https://www.udemy.com/vlsi-academy
During placement and routing, most of the placement tools, place/move logic cells based on floorplan specifications. Some of the important or critical cell's locations has to be pre-defined before actual placement and routing stages. The critical cells are mostly the cells related to clocks, viz. clock buffers, clock mux, etc. and also few other cells such as RAM's, ROM,s etc. Since, these cells are placed in to core before placement and routing stage, they are called 'preplaced cells'.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
This document introduces VLSI physical design. It discusses how the number of transistors on chips has rapidly increased over time, from 100,000 to over 3 million. Complex chip design is now only possible using computer-aided design tools. The document outlines the different levels of abstraction in chip design from behavioral modeling down to the cell/mask level. It provides examples of logical and architectural design, and discusses the different layout styles including full-custom, gate-array, and standard-cell approaches.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
VLSI Physical Design Flow(http://www.vlsisystemdesign.com)VLSI SYSTEM Design
Learning becomes Fun..
When tedious & difficult topics like Chip Design are explained in simple n creative videos....https://www.udemy.com/vlsi-academy
This document discusses the key inputs required for the physical design phase of a VLSI chip, using Synopsys tools as an example. The main inputs are: (1) a gate-level netlist describing the logical connections, (2) libraries providing timing, power and physical information for standard cells and macros, (3) a technology file describing manufacturing details, (4) parasitic extraction files (TLU+) for timing analysis, and (5) constraints describing design objectives. Additional inputs include floorplanning guidelines, scenarios for optimization, and reference design methodologies. The goal of physical design is to implement the logic from the netlist while meeting area, timing and power targets.
Define Width and Height of Core and Die (http://www.vlsisystemdesign.com/PD-F...VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
The very first step in chip design is floorplanning, in which the width and height of the chip, basically the area of the chip, is defined. A chip consists of two parts, 'core' and 'die'.
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Crosstalk is a significant issue in structured cabling, audio electronics, integrated circuit design, wireless communication and other communications systems.
This document introduces VLSI physical design. It discusses how the number of transistors on chips has rapidly increased over time, from 100,000 to over 3 million. Complex chip design is now only possible using computer-aided design tools. The document outlines the different levels of abstraction in chip design from behavioral modeling down to the cell/mask level. It provides examples of logical and architectural design, and discusses the different layout styles including full-custom, gate-array, and standard-cell approaches.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
Fusion Compiler is the next-generation RTL-to-GDSII implementation system architected to address the complexities of advanced node designs and deliver up to 20% improved PPA while reducing Time To Results (TTR) by 2X.
VLSI Physical Design Flow(http://www.vlsisystemdesign.com)VLSI SYSTEM Design
Learning becomes Fun..
When tedious & difficult topics like Chip Design are explained in simple n creative videos....https://www.udemy.com/vlsi-academy
This document discusses the key inputs required for the physical design phase of a VLSI chip, using Synopsys tools as an example. The main inputs are: (1) a gate-level netlist describing the logical connections, (2) libraries providing timing, power and physical information for standard cells and macros, (3) a technology file describing manufacturing details, (4) parasitic extraction files (TLU+) for timing analysis, and (5) constraints describing design objectives. Additional inputs include floorplanning guidelines, scenarios for optimization, and reference design methodologies. The goal of physical design is to implement the logic from the netlist while meeting area, timing and power targets.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
Clock tree synthesis log messages provide information about:
1) Preprocessing steps like design updates, buffer characterization, and clock tree constraints.
2) The clock tree synthesis process which includes clustering, meeting timing targets, and reporting results.
3) Post processing steps like embedded clock tree optimization, DRC fixing, and placement legalization.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
The document discusses the backend design flow in VLSI, including floorplanning, placement, and routing. Floorplanning involves estimating block sizes and locations. Placement defines the location of logic cells and interconnect space. Routing connects the placed logic cells, with global routing determining interconnect locations and local routing connecting cells. The document outlines the goals and objectives of EDA tools for floorplanning, placement, and routing. It also discusses clock trees, placement strategies, and concludes with the overall backend flow.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
Implementing Useful Clock Skew Using Skew GroupsM Mei
Implementing useful skew through skew groups or manual buffer insertion can improve timing in a large memory block design. Skew groups define a target skew value for groups of clock pins before clock tree synthesis, resulting in a smaller clock tree, lower power increase, and less routing complexity compared to manual buffer insertion. Manual insertion precisely controls skew by adding buffers but dramatically increases clock cell count and power consumption versus skew groups. Both methods effectively improved setup timing for the memory block design.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
The document discusses timing closure in FPGA design flows. It explains that timing requirements include clock period/frequency, throughput, and latency. The timing-driven design flow in Lattice Diamond is outlined, highlighting key steps like defining timing constraints, running synthesis and implementation with timing analysis, and iterating to resolve issues. Timing constraints like input/output delays and exceptions are also covered.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
The document discusses placement in physical design. It describes placement as assigning positions to predesigned cells on a chip without overlapping to optimize objectives like minimizing area and interconnects. It discusses different placement types, formulates the placement problem, and describes algorithms like partitioning-based placement, simulated annealing placement, and iterative placement methods.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Clock Tree Synthesis is a technique for distributing the clock equally among all sequential parts of a VLSI design. The purpose of Clock Tree Synthesis is to reduce skew and delay. Clock Tree Synthesis is provided the placement data as well as the clock tree limitations as input. Clock Tree Synthesis (CTS) is the technique of balancing the clock delay to all clock inputs by inserting buffers/inverters along the clock routes of an ASIC design. As a result, CTS is used to balance the skew and reduce insertion latency. Before Clock Tree Synthesis, all clock pins were driven by a single clock source. Clock tree synthesis includes both clock tree construction and clock tree balance. Clock tree inverters may be used to create a clock tree that maintains the correct transition (duty cycle), and clock tree buffers (CTB) can balance the clock tree to fulfil the skew and latency requirements. To fulfil the space and power limits, fewer clock tree inverters and buffers should be employed.
