The document provides guidelines for PCB design including board size, thickness, trace width and spacing, pad sizes, hole sizes, hole density, and standard drill sizes. Key recommendations include checking the maximum board size with your fabricator, using standard board thicknesses like 0.062" FR4, following trace width and spacing rules like 8/8 mil, using a 5 mil annulus for pad sizes, and being aware of the fabricator's maximum hole density which may involve extra charges above 24 holes/square inch.
This document summarizes the process of designing and fabricating a small printed circuit board (PCB). It begins with defining a PCB and providing a brief history. It then discusses types of PCBs, common materials used, and the key steps to fabricating a PCB which include: 1) Simulating a circuit design using software, 2) Designing the PCB layout, 3) Printing the design onto the PCB board using iron and acid, and 4) Placing components and soldering them into place. The document uses a simple circuit as an example to demonstrate the full PCB fabrication process from start to finish.
This document summarizes the process of designing and fabricating a small printed circuit board (PCB). It begins with defining a PCB and providing a brief history. It then discusses types of PCBs, common materials used, and the key steps to fabricating a PCB which include: 1) Simulating a circuit design using software, 2) Designing the PCB layout, 3) Printing the design onto the PCB board using iron and acid, and 4) Placing components and soldering them into place. The document uses a simple circuit as an example to demonstrate the full PCB fabrication process from start to finish.
This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
This document provides an overview of printed circuit board (PCB) manufacturing. It discusses various stages of the PCB manufacturing process including laminate fabrication, copper deposition, photolithography, etching, drilling, surface finishing techniques like solder masking and hot air leveling. It also covers different types of PCBs like single sided, double sided, multilayer and flexible PCBs. Various material options for PCB substrates and their properties are described. Manufacturing processes for different PCB components are outlined.
The document discusses the process of printed circuit board (PCB) design, fabrication, and installation. It covers:
- The key components of a PCB including pads, traces, vias, and layers
- The PCB fabrication process including film generation, drilling, electroplating, imaging, etching, solder mask application, and silkscreening
- How components are attached to the board through surface mount or through-hole methods and the importance of carefully soldering to avoid shorts
This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
This document discusses printed circuit board (PCB) design. It begins with an introduction to PCBs, describing how they mechanically support and electrically connect electronic components using conductive tracks on insulating substrates. It then discusses the basic materials that make up PCBs like copper foil and plating. The document outlines the main fabrication steps for PCBs which include setting up, imaging, etching, drilling, masking, and electrical testing. It also describes the characteristics of through-hole and surface mount technology. The etching and assembly processes are explained in more detail. Finally, the document provides an overview of PCB design and routing software like EAGLE and includes an example of a power supply board.
This document summarizes the process of designing and fabricating a small printed circuit board (PCB). It begins with defining a PCB and providing a brief history. It then discusses types of PCBs, common materials used, and the key steps to fabricating a PCB which include: 1) Simulating a circuit design using software, 2) Designing the PCB layout, 3) Printing the design onto the PCB board using iron and acid, and 4) Placing components and soldering them into place. The document uses a simple circuit as an example to demonstrate the full PCB fabrication process from start to finish.
This document summarizes the process of designing and fabricating a small printed circuit board (PCB). It begins with defining a PCB and providing a brief history. It then discusses types of PCBs, common materials used, and the key steps to fabricating a PCB which include: 1) Simulating a circuit design using software, 2) Designing the PCB layout, 3) Printing the design onto the PCB board using iron and acid, and 4) Placing components and soldering them into place. The document uses a simple circuit as an example to demonstrate the full PCB fabrication process from start to finish.
This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
This document provides an overview of printed circuit board (PCB) manufacturing. It discusses various stages of the PCB manufacturing process including laminate fabrication, copper deposition, photolithography, etching, drilling, surface finishing techniques like solder masking and hot air leveling. It also covers different types of PCBs like single sided, double sided, multilayer and flexible PCBs. Various material options for PCB substrates and their properties are described. Manufacturing processes for different PCB components are outlined.
