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ICT Proposers' Day 2019 Side Event, Visit 1


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ICT Proposers' Day 2019 Side Event, visit 1: Microelectronics and printed intelligence pilot and demonstration facilities

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ICT Proposers' Day 2019 Side Event, Visit 1

  1. 1. Welcome to Visit 1: Microelectronics and Printed Intelligence Pilot and Demonstration Facilities Host: Tauno Vähä-Heikkilä, VTT #ICTpropday #vttbeyondtheobvious 20/09/2019 VTT – beyond the obvious
  2. 2. 20/09/2019 VTT – beyond the obvious Micronova Centre for Micro and Nanotechnology Himadri Majumdar, VTT Printocent Pilot Manufacturing for Printed Intelligence Jukka Hast, VTT OtaNano Jukka Pekola, Aalto University Silicon Photonics Timo Aalto, VTT Antennas and RF Technologies Pekka Rantakari, VTT Visit of the Micronova Facility Agenda
  3. 3. MICRONOVA Centre for Micro and Nanotechnology Himadri Majumdar #ICTpropday #VTTbeyondtheobvius 20/09/2019 VTT – beyond the obvious 3
  4. 4. 20/09/2019 Owned by Ministry of Economic Affairs and Employment VTT – beyond the obvious VTT – beyond the obvious Established in 1942 268M€ Net turnover and other operating income (VTT Group 2018) 2,049 Total of personnel (VTT Group 31.12.2018) 44% From the net turnover abroad (VTT Group 2018) 31% Doctorates and Licentiates (VTT Group 2018) VTT is one of the leading research, development and innovation organizations in Europe. We help our customers and society to grow and renew through applied research. The business sector and the entire society get the best benefit from VTT when we solve challenges that require world-class know-how together and translate them into business opportunities. Our vision A brighter future is created through science-based innovations. Our mission Customers and society grow and renew through applied research. Strategy Impact through scientific and technological excellence. 4
  5. 5. VTT is a key actor in the Finnish innovation ecosystem 20/09/2019 VTT – beyond the obvious • Innovation partner to companies • Finland’s biggest single actor in EU’s framework programmes • Participates in ca. 30 national technology programmes (Business Finland, Academy of Finland) • Strategic partnerships with main universities • Participates in two Academy of Finland Centers of Excellence and in four Flagship Programme 5
  6. 6. VTT is one of the most appreciated and active Horizon 2020 programme participants. VTT has won EUR 134 million in research funding from the H2020 programme in 2014 to 2018. This represents 17% of the funding won by the Finnish participants. 20/09/2019 VTT – beyond the obvious 6 European Research Ranking: VTT ranked 4th in Horizon 2020
  7. 7. VTT’s research projects 20/09/2019 VTT – beyond the obvious 7 COMMERCIAL PROJECTS Impact: • Building competitiveness for VTT’s customers through world-class research and innovation services JOINTLY FUNDED PROJECTS Impact: • More efficient technology transfer • Foundation for new innovations and political decision-making SELF-FINANCED PROJECTS Impact: • Developing VTT’s own competitiveness and acquiring knowledge and expertise to meet future customer needs 1 2 3
  8. 8. 20/09/2019 VTT – beyond the obvious 8 VTT’s R&D infrastructure – an essential part of the national research infrastructure Bioruukki Biotechnology and food research piloting environment ROVIR A pilot-scale research environment for fibre processes Centre for Nuclear SafetyEngine and vehicle laboratory Micronova VTT MIKES MetrologyPrintoCent
  9. 9. 20/09/2019 VTT – beyond the obvious 9 Micronova is the largest R&D cleanroom in Nordics for fabrication of silicon based microstructures A national research infrastructure in the field of microelectronics and nanotechnology • VTT, Aalto University and companies • Both academic and applied research • Pilot and small scale production Cleanroom environment enables versatile innovation projects
  11. 11. VTT – beyond the obvious 11 Micronova Facilities Main Cleanroom Characteristics Total Area 2 600 m2 Cleanroom Classification ISO 4…ISO 6 Temperature 21 C  0,5 C Relative humidity 45 %  5 Labs with built-in Cleanroom  Micro-packaging lab - dicing saws, wire bonding  SubTech lab - Ion implantation, CMP, backgrinder, wafer bonder