The document discusses physical design and placement optimization in Cadence tools. It covers prerequisites for placement, goals of optimization including timing, power and area. It describes placement flow and discusses pre-placement, in-placement and post-placement optimization stages. Key techniques covered include zero interconnect timing analysis, scan chain handling, pre-placement optimization, congestion-driven placement, and post-placement optimization before and after clock tree synthesis.
This document discusses two types of timing analysis for integrated circuits (ICs): dynamic timing analysis (DTA) and static timing analysis (STA). DTA requires input stimuli to check both timing and functionality but is limited to small designs. STA is non-vector based, checks timing without input stimuli, and is suitable for large designs, though results may be pessimistic. While DTA only analyzes activated paths, STA considers all paths, potentially reporting false violations requiring exceptions.
This document discusses multi mode multi corner (MMMC) analysis for chip design. It defines that a mode is a set of design parameters like clocks and timing constraints, and a corner captures process, voltage, and temperature variations. It provides examples of multiple modes like normal, sleep, and test modes and corners for temperature, voltage, process variations, and parasitic interconnects. The document gives an example of analyzing a chip with 4 modes under 3 process-voltage-temperature corners and 3 parasitic interconnect corners, showing 9 analysis cases.
Floorplan (http://www.vlsisystemdesign.com/PD-Flow.php)VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
Floorplanning is basically the arrangement of logical blocks (i.e. multiplexer, AND, OR gates, buffers) on silicon chip.
https://www.udemy.com/vlsi-academy
http://vlsisystemdesign.com/place_decap.php
Once the critical cells are placed on the chip, it becomes necessary to surround the critical cells by decoupling capacitors. The placement of de-coupling capacitors surrounding the pre-placed cells improves the reliability and efficiency of the chip.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
Clock tree synthesis log messages provide information about:
1) Preprocessing steps like design updates, buffer characterization, and clock tree constraints.
2) The clock tree synthesis process which includes clustering, meeting timing targets, and reporting results.
3) Post processing steps like embedded clock tree optimization, DRC fixing, and placement legalization.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
The document discusses the backend design flow in VLSI, including floorplanning, placement, and routing. Floorplanning involves estimating block sizes and locations. Placement defines the location of logic cells and interconnect space. Routing connects the placed logic cells, with global routing determining interconnect locations and local routing connecting cells. The document outlines the goals and objectives of EDA tools for floorplanning, placement, and routing. It also discusses clock trees, placement strategies, and concludes with the overall backend flow.
Routing is an important step in the design of integrated circuits. It involves generating metal wires to connect the pins of same signal while obeying manufacturing design rules. Before routing is performed on the design, cell placement has to be carried out wherein the cells used in the design are placed. But the connections between the pins of the cells pertaining to same signal need to be made. At the time of placement, there are only logical connections between these pins. The physical connections are made by routing. More generally speaking, routing is to locate a set of wires in routing space so as to connect all the nets in the netlist taking into consideration routing channels’ capacities, wire widths and crossings etc. The objective of routing is to minimize total wire length and number of vias and that each net meets its timing budget. The tools that perform routing are termed as routers. You typically provide them with a placed netlist along with list of timing critical nets. These tools, in turn, provide you with the geometry of all the nets in the design.
In the world of Very Large Scale Integration (VLSI), the Physical Design process plays a crucial role in transforming a logical design into a physical layout that can be manufactured. Among the various steps involved in the Physical Design flow, Place and Route (PnR) stand out as a critical phase. PnR consists in placing the different components of a design on a chip and routing the connections between them. In this article, we will delve into the PnR flow, exploring its key steps, challenges, and the tools involved.
1. Partitioning:
Partitioning is a preliminary step in the PnR flow that divides the design into manageable blocks or modules based on functionality, hierarchy, or timing constraints. It enables parallel processing during subsequent steps and facilitates easier placement and routing. Partitioning algorithms aim to balance the workload across partitions and minimize inter-partition communication.
2. Floorplanning:
Floorplanning is a critical aspect of the placement process, defining the overall chip's top-level structure and organizing the different functional blocks. It involves allocating space for each block, determining their relative positions, and defining the placement regions. Effective floorplanning ensures proper utilization of available chip areas, reduces congestion, and facilitates efficient routing.
3. Power Planning:
Power planning focuses on distributing power supply and ensuring a stable power delivery network throughout the chip. It involves inserting power distribution networks, decoupling capacitors, and voltage regulators to minimize voltage drop, signal noise, and power supply fluctuations. Power planning techniques aim to optimize power grid layout, reduce IR drop, and mitigate electromigration issues.
