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International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 601
PERFORMANCE ANALYSIS OF D-FLIP FLOP USING CMOS, GDI, DSTC
TECHNIQUES
Dr.N. Vinodh kumar 1, S. Suguna Chandana2, D. Divija3, M. Ahalya4
1Associate Professor, Department of ECE, Vel Tech Rangarajan Dr.Sagunthala R&D Institute Of Science And
Technology, Chennai, India
2,3,4Student, Department of ECE, Vel Tech Rangarajan Dr.Sagunthala R&D Institute Of Science And Technology,
Chennai, India
---------------------------------------------------------------------***---------------------------------------------------------------------
Abstract - This Paper explains the performance analysis of
D-Flip Flop using three different techniques. They are D-Flip
Flop using CMOS technology, Gate-Diffusion-Input(GDI) and
DSTC technique. D flip-flop has been designed and layout
simulated using 45nm technology in the first technique. The
Gate diffusion technique is utilizeddirectly followingexploring
different flip flop circuits since it is found to give the most
minimal power delay when contrasted with other CMOS
designs. Thedynamicsingle-transistor-clocked(DSTC)flip-flop
that experiences significant voltage drop at the result due to
the capacitive coupling impact between the common node of
the slave latch and the drifting result driving node of the
master latch. The performance has been Analysed in terms of
power dissipation and Propagation delay.
Key Words: D flip-flop, CMOS, Gate diffusiontechnique,
DSTC, Power Estimation, Propagation Delay.
1. INTRODUCTION
A bistable multivibrator, often known as a flip-flop or latch,
is a circuit with two stable states that can be used to store
state information. Signals provided to one or more control
inputs can cause the circuit to change state, and it will have
one or two outputs. In sequential logic, it is the most
fundamental storage element. Flip-flops and latches are
essential components of digital electronics systems found in
computers, communications, and a variety of other
applications.
The D flip- flop is extensively used. itisalsoreferred
to as a "data” or “delay" flip-flop. The D flip- flopcapturesthe
worth of the D- input at a particular portion of the clock
cycle (alike because the rising edge of the clock). That
captured value becomes the Q output. At further times, the
output Q doesn't transform. The D flip- flop are oftenviewed
as a memory cell, a zero- order hold, or a circuit.
D flip-flop is bistable circuits whichgivetheresultin
reaction to a reference pulse. So the data put away in flip
flops on the rising and falling edge of the clock signal is
applied. as the inputs to other sequential circuits.Thoseflip-
flops that store data on both the rising and falling of the
clock signal is named as double edge triggered flip flops and
those flip flops that store data any of the rising or falling
edge are known single edge-triggered flip flops. So the
latches and flip flops are the sequential circuits that pile 1
and 0 state called logic states. Latches works on level-
triggered whereas flip flops work on edge-triggered.
In VLSI innovation the few past and years silicon
CMOS innovation has turned into a prevailing creation
process for moderately elite execution and cost-effective
VLSI circuits. The VLSI innovation first semiconductor was
created by William B. Hackey in 1947. [1] The incorporated
circuits are created by the year 1960 and essentially there
are four generations. The flip-flops termed so far in this
module have been based on TTL technology, however many
modern devices such as the 74HC and 74HCT series are
CMOS ICs, which have deeply different internal structures.
The flip flops in CMOS ICs persist on a different type of gate,
called a ‘Transmission Gate’ or ‘Bi-lateral Switch’, which
make it probable to build bi-stable flip-flops usinglessspace
within the IC, and have naiver structures than those used in
TTL ICs.
Gate diffusion technique is termed as a new
technique of low power digital combinationofcircuitdesign.
This permits reduced power consumption and delayed
propagation. [2] The GDI technique is more vital, because it
involves less transistors compared to CMOS. GDI technique
can be used to build fast, low power circuits using only few
transistors and reduced power consumption, delayandarea
of the digital circuit. It preserves low complexity of logic
design.