  12. 12. Existing Technology Platforms Silicon Photonics Hyperspectral Components MEMS Technologies Quantum Devices Silicon Detectors Silicon Photonics solutions based on a novel, low-loss thick SOI platform. Optical MEMS-based & Piezo Fabry-Perot filters for spectroscopy applications Surface MEMS, SOI MEMS and Piezo-MEMS CSOI processing capabilities. Superconducting and tunnel-junction devices Pixel detectors for medical and high energy physics applications. Developed within research projects over multiple years, platforms listed are mature enough for VTT Memsfab to offer manufacturing services 20/09/2019 VTT – beyond the obvious 12
  13. 13. 13 Equipment and Process Overview Lithography i-line stepper, 5:1, 0.35 µm CD Contact/proximity aligners Electron-beam writing Nanoimprinting (step&stamp) Etching Polysilicon/nitride Oxide; thin film and Advanced Oxide Etching Metals; Al, Mo, Ti-W, Nb (TCP) Deep silicon etching; production and R&D Anhydrous HF vapour Ion trimming Wet etching, various; critical-point drying Deposition Six sputtering tools LPCVD of nitride, poly, and oxide (TEOS, LTO) PECVD; nitride and oxide ALD: aluminium oxide, titanium oxide Parylene Ion implantation Medium-current; n- or p-type doping of silicon Plating, spin-coating Cu (via or wiring), Ni, Sn-Ag, Sn-Pb, In-Sn, Au Polyimide, BCB 3D integration CMP of Si/oxide or copper Direct wafer bonding Grinding Spin-etching Thin-wafer handling Ion trimming Backend Dicing, flip-chip and wire bonding 20/09/2019 VTT – beyond the obvious
  14. 14. 20/09/2019
  15. 15. PrintoCent pilot manufacturing for printed intelligence Prof. Dr. Jukka Hast Research Manager Sensing and Integration +358 40 587 0069 20.9.2019 VTT – beyond the obvious 15
  16. 16. Contents  What is Printed Intelligence?  Research today at VTT  Position  Infra  Some research highlights  PrintoCent Industry Cluster  Spin-offs VTT – beyond the obvious 16
  17. 17. What is Printed intelligence? Printed intelligence are components and systems which:  extend the functions of printed matter beyond traditional visually interpreted text and graphics  perform actions as a part of functional products or wider information systems Printed intelligence is combined multidisciplinary know-how of  Electronics, photonics, biotechnology, nanotechnology, chemistry, printing, hybrid integration and process automation Key application areas are:  Structural electronics and photonics  Stretchable and wearable electronics  Diagnostics and biosensors  … VTT – beyond the obvious 17
  18. 18. Research teams (100+ people in Oulu & Espoo):  Flexible electronics integration (Oulu)  Concept creation for smart surroundings, large-area surfaces and wearables  Hybrid integration R&D & PrintoCent Pilot Factory  Printed electronic processing (Oulu)  Printed optoelectronics (OPV, OLED, OPD)  Nano- and microstructure replication (hot embossing and nano-imprinting)  Flexible sensors and devices (Espoo)  Printed sensors and indicators including paper-based diagnostics  Sensor read-out electronics (transistors, memories, circuits)  Biosensors (Oulu/Espoo)  Assay platforms with printed functionality  Diagnostic systems (assay platform and reader devices)  Tailored antibodies for diagnostics and analytical purposes Printed Intelligence research at VTT VTT – beyond the obvious 18 Scale up large area R2R printing process from lab to pilot fab• •Oulu Espoo Polar circle 1h flight
  19. 19. Strong player in EC R/D-landscape (FP6 => H2020) VTT – beyond the obvious Impact in European framework programs: • Over 40 research project done/on-going (11 VTT coordinated projects) • Total project volume over 350 M€ Networking and CSA projects: FP7-PRODI, FP7-PolyNEt, FP7-PolyMAP, FP7-OPERA,FP7-FlexNEt, FP7-COLAE
  20. 20. Flexible and Printed Electronics VTT’s competitive edge to demonstrate functional systems is enabled by:  Multidisciplinary research teams  Unique roll-to-roll research infrastructure  About 20 years experience – research started at end of 1990’s  Strong international networking with academia and industry VTT – beyond the obvious 20 Materials Components Systems Material tailoring VTT’s competences cover whole production chain Component manufacturing System integration
  21. 21. World leading roll-to-roll pilot manufacturing facilities VTT – beyond the obvious 21 PICO printing machine ROKO printing machine MAXI printing machine TESLA2 testing unit ELAS ps-laser processing unit DELTA converting unit with CO2 laser ENKELI R2R injection moulding machine EVO assembly and bonding unit LAKO assembly and bonding machine
  22. 22. Some research highlights VTT – beyond the obvious 22 R2R printed Organic PV modules: 150 meters foil tested, yield 100%, Area 100 cm2, PCEAVE 1.8%, PCEMAX 2.1% (with P3HT_PCBM) Printed oxide TFTs on low-T plastic:
