2. 3Dtronic Mission
• Support the Brazilian Electronic Industry to develop
products using MID Technology by providing Education,
Design and Prototyping services of MID products and
devices.
2Confidential - 3Dtronic - 2015
3. 3Dtronic Services
• Consulting for redesign and new products
• Design Specification
• Mechanical and Electronic Design
• MID Prototyping
• Debug and tests
• Design Documentation
• 3D-MID Training Services
3Confidential - 3Dtronic - 2015
5. Trade balance of electrical and
electronic products
5
In US$Billion, due to absence of technology Source: ABINEE
Confidential - 3Dtronic - 2015
6. Millions of MID Antennas
6
Source: ABINEE
Confidential - 3Dtronic - 2015
7. Molded Interconnect Devices
• The use of high
temperature thermoplastics
and their structured
metallization opens up a
new dimension of circuit
carrier design to the
electronic industry: Molded
Interconnect Devices (MID).
MID are injected molded
thermoplastic parts with
integrated circuit traces.
7Confidential - 3Dtronic - 2015
8. Industrial Applications for 3D MID
Technology
• Automotive industry
• Medical technology
• Consumer electronics
• Computer technology
• Aircraft and space industry
• Household appliances
• Industry automatization
• Robotics and Mechatronics
• LED Lighting
8Confidential - 3Dtronic - 2015
9. Advantages
• Designing New Products Using 3-Dimensional Molded
Interconnect Devices you can reduce:
– Size, weight and complexity of assemblies
– And to reduce Costs – through reduction in number of
components, wires, interconnects and assembly time
• Improvements:
– Reliability
– Functionality
9Confidential - 3Dtronic - 2015
10. MID Process in Short
• Injection molding
• Laser processing (LDS)
• Metallization
10
- LDS is a mature, robust technology
- Cell Phone Antenna production is
largest application, with ten’s of
millions produced annually
- Europe is currently experiencing
rapid growth in automotive, with
BMW taking the lead, medical
devices, antennas systems, sensors
and RF-ID tags
Confidential - 3Dtronic - 2015
15. Applications - Automotive
Former device
Diameter approx. 10mm
Prototype new Sensor
Diameter: 5mm
Realized by Flip Chip on
LPKF-LDS® MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Final Part
15Confidential - 3Dtronic - 2015