4. Placement:
Placement is the first step in the PnR flow and involves determining the optimal location for each logic component on the chip. The primary objective of placement is to minimize wire length, power consumption, and timing delays while adhering to various constraints such as blockages, power grid, and signal integrity.
5. Clock Tree Synthesis (CTS):
Clock Tree Synthesis is a crucial step in PnR flow that ensures the efficient distribution of clock signals to all sequential elements of the design. CTS aims to minimize clock skew, and power dissipation, and provide a balanced clock network. CTS algorithms construct a tree-like structure by inserting buffers and optimizing wire length to achieve reliable clock distribution.
6. Routing:
6.1 Global Routing:
Once the placement is complete, the next step is global routing, which establishes the connections between the placed components. Global routing generates a coarse routing structure using minimum spanning trees, maze routing, or other algorithms. It focuses on achieving reasonable wirelength and reducing congestion without considering the precise details of the interconnects.
In today’s world, there is an ever-increasing demand for SOC speed, performance, and features. To cater to all those needs, the industry is moving toward lower technology nodes. The current market has become more and more demanding, in turn forcing complex architectures and reduced time to market. The complex integrations and smaller design cycle emphasize the importance of floorplanning, i.e., the first step in netlist-to-GDSII design flow. Floorplanning not only captures designer’s intent, but also presents the challenges and opportunities that affect the entire design flow, from design to implementation and chip assembly.
A typical SOC can include many hard- and soft-IP macros, memories, analog blocks, and multiple power domains. Because of the increases in gate count, power domains, power modes, and special architectural requirements, most SOCs these days are hierarchical designs. The SOC interacts with the outside world through sensors, antennas, displays, and other elements, which introduce a lot of analog component in the chip. All of these limitations directly result in various challenges in floorplanning.
Floorplanning includes macro/block placement, design partitioning, pin placement, power planning, and power grid design. What make the job more important is that the decisions taken for macro/block placement, partitioning, I/O-pad placement, and power planning directly or indirectly impact the overall implementation cycle.
Lots of iterations happen to get an optimum floorplan. The designer takes care of the design parameters, such as power, area, timing, and performance during floorplanning. These estimations are repeatedly reviewed, based on the feedback of other stakeholders such as the implementation team, IP owners, and RTL designers. The outcome of floorplanning is a proper arrangement of macros/blocks, power grid, pin placement, and partitioned blocks that can be implemented in parallel.
In hierarchical designs, the quality of the floorplan is analyzed after the blocks are integrated at the top level. That can results in unnecessary iterative work, wasted resource hours, and longer cycle times, which could mean missed market opportunities. This underscores the importance of floorplanning.
In this paper, we will discuss some of the good practices, techniques, and complex cases that arise while floorplanning in an SOC.
The first rule of thumb for floorplanning is to arrange the hard macros and memories in such a manner that you end up with a core area (to be used for SOG placement) square in shape. This is always not possible, however, because of the large number of analog-IP blocks, memories, and various other requirements in design.
Implementing Useful Clock Skew Using Skew GroupsM Mei
Implementing useful skew through skew groups or manual buffer insertion can improve timing in a large memory block design. Skew groups define a target skew value for groups of clock pins before clock tree synthesis, resulting in a smaller clock tree, lower power increase, and less routing complexity compared to manual buffer insertion. Manual insertion precisely controls skew by adding buffers but dramatically increases clock cell count and power consumption versus skew groups. Both methods effectively improved setup timing for the memory block design.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
The document discusses timing closure in FPGA design flows. It explains that timing requirements include clock period/frequency, throughput, and latency. The timing-driven design flow in Lattice Diamond is outlined, highlighting key steps like defining timing constraints, running synthesis and implementation with timing analysis, and iterating to resolve issues. Timing constraints like input/output delays and exceptions are also covered.
This document discusses various concepts related to physical design implementation. It describes the inputs and outputs of physical design tools, important checks to perform before starting design such as clock and high fanout net budgeting, and concepts like floorplanning, placement, routing, libraries, multi-voltage design, and clock tree synthesis and optimization.
The document discusses placement in physical design. It describes placement as assigning positions to predesigned cells on a chip without overlapping to optimize objectives like minimizing area and interconnects. It discusses different placement types, formulates the placement problem, and describes algorithms like partitioning-based placement, simulated annealing placement, and iterative placement methods.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
Clock Tree Synthesis is a technique for distributing the clock equally among all sequential parts of a VLSI design. The purpose of Clock Tree Synthesis is to reduce skew and delay. Clock Tree Synthesis is provided the placement data as well as the clock tree limitations as input. Clock Tree Synthesis (CTS) is the technique of balancing the clock delay to all clock inputs by inserting buffers/inverters along the clock routes of an ASIC design. As a result, CTS is used to balance the skew and reduce insertion latency. Before Clock Tree Synthesis, all clock pins were driven by a single clock source. Clock tree synthesis includes both clock tree construction and clock tree balance. Clock tree inverters may be used to create a clock tree that maintains the correct transition (duty cycle), and clock tree buffers (CTB) can balance the clock tree to fulfil the skew and latency requirements. To fulfil the space and power limits, fewer clock tree inverters and buffers should be employed.
