This document discusses microelectromechanical systems (MEMS) and electrostatic micro-actuators. It explains that MEMS integrate sensors, actuators and electronics on a silicon substrate using microfabrication technology. Electrostatic micro-actuators consist of thin fingers that are actuated by applying a voltage, generating an attractive electrostatic force due to fringing fields. The document derives equations for the electrostatic energy and force in a parallel plate capacitor model, showing that the force is independent of gap size. It describes the pull-in effect, where the gap decreases until reaching 2/3 of the original spacing, at which point the plates suddenly contact.
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
It was a review project that is typically more focused on mechanical parts and microfabrication technologies made suitable for biological applications.
The interdisciplinary nature of bio-MEMS combines material sciences, clinical sciences, medicine, surgery, electrical engineering, mechanical engineering, optical engineering, chemical engineering and biomedical engineering.
Some of its major applications include genomics, proteomics, molecular diagnostics, point-of-care diagnostics, tissue engineering and implantable microdevices. MEMS techniques were originally developed in the microelectronics industry.
MEMS are a class of miniature devices and systems fabricated by micromachining processes. MEMS devices have critical dimensions in the range of 100nm to 1000um (or 1mm).
MEMS technology is a precursor to the relatively more popular field of Nanotechnology, which refers to science, engineering and technology below 100nm down to the atomic scale.
Occasionally, MEMS devices with dimensions in the millimetre-range are referred to as meso-scale MEMS devices. as drug delivery systems improve, the components of the systems continue to decrease in size.
Currently, most drug delivery systems are based upon devices and drug carrier elements that are on a micro-scale. Many of the future and developing technologies are based on the nano-scale.
Piezoresistive pressure sensors are one of the very-first products of MEMS technology. Those products are widely used in biomedical applications, automotive industry and household appliances.
The sensing material in a piezoresistive pressure sensor is a diaphragm formed on a silicon substrate, which bends with applied pressure. A deformation occurs in the crystal lattice of the diaphragm because of that bending. This deformation causes a change in the band structure of the piezoresistors that are placed on the diaphragm, leading to a change in the resistivity of the material. This change can be an increase or a decrease according to the orientation of the resistors.
MEMS = Micro Electro Mechanical System
Any engineering system that performs electrical (switching ,deciding) and mechanical functions (sensing,moving,heating) with components in micrometers is a MEMS.
It was a review project that is typically more focused on mechanical parts and microfabrication technologies made suitable for biological applications.
The interdisciplinary nature of bio-MEMS combines material sciences, clinical sciences, medicine, surgery, electrical engineering, mechanical engineering, optical engineering, chemical engineering and biomedical engineering.
Some of its major applications include genomics, proteomics, molecular diagnostics, point-of-care diagnostics, tissue engineering and implantable microdevices. MEMS techniques were originally developed in the microelectronics industry.
MEMS are a class of miniature devices and systems fabricated by micromachining processes. MEMS devices have critical dimensions in the range of 100nm to 1000um (or 1mm).
MEMS technology is a precursor to the relatively more popular field of Nanotechnology, which refers to science, engineering and technology below 100nm down to the atomic scale.
Occasionally, MEMS devices with dimensions in the millimetre-range are referred to as meso-scale MEMS devices. as drug delivery systems improve, the components of the systems continue to decrease in size.
Currently, most drug delivery systems are based upon devices and drug carrier elements that are on a micro-scale. Many of the future and developing technologies are based on the nano-scale.
Piezoresistive pressure sensors are one of the very-first products of MEMS technology. Those products are widely used in biomedical applications, automotive industry and household appliances.
The sensing material in a piezoresistive pressure sensor is a diaphragm formed on a silicon substrate, which bends with applied pressure. A deformation occurs in the crystal lattice of the diaphragm because of that bending. This deformation causes a change in the band structure of the piezoresistors that are placed on the diaphragm, leading to a change in the resistivity of the material. This change can be an increase or a decrease according to the orientation of the resistors.
MEMS = Micro Electro Mechanical System
Any engineering system that performs electrical (switching ,deciding) and mechanical functions (sensing,moving,heating) with components in micrometers is a MEMS.
This is a basic presentation about the Capacotors with iths basic knowledge about some equations also.
It is a little longer but you will get the general information about the capacitors.
It is well divided into 4 portions.
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Use Gauss’ Law symmetries to calculate capacitance.
Series and parallel connections.
Dielectrics increase capacitance.
