The Laboratory of Vacuum Technologies develops and produces vacuum components and customized coating deposition systems. It offers magnetrons, ion beam sources, plasma generators, and other vacuum equipment. The laboratory has expertise in magnetron sputtering, ion beam cleaning and etching, plasma nitriding, evaporation, and other vacuum coating processes. It also provides engineering consulting, maintenance services, and refurbishment of existing vacuum process tools. Key capabilities include high deposition rates up to 40 μm/min, large area etching, and customized systems for specialized applications.

1. Laboratory of
Vacuum Technologies Plus, LLC

2. Our competence in
Technology
• magnetron sputtering for deposition of metals and dielectrics;
• ion beam cleaning, etching, sputtering, polishing;
• electron beam melting and evaporation;
• low pressure plasma nitriding;
• high rate magnetron evaporation (up to 40 µm/min);
• large area high rate ion and plasma chemical etching (Si and GaAs up to 40 µm/min, SiO2
– up to 6
µm/min, Cu – up to 0,4 µm/min)
• PECVD for semiconductor, optical and protection layers deposition
• vacuum arc and pulsed arc deposition; DLC coatings;
• thermal evaporation of pure metals, alloys and compositions.

3. Our competence in
Design and Assembly of devices/ components for sputter tools
20 years experience of component design and production for different sputter systems.
The range of devices includes:

magnetron sputtering sources

ion beam sources for cleaning, etching and sputtering,

plasma sources,

arc and pulsed arc evaporators,

electon beam guns,

resistive heating evaporation systems and powder feeders for them,

heaters.
Additional: customer tailored power supplies, vacuum gauges, control systems, etc.

4. Our competence in
Customized PVD systems
We offer for more than 10 years standard and customized PVD systems do to increased market demand
for complete technology solutions in Russia.
In house assembly, broad range of different applications (coaters, ion beam and plasma etching
systems, e-beam melting furnaces and systems for some special applications upon customer
requirements.

5. Our components for PVD tools:
Plasma sources

6. Two Plasma sources from our assembly line
RFPG-250 RFPG-128
For uniform treatment of large
surfaces or volumes
Housing diameter 245 mm
ion flux density up to 25 mA/cm2 with
high uniformity
Housing diameter 128 mm
ion flux density up to 50 mA/cm2
For high density plasma generation or
implementation into a small system

7. Plasma sources provide dense electrodeless plasma that can be used for different applications.
• Cleaning and activation
• Ion plasma and plasmachemical etching
• Assisted deposition
• Sputtering
• Surface modification (polishing, nitriding, oxydation)
• Two-step deposition of compositions
Plasma sources applications

8. Plasma properties
100 Pa 10 Pa
1 Pa
0.1 Pa

9. Ion current density
RFPG-250 vs. RFPG-128

10. An example of RFPG application
X82WMoCrV6 steel sample
• Ion beam source cleaning
• Nitriding at 450°C for 30 minutes in Nitrogen
RFPG plasma
• Deposition of (TiAlCrY)N/ZrN multilayer coating
from a magnetron with RFPG assistance
Resulting microhardness is 68 GPa

11. Scalable for different applications
Our components for PVD tools:
Linear and circular Ion Beam Sources

12. Anode layer type ion beam sources
(inverted magnetron)
A wide range of applications:
sputtering of materials both dielectric and conductive targets;
magnetron sputtering assistance;
ion cleaning, etching;
polishing;
plasma-enhanced chemical vapor deposition (PECVD);
surface modification.

13. Technical data
Parameter IBS-125 IBS-145 IBS-400 IBS-600 IBS-700 IBS-800
Supply voltage, kV 1.5-5
Mean ion energy Approx. of supply voltage½
Maximum beam current, A* 0.3 0.4 1.0 1.5 1.75 2.0
Gas efficiency, mA/sccm* 10
Electrode lifetime (Ar at maximal
current), hours** 200
Beam shape Hollow rectangular
Beam size, WхT, mm 100х42 120x42 375х42 575х42 675x42 775x42
Beam divergence angle 2°
Maximum operating pressure, Pa 10
Work gas Ar, H2
, He, Xe, O2
, N2
, Ne, Cx
Hy
, CO2
, Cx
Fy
* Parameters measured in the following conditions:
Argon, voltage 3 kV, chamber pressure 0.1 Pa
** Electrodes are sputtered in inert gases except He only .

14. IBS-125

15. Current vs Voltage graph Current vs gas flow rate graph
(IBS-145)
Gas – N2, flow rates (sccm) are shown in the legend Supply voltage 3000 Volts
500 1000 1500 2000 2500 3000 3500
0
50
100
150
200
250
300
350
400
450
0,67
0,64
0,58
0,53
0,47
0,42
0,36
0,31
Supply voltage, V
Beamcurrent,mA
0,00 5,00 10,0015,0020,0025,0030,0035,0040,0045,00
0
50
100
150
200
250
300
350
400
450
f(x) = 8,9 x
f(x) = 10,0 x
Gas flow, sccm
Beamcurrent,mA
Ar
N2

16. IBS-600..800
Device A
IBS-400 398
IBS-600 598
IBS-700 698
IBS-800 798

17. IBS-52
Narrow cylindrical ion beam that is ideal for sputtering of small
targets, polishing and other applications that require high sputtering
rate on a small spot.
Ion current up to 160 mA with mean ion energy up to 2500 eV is
concentrated on a 25 mm spot. E.g. 20 μm Iron foil is etched through
in 25 minutes.
Low deflection of the beam allows to place the source away from a
target to prevent its contamination with the sputtered material.

18. IBS-52 technical data
Parameter Value
Voltage, kV 2.5..5
Beam shape Circular, tubular
Beam diameter, mm 20
Housing diameter, mm 52
Housing length, mm 80
Maximum beam current, mA* 160
Gas efficiency, mA/sccm* 6
Beam angle, maximum, º 2
Operating pressure range in the
chamber, Pa
0.001..10
Weight (kg) 0.3
*plasma-forming gas at 5 kV supply voltage: Ar
* Parameters measured in the following conditions:
Argon, voltage 3 kV, chamber pressure 0.1 Pa .

19. Special Customer application:
High rate magnetron evaporation
This technology has a combination of benefits of
thermal evaporation and magnetron sputtering

high deposition rate (10 grams/min)

a substantial material volume

high quality of the deposited films and perfect
adhesion due to high vapor ionization

20. Special Customer application:
Cr deposition upon an Al alloy substrate
Back side 1 µm
Front side 7 µm
Element concentration across the film boundary

21. Summary
Laboratory of Vacuum Technologies (Beams&Plasmas®) develops and produces vacuum components,
standard and customized tools for coating deposition.
State-of-the-art technical concepts, high reliability and capacity, as well as reasonable prices and
compact sizes are distinguishing features of our machines.
We offer:

Vacuum components for process equipment (magnetrons, ion beam sources, plasma generators,
vacuum system matching units, sensors and accessories)

Engineering and technology consultancy

Maintenance and repair of vacuum equipment

Refit of the existing vacuum process equipment
Laboratory of Vacuum Technologies Plus, LLC
Deputy Director for Research and Development
Grigoriev Vassily
Zelenograd, Russia
E-mail: vgrig@e-beam.ru
Phone +7 (499) 346 0667
http://e-beam.ru
BeamTec GmbH
Managin Director
Ralph Kempter
Ulm, Germany
E-mail: rkempter@beamtec.de
Phone +49 731 146620-0
Fax +49 731 146620-99
http://beamtec.de