112TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling parameters and simulation results for a TPC8118 power MOSFET manufactured by Toshiba. It includes:
1) MOSFET model parameters such as channel length, width, transconductance, resistances, thresholds, and more.
2) Simulation results comparing measurements and simulations of characteristics like transconductance, drain current, gate charge, switching times, and more.
3) Body diode model parameters and simulation results comparing measurements and simulations of forward current, reverse recovery time, and more.
4) Circuit configurations used to simulate and evaluate the MOSFET and diode characteristics.
SPICE MODEL of 2SK2782 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2782 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2782 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2782 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling parameters and simulation results for a TPC8117 power MOSFET manufactured by Toshiba. It includes MOSFET and body diode SPICE models and simulations validating the models, comparing measurement and simulation results for key characteristics like transconductance, capacitance, switching times and reverse recovery. The simulations show good agreement with measurements, validating the accuracy of the models.
SPICE MODEL of TPC8117 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8117 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of XBS203V17R (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of XBS203V17R (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K102TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IDT10S60C (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IDT10S60C (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TLWH1100 , White ,TA=-20degree (Professional Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for an LED lamp component. It includes specifications such as manufacturer, part number, and operating temperature range. It also contains simulation results that model the forward current, luminous intensity, reverse current, and reverse recovery characteristics of the component and compare the simulation data to measurement data.
SPICE MODEL of XBS204S17R (Professional Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Schottky rectifier diode with part number XBS204S17R. It includes:
1) Details of the diode components and manufacturer.
2) Descriptions of the PSpice model parameters used to simulate the diode.
3) Simulation results and comparisons with measurement data for the diode's forward and reverse characteristics, capacitance over voltage, and reverse recovery time.
4) Circuit diagrams used to simulate the diode's electrical behavior.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ656 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J112TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J112TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8118 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling parameters and simulation results for a TPC8118 power MOSFET manufactured by Toshiba. It includes:
1) MOSFET model parameters such as channel length, width, transconductance, resistances, thresholds, and more.
2) Simulation results comparing measurements and simulations of characteristics like transconductance, drain current, gate charge, switching times, and more.
3) Body diode model parameters and simulation results comparing measurements and simulations of forward current, reverse recovery time, and more.
4) Circuit configurations used to simulate and evaluate the MOSFET and diode characteristics.
SPICE MODEL of 2SK2782 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2782 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2782 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2782 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling parameters and simulation results for a TPC8117 power MOSFET manufactured by Toshiba. It includes MOSFET and body diode SPICE models and simulations validating the models, comparing measurement and simulation results for key characteristics like transconductance, capacitance, switching times and reverse recovery. The simulations show good agreement with measurements, validating the accuracy of the models.
SPICE MODEL of TPC8117 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8117 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J117TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J120TU (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K16FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K16FU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of MTM23223 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of XBS203V17R (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of XBS203V17R (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K102TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K102TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IDT10S60C (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IDT10S60C (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TLWH1100 , White ,TA=-20degree (Professional Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for an LED lamp component. It includes specifications such as manufacturer, part number, and operating temperature range. It also contains simulation results that model the forward current, luminous intensity, reverse current, and reverse recovery characteristics of the component and compare the simulation data to measurement data.
SPICE MODEL of XBS204S17R (Professional Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Schottky rectifier diode with part number XBS204S17R. It includes:
1) Details of the diode components and manufacturer.
2) Descriptions of the PSpice model parameters used to simulate the diode.
3) Simulation results and comparisons with measurement data for the diode's forward and reverse characteristics, capacitance over voltage, and reverse recovery time.
4) Circuit diagrams used to simulate the diode's electrical behavior.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6P54TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6P54TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8401 (Standard+BDS N&P Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8401 (Standard+BDS N&P) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J14T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J14T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4066-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4066-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a MOSFET transistor and body diode. It includes:
1) Component details such as part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Descriptions and parameters for the MOSFET and diode SPICE models.
3) Results of circuit simulations characterizing key transistor properties like transconductance, Vgs-Id curve, gate charge, switching times and comparing to manufacturer data.