  23. 23. VTT – beyond the obvious 23 R2R processing of PDMS biosensors: Nature Reviews Materials (2017), 2, 17016 Hou et al Nature (2014), 507, 181 Sackmann et al Some research highlights
  24. 24. VTT – beyond the obvious 24 R2R processing of sweat analysis patches: Some research highlights
  25. 25. VTT – beyond the obvious 25 Elevator user interface in media wall (GEN2): UI media panel (2.6m x 1.3m) implementation including:  Manufactured using R2R printing and hybrid assembly techniques including functional testing  Backlighting video and display element implemented with data bus controllable RGB LEDs (5050 LEDs)  Proximity sensing with transparent capacitive touch sensors and Haptic feedback element In GEN3 phase whole elevator cabin demonstrator with total wall area of 18 m2 is targeted equipped with pop- up user interfaces. Some research highlights
  26. 26. Some research highlights VTT – beyond the obvious 26 R2R manufacturing of cancer diagnostic photonic biosensors:
  27. 27. PrintoCent Industrial Cluster VTT – beyond the obvious 27 2019-2021 2016-2018 2013-2015 27.-30.1.2020, Oulu, Finland
  28. 28. Deep tech Spin-offs from R/D work VTT – beyond the obvious 28 See through near to eye display to smart glasses Listed on 60 most promising spin-offs list: Produces holographic-like, light scattering effects for plastic- based and fibre-based film materials with its’ state-of-the art surface modification technology - EARTO Innovation Award 2018 Injection molded structural electronics (IMSE) solutions seamlessly integrate printed circuitry and electronic components within 3D injection molded plastics. +several other spin-offs and start-ups employing +300 people in Finland
  29. 29. Aalto University Large scale research and teaching infrastructures Jukka Pekola 18 September 2019
  30. 30. Aalto large scale RIs • Supported by over 10 M€ annually from University budget • Provide support to the core research at Aalto University • Open for external partners • Professionally managed • Operate under Aalto’s common management principles:  Defined management and ownership  Transparent budgeting, costs and invoicing  Open access  Clear plan of development  Annual evaluation
  31. 31. • Aalto IceTank  Multipurpose basin suited for testing ships and other maritime structures in ice conditions • Aalto Neuroimaging  Open-Access Infrastructure for Human Functional Neuroimaging • Aalto Studios  The media center of the future • Bioeconomy  Research Infrastructure for sustainable biomass refining • i3  Industry Innovation Infrastructure Aalto large scale RIs • Metsähovi radio-observatory  The only astronomical radio observatory in Finland • OtaNano  Nanoscience and technology and quantum technologies • RawMatTERS  Design, synthesis and characterization of a variety of inorganic materials • Science-IT  Resources in data analytics and computational research
  32. 32. National OPEN ACCESS research infrastructure
  33. 33. • Aalto-VTT joint research infrastructure • Established 2013 (current form) • On National RI Roadmap since 2009 • Currently serves 9 Finnish universities and 30+ companies • Since 2013: > 500 000 h of use > 100 theses > 1000 rev. articles ~ 100 pat. / appl. 8 M€ annual budget 500 FEATURES users annually • 90 research groups • 30 companies
  34. 34. FOCUS AREAS • Nanostructured materials • Nanoelectronics and quantum technology • Micro- and nanophotonics • MEMS/NEMS, printed electronics
  35. 35. 4 700 m2 of lab space 24/7 available tools • 2600 m2 cleanroom, ISO 4–ISO 6 • Vibration free facilities for nanomicroscopy • Ultra-low-noise measurement techniques at cryogenic temperatures • Over 200 major instruments installed FACILITIES
  36. 36. QUANTUM TEHCHNOLOGIES Computers & Transistors Light emitting diodes (leds) Photodetectors & photodiodes Lasers Scanning tunnelling microscopes GPS & Atomic clocks MRI and MEG scanners Solar panels 1st revolution 2nd revolution
  37. 37. Faster method to read quantum memory – speeding up getting data from a quantum computer. QUANTUM HIGHLIGHTS Quantum control of high speed energy transfers – paving the way towards quantum simulation and computing applications. Realization of a miniature heat valve – a major step towards quantum refrigerators and heat engines. New confirmation of exotic arrangements in graphene – novel approach for topologically protected quantum information processing. Fabrication and properties of a new nanowire structures – applications in photonics and quantum technologies.
