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Confidential - 3Dtronic - 2015
3Dtronic
Presentation: 3D-MID Technology
Molded Interconnect Device
3Dtronic Mission
• Support the Brazilian Electronic Industry to develop
products using MID Technology by providing Education,
Design and Prototyping services of MID products and
devices.
2Confidential - 3Dtronic - 2015
3Dtronic Services
• Consulting for redesign and new products
• Design Specification
• Mechanical and Electronic Design
• MID Prototyping
• Debug and tests
• Design Documentation
• 3D-MID Training Services
3Confidential - 3Dtronic - 2015
Electronics Devices Importation
4
In US$Million, includind MID Devices Source: ABINEE
Confidential - 3Dtronic - 2015
Trade balance of electrical and
electronic products
5
In US$Billion, due to absence of technology Source: ABINEE
Confidential - 3Dtronic - 2015
Millions of MID Antennas
6
Source: ABINEE
Confidential - 3Dtronic - 2015
Molded Interconnect Devices
• The use of high
temperature thermoplastics
and their structured
metallization opens up a
new dimension of circuit
carrier design to the
electronic industry: Molded
Interconnect Devices (MID).
MID are injected molded
thermoplastic parts with
integrated circuit traces.
7Confidential - 3Dtronic - 2015
Industrial Applications for 3D MID
Technology
• Automotive industry
• Medical technology
• Consumer electronics
• Computer technology
• Aircraft and space industry
• Household appliances
• Industry automatization
• Robotics and Mechatronics
• LED Lighting
8Confidential - 3Dtronic - 2015
Advantages
• Designing New Products Using 3-Dimensional Molded
Interconnect Devices you can reduce:
– Size, weight and complexity of assemblies
– And to reduce Costs – through reduction in number of
components, wires, interconnects and assembly time
• Improvements:
– Reliability
– Functionality
9Confidential - 3Dtronic - 2015
MID Process in Short
• Injection molding
• Laser processing (LDS)
• Metallization
10
- LDS is a mature, robust technology
- Cell Phone Antenna production is
largest application, with ten’s of
millions produced annually
- Europe is currently experiencing
rapid growth in automotive, with
BMW taking the lead, medical
devices, antennas systems, sensors
and RF-ID tags
Confidential - 3Dtronic - 2015
Market MID (LDS)
Source: LPKF Laser & Electronics AG
11Confidential - 3Dtronic - 2015
Applications - Communication
• Antenna for cell phones, tablets, computers and
Internet of Things
12Confidential - 3Dtronic - 2015
Applications - Automotive
13Confidential - 3Dtronic - 2015
Applications - Automotive
14
• TRW’s “Base-Line” MID after assembly:
Source: I&T 3D-Produktionsgesellschaft mbH
Confidential - 3Dtronic - 2015
Applications - Automotive
Former device
Diameter approx. 10mm
Prototype new Sensor
Diameter: 5mm
Realized by Flip Chip on
LPKF-LDS® MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Final Part
15Confidential - 3Dtronic - 2015
Applications - Medical
16Confidential - 3Dtronic - 2015
Applications - RFID
17
Source: Harting Mitronics AG
•RFID-Transponder
Confidential - 3Dtronic - 2015
Applications – Micro Packaging
18Confidential - 3Dtronic - 2015
Applications – Ligthing
19Confidential - 3Dtronic - 2015
Applications – Others
20Confidential - 3Dtronic - 2015
Source: Multiple Dimensions AG
THANK YOU!
www.3dtronic.com.br
Office: +55 11 4473-1984
Mobile: +55 11 94125-5227
Email: contato@3dtronic.com.br
Confidential - 3Dtronic - 2015 27

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3D MID Technology Presentation Outlines Benefits and Applications

  • 1. Confidential - 3Dtronic - 2015 3Dtronic Presentation: 3D-MID Technology Molded Interconnect Device
  • 2. 3Dtronic Mission • Support the Brazilian Electronic Industry to develop products using MID Technology by providing Education, Design and Prototyping services of MID products and devices. 2Confidential - 3Dtronic - 2015
  • 3. 3Dtronic Services • Consulting for redesign and new products • Design Specification • Mechanical and Electronic Design • MID Prototyping • Debug and tests • Design Documentation • 3D-MID Training Services 3Confidential - 3Dtronic - 2015
  • 4. Electronics Devices Importation 4 In US$Million, includind MID Devices Source: ABINEE Confidential - 3Dtronic - 2015
  • 5. Trade balance of electrical and electronic products 5 In US$Billion, due to absence of technology Source: ABINEE Confidential - 3Dtronic - 2015
  • 6. Millions of MID Antennas 6 Source: ABINEE Confidential - 3Dtronic - 2015
  • 7. Molded Interconnect Devices • The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID). MID are injected molded thermoplastic parts with integrated circuit traces. 7Confidential - 3Dtronic - 2015
  • 8. Industrial Applications for 3D MID Technology • Automotive industry • Medical technology • Consumer electronics • Computer technology • Aircraft and space industry • Household appliances • Industry automatization • Robotics and Mechatronics • LED Lighting 8Confidential - 3Dtronic - 2015
  • 9. Advantages • Designing New Products Using 3-Dimensional Molded Interconnect Devices you can reduce: – Size, weight and complexity of assemblies – And to reduce Costs – through reduction in number of components, wires, interconnects and assembly time • Improvements: – Reliability – Functionality 9Confidential - 3Dtronic - 2015
  • 10. MID Process in Short • Injection molding • Laser processing (LDS) • Metallization 10 - LDS is a mature, robust technology - Cell Phone Antenna production is largest application, with ten’s of millions produced annually - Europe is currently experiencing rapid growth in automotive, with BMW taking the lead, medical devices, antennas systems, sensors and RF-ID tags Confidential - 3Dtronic - 2015
  • 11. Market MID (LDS) Source: LPKF Laser & Electronics AG 11Confidential - 3Dtronic - 2015
  • 12. Applications - Communication • Antenna for cell phones, tablets, computers and Internet of Things 12Confidential - 3Dtronic - 2015
  • 14. Applications - Automotive 14 • TRW’s “Base-Line” MID after assembly: Source: I&T 3D-Produktionsgesellschaft mbH Confidential - 3Dtronic - 2015
  • 15. Applications - Automotive Former device Diameter approx. 10mm Prototype new Sensor Diameter: 5mm Realized by Flip Chip on LPKF-LDS® MID Source: Robert Bosch GmbH Rotation Sensor for Automotive Brake System (ESP) Final Part 15Confidential - 3Dtronic - 2015
  • 17. Applications - RFID 17 Source: Harting Mitronics AG •RFID-Transponder Confidential - 3Dtronic - 2015
  • 18. Applications – Micro Packaging 18Confidential - 3Dtronic - 2015
  • 20. Applications – Others 20Confidential - 3Dtronic - 2015 Source: Multiple Dimensions AG
  • 21. THANK YOU! www.3dtronic.com.br Office: +55 11 4473-1984 Mobile: +55 11 94125-5227 Email: contato@3dtronic.com.br Confidential - 3Dtronic - 2015 27