The document discusses physical design and placement optimization in Cadence tools. It covers prerequisites for placement, goals of optimization including timing, power and area. It describes placement flow and discusses pre-placement, in-placement and post-placement optimization stages. Key techniques covered include zero interconnect timing analysis, scan chain handling, pre-placement optimization, congestion-driven placement, and post-placement optimization before and after clock tree synthesis.
This document discusses two types of timing analysis for integrated circuits (ICs): dynamic timing analysis (DTA) and static timing analysis (STA). DTA requires input stimuli to check both timing and functionality but is limited to small designs. STA is non-vector based, checks timing without input stimuli, and is suitable for large designs, though results may be pessimistic. While DTA only analyzes activated paths, STA considers all paths, potentially reporting false violations requiring exceptions.
This document discusses multi mode multi corner (MMMC) analysis for chip design. It defines that a mode is a set of design parameters like clocks and timing constraints, and a corner captures process, voltage, and temperature variations. It provides examples of multiple modes like normal, sleep, and test modes and corners for temperature, voltage, process variations, and parasitic interconnects. The document gives an example of analyzing a chip with 4 modes under 3 process-voltage-temperature corners and 3 parasitic interconnect corners, showing 9 analysis cases.
Floorplan (http://www.vlsisystemdesign.com/PD-Flow.php)VLSI SYSTEM Design
https://www.udemy.com/vlsi-academy
Floorplanning is basically the arrangement of logical blocks (i.e. multiplexer, AND, OR gates, buffers) on silicon chip.
https://www.udemy.com/vlsi-academy
http://vlsisystemdesign.com/place_decap.php
Once the critical cells are placed on the chip, it becomes necessary to surround the critical cells by decoupling capacitors. The placement of de-coupling capacitors surrounding the pre-placed cells improves the reliability and efficiency of the chip.
The document discusses the Oracle shared global area (SGA) and how it is used to share memory between Oracle processes and threads. It describes the different components of the SGA including the buffer cache, shared pool, large pool, java pool, redo buffers, and fixed area. It also discusses X$Tables, which provide a low-level view into the internal data structures of the SGA, and how they can be used to view additional details not available through V$Views.
Java 8 Streams And Common Operations By Harmeet Singh(Taara)Harmeet Singh(Taara)
In this, we are discuss about Java 8 Streams. Common Operations . Java 8 Streams are huge topic, so i am not cover all the things, but try to cover the basics operations of Streams. Before this, please refer my previous presentation "Functional programming in java 8", because of clear some basic concept for functional programming. For the reference use Java 8 API docs.
The document discusses input and output streams in Java. It describes the BufferedReader class, which reads text from a character input stream and buffers it for efficient reading. It also discusses the Scanner class in Java's util package for reading user input through the keyboard. An example program is provided that uses Scanner to read integer and float values from the user and calculate their sum.
java: basics, user input, data type, constructorShivam Singhal
The document provides an overview of some key Java concepts including classes, attributes, methods, objects, constructors, and data types. It explains that classes contain attributes and methods, and that objects are instantiated from classes using constructors. It also describes static and non-static methods, with static methods not requiring an object to be called. The main method is used to control program flow. User input can be obtained through command line arguments, Scanner, or BufferedReader classes.
This document discusses Java data types. It explains that variables reserve memory locations and the data type determines what memory is allocated and what values can be stored. There are two main data types in Java: primitive types and reference types. The primitive types are predefined by Java and include byte, short, int, long, float, double, boolean and char. Reference types refer to objects.
The document discusses Java network programming using sockets, including how TCP and UDP sockets work in Java, how to create basic client-server applications with TCP sockets, how to create multithreaded servers to handle multiple clients simultaneously, and how to use UDP sockets to send and receive datagrams. It provides code examples for basic TCP clients and servers, a concurrent multithreaded TCP server, UDP clients and servers, and hints at creating a multiprotocol server.
The document discusses Java streams and I/O. It defines streams as abstract representations of input/output devices that are sources or destinations of data. It describes byte and character streams, the core stream classes in java.io, predefined System streams, common stream subclasses, reading/writing files and binary data with byte streams, and reading/writing characters with character streams. It also covers object serialization/deserialization and compressing files with GZIP.
This document provides an overview of Java input/output (I/O) concepts including reading from and writing to the console, files, and streams. It discusses different I/O stream classes like PrintStream, InputStream, FileReader, FileWriter, BufferedReader, and how to read/write characters, bytes and objects in Java. The document also introduces new I/O features in Java 7 like try-with-resources for automatic resource management.
The document provides an overview of object-oriented analysis and design (OOAD). It discusses key OOAD concepts like iterative development, the Unified Process, UML notation, thinking in terms of objects and their services/responsibilities. It explains the differences between object-oriented analysis, which focuses on identifying domain objects, and object-oriented design, which defines software objects and how they collaborate. The document uses a dice game example to illustrate domain modeling with objects, interaction diagrams to show message flows, and a class diagram to define class attributes and methods.