The dynamic single-transistor-clocked (DSTC)
[3]flip-flop that experiences significant voltage drop at the
result because of the capacitivecouplingimpactbetween the
normal hub of the slave lock and the drifting result driving
hub of the expert hook. This effect occurs at the rising edge
of the clock and causes an extension in delay and short out
power usage in the slave hook which could lead the
extraordinary power use.
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 602
2. SIMULATOR
2.1 TANNER EDA TOOL
Tanner EDA is a set of tools for the design of
integrated circuits. These tools permit you to enter
schematics, accomplish SPICE simulations, do physical
design (i.e., chip layout), and achieve design rule checks
(DRC) and layout versus schematic (LVS) checks.
S-edit - a schematic capture tool
T-SPICE - the SPICE simulation appliance combined with S-
edit
L-edit - the physical design tool
S-edit is a schematic access tool that is used to
document circuits that can be focused forward into a layout
of an integrated circuit. It also provides the capacity to
achieve SPICE simulations of the circuits using a simulation
engine called T-SPICE. T-SPICE can be setup and invoked
from within S-edit. Today, in industry we utilizeEDAtoolsto
manufacture a netlist. It is easy to understand and debug.
Also, for testability, it is easy if we have D flip-flops in scan
chain.
3. SIMULATION METHODOLOGY
3.1 D FLIP-FLOP USING CMOS TECHNOLOGY
There are three bases of power dissipation inCMOS
digital circuits. The first one is because of signal transistor,
the following one is due to the leakage current and the final
one is because of short circuit current which runs straight
from the supply terminal totheground.Highleakagecurrent
plays the most significant part of contributor in the power
dissipation of CMOS circuit as the threshold voltage, gate
oxide thickness on the channel length is decreased.
The schematic design of D flip-flop is publicized in below
figure 1 in which the 5 transistors where 3 NMOS and 2
PMOS are used.
Fig 1: schematic design of D flip-flop
D flip-flop terms into a multi-threshold CMOS
technology when 1 PMOS transistor and 1 NMOS transistor
are linked to the circuit of D flip-flop so the clock is high and
input is low because of the transistor M1 and M2 are “on”
and M3 and M4 are “off” and the M5 transistor is “on”
because of the output is low. The clock is high the input is
high this transistor M1 is “off” and M2, M3, M4 transistors
are on and the M5 transistor is “off” due to the output is high
state i.e. High impudence state. In alternative way the clock
is in low state due to the input is in low state and the M1
transistor is “on” and M2, M2, M3, M4, M5 transistors are
“off” due to the output is low state.
After designing the early schematic in the Fig 1, we
test the running of the circuit in Tanner EDA tool for
supplementary analysis. So the circuit is designed in S-Edit
software simulations arisen. The data stored is one, thenthe
outputs will the similar.
Fig 2: D Flip-Flop Using CMOS
Fig 3: Output of D Flip-Flop Using CMOS
The D flip flop using CMOS Technology has a propagation
delay 93.5197n/sec. The power consumption due to the
width to length is 1.8856uW.
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 603
3.2 D FLIP-FLOP USING GDI TECHNIQUE
Fig 4: Schematic diagram of GDI
The main purpose of this effort is to minimize the
power dissipation using GDI Technique. It is called Gate
Diffusion Input Technique since the inputs are directly
diffused hooked on to the gates of the transistors of N type
and P type devices.