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
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Final project report on grocery store management system..pdfKamal Acharya
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Author: Robbie Edward Sayers
Collaborators and co editors: Charlie Sims and Connor Healey.
(C) 2024 Robbie E. Sayers
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TECHNICAL TRAINING MANUAL GENERAL FAMILIARIZATION COURSEDuvanRamosGarzon1
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Explore the innovative world of trenchless pipe repair with our comprehensive guide, "The Benefits and Techniques of Trenchless Pipe Repair." This document delves into the modern methods of repairing underground pipes without the need for extensive excavation, highlighting the numerous advantages and the latest techniques used in the industry.
Learn about the cost savings, reduced environmental impact, and minimal disruption associated with trenchless technology. Discover detailed explanations of popular techniques such as pipe bursting, cured-in-place pipe (CIPP) lining, and directional drilling. Understand how these methods can be applied to various types of infrastructure, from residential plumbing to large-scale municipal systems.
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Water scarcity is the lack of fresh water resources to meet the standard water demand. There are two type of water scarcity. One is physical. The other is economic water scarcity.
Sachpazis:Terzaghi Bearing Capacity Estimation in simple terms with Calculati...Dr.Costas Sachpazis
Terzaghi's soil bearing capacity theory, developed by Karl Terzaghi, is a fundamental principle in geotechnical engineering used to determine the bearing capacity of shallow foundations. This theory provides a method to calculate the ultimate bearing capacity of soil, which is the maximum load per unit area that the soil can support without undergoing shear failure. The Calculation HTML Code included.
2. It stands for micro electro mechanical
systems
It is the integration of elements sensors
actuators and electronics on a common
silicon substrate
Micro fabrication technology, for making
microscopic devices
3. The actuator is an element which applies a
force to some object through a distance
Various actuation mechanisms:
- Electrostatic actuation
-Thermal actuation
-Piezoelectric actuation
-Magnetic actuation
4.
5. A voltage is applied between metal plates to
induce opposite charges and Coulomb
attraction
Where
α fringing field factor Normally the flux lines inside
the capacitor are uniform and
parallel. But at the edges, the
flux lines are not straight and
bend slightly upward due to
the geometry. This is known as
fringing effect.
6. Electrostatic Micro-actuator consists of many
fingers that are actuated by applying a voltage.
The thickness of the fingers is small in
comparison to their lengths and widths.
The attractive forces are mainly due to the
fringing fields rather than the parallel plate
fields.
Fringing Curves
7. Electrostatic energy :
W= ½ CV2 = αƐ0ƐrWL V2/2d
Electrostatic Force :
Coulomb’s Law: Force between two point
charges
8. Low power dissipation.
Can be designed to dissipate no power while
exerting a force.
High power density at micro scale.
Easy to fabricate.
9. Scaling
Noise & Efficiency
Range of force, motion and frequency
Repeatability
Nonlinearity
11. assume that the electrical field is uniform
between the plates of the capacitor, and
zero outside
uniform electric field between the plates has
the magnitude
E=Q/εA
where A is the area of one capacitor plate, and Q is the
magnitude of the charge on each plate
voltage across the capacitor is the product of
the E-field and the gap
V = gE = gQ /ƐA
the capacitance is the ratio of the charge
and
the voltage
C=Q/V = ƐA/ g
12. When the capacitor plates are fixed
The stored energy in the capacitor is given by
Fixed gap
Increasing charge
13. Charging the capacitor at zero gap and
lifting
At zero gap, the electrical stored energy is zero
The force between two plates with opposite charges +Q
and –Q depends on electric field setup by charges
This field is
Ɛ= Q/εA
The corresponding force is
F= (Q/2)Ɛ =Q2/2ƐA This force is independent of g
Now we pull upper plate by distance g
W(g) = F*g
= Q2g/2ƐA
Charge fixed,
Increasing gap
14. • Stored energy
• Force is derivative of energy with
respect to pertinent dimensional
variable
• Plug in the expression for capacitor
• We arrive at the expression for
force
C
Q
CVU
2
2
2
1
2
1
2
2
1
V
d
C
d
U
F
d
A
d
A
Q
Q
C
d
CV
V
d
A
d
U
F
2
2
2
2
1
2
1
15. As the voltage bias increases from zero
across a pair of parallel plates, the distance
between such plates would decrease until
they reach 2/3 of the original spacing, at
which point the two plates would be
suddenly snapped into contact.
This behavior is called the pull-in effect.