  38. 38. More information:
  39. 39. Silicon Photonics Timo Aalto Research Team Leader VTT #ICTpropday #VTTbeyondtheobvious 20/09/2019 VTT – beyond the obvious 40
  40. 40. Photonics integration – Why?  Discrete components don’t scale up well into complicated systems 20/09/2019 VTT – beyond the obvious Ludwig-Maximilians-University – Munich 41
  41. 41. Benefits of photonic integrated circuits  Smaller size  Smaller weight  Smaller power consumption  Smaller cost (in volume manufacturing)  Better optical performance • Lower coupling losses • Higher bandwidth 4220/09/2019 VTT – beyond the obvious
  42. 42. Example applications for Si photonics  Data/signal transfer • Data centers • Fiber networks • Wireless networks • Harsh environments • Quantum key distribution  Data/signal processing • Analog-digital conversions • Optical logic & memory • Microwave photonics • Optical computing • Quantum computing • Neural networks and AI 20/09/2019 VTT – beyond the obvious 43  Sensors & imaging • Gas analysis • Environmental and biosensors • Medical imaging • LIDARs "Low-error and broadband microwave frequency measurement in a silicon chip", Optica 2, pp. 751-756, 2015
  43. 43. Many open access Si photonics platforms Si310-PH Si substrate WaveGuide SiO2 Si FiberCoupler PSV ISIPP50G IHP SG25H4_EPIC Passive + heaters IHP SG25_PIC Passive + heaters Actives Passives + Heaters + Implanted PIN + Flip-chip 310 nm SOI220 nm SOI 3 µm SOI220 nm SOI 220-500 nm SOI Photonic BiCMOS Customized actives & Passives with EBL 220/340 nm SOI 220/300 nm SOI220 nm SOI 220 nm SOI 220 nm SOI 3 µm SOI 44 Specialty of VTT: 3 µm thick silicon-on-insulator (SOI) waveguides 20/09/2019 VTT – beyond the obvious
  44. 44. Illustration of the 3 µm SOI platform 3 µm thick SOI layer Buried oxide layer Silicon substrate Oxide cladding layer Up-reflecting TIR mirror and anti- reflection layer Single-mode rib waveguide Multi-mode strip waveguide Total internal reflection (TIR) mirror Rib-strip converter Spot-size converter Euler bend 4520/09/2019 VTT – beyond the obvious
  45. 45. Micron-size SOI waveguides have ultra-wide wavelength range for both TE & TM 220 nm SOI (strip) TE TM 3 µm SOI (SM rib) 3 µm SOI (strip) 12 µm SOI (strip) Standard single-mode fiber 1.2 µm 1.5 µm 1.8 µm 2.1 µm 2.4 µm 2.7 µm 3.0 µm 3.3 µm 3.6 µm 3.9 µm 4.2 µm TE TM TE TM Norm of the E field plotted as a function of wavelength (material absorption and dispersion ignored) Core
  46. 46. Small bends and mirrors for dense PICs Euler bends for negligible loss and small footprint (<0.01 dB, Reff = 10-50 µm) Total internal reflection mirrors for negligible footprint and small loss (0.1-0.3 dB, Reff = 1.5 µm) 5 µm 4720/09/2019 VTT – beyond the obvious
  47. 47. Wavelength (de)multiplexers and filters With strip (+rib) waveguides:  Arrayed waveguide gratings (AWGs)  Echelle gratings  Asymmetric Mach-Zehnder interferometers  Ring resonators and ring-loaded AMZIs Ring-loaded AMZI 48 1530 1540 1550 1560 - 40 - 30 - 20 - 10 0 Wavelength (nm) Transmission(dB) CH1 CH2 CH3 CH4 CH5 Echelle with 1 mm2 footprint and down to 0.9 dB loss (TE)1x10 AWG with loss ~1.6 dB and cross-talk -35 dB (TE) 20/09/2019 VTT – beyond the obvious
  48. 48. Wavelength (de)multiplexers and filters With strip (+rib) waveguides:  Arrayed waveguide gratings (AWGs)  Echelle gratings  Asymmetric Mach-Zehnder interferometers  Ring resonators and ring-loaded AMZIs Ring-loaded AMZI 49 Ring-loaded AMZI for flat-top interleaving 20/09/2019 VTT – beyond the obvious
  49. 49. Wavelength (de)multiplexers and filters With rib waveguides:  Directional couplers and lattice filters With strip (+rib) waveguides:  Arrayed waveguide gratings (AWGs)  Echelle gratings  Asymmetric Mach-Zehnder interferometers  Ring resonators and ring-loaded AMZIs Ring-loaded AMZI 1310 nm 1490 nm 5020/09/2019 VTT – beyond the obvious
  50. 50. Ge photodetectors up to 40 GHz  Vertical Ge PDs for high sensitivity  Side-wall implanted horizontal Ge PDs for fast operation  Bandwidth limited by the width of the Ge waveguide n-well on Si n-well on Si p-well on Ge Vertical PIN Ge PD 3 µm SOI waveguide n-well p-well Horizontal PIN Ge PD 20/09/2019 VTT – beyond the obvious 51
