The document summarizes information about the Centro de Tecnologia da Informação Renato Archer (CTI Renato Archer), a Brazilian research and development institution. It details that CTI has 600 personnel working across various technology areas, including hardware design, microsystems, software quality, and more. The document also provides an overview of CTI's facilities and infrastructure for microfabrication, packaging, reliability testing, and other areas.
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining thousands of transistors into a single chip. VLSI began in the 1970s when complex semiconductor and communication technologies were being developed. The microprocessor is a VLSI device.
Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform. An electronic circuit might consist of a CPU, ROM, RAM and other glue logic. VLSI lets IC designers add all of these into one chip.
The electronics industry has achieved a phenomenal growth over the last few decades, mainly due to the rapid advances in large scale integration technologies and system design applications. With the advent of very large scale integration (VLSI) designs, the number of applications of integrated circuits (ICs) in high-performance computing, controls, telecommunications, image and video processing, and consumer electronics has been rising at a very fast pace.
The current cutting-edge technologies such as high resolution and low bit-rate video and cellular communications provide the end-users a marvelous amount of applications, processing power and portability. This trend is expected to grow rapidly, with very important implications on VLSI design and systems design.
Call for papers - 4th International Conference on Signal, Image Processing (S...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
7th International Conference on Signal and Image Processing (SIPRO 2021)sipij
7th International Conference on Signal and Image Processing (SIPRO 2021) is a forum for presenting new advances and research results in the fields of Digital Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. The scope of the conference covers all theoretical and practical aspects of the Signal, Image Processing & Pattern Recognition. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experience.
Call for papers - 4th International Conference on Signal, Image Processing (...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th international conference on signal image processingsipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th International Conference on Signal, Image Processing (...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th International Conference on Signal, Image Processing (S...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining thousands of transistors into a single chip. VLSI began in the 1970s when complex semiconductor and communication technologies were being developed. The microprocessor is a VLSI device.
Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform. An electronic circuit might consist of a CPU, ROM, RAM and other glue logic. VLSI lets IC designers add all of these into one chip.
The electronics industry has achieved a phenomenal growth over the last few decades, mainly due to the rapid advances in large scale integration technologies and system design applications. With the advent of very large scale integration (VLSI) designs, the number of applications of integrated circuits (ICs) in high-performance computing, controls, telecommunications, image and video processing, and consumer electronics has been rising at a very fast pace.
The current cutting-edge technologies such as high resolution and low bit-rate video and cellular communications provide the end-users a marvelous amount of applications, processing power and portability. This trend is expected to grow rapidly, with very important implications on VLSI design and systems design.
Call for papers - 4th International Conference on Signal, Image Processing (S...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
7th International Conference on Signal and Image Processing (SIPRO 2021)sipij
7th International Conference on Signal and Image Processing (SIPRO 2021) is a forum for presenting new advances and research results in the fields of Digital Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. The scope of the conference covers all theoretical and practical aspects of the Signal, Image Processing & Pattern Recognition. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experience.
Call for papers - 4th International Conference on Signal, Image Processing (...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th international conference on signal image processingsipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th International Conference on Signal, Image Processing (...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 4th International Conference on Signal, Image Processing (S...sipij
4th International Conference on Signal, Image Processing (SIPO 2020) is a forum for presenting new advances and research results in the fields of Signal and Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Call for papers - 6th International Conference on Signal Processing and Patte...sipij
6th International Conference on Signal Processing and Pattern Recognition (SIPR 2020) is a forum for presenting new advances and research results in the fields of Digital Processing and Pattern Recognition. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences
Call for papers - 6th International Conference on Signal Processing and Patte...sipij
6th International Conference on Signal Processing and Pattern Recognition (SIPR 2020) is a forum for presenting new advances and research results in the fields of Digital Processing and Pattern Recognition. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences
This is a technical review for electrical and mechanical engineers and project managers involved in designing your next-generation products. We will cover the two processes for producing 3-dimensional molded interconnects; Double-Shot molding and Laser Direct Structuring, with an emphasis on laser direct structuring.