The document discusses the process of printed circuit board (PCB) design, fabrication, and installation. It covers:
- The key components of a PCB including pads, traces, vias, and layers
- The PCB fabrication process including film generation, drilling, electroplating, imaging, etching, solder mask application, and silkscreening
- How components are attached to the board through surface mount or through-hole methods and the importance of carefully soldering to avoid shorts
This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
This document discusses printed circuit board (PCB) design. It begins with an introduction to PCBs, describing how they mechanically support and electrically connect electronic components using conductive tracks on insulating substrates. It then discusses the basic materials that make up PCBs like copper foil and plating. The document outlines the main fabrication steps for PCBs which include setting up, imaging, etching, drilling, masking, and electrical testing. It also describes the characteristics of through-hole and surface mount technology. The etching and assembly processes are explained in more detail. Finally, the document provides an overview of PCB design and routing software like EAGLE and includes an example of a power supply board.
The document provides information about printed circuit board design, including requirements specification, computer-aided design procedures, general design principles, and guidelines. It discusses establishing requirements, schematic entry, component placement, routing connections, design rule checks, and plotting. It also covers determining design standards, component outlines, placement techniques, wiring orientation, and considerations for board size and conductor widths/spacings.
Low Power VLSI design architecture for EDA (Electronic Design Automation) and Modern Power Estimation, Reduction and Fixing technologies including clock gating and power gating
The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
The document discusses printed circuit board (PCB) design. It begins by introducing PCBs and their history. It then describes the main types of PCBs and basic PCB terminology. The document outlines the general PCB design process from schematic design to routing to generating output files for fabrication. It provides guidelines for component placement and introduces PCB design rules to ensure sufficient spacing and avoid electrical issues. Finally, it briefly summarizes the key topics covered in the document.
A printed circuit board (PCB) is a non-conductive laminated substrate that mechanically supports and electrically connects electronic components using copper tracks, pads and other features etched onto copper sheets. PCBs have evolved from early point-to-point wiring to modern surface mount and multilayer board designs. Key aspects of PCBs include the substrate material (often FR-4 fiberglass), copper patterning process (subtractive or additive), drilling of holes, plating, solder mask and the assembly of electronic components. Modern PCB design utilizes computer-aided manufacturing systems to efficiently layout, simulate and produce circuit boards.
This document describes a method for simulating electrostatic discharge (ESD) protection circuits using empirical models of ESD devices. The method combines regular SPICE models of ESD transistors with curves based on transmission line pulsing (TLP) measurements. The models trigger bipolar behavior based on simulated terminal voltages and TLP data. Simulation results matched TLP curves and demonstrated checking ESD current and voltage clamping. The method allows verifying ESD protection in complex chip designs.
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies, with common types including single-sided, double-sided, and multilayer boards.
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
This document provides information about printed circuit boards (PCBs) including:
- PCBs mechanically support and electrically connect electronic components using conductive tracks etched onto a non-conductive substrate. PCBs can be single layer, double layer, or multi-layer.
- Auto-routing is an automated design process where components are automatically routed after placement. Software programs like ISIS and ARES are used for auto-routing.
- There are different methods for PCB fabrication including hand/home made, small factories using screen printing processes, and large automated industrial facilities. Basic design considerations include tracks, drills, clearances, and component packages.
VLSI is the process of integrating millions of transistors on a single chip. It was invented in 1980 and allows for 20,000 to 1,000,000 transistors per chip. VLSI enables devices to be physically smaller, cheaper to produce, faster, more reliable and efficient. Integrated circuits are used in consumer electronics, computers, wireless devices, automotive electronics, aerospace, defense and more. Moore's Law predicts that the number of transistors on a chip will double every 18 months, allowing continued advancement and miniaturization of chips. Common processing technologies for VLSI include CMOS, Bipolar, BiCMOS, GaAs and SOI.
Instrumentation Limited (IL) is an Indian government enterprise established in 1964 to achieve self-reliance in control and automation technology for process industries. IL manufactures and supplies advanced control equipment on a turnkey basis to various industry sectors. It has manufacturing facilities in Kota and Palakkad, India and a network of offices across India to provide installation, commissioning and after-sales services. With over 45 years of experience, IL designs, engineers, manufactures, integrates, installs and commissions complex control systems and has diversified into various related fields to offer a comprehensive range of products and services.