  51. 51. Seeking for the holy grail in silicon photonics: Monolithically integrated optical circulator  Faraday rotation in 3 µm SOI has already been demonstrated  Further work is needed to improve bandwidth & isolation, and to develop polarization splitters and rotators Dirk Jalas et al., "Faraday rotation in silicon waveguides", Proc. IEEE 14th Int. Conf. Group IV Photonics (GFP’17), pp. 141-142, 2017 52 PBSPBS 45° FR 45° FR 45° reciprocal rotators IN M M OUT 20/09/2019 VTT – beyond the obvious
  52. 52. Next step: Local spot-size conversions for ultra-fast components 20/09/2019 VTT – beyond the obvious 3 µm thick waveguide (low-loss, zero-birefringence) Thin a-Si waveguide pulling light to the surface Evanescently coupled III-V devices (lasers, SOAs, EAMs) Fast (monolithic) detectors and modulators  Amorphous silicon “escalator” pulling light into a thin a-Si waveguide  High-speed modulators and photodetectors can be coupled to the thin waveguide SIDEVIEWTOPVIEW SOI a-Si BOX SiO2 53 TE TM l = 1260nm Fabricated a-Si waveguide on Si
  53. 53. Finnish Si photonics ecosystem  National RAPSI project 2018-2020 for "Ramping up silicon photonics business in Finland"  VTT and Tampere University jointly develop hybrid & monolithic integration of III-V chips on SOI wafers  Integrated InP/GaAs-on-SOI to be offered in MPW runs  Industrial RAPSI partners develop new manufacturing methods for SiPh and their own SiPh products /turning-silicon-photonics-into-a-new- competitive-asset-for-the-electronics-industry H. Tuorila et al., Appl. Phys. Lett. 113, 041104 (2018) 20/09/2019 VTT – beyond the obvious 54
  54. 54. VTT’s services in silicon photonics Consultation & feasibility studies VTT can help you to understand SiPh and to see what silicon photonics can do for you and your business. Multi-project wafer runs Low-cost prototyping using VTT’s process design kit (PDK) and mature process modules. VTT delivers SiPh chips with your layout. Design support VTT can provide all or part of the design and simulation work that is needed to convert your conceptual idea into a product. 20/09/2019 VTT – beyond the obvious 55 Dedicated process runs VTT can provide full SiPh wafers, customized wafer processes and process development to come up with an optimized solution for you. Assembly, packaging and testing VTT can help you to convert optical chips into functional modules and systems, and to test those on wafer/chip/module/system level. Contract manufacturing After successful prototyping at VTT, small and medium volume production is available via VTT Memsfab Ltd. in the same fab. Looking for an EU project partner? Contact
  55. 55. CONCLUSIONS Micron-size silicon waveguides already offer • Low losses in small footprint • Polarization independent, ultra-broadband operation • Monolithic & hybrid integration of active components …and in the future they are aimed to also offer • Isolators & circulators on chip • Fast monolithic modulators • Even lower losses to support microwave photonics, optical computing and other new applications • Scalability from R&D and small volumes (<1M chips) to very large volume manufacturing (>>1M chips) 20/09/2019 VTT – beyond the obvious 56
  56. 56. Acknowledgments  VTT: Matteo Cherchi, Mikko Harjanne, Fei Sun, Tapani Vehmas, Srivathsa Bhat, Markku Kapulainen, Giovanni Delrosso, Päivi Heimala, Ari Hokkanen, Tomi Hassinen, Lauri Lehtimäki, Mikko Karppinen, Jyrki Ollila, Noora Heinilehto etc.  Tampere university: Mircea Guina, Jukka Viheriälä  Hamburg University of Technology: • Dirk Jalas, Nabeel Hakemi, Alexander Petrov, Manfred Eich  Vertilas Gmbh: Christian Neumeyr  PASSION, RAPSI, OPEC: All project members RAPSI OPEC 20/09/2019 VTT – beyond the obvious 57
  57. 57. Thank you! @VTTFinland #VTTbeyondtheobvious 5820/09/2019 VTT – beyond the obvious
  58. 58. Antennas and RF technologies Pekka Rantakari 20/09/2019 VTT – beyond the obvious
