This document discusses the challenges in electronic design and the advantages of using cloud-based Computational Fluid Dynamics (CFD) for electronics cooling. It highlights misconceptions about electronics cooling, the benefits of simulation, and presents case studies optimizing design using cloud CFD. SimScale is introduced as a leading platform providing tools for engineering simulation that facilitate faster product development and improved thermal management.

1. By Jousef Murad
An Introduction to
Electronics Cooling (EC)

2. Agenda
● Introduction
● Challenges in Electronic Design
● Simulation
● Basics of Electronics Cooling
● Three Big Misconceptions about EC
● CAD Best Practices
● Demo Case

3. About SimScale
Who we are
Founded in 2012 in Munich (Germany), and
currently with an international team on two
continents, SimScale is the world’s first
production-ready SaaS application for
engineering simulation.

4. We created the world’s first cloud-based
engineering simulation platform.
● Fluid dynamics (CFD)
● Solid mechanics (FEA)
● Thermodynamics
All accessible via a web browser.
About SimScale
What we do

5. Image Source: https://www.weforum.org/agenda/2017/06/internet-of-things-will-power-the-fourth-industrial-revolution
Challenges in Electronic Design

6. [1] https://www.altex.com/images/SolutionCenter/BurntBoard.jpg
[2] https://www.microwaves101.com/content/images/Mortuary/burn/burn.jpg
Challenges in Electronic Design

7. Challenges in Electronic Design

8. ● Performance
● Sizing
● Cost
● Lifespan
Challenges in Electronic Design

9. Thermal CFD analysis allows to ship better products faster.
$
Thermal Design Traditionally
Design
Physical
Prototype
Physical
Test
Design
Change
Production
Thermal Design with Simulation
Design
Simul-
ation
Production
Design
Change
Simulation to Deliver Faster

10. Definition
Realization
ProductQuality&Costs
Product Development Concept Implementation Phase Validation
100%
Product Development Process
Test
Simulation
Frontloading
Why Do We Need Simulation?

11. Simulation Steps

12. Computational Fluid Dynamics (CFD)
The Navier-Stokes Equations

13. Visualizing the model
CAD modifications
Simulation setup
Checking progress/status
Analyzing results
Sharing results
Run MULTIPLE simulations
What Does Cloud CFD Actually Mean?
Cloud CFD

14. They require design iterations to find the optimal design.
Different parameters variations to test efficient cooling strategies
Heat sink design Active cooling
Optimize
convective flow
Decrease pressure
drop
Material choice
Why is Cloud CFD Well Suited for EC Applications?

15. Physical Testing In-house Simulation Cloud Simulation
Number of Design
Iterations
A few, often just the
prototype
10+ Unlimited
Turnaround Times
Days/Weeks for each
iteration
Hours for each
iteration
Hours for all
iterations
Costs
$100-1000 for each
iteration
Dependent on
hard-/software costs
$10-100
Why is Cloud CFD Well Suited for EC Applications?
Cloud CFD

16. Safety Net
● Forum
● Live Support
● Knowledge Base
● Modeling Capabilities
● Customized Onboarding

17. Basics of Electronics Cooling

18. https://www.simscale.com/docs/simwiki/heat-transfer-thermal-analysis/what-is-heat-transfer/
Heat Transfer Methods

19. Change of Internal Energy
Heat Added
Work Done by the System
→ Energy cannot be created or destroyed!
First Law of Thermodynamics

20. GPU Heat Generation

21. Three Big Misconceptions about EC

22. 1. Fans & Heatsinks Solve Everything
2. Tools Show No Difference
3. Simulation Is Only for Experts
4. Simulation Tools are Expensive
Misconceptions

23. CAD Best Practices

24. 1. Simplify & Merge
2. Defeature Unnecessary Details
3. Remove Small Bodies
4. Inlet & Outlet Extension
CAD Cleanup

25. Visualize the Invisible

26. Demo Case

27. 10W
2W
Small Chips
Small Capacitors
5W
Medium Capacitors
6W
Transformer
8W
Board Chips
3W
Board Components
10W
Other Components
30W
CPU
High-Power Density Electronics Design

28. Fan Inlet: 20°C
Open Outlet
High-Power Density Electronics Design
Cooling Strategy:
● Forced Convection
● Natural Convection
● Fluid Phase Change
● Liquid Cooled
High-Power Density Electronics Design

29. Fan Inlet: 20°C
Fan Inlet: 20°C
Open Outlet
Design Parameters:
● Heat Sink selection
● Fan Selection
● Fan Placement
● Component Placement
Design Constraints:
● ~92W Total Power
● ~1,200cm³ Cabinet Volume
● ~3,700 W/m² Power Density
● Max Component
Temperature
High-Power Density Electronics DesignHigh-Power Density Electronics Design

30. Design Study 1
How to optimize a design with cloud-based CFD

31. Baseline: 15m/s Fan 2: 10m/s Fan 3: 20m/s
Fan Sizing

32. 15m/s
20m/s
10m/s
Temperature [K]
Fan Sizing

33. 15m/s 20m/s 10m/s
Temperature [K]
Fan Sizing

34. Temperature [K]
-5%
15m/s
20m/s
10m/s
Impact on system reliability
Result Summary

35. Design Study 2
How to optimize a design with cloud-based CFD

36. Velocity [m/s]
Design 1: Plate Fin Design 2: Pin Fin
Heat Sink Variation

37. Temperature [K]
Design 1: Plate Fin
Design 2: Pin Fin
-16%
Impact on system reliability
Result Summary