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This document provides an agenda for a workshop on thermal management and electronics cooling. The workshop will focus on a case study of passively cooling an LED module using different heat sink materials, including standard aluminum, anodized aluminum, and standard aluminum with radiative paint. Through completing milestones to set up the simulation model, define operating conditions and materials, and run a design study, participants will determine which heat sink material provides the optimal solution for keeping the LED junction temperature within its operational range.