Call for papers - 8 th International Conference on Signal and Image Processin...sipij
8
th International Conference on Signal and Image Processing (SIGL 2021) is a forum for
presenting new advances and research results in the fields of Digital Image Processing. The
conference will bring together leading researchers, engineers and scientists in the domain of
interest from around the world. The scope of the conference covers all theoretical and practical
aspects of the Signal, Image Processing & Pattern Recognition.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
AI and Machine Learning Demystified by Carol Smith at Midwest UX 2017Carol Smith
What is machine learning? Is UX relevant in the age of artificial intelligence (AI)? How can I take advantage of cognitive computing? Get answers to these questions and learn about the implications for your work in this session. Carol will help you understand at a basic level how these systems are built and what is required to get insights from them. Carol will present examples of how machine learning is already being used and explore the ethical challenges inherent in creating AI. You will walk away with an awareness of the weaknesses of AI and the knowledge of how these systems work.
Call for papers - 6th International Conference on Signal Processing and Patte...sipij
6th International Conference on Signal Processing and Pattern Recognition (SIPR 2020) is a forum for presenting new advances and research results in the fields of Digital Processing and Pattern Recognition. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences
Call for papers - 6th International Conference on Signal Processing and Patte...sipij
6th International Conference on Signal Processing and Pattern Recognition (SIPR 2020) is a forum for presenting new advances and research results in the fields of Digital Processing and Pattern Recognition. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences
This is a technical review for electrical and mechanical engineers and project managers involved in designing your next-generation products. We will cover the two processes for producing 3-dimensional molded interconnects; Double-Shot molding and Laser Direct Structuring, with an emphasis on laser direct structuring.
Call for papers - 8 th International Conference on Signal and Image Processin...sipij
8
th International Conference on Signal and Image Processing (SIGL 2021) is a forum for
presenting new advances and research results in the fields of Digital Image Processing. The
conference will bring together leading researchers, engineers and scientists in the domain of
interest from around the world. The scope of the conference covers all theoretical and practical
aspects of the Signal, Image Processing & Pattern Recognition.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
AI and Machine Learning Demystified by Carol Smith at Midwest UX 2017Carol Smith
What is machine learning? Is UX relevant in the age of artificial intelligence (AI)? How can I take advantage of cognitive computing? Get answers to these questions and learn about the implications for your work in this session. Carol will help you understand at a basic level how these systems are built and what is required to get insights from them. Carol will present examples of how machine learning is already being used and explore the ethical challenges inherent in creating AI. You will walk away with an awareness of the weaknesses of AI and the knowledge of how these systems work.
Implementing AI: Running AI at the Edge: Embedding low-cost intelligence with...KTN
The Implementing AI: Running AI at the Edge, hosted by KTN and eFutures, is the second event of the Implementing AI webinar series.
To make products more intelligent, more responsive and to reduce the data generated, it is advantageous to run AI on the product itself, as opposed to in the cloud.
The focus of this webinar was the opportunities and challenges of moving the AI processing to “the Edge”. The webinar had four presentations from experts covering overviews of the opportunity, implementation techniques and case studies.
Find out more: https://ktn-uk.co.uk/news/just-launched-implementing-ai-webinar-series
Exploring PCBLOOP: Innovations in PCB Fabrication and Assembly Technologypcbloop2
Welcome to PCBLOOP, your go-to place for all things PCB fabrication and assembly! With over 20 years of experience, we're experts in making printed circuit boards (PCBs). Our goal is simple: we want to make the best PCBs for our customers, whether they need a few or thousands. We care about quality, speed, and cost-effectiveness.
At PCBLOOP, we have top certifications like ISO 9001 and RoHS, showing our commitment to high standards and environmental friendliness. We believe in diversity, so we welcome people from all backgrounds to bring fresh ideas to the table.