The document discusses integrated circuits (ICs), which are electronic circuits composed of many components integrated onto a single semiconductor chip. It provides a history of ICs beginning with Jack Kilby's demonstration of the first working IC in 1958. The document then outlines the evolution of ICs from small to very large scale integration. It describes different types of ICs including digital, analog, mixed-signal, microprocessors, memory, and application-specific ICs. Advantages and disadvantages of ICs are presented, as well as their importance in reducing the size and power consumption of electronic devices.
The document discusses various integrated circuit packaging technologies. It describes through-hole packages, surface mount packages, chip-scale packages including wire bonded ball grid arrays and flip chip ball grid arrays. It then focuses on wafer level chip-scale packages, explaining that they are manufactured by building up interconnect structures directly on the silicon wafer before dicing. Key advantages of wafer level chip-scale packages are their small size, minimized inductance, and streamlined manufacturing process.
Our PCB 101 Presentation goes through the processes involved in manufacturing a printed circuit board.
From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper and production tolerances allow us to provide our customers exactly what they need for their end product.
A printed circuit board (PCB) is used in electronics to build electronic devices. It provides both a place to mount electronic components and the means to electrically connect them. A PCB has conducting copper layers that are typically coated with a green solder mask. Unwanted copper is removed via etching, leaving only the desired copper traces. Components, pads, traces, vias, and metal layers make up the basic structure and function of a PCB.
PCBs are non-conductive boards that hold electronic components and allow electricity to flow through circuitry etched onto their surfaces, and they have been used since the 1940s in devices like radios, computers, and appliances; PCBs can be single sided, double sided, or multilayered and come in rigid, flexible, or rigid-flex styles to suit different applications; They connect components like resistors, capacitors, and ICs through pads and traces on one or more metal layers.
This document provides guidelines for PCB design, including key principles of current flow, coupling, and stackup goals. It discusses protection devices, power generation, routing traces, vias, copper pours, grounding, decoupling capacitors, component selection, circuit mounting, and layout programs. Manufacturers for PCB ordering are also listed.
Floorplanning involves determining the approximate locations and shapes of modules on an integrated circuit to optimize the design for factors like area, wirelength, and timing. The goals are to partition the design into functional blocks, arrange the blocks, place macros and I/Os, and design the power distribution grid. Floorplanning algorithms use techniques like integer programming, rectangular dual graphs, and hierarchical and simulated annealing approaches to explore the design space and generate optimized floorplans. The outputs include the die area, placement of I/Os and macros, a preliminary power grid design, and definitions of standard cell placement regions.
This PPT Gives information about:
1. New component creation
2. Creating many parts in multiple packages
3. Creating Netlist
4. Design Rule Check
5. Generating Netlist from the schematics
6. Generating Bill Of Materials (BOM).
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
The document lists decimal equivalents of drill sizes from #1 to #80 in a table with 4 columns. It provides the size of each drill in inches in increments decreasing from 0.2280 inches for the #1 drill to 0.0135 inches for the #80 drill size.
The document provides information about printed circuit board design, including requirements specification, computer-aided design procedures, general design principles, and guidelines. It discusses establishing requirements, schematic entry, component placement, routing connections, design rule checks, and plotting. It also covers determining design standards, component outlines, placement techniques, wiring orientation, and considerations for board size and conductor widths/spacings.
Low Power VLSI design architecture for EDA (Electronic Design Automation) and Modern Power Estimation, Reduction and Fixing technologies including clock gating and power gating
The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
The document discusses printed circuit board (PCB) design. It begins by introducing PCBs and their history. It then describes the main types of PCBs and basic PCB terminology. The document outlines the general PCB design process from schematic design to routing to generating output files for fabrication. It provides guidelines for component placement and introduces PCB design rules to ensure sufficient spacing and avoid electrical issues. Finally, it briefly summarizes the key topics covered in the document.