Structured Vs, Object Oriented Analysis and DesignMotaz Saad
This document discusses structured vs object-oriented analysis and design (SAD vs OOAD) for software development. It outlines the phases and modeling techniques used in SAD like data flow diagrams, decision tables, and entity relationship diagrams. It also outlines the phases and modeling techniques used in OOAD like use cases, class diagrams, sequence diagrams, and state machine diagrams. The document compares key differences between SAD and OOAD, discusses textbooks on software engineering and UML, and references papers on using UML in practice and evaluating the impact and costs/benefits of UML in software maintenance.
The document contains interview questions and answers related to CMOS design. Some key topics covered include:
1. Latch-up and how it can permanently damage a device due to excessive current flow.
2. NAND gates are preferred over NOR gates in fabrication due to higher electron mobility and lower gate leakage in NAND structures.
3. Noise margin is the minimum amount of noise that can be allowed on the input without affecting the output.
The document discusses how switching activity in a device can affect the voltage levels of input/output signals. It explains that for a signal to be considered logic '1' or '0', its voltage should fall within the normal markup level (NMH) or normal markup low (NML) ranges, respectively. The summary discusses how a capacitor needs a peak current to charge up to the supply voltage level for the output of an inverter to be recognized as logic '1'.
This document provides an overview of object-oriented analysis and design. It defines key terms and concepts in object-oriented modeling like use cases, class diagrams, states, sequences. It describes developing requirements models using use cases and class diagrams. It also explains modeling object behavior through state and sequence diagrams and transitioning analysis models to design.
This document provides an introduction to VLSI design. It discusses the evolution of integrated circuits from SSI to VLSI, CMOS transistor structure and logic gates, the VLSI design process involving different levels of abstraction, design styles including full custom, ASIC, programmable logic, and system-on-chip. It also covers trends in transistor size, interconnect delay becoming dominant, and issues like power consumption and noise. The objectives are to understand transistor operation, CMOS logic, power and delay estimation, and layout design rules.
This document discusses CMOS VLSI digital design. It covers physical principles of CMOS including dopants, nMOS and pMOS transistor operation, and CMOS inverters. It then discusses circuit-level CMOS design including combinational logic, sequential logic, datapaths, and memories. Fabrication steps for building CMOS circuits are outlined including oxidation, photolithography, etching, and diffusion. Circuit performance factors like capacitance, RC delay models, and crosstalk are also covered. Different circuit styles like dynamic logic and pass transistor logic are introduced. Finally, sequencing elements like latches and flip-flops used for sequential logic are discussed.
This document provides an overview of VLSI circuits and design. It discusses the evolution from transistors to integrated circuits, highlighting advantages like reduced size and cost. The VLSI design process involves problem specification, architecture definition, functional design, logic design, and physical design. CMOS technology is described, including transistor operation, fabrication, and basic gates. Dynamic CMOS uses precharge and evaluation phases to conditionally discharge outputs. Programmable logic devices like PLA, PAL, and FPGA are also summarized.
This document outlines the syllabus for a course on Fundamentals of CMOS VLSI. The syllabus covers 8 units over the course of the semester. Unit 1 covers basic CMOS technology and MOS transistor theory. Subsequent units cover circuit design processes, CMOS logic structures, basic circuit concepts, subsystem design, memory, registers, clocking, and testability. The document also provides an introduction to the topic and overview of MOS transistor operation and CMOS fabrication processes.
The document discusses CMOS transistor theory, including:
1) It describes the MOS capacitor structure and its operating modes of accumulation, depletion, and inversion.
2) It analyzes the I-V characteristics of nMOS and pMOS transistors in the cutoff, linear, and saturation regions based on the channel charge and carrier velocity.
3) It explains the gate, source, and drain capacitances of MOS transistors and how they impact speed. The gate capacitance contributes to channel charge while other capacitances are parasitic.
Introduction to CMOS VLSI Design:
This Presentations is design in way to provide basic summary of CMOS Vlsi design
This Presentation is Made at Eutectics.blogspot.in
the following is the structure of presentation :
2: Outline
3: Introduction
4: MOS capacitor
5: Terminal Voltage
6: nMOS Cutoff
7: nMOS Linear
8: nMOS Saturation
9: I-V Characteristics
10 : Channel Charge
11: Carrier velocity
12: nMOS Linear I-V
13: nMOS Saturation
14: nMOS I-V Summary
15: Example
16: pMOS I-V
17: Capacitance
18: Gate Capacitance
19: Diffusion Capacitane
20: Pass Transistor
21: Pass transistor ckts
22: Effective Resistance
23: RC Delay Model
24: RC values
25: Inverter Delay Estimate
ER Publication,
IJETR, IJMCTR,
Journals,
International Journals,
High Impact Journals,
Monthly Journal,
Good quality Journals,
Research,
Research Papers,
Research Article,
Free Journals, Open access Journals,
erpublication.org,
Engineering Journal,
Science Journals,
This document discusses designing combinational logic circuits using static complementary CMOS design. It explains how to construct static CMOS circuits for logic gates like NAND and NOR by using pull-up and pull-down networks of PMOS and NMOS transistors respectively. Issues related to pass-transistor design like noise margins and static power consumption are also covered. The document provides details on implementing various logic functions using pass-transistor logic and differential pass-transistor logic. It discusses solutions to overcome the disadvantages of pass-transistor logic like level restoration and use of multiple threshold transistors.