  59. 59. Antennas and RF technology • Hardware and technology development for RF applications from sub 6 GHz to THz frequencies Research focus • Part of MilliLab, Millimetre Wave Laboratory of Finland (est. 1995) Several decades of experience on mm- waves • Millimetre wave imaging radars (24,35 & 60 GHz) • Millimetre and sub-mm wave radiometer development • Active antennas for 5G and beyond wireless systems (sub 6GHz, E-band, D-band) • 5G satellite integration - payloads for mm-wave communications • Evaluation and space qualification of RF components, material characterization • LTCC manufacturing (e.g. ceramic antennas and AiP modules) Current R&D topics and activities 20/09/2019 VTT – beyond the obvious 63 • Anechoic chambers for antenna testing • Labs and cleanrooms for manufacturing and on-wafer testing Research facilities R&D services from design to manufacturing, prototyping and testing
  60. 60. Why? 20/09/2019 VTT – beyond the obvious 64  Digitalization, robotization and rise of autonomous systems  We are living a Digital World and number of connected devices and amount of data is increasing faster and faster every year  New digital services need high capacity networks that are available anytime and anywhere  Autonomous systems (e.g. self- driving cars and ships) and robots need reliable sensor systems and low-latency connectivity
  61. 61. 20/09/2019 VTT – beyond the obvious  16-channel beam forming BiCMOS SiGe MMICs • Active phased array antennas for E-band (71-76 GHz) • 8-bit digital control for phase and amplitude  4 mm × 4 mm MMIC includes: • 16 times LNA + VM + BA + DAC • 16-to-1 power combining/dividing network • solder bumps for flip-chip packaging E-band 5G development – Beam forming MMIC 65 4×4 receiver MMIC 4×4 transmitter MMIC Research Highlights One MMIC feeds 16 antenna elements
  62. 62. 66 E-band active phased array antennas Simulated beam steering of 64-element array φ= 0 deg. φ= 90 deg. 64-el array in CST 16-element array Electronic scanning range +/-30 degrees Research Highlights 20/09/2019 VTT – beyond the obvious
  63. 63. 20/09/2019 VTT – beyond the obvious  ESA ARTES Advanced Technology Programme project  Study W-band for future satellite communication links  Why W-band (75-110 GHz)? • Wide available bandwidth • small antenna size for high gain • low interference from ground • rapid RF electronics development  Purpose is to collect propagation data at W-band from LEO to ground to create atmospheric channel propagation models  Reaktor Space Lab satellite platform is used in 3U configuration  VTT is responsible for the RF payload including antennas • Radio beacon for Q/V- and W-bands  Planned launch in 2020 W-band communication test mission – W-CUBE 67 Photos: Reaktor Space Lab. Research Highlights
  64. 64.  State-of-the-art 60 GHz 3D imaging system, based on VTT’s in-house designed radar MMICs  Fully scalable radar chips with FMCW and modulation capabilities  Supports frequency MIMO operation Modular 60 GHz 3D imaging system 4-ch Tx and Rx MMICs based on the IHP’s SG13S SiGe technology Research Highlights 20/09/2019 VTT – beyond the obvious 68
  65. 65. 20/09/2019 VTT – beyond the obvious  Surroundings sensing/imaging • Visually impaired persons, robotics & autonomous systems  Presence detection • Counting and tracking objects  Wellbeing (Radar + AI & ML) • Vital sign monitoring (RR, HR, HRV) • Sleep quality • Stress recovery Radar use-cases Research Highlights 69
  66. 66. 20/09/2019 VTT – beyond the obvious Summary 20/09/2019 VTT – beyond the obvious We are living in a Digital World and number of connected devices and amount of data is increasing faster and faster every year Autonomous systems (e.g. self- driving cars and ships) and robots need reliable sensor systems and low-latency connectivity VTT is developing antennas and RF solutions for future wireless communications systems as well as for robotics, autonomous systems, public safety and wellbeing applications We collaborate world wide with top universities, research organisations and companies 70
  67. 67. Pekka Rantakari +358 40 7215 148 @VTTFinland @your_account