A printed circuit board (PCB) is a non-conductive laminated substrate that mechanically supports and electrically connects electronic components using copper tracks, pads and other features etched onto copper sheets. PCBs have evolved from early point-to-point wiring to modern surface mount and multilayer board designs. Key aspects of PCBs include the substrate material (often FR-4 fiberglass), copper patterning process (subtractive or additive), drilling of holes, plating, solder mask and the assembly of electronic components. Modern PCB design utilizes computer-aided manufacturing systems to efficiently layout, simulate and produce circuit boards.
This document describes a method for simulating electrostatic discharge (ESD) protection circuits using empirical models of ESD devices. The method combines regular SPICE models of ESD transistors with curves based on transmission line pulsing (TLP) measurements. The models trigger bipolar behavior based on simulated terminal voltages and TLP data. Simulation results matched TLP curves and demonstrated checking ESD current and voltage clamping. The method allows verifying ESD protection in complex chip designs.
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies, with common types including single-sided, double-sided, and multilayer boards.
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
This document provides information about printed circuit boards (PCBs) including:
- PCBs mechanically support and electrically connect electronic components using conductive tracks etched onto a non-conductive substrate. PCBs can be single layer, double layer, or multi-layer.
- Auto-routing is an automated design process where components are automatically routed after placement. Software programs like ISIS and ARES are used for auto-routing.
- There are different methods for PCB fabrication including hand/home made, small factories using screen printing processes, and large automated industrial facilities. Basic design considerations include tracks, drills, clearances, and component packages.
VLSI is the process of integrating millions of transistors on a single chip. It was invented in 1980 and allows for 20,000 to 1,000,000 transistors per chip. VLSI enables devices to be physically smaller, cheaper to produce, faster, more reliable and efficient. Integrated circuits are used in consumer electronics, computers, wireless devices, automotive electronics, aerospace, defense and more. Moore's Law predicts that the number of transistors on a chip will double every 18 months, allowing continued advancement and miniaturization of chips. Common processing technologies for VLSI include CMOS, Bipolar, BiCMOS, GaAs and SOI.
Instrumentation Limited (IL) is an Indian government enterprise established in 1964 to achieve self-reliance in control and automation technology for process industries. IL manufactures and supplies advanced control equipment on a turnkey basis to various industry sectors. It has manufacturing facilities in Kota and Palakkad, India and a network of offices across India to provide installation, commissioning and after-sales services. With over 45 years of experience, IL designs, engineers, manufactures, integrates, installs and commissions complex control systems and has diversified into various related fields to offer a comprehensive range of products and services.
The document discusses integrated circuits (ICs), which are electronic circuits composed of many components integrated onto a single semiconductor chip. It provides a history of ICs beginning with Jack Kilby's demonstration of the first working IC in 1958. The document then outlines the evolution of ICs from small to very large scale integration. It describes different types of ICs including digital, analog, mixed-signal, microprocessors, memory, and application-specific ICs. Advantages and disadvantages of ICs are presented, as well as their importance in reducing the size and power consumption of electronic devices.
The document discusses various integrated circuit packaging technologies. It describes through-hole packages, surface mount packages, chip-scale packages including wire bonded ball grid arrays and flip chip ball grid arrays. It then focuses on wafer level chip-scale packages, explaining that they are manufactured by building up interconnect structures directly on the silicon wafer before dicing. Key advantages of wafer level chip-scale packages are their small size, minimized inductance, and streamlined manufacturing process.
Our PCB 101 Presentation goes through the processes involved in manufacturing a printed circuit board.
From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper and production tolerances allow us to provide our customers exactly what they need for their end product.
A printed circuit board (PCB) is used in electronics to build electronic devices. It provides both a place to mount electronic components and the means to electrically connect them. A PCB has conducting copper layers that are typically coated with a green solder mask. Unwanted copper is removed via etching, leaving only the desired copper traces. Components, pads, traces, vias, and metal layers make up the basic structure and function of a PCB.