BiCMOS technology incorporates both bipolar junction transistors and CMOS transistors on a single integrated circuit. This allows for circuits with higher speed, power, and density than either bipolar or CMOS alone. BiCMOS provides the high speed of bipolar transistors along with the low power advantages of CMOS transistors. It is used in applications such as microprocessors, memories, analog circuits, and mixed-signal circuits that require both analog and digital components.
CMOS VLSI PROJECT || CMOS 3-Bit Binary to Square of the given Input || MULTIP...rameshreddybattini
This document describes a project to design a CMOS 3-bit binary to square circuit. It includes the aim, components, schematic design rules, truth table, circuit diagram, schematic, stick diagram, layout, and output waveforms. The project aims to understand CMOS schematic design, stick diagrams, and layouts. It takes a 3-bit input and calculates the square of the input value using complementary MOS logic gates. Truth tables are used to determine the Boolean expressions, from which a schematic is designed and verified. A stick diagram and layout are then created to demonstrate translating the design to silicon. The output waveforms are compared to the truth table to validate the design.
This document provides an overview of CMOS VLSI design. It begins with an introduction to CMOS technology, including the basic structure and operation of NMOS and PMOS transistors. It then discusses DC characteristics such as different operating regions and I-V curves. The document covers fabrication processes like oxidation, photolithography, and etching. It also shows cross-sections and mask views for a sample CMOS inverter, highlighting steps like forming the n-well and adding contacts, polysilicon, diffusion and metal layers.
The document discusses modeling techniques for verifying a 4-port PCI Express switch using reference modeling. It presents the device under test, examples of reference models for ingress port logic and the router, and how the reference models are integrated at the chip level for verification. The reference models are independent of the implementation, coded at a high level, and co-simulated with the device under test to predict and check runtime behavior.
1) Stick diagrams are a popular method for symbolically designing VLSI layouts using colored lines to represent different layers like diffusion, metal, and polysilicon.
2) Design rules are used to communicate requirements between designers and fabricators to ensure layouts can be successfully materialized in silicon.
3) Stick diagrams convey layer information through color coding and are essentially the same as mask layouts but must show aspect ratios and dimensions between features for fabrication.
This document summarizes power in CMOS VLSI circuits. It discusses different sources of power consumption including dynamic power from switching capacitances and static power from leakage currents. Dynamic power is proportional to the activity factor, capacitance, supply voltage, and frequency. Static power comes from subthreshold leakage, gate leakage, junction leakage, and other leakage currents. The document provides examples of estimating power consumption and discusses techniques for reducing both dynamic and static power, such as clock gating, multi-threshold voltage techniques, and power gating.
This document contains the resume of Ankita Gloria Kerketta. She has a PG Diploma in Advanced ASIC Design - Full Custom from RV-VLSI Design Center in 2016 and a Bachelor's Degree in Electrical and Electronics Engineering from RSR Rungta College Of Engg. & Tech. in 2015. Her projects include designing a 32*32 SRAM Memory Cell and a Two Stage OP-AMP in 180nm technology at RV-VLSI Design Center. She also has experience designing standard cell libraries in 90nm and 28nm technologies. Her undergraduate project involved converting kinetic energy to electrical energy using a rolling speed breaker connected to a dynamo.
This document provides an overview of the topics that will be covered in the EC6601 VLSI Design course taught by Mrs. R. Chitra at Ramco Institute of Technology in Rajapalayam. The topics include an introduction to integrated circuits and CMOS circuits, MOS transistor theory and processing technology, and how to build a simple CMOS chip. It also outlines the CMOS fabrication process which involves growing oxide layers, patterning polysilicon, and diffusing dopants to form transistors on a silicon wafer through multiple photolithography steps. The document includes diagrams of CMOS inverter structures and transistor operation.
This document provides an overview of the ASIC back-end design flow, including physical design steps like floorplanning, placement, clock tree synthesis, and routing. It describes how CAD tools like Astro are used to automate the complex physical design process and optimize a design for timing while meeting other constraints. Key aspects of the flow include floorplanning the design, performing timing-driven placement and routing, building clock trees, and verifying the final implementation against timing and functional requirements.
Similar to Define location of Preplaced cells(http://www.vlsisystemdesign.com/PD-Flow.php) (20)
How to Make a Field Mandatory in Odoo 17Celine George
In Odoo, making a field required can be done through both Python code and XML views. When you set the required attribute to True in Python code, it makes the field required across all views where it's used. Conversely, when you set the required attribute in XML views, it makes the field required only in the context of that particular view.
Chapter wise All Notes of First year Basic Civil Engineering.pptxDenish Jangid
Chapter wise All Notes of First year Basic Civil Engineering
Syllabus
Chapter-1
Introduction to objective, scope and outcome the subject
Chapter 2
Introduction: Scope and Specialization of Civil Engineering, Role of civil Engineer in Society, Impact of infrastructural development on economy of country.
Chapter 3
Surveying: Object Principles & Types of Surveying; Site Plans, Plans & Maps; Scales & Unit of different Measurements.
Linear Measurements: Instruments used. Linear Measurement by Tape, Ranging out Survey Lines and overcoming Obstructions; Measurements on sloping ground; Tape corrections, conventional symbols. Angular Measurements: Instruments used; Introduction to Compass Surveying, Bearings and Longitude & Latitude of a Line, Introduction to total station.