An innovative usage of a GDI DFF is give the idea in
Fig 3. It depends on the Master-Slave link of two GDI D
Latches. Every lock contains of four fundamental GDI cells,
fetching about a basiceight-transistorstructure.Thecircuit's
segments can be subdivided into two principle
classifications:
(a) Body doors - in control of the circuit's condition. These
doors are organized by the CIk flag and create two
option ways: one for straightforward condition of the
lock (when the CIk is low and the signs are flourishing
through PMOS transistors), and one more for the
holding condition of the lock (when the Clk is high and
inward values are saved up because of conductionofthe
NMOS transistors)
(b) Inverters (checked by x) - in control of synchronizedthe
reciprocal estimations of the inward signs and the
circuit yields. An extra vigorous part of inverters is
buffering of the inward flags for swing rebuilding and
enhanced driving capacities of the yields. This
distribution of classes can aid understanding and
improvement of circuit operation. The signal is
transmitted through the dispersion hubsoftheGDIcells
in body entryways, as can be observed. It could cause a
swing drop in VTH in yield signals. The inwardinverters
in their cradle part understand this problem. To get a
small power delay item, theproposedcircuit'sexecution
can be improved by changing the transistor sizes (as a
scope parameter in reenactment). This iterative
technique includes a collection of independent size
conformities:
Fig 5: D Flip-Flop Using GDI
(a) First, the samescalingcomponentisobtainedfor
all of the circuit's transistors (body entryways and
inverters).
(b) Second, while focusing on the negligible force
delay item, iterative size advancements are connected
separately to inverters and body entryways (for the most
part via inverse moving of the scaling components around
the "operation point" established in (a).
(c) For high load requirements, an additional
streamlining on the Slave lock's inverter can be conducted
independently.
The proposed DFF's somewhat conservative structure,
which includes 18 transistors(plusaninverterforreciprocal
D estimate), gives it a capable option for obtaining a blendof
low range and good performance.
Fig 6: Output of D Flip-Flop Using GDI
The D flip flop using GDI Technologyhasa propagationdelay
54.521n/sec. The power consumption due to the width to
length is 1.1475uW.
After designing the early schematic in the Fig 3, we
test the running of the circuit in Tanner EDA tool for
supplementary analysis. So the circuit is designed in S-Edit
software simulations arisen. The data stored is one, thenthe
outputs will the similar.
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 604
3.3 D FLIP-FLOP USING DSTC TECHNIQUE
Fig 7: Schematic diagram of DSTC
Because of the topological contrasts among the
current hooks, some of them required an altered test seat,
i.e., a double information and/or a solitary yield. Be thatasit
may, these changes did not modify the examination's key
methodology in view of the recreation conditions.
In DSTC circuit, we have utilized 12 transistors be
that as it may, in GDI number of transistors utilized are 18 to
manufacture D flip failure, so in DSTC lesser be the zone,
lesser force scattering and lesser deferral as contrast with
the GDI based D Flip Flop. Among all these circuits DSTC
utilizes lesser transistors,lesserregion,lesserpostponement
and lesser the force dispersal.
The fundamental purposeof theimprovementisthe
minimization of the force delay item, given the constantly
introduce trade-off in the middle of force andspeed.Thelow
power/high-speed performance of D flip-flops based on
resistance is presented.
Fig 8: D Flip-Flop Using DSTC
Fig 7 represents the Schematic diagram of DSTC and Above
Figure (fig 8) shows the implementation of fig 5 in tanner
tool. the circuit is designed in S-Edit software simulations
arisen.
Fig 9: Output of D Flip-Flop Using DSTC
The D flip flop using DSTC Technology has a propagation
delay 70.733n/sec. Thepowerconsumptionduetothe width
to length is 1.4349uW.
4. RESULTS AND DISCUSSIONS
The layout simulations occur in T-Edit and W-Edit
software. So the simulation results performed in the d flip
flop layout consist of p diffusion and n diffusion and metal
and contact cuts and substrate.
Power
Consumption(uW)
Propagation
Delay(n/sec)
CMOS 1.8856 93.5197
GDI 1.1475 54.521
DSTC 1.4349 70.733
Table: Performance Results of D Flip flop
Propagation delay is obtained using delay formula and
power is obtained using .Power (dot power) command in
TANNER TOOL. The output signal wave forms of D Flip-Flop
using CMOS, GDI and DSTC are shown in Fig 3, Fig 6 and Fig
9 respectively.