PCBs are non-conductive boards that hold electronic components and allow electricity to flow through circuitry etched onto their surfaces, and they have been used since the 1940s in devices like radios, computers, and appliances; PCBs can be single sided, double sided, or multilayered and come in rigid, flexible, or rigid-flex styles to suit different applications; They connect components like resistors, capacitors, and ICs through pads and traces on one or more metal layers.
This document provides guidelines for PCB design, including key principles of current flow, coupling, and stackup goals. It discusses protection devices, power generation, routing traces, vias, copper pours, grounding, decoupling capacitors, component selection, circuit mounting, and layout programs. Manufacturers for PCB ordering are also listed.
Floorplanning involves determining the approximate locations and shapes of modules on an integrated circuit to optimize the design for factors like area, wirelength, and timing. The goals are to partition the design into functional blocks, arrange the blocks, place macros and I/Os, and design the power distribution grid. Floorplanning algorithms use techniques like integer programming, rectangular dual graphs, and hierarchical and simulated annealing approaches to explore the design space and generate optimized floorplans. The outputs include the die area, placement of I/Os and macros, a preliminary power grid design, and definitions of standard cell placement regions.
This PPT Gives information about:
1. New component creation
2. Creating many parts in multiple packages
3. Creating Netlist
4. Design Rule Check
5. Generating Netlist from the schematics
6. Generating Bill Of Materials (BOM).
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
The document lists decimal equivalents of drill sizes from #1 to #80 in a table with 4 columns. It provides the size of each drill in inches in increments decreasing from 0.2280 inches for the #1 drill to 0.0135 inches for the #80 drill size.
Hebei General Metal Netting Co., Ltd produces various types of stainless steel wire mesh and wire cloth, including square opening mesh ranging from 1 to 635 meshes and cloth ranging from 12x64 mesh to 400x2800 mesh. The document provides details on weaving patterns and specifications for stainless steel wire mesh and cloth, including mesh count, wire diameter, opening size, opening area, and weight for various mesh sizes. Contact information is provided at the end for Hebei General Metal Netting Co., Ltd in China.
The DM3 Density Meter provides accurate continuous in-line density measurement of slurries in pipes. It uses a patented transducer to continuously weigh slurry passing through a reinforced rubber-lined flow tube, measuring density 110 times per second. Key features include its obstruction-free design, accurate direct mass measurement, abrasion-resistant flow tube, and simple installation and maintenance.
1) The document discusses DIN and ISO standards for metric hexagon head screws.
2) DIN 931 specifies dimensions for screws from M1.6 to M160, divided into parts 1 and 2 based on size.
3) ISO 4014 specifies dimensions for screws from M3 to M36, including thread diameter, pitch, and other dimensions.
This document provides specifications for various EE, EF, EI, EER and ETD magnetic core types including their dimensions, weight, effective parameters and magnetic characteristics. The dimensions, shapes, weights and other technical specifications are given for each core type in either Chinese or English units. Magnetic properties like inductance and maximum power are also listed for each core.
This document provides specifications for different types and sizes of power cables, including their nominal dimensions, weights, current carrying capacities, and other technical specifications. It includes data on both aluminum and copper conductor cables that are either unarmored or armored, with XLPE insulation, and conform to certain industry standards. The specifications are presented in tables with the cable properties listed for various standard cable sizes ranging from 35 to 1000 square mm.
This document provides specifications for ANSI B16.5 class 150 lb lap joint flanges in various pipe sizes from 1/2" to 24". It includes dimensions for the pipe outside diameter, flange overall diameter, inside diameter, thickness, lap length, hub diameter, drilling data including number of bolt holes, hole diameter, and circle diameter. Weight is also provided for each size flange. Tolerances for the flanges refer to additional specifications.
The document is a device modeling report for a digital transistor with part number DTD123YK manufactured by ROHM. It includes the components, manufacturer, and PSpice model parameters for the transistor. It also provides circuit simulation results comparing the transistor's ON characteristics, OFF characteristics, DC current gain, and output voltage versus output current to the datasheet specifications. The simulations show good agreement with errors generally below 3%.