SPICE MODEL of 2SK3301 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3301 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3301 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6L13TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6L13TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a TPC8029 power MOSFET. It includes:
1) Details of the MOSFET model parameters and equations used in the Pspice simulation.
2) Simulation results and comparisons to measurement data for key MOSFET characteristics like transconductance, Vgs-Id, output characteristics, and switching times.
3) The model for the internal body diode and simulation results for forward and reverse recovery characteristics compared to measurements.
4) A diagram showing the relationship between reverse recovery times trj and trb.
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM6N29TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM6N29TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA Power MOSFET with part number SSM3K15FU. The 3-sentence summary is:
The report includes PSpice models and simulation results characterizing the electrical parameters and performance of the MOSFET, such as its transconductance, threshold voltage, on-resistance, switching times, and forward/reverse current characteristics. Comparisons between measured data and simulated values show good agreement within a few percent error. Component specifications and simulation circuits are provided to model and evaluate the MOSFET's electrical behavior.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3704 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2508 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2508 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8011-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K101TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a TOSHIBA SSM3K101TU power MOSFET and its internal body diode and ESD protection diode. It includes SPICE models and simulation results for the MOSFET characteristics like transconductance, gate charge, output, switching time and for the diode characteristics like forward current, reverse recovery and zener voltage. The simulations match well with measurements with less than 5% error for most characteristics.
SPICE MODEL of SSM3K126TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K126TU (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Enchancing adoption of Open Source Libraries. A case study on Albumentations.AIVladimir Iglovikov, Ph.D.
Presented by Vladimir Iglovikov:
- https://www.linkedin.com/in/iglovikov/
- https://x.com/viglovikov
- https://www.instagram.com/ternaus/
This presentation delves into the journey of Albumentations.ai, a highly successful open-source library for data augmentation.
Created out of a necessity for superior performance in Kaggle competitions, Albumentations has grown to become a widely used tool among data scientists and machine learning practitioners.
This case study covers various aspects, including:
People: The contributors and community that have supported Albumentations.
Metrics: The success indicators such as downloads, daily active users, GitHub stars, and financial contributions.
Challenges: The hurdles in monetizing open-source projects and measuring user engagement.
Development Practices: Best practices for creating, maintaining, and scaling open-source libraries, including code hygiene, CI/CD, and fast iteration.
Community Building: Strategies for making adoption easy, iterating quickly, and fostering a vibrant, engaged community.
Marketing: Both online and offline marketing tactics, focusing on real, impactful interactions and collaborations.
Mental Health: Maintaining balance and not feeling pressured by user demands.
Key insights include the importance of automation, making the adoption process seamless, and leveraging offline interactions for marketing. The presentation also emphasizes the need for continuous small improvements and building a friendly, inclusive community that contributes to the project's growth.
Vladimir Iglovikov brings his extensive experience as a Kaggle Grandmaster, ex-Staff ML Engineer at Lyft, sharing valuable lessons and practical advice for anyone looking to enhance the adoption of their open-source projects.
Explore more about Albumentations and join the community at:
GitHub: https://github.com/albumentations-team/albumentations
Website: https://albumentations.ai/
LinkedIn: https://www.linkedin.com/company/100504475
Twitter: https://x.com/albumentations
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
SPICE MODEL of SSM3K7002F (Professional+BDP Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Professional Model)
PART NUMBER: SSM3K7002F
MANUFACTURER: TOSHIBA
Body Diode (Professional Model) / ESD Protection
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
2. MOSFET MODEL
PSpice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
15. Reverse Recovery Characteristic Reference
Measurement
trj=19.20(ns)
trb=11.60(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
16. Zener Voltage Characteristic
Circuit Simulation Result
10mA
9mA
8mA
7mA
6mA
5mA
4mA
3mA
2mA
1mA
0A
0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V
I(R1)
V_V1
Evaluation Circuit
R1
0.01m U1
SSM3K7002F open
open
V1 Ropen
0Vdc 100MEG
0
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008