Levelling: Instrument used Object of levelling, Methods of levelling in brief, and Contour maps.
Chapter 4
Buildings: Selection of site for Buildings, Layout of Building Plan, Types of buildings, Plinth area, carpet area, floor space index, Introduction to building byelaws, concept of sun light & ventilation. Components of Buildings & their functions, Basic concept of R.C.C., Introduction to types of foundation
Chapter 5
Transportation: Introduction to Transportation Engineering; Traffic and Road Safety: Types and Characteristics of Various Modes of Transportation; Various Road Traffic Signs, Causes of Accidents and Road Safety Measures.
Chapter 6
Environmental Engineering: Environmental Pollution, Environmental Acts and Regulations, Functional Concepts of Ecology, Basics of Species, Biodiversity, Ecosystem, Hydrological Cycle; Chemical Cycles: Carbon, Nitrogen & Phosphorus; Energy Flow in Ecosystems.
Water Pollution: Water Quality standards, Introduction to Treatment & Disposal of Waste Water. Reuse and Saving of Water, Rain Water Harvesting. Solid Waste Management: Classification of Solid Waste, Collection, Transportation and Disposal of Solid. Recycling of Solid Waste: Energy Recovery, Sanitary Landfill, On-Site Sanitation. Air & Noise Pollution: Primary and Secondary air pollutants, Harmful effects of Air Pollution, Control of Air Pollution. . Noise Pollution Harmful Effects of noise pollution, control of noise pollution, Global warming & Climate Change, Ozone depletion, Greenhouse effect
Text Books:
1. Palancharmy, Basic Civil Engineering, McGraw Hill publishers.
2. Satheesh Gopi, Basic Civil Engineering, Pearson Publishers.
3. Ketki Rangwala Dalal, Essentials of Civil Engineering, Charotar Publishing House.
4. BCP, Surveying volume 1
Leveraging Generative AI to Drive Nonprofit InnovationTechSoup
In this webinar, participants learned how to utilize Generative AI to streamline operations and elevate member engagement. Amazon Web Service experts provided a customer specific use cases and dived into low/no-code tools that are quick and easy to deploy through Amazon Web Service (AWS.)
How to Fix the Import Error in the Odoo 17Celine George
An import error occurs when a program fails to import a module or library, disrupting its execution. In languages like Python, this issue arises when the specified module cannot be found or accessed, hindering the program's functionality. Resolving import errors is crucial for maintaining smooth software operation and uninterrupted development processes.
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it describes the bony anatomy including the femoral head , acetabulum, labrum . also discusses the capsule , ligaments . muscle that act on the hip joint and the range of motion are outlined. factors affecting hip joint stability and weight transmission through the joint are summarized.
Strategies for Effective Upskilling is a presentation by Chinwendu Peace in a Your Skill Boost Masterclass organisation by the Excellence Foundation for South Sudan on 08th and 09th June 2024 from 1 PM to 3 PM on each day.
3. Let’s explore how a city is planned
Railway
Hospital
Station
Water
Playground
Storage Tank
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4. Basic necessities and utilities are pre-planned and positioned,
in a manner to have the best reachability by each citizen
Railway
Hospital
Station
Water
Playground
Storage Tank
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5. In a similar fashion, we start planning the chip area, by prioritizing the location
of critical cells.
Die
Core
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6. Crtical cells can be IP’s (memories, ALU, etc.) or std cells (clock Buffer, clock inverter, etc )
Die
Core
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7. Let us understand, what are IP’s, std cells and their architecture?
Die
Core
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8. IP is a reusable unit of logic, cell, or chip layout design that is the intellectual
property designed by any individual.
IP are also sometimes offered as generic gate-level netlist. i.e. standard cells,
and complex cells.
It consists of transistor level layout for logical cells and complex cells, which
are implemented using layout tools.
Lets have a look into internal of IP’s
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9. Consider one of the most commonly used IP i.e. CMOS Inverter
Vdd Vdd
In Inverter Out In Out
Vss Vss
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10. CMOS Inverter consist of P-MOS Transistor
Vdd
PMOS – P Diff
In Out
Vss
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11. CMOS Inverter consist of N-MOS Transistor
Vdd
PMOS – P Diff
In Out
NMOS – N Diff
Vss
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12. CMOS Inverter consist of Polysilicon Gate.
Vdd
Poly Gate
PMOS – P Diff
In Out
NMOS – N Diff
Vss
Note : At the component level, polysilicon has been used as the conducting gate
material in MOSFET and CMOS processing technologies.
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13. CMOS Inverter IN/ OUT Lines
Vdd
Poly Gate
PMOS – P Diff
In Out In
NMOS – N Diff
Vss
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14. CMOS Inverter IN/ OUT Ports
Vdd
Poly Gate
PMOS – P Diff
In Out In Out
NMOS – N Diff
Vss
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15. CMOS Inverter Vdd & Vss Ports.
Vdd
Vdd
Poly Gate
PMOS – P Diff
In Out In Out
NMOS – N Diff
Vss
Vss
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16. Lets draw preliminary layout of inverter using stick diagram
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17. Lets draw preliminary layout of inverter using stick diagram
Stick Diagrams are useful for planning the layout and routing of integrated circuits.