The document lists standard resistor and capacitor values. For resistors, it provides 1%, 5%, and 10% tolerance values ranging from 10 ohms to 2.2 megohms. For capacitors, it lists values from 1 picofarad to 9100 microfarads. Both components have decade increments, with resistors having more options in the megohm range and capacitors having picofarad, nanofarad, microfarad, and millifarad values.
This document provides a summary of technical information useful for quantity surveyors and construction professionals. It includes conversion factors for units of measurement, formulas for mensuration, weights of common building materials, steel sections, and other reference tables. The tables provide data on densities, weights, and dimensions of various construction materials to allow for quick calculations and estimations.
The document discusses deposition rates, electrode efficiency, and electrode weld metal recovery, which are different metrics for measuring welding consumables. Deposition rate is the rate at which weld metal is deposited, while electrode efficiency is the percentage of filler metal that is deposited. Electrode weld metal recovery allows calculating the percentage of welding consumable that will end up in the finished weld. Tables provide the weight of weld metal deposited per meter for common weld geometries like triangles and rectangles at different thicknesses.
The document contains data from a conductivity test conducted over time on a solution with a concentration of magnesium. It includes measurements of conductivity, concentration, mass, load, and other variables taken at 10 second intervals from 10 to 430 seconds. The data is presented in a table and two graphs show trends in concentration and mass over time.
This document provides information about MCX connectors, including:
- MCX connectors are small coaxial connectors developed in Europe in the 1980s that provide consistent performance from DC to 6 GHz.
- The connectors are used in applications like GPS, wireless communication, and testing/instrumentation.
- Specifications and dimensions are provided for MCX plugs, jacks, and their electrical, mechanical, and environmental performance characteristics.
This document provides torque values and specifications for Hydril 553 tubing connections. It lists:
- Minimum and target make-up and yield torque values for various tubing sizes and steel grades.
- Dimensional specifications like pin and box dimensions, thread details, and critical section areas to aid in connection and string design.
- Performance features of the Hydril 553 connection like corrosion protection, sealing capability, and interchangeability with other Hydril connections.
Quirky's headcount grew steadily throughout 2011. By the end of the year, 239 ideas had been chosen and 36 products were on sale, with 29 in production and 74 in development. Total product revenue for 2011 was over $6.5 million, up 681% from 2010. The top 10 influencers earned over 63% of total rewards. Quirky announced a major retail partnership with a top 3 US retailer known for its community and design-centric approach. This partnership is expected to help drive further growth for Quirky in 2012.
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Pushing the limits of ePRTC: 100ns holdover for 100 days
Pcb design guidelines
1. PCB Design Guidelines
Below are a number of Guideline Rules to follow and keep in mind when designing PCBs. These are
general rules that apply for the most PCB fabricators, but it is advisable to check with your fabricator.
Board Size
PCB manufacturers have a maximum size board they can handle. Typically this is also their panel size. The
PCB fabrication house's panel size is also important when mass producing boards. In this situation one
would want to fit as many boards as possible on a panel with as little wasted board space as possible (in
order to reduce costs). Normal board spacing for routing (how boards are separated on a panel) is 0.3",
plus there is typically a 1.0" to 2.0" border on the board for handling it during processing.
Board thickness may also be specified. A standard thickness and type of board is .062" FR4. Other typical
board thickness are .010", .020", .031", and .092".
Trace Width and Spacing
The chemical and photographic processes used to produce a PCB put requirements on the minimum width
of trace and the minimum spacing between traces. If a trace is made smaller than this minimum width there
is some chance it will open (no connection) when manufactured. If two traces are closer together than the
minimum spacing there is some chance they will short when manufactured. These parameters are usually
specified as "x/y rules", where x is the minimum trace width and y is the minimum trace spacing. For
example, "8/10 rules" would indicate 8 mil minimum trace width and 10 mil minimum trace spacing. These
rules (especially spacing) apply to any metal on the PCB, including pad to track spacing and line widths for
strings on the PCB.