We value our employees and offer them competitive pay, great benefits, and a supportive work environment. Whether you're starting or have years of experience, we have opportunities for you. Join us at PCBLOOP and be part of a company that's leading the way in PCB technology. Visit our website: https://www.pcbloop.com/pcb-fabrication/
Robozz Lab is a premier provider of electronic solution. Our company deals in electronics import/export and manufacturing.
We take pleasure in introducing ourselves as the technical training & electronics solution provider for corporate houses and technical institutions. We manufacture more than 20 electronic products for laboratories, industries and individuals. We also offer training and development services to industry and students.
Our work is divided into mainly three domains:
• Trainings: With the aim to spread high level knowledge based practical education, we introduce our state of art training center with all advance facilities and unique course modules. All our trainers have industry exposure and have worked on many commercial products. Our training equipments have been designed and developed in-house, which gives students an opportunity to see complete product development cycle. All of our training programs are offered in-campus as well as at our training centers.
• Products: Our products range starts with basic microcontroller development boards to advance products like RFID readers, laboratory trainer kit, score boards etc. Our in house mechanical fabrication and electronic fabrication unit give us confidence to provide export quality goods.
• Services: Since last one year we have being serving electronic industry for customized solution developments. This includes atomization of existing machinery, firmware development for embedded device, programming of PLCs, development of schematic and PCB designs.
Thanks & Regards
Robozz Lab
+91-8253-011-002
+91-7806-093-134
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
2. R&D Total Personnel
PhD
MS
BS
Tech
Centro de Tecnologia da Informação Renato Archer
Figures:
– Total area = 320.000 m2
– Built area= 14.000 m2
– Personnel = 600
2010 Budget:
– OGU: R$ 12M
– Projects: R$ 22M
– Total: R$ 34M
3. Microelectronics Software Applications
R&D Areas
HW and IC Design
Microsystems
Packaging
Qualification of
Electronic Products
Surface Interaction
and Displays
Software Quality
and Process
Improvement
Information
System Security
Software
Development
Robotics and
Computer Vision
Decision Support
Systems
3D Technologies
MISSION: Create, apply and disseminate knowledge in Information Technology, in
articulation with other social and economic agents, promoting innovations according to
society demands.
4. Final Commercial
Product
Digital, Analog and RF
0,18 µm Technology
1st batch from Foundry
Engineering Phase
Test on Protoboard
Backend & Final Tests
Geometrical Description
Functional blocs
Symbolic language descriptionSimulation
Design House
5. Main Tools:
Mask Fabrication Wet bench
Mask aligner MJB3
Magnetron sputtering Balzers BAS 450
Optical profilemeter Zygo
Pattern Generator Heidelberg DWL66
Clean rooms:
400 m2, Class 1000 & 100 w. tunnel class 10
Microfabrication and Microsystems
Infrastructure
14. [1] R. R. Tummala,
MOORE'S LAW MEETS ITS
MATCH, IEEE Spectrum, p.
44, June 2006.
IC Packaging: More-than-Moore
14
15. DSL CO Linecards
1996
1st Gen
Single Channel
1998
2nd Gen
Dual Ch
1999
3rd Gen
Dual Ch
2000
4th Gen
Quad Ch
2001
5th Gen
Octal Ch
2002
6th Gen
Octal Ch
IC Packaging: SOC – Saving Space
15
16. AR5
BOM
Manufacturing
Process
Technology
2000
5 chips
740 discretes
u CMOS
u Analog
u Flash
u SDRAM
2005 – AR5
3 chips
415 discretes
u CMOS
u Analog
u Flash
u SDRAM
1 chip
<50 discretes
u CMOS
u Analog
u Flash
u SDRAM
Memory
Comms
Processor
Digital
PHY
Analog
Codec
Line
Driver
Line
Receiver
740
Discretes
Memory
Comms
Processor
Digital
PHY
415
Discretes
AFE
Memory
<50
Discretes
Single-Chip
DSL Modem
IC Packaging: SOC Integration
16
17. IC Packaging: 3D SoP
[1] R. R. Tummala, MOORE'S LAW MEETS ITS MATCH, IEEE Spectrum, p. 44, June 2006.
17