Every Line of a conducting material layer is represented by a line of a distinct color.
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18. Lets draw preliminary layout of inverter using stick diagram
Stick Diagrams are useful for planning the layout and routing of integrated circuits.
Every Line of a conducting material layer is represented by a line of a distinct color.
Polysilicon Gate
P Diffusion
N Diffusion
Metal
Contact
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20. N-MOS Transistor represented by a Apple Green Color line
PMOS – P Diff P Diff
NMOS – N Diff N Diff
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21. Polysilicon gates represented by Brown Color line
Poly Gate Poly
PMOS – P Diff P Diff
NMOS – N Diff N Diff
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22. Metal is represented by Bottle Blue Color line
Poly Gate Poly
PMOS – P Diff P Diff
In In
NMOS – N Diff N Diff
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23. Contacts are represented by Black Cross
Poly Gate Poly
PMOS – P Diff P Diff
In In
NMOS – N Diff N Diff
= Contact
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24. Metal is represented by Bottle Blue Color line
Poly Gate Poly
PMOS – P Diff P Diff
In Out In Out
NMOS – N Diff N Diff
= Contact
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25. Contacts are represented by Black Cross
Poly Gate Poly
PMOS – P Diff P Diff
In Out In Out
NMOS – N Diff N Diff
= Contact
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26. Metal is represented by Bottle Blue Color line
Vdd Vdd
Poly Gate Poly
PMOS – P Diff P Diff
In Out In Out
NMOS – N Diff N Diff
Vss Vss
= Contact
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27. Metal is represented by Bottle Blue Color line
Vdd Vdd
Poly Gate Poly
PMOS – P Diff P Diff
In Out In Out
NMOS – N Diff N Diff
Vss Vss
= Contact
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28. Stick Diagrams are converted to Cell Layout by assigning length and width to the Wire
Vdd Vdd
Poly Poly
P Diff P Diff
In Out In Out
N Diff N Diff
Vss Vss
= Contact = Contact
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29. Stick Diagrams are converted to Cell Layout by assigning length and width to the Wire
Vdd
Width (w)
Poly
P Diff
In Out
N Diff
Vss
= Contact
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30. Stick Diagrams are converted to Cell Layout by assigning length and width to the Wire
Vdd
Width (w)
Length (L)
Poly
P Diff
In Out
N Diff
Vss
= Contact
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31. Cell Layout is a Black Box for IP User.
Vdd
Vdd
Width (w)
Length (L)
Poly Poly
P Diff P Diff
In Out In Out
N Diff N Diff
Vss
Vss
= Contact = Contact
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32. In Black Box, internal architecture counts less compared to IP Functionality
Vdd Vdd
Poly Poly
P Diff P Diff
In Out In Out
N Diff N Diff
Vss Vss
= Contact = Contact
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33. IP’s serves the purpose of the Circuit design
i.e. Inverter in this case
Vdd
Vdd
Poly
P Diff
In Out In Out
N Diff
Vss
Vss
= Contact
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39. Complex blocks are also offered as IP’s
Vdd
In Out
Vss
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40. Complex blocks are also offered as IP’s
Buffer is nothing but two inverters connected back-to-back
Vdd
In Out
Vss
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41. Complex blocks are also offered as IP’s
Buffer is nothing but two inverters connected back-to-back
Vdd Vdd Vdd
In Out In Out
Vss Vss Vss
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42. Complex blocks are also offered as IP’s
Buffer is nothing but two inverters connected back-to-back
Vdd Vdd
In Out
Vss Vss
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43. Complex blocks are also offered as IP’s
Buffer is nothing but two inverters connected back-to-back
Vdd Vdd Vdd Vdd
Poly Poly
P Diff P Diff
In Out In In Out Out
N Diff N Diff
Vss Vss
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44. Complex blocks are also offered as IP’s
Buffer is nothing but two inverters connected back-to-back
Vdd Vdd Vdd
In Out In Buffer Out
Vss Vss Vss
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45. IP’s are offered in form of rectangular/square boxes
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46. IP’s are offered in form of rectangular/square boxes
For E.g. The Buffer IP, will be represented as below
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47. IP’s are offered in form of rectangular/square boxes
For E.g. The Buffer IP, will be represented as below
Vdd
In Buffer Out Buffer
Vss
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48. IP’s are offered in form of rectangular/square boxes
For E.g. The AND Gate IP, will be represented as below
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49. IP’s are offered in form of rectangular/square boxes
For E.g. The AND Gate IP, will be represented as below
Vdd
In1
AND Out AND
In2
Vss
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51. Commonly asked Question
How do we differentiate between Vdd and Vss ?
It is represented in below pattern.
A Cross line on the bottom left of the Block represents Vss and top corner Vdd
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52. Commonly asked Question
How do we differentiate between Vdd and Vss ?
It is represented in below pattern.
A Cross line on the bottom left of the Block represents Vss and top corner Vdd
Vdd
Buffer Buffer
Vss
Vdd
AND AND
Vss
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54. Complex blocks e.g. ALU will be represented as below IP Block
ALU
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55. • Memory is also a Complex IP used commonly.
• It is necessary to pre-define the geometrical location of these IP’s on a chip,
so that the automated PNR tools do not modify their locations
• These cells are referred to as Pre-placed cells
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