Typical modern process rules are 8/8 rules with values as small as 2/2 rules being available. For Press-n-
Peel people have had success using 12/12 rules, but values a little larger are easier to make work
consistently. However, keep in mind that the board must be soldered and a trace within 8 mils (8/8 rules) of
a pad is easier to short than one with greater spacing when hand soldered. For hand soldering 10/10 rules
are much easier to solder (if the design density can allow spacing this large).
Pad Sizes
The biggest issues with pad size are solder ability and manufacturability. Solder ability is really just a matter
of skill and will not be discussed here. Manufacturability is concerned with whether or not the pad will be
broken when the hold is drilled in it. This is mainly a function of the accuracy of the PCB manufacturer's
drilling. If a drill hole is slightly off center the pad may be broken at one edge possibly leading to an open in
the circuit. A standard requirement for pad sizes is a 5 mil annulus. This means there must be .005" all
around the hole (i.e. a 28 mil hole would require a 38 mil pad). Something a little larger than this (maybe 10
mils) is recommended for solder ability. AP Circuits states they have had relatively consistent success with
a 2.5 mil annulus (i.e. a 20 mil hole with only a 25 mil pad), but they don't recommend it.
Hole Sizes
Most PCB manufacturers have a wide selection of drill (hole) sizes available. Some charge per drill size
used, others offer a standard set of drill sizes for no charge and then charge for any non-standard drill sizes.
AP Circuits uses the latter approach. When choosing a hole size remember that the plate-through will cause
the hole to effectively be more narrow. The plate-through thickness varies from .001" to .003". AP Circuits'
2. plate-through thickness is approximately .015" (meaning the "finished hole" diameter is 3 mils smaller).
Standard Drill Sizes
Finished Hole
Drill Number Hole Size
Size
70 .028" .025"
65 .035" .032"
58 .042" .039"
55 .052" .049"
53 .0595" .056"
44 .086" .083"
1/8" .125" .122"
24 .152" .149"
Hole Density
Hole density is purely a cost issue. The more holes there are on a board the more wear and tear
manufacturing will put on the equipment (and thus the more the board will cost). Most PCB manufacturers
have a maximum hole density and boards with greater density are charged more. For AP Circuits, there is a
per hole charge for densities above 24 holes per square inch.
Drill Chart
Drill Drill Drill
Inches Inches Inches
No. No. No.
80 .0135 53 .0595 27 .1440
79 .0145 52 .0635 26 .1470
78 .0160 51 .0670 25 .1495
77 .0180 50 .0700 24 .1520
76 0200 49 .0730 23 .1540
75 .0210 48 .0760 22 .1570
74 .0225 47 .0785 21 .1590
12. More
0.0002/V
than 0.0001/V
0.001/V
0.00012/V 0.00012/V 0.00012/V 0.00012/V
500
A1 - Internal Conductors
A2 - External Conductors, uncoated, sea level to 10,000 ft.
A3 - External Conductors, uncoated, over 10,000 ft.
A4 - External Conductors, with permanent polymer coating (Solder Mask).
A5 - External Conductors, with conformal coating over assembly.
A6 - External Component lead/termination, uncoated.
A7 - External Component lead/termination, with conformal coating.
Electrical Design Factors
Conductor Capacitance
C = 0.31 a/b + 0.23(1 + k) log10 (1 + 2b/d +2b + b2/d2)
Where
k = Substrate dielectric constant
a = Conductor thickness
b = Width of conductor in inches
d = Distance between conductors in inches
Conductor Resistance
R = 0.000227W
Where
W = Width of conductor
Characteristic Impedance
Zo = R + jwL / G + kwC
Where
Zo = Apparent Z of an infinitely long line in ohms
R = Resistance in ohms
L = Inductance in Henries
G = Conductor per unit length of line in mhos
C = Capacitance in farads
Characteristic Impedance for a Micro Strip
Zo = (h/W) (377 / (Sqrt. er) {1 + (2h/PI W)[1 + ln(PI W/h)]}
Where
h = Dielectric thickness
13. W = Micro Strip width
er = Effective dielectric constant of substrate
1-800-319-3599
E-Mail: info@pcbdesignandfab.com