6. CONCLUSION
D Flip-Flop using CMOS, GDI and DSTC Techniques
has been successfully designed and their performances is
analyzed in terms of propagation delay and power
estimation. An assortment of circuits has been actualized in
45 nm to contrast the proposed GDI structure and an
organization of representative flip-flops, normally used for
high execution outline. The simulation results are based on
Tanner tool and it gives good lashing ability with good
output signal and improved performance. DSTC uses fewer
transistors, a smaller region, less postponement, and less
force dispersal than the other circuits. Given the constant
introduce tradeoff between force andspeed,the maingoal of
the improvement is to minimize the force delay item. The
resistance-based low-power/high-speed performance of D
flip-flops is presented.
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 605
REFERENCES
[1] K. Srilatha, B. Pujitha and M. V. Sirisha ”Implementation
of D Flip-Flop using CMOS Technology. ”International
Journal of Trend in Scientific ResearchandDevelopment
(IJTSRD). ISSN:2456-6470, Volume-4 — Issue-3, April
2020, pp.624-626.
[2] Nandyala Naveena, Nimmagadda Poojitha, Pallewar
Rageshwari, and Somashekhar Malipatil.”Low Power
Area Efficient Digital Circuits Design for Portable
Devices using GDI”Journal of Xidian University, 14.
1780-1785. 10.37896/jxu14.6/212.
[3] B. Aparna and V. Anandi . ” Design of a D flip flop for
optimization of power dissipation using GDI technique”
2017 2nd IEEE International Conference on Recent
Trends in Electronics, Information Communication
Technology (RTEICT)2017, pp.172-177.
[4] Yash Vardhan, Dhruv Nair, M. Vinoth Kumar. ”Design
and analysis of flip flop for low power VLSI
applications - A Review” International Journal for
Research Trends and Innovation(IJRTI),Volume2,Issue
2 , ISSN: 2456-3315.
[5] Kunal Nidhi Kedia, ”GDI Technique : A Power-Efficient
Method for Digital Circuits”,2012 under
International Journal of Advanced Electrical and
Electronics Engineering,(IJAEEE) ISSN (Print):
2278-8948, Volume-1, Issue-3, 2012.
[6] Hardeep Kaur, Sukhdeep Kaur and Er.Poonam Rani,
”Design of Single Edge Triggered D Flip-FlopUsing
GDI Technique.” IOSR Journal of Electronics and
Communication Engineering (IOSR-JECE)e-ISSN:2278-
2834,p- ISSN: 2278-8735.Volume 10, Issue 2, Ver. II
(Mar - Apr.2015),PP 47-50.
[7] S. Gupta and N. Saxena, ”Tolerant design of low power D
Flip Flop using GDI and DSTC for higher performance”
2015 International Conference on Communication
Networks (ICCN) 2015, pp. 339-342.
[8] H. Sunagawa and H. Onodera, ”Variation-tolerantdesign
of D-flipflops” 23rd IEEE International SOC Conference
2010, pp. 147-151.
[9] Morgenshtein, Arkadiy Fish, Alexander Wagner, Israel
”An efficient implementation of D-Flip-Flop using the
GDI technique” 2004 IEEE International Symposium on
Circuits and Systems(IEEE Cat. No.04CH37512), 2004,
pp. II-673.
[10] A. Morgenshtein, A. Fish and I. A. Wagner, ”Gate-
diffusion input (GDI): a power-efficient method for
digital combinatorial circuits” IEEE Transactions on
Very Large Scale Integration (VLSI) Systems VOL. 10,
NO. 5, OCTOBER 2002

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Performance Analysis of D Flip-Flop Techniques

  • 1. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 601 PERFORMANCE ANALYSIS OF D-FLIP FLOP USING CMOS, GDI, DSTC TECHNIQUES Dr.N. Vinodh kumar 1, S. Suguna Chandana2, D. Divija3, M. Ahalya4 1Associate Professor, Department of ECE, Vel Tech Rangarajan Dr.Sagunthala R&D Institute Of Science And Technology, Chennai, India 2,3,4Student, Department of ECE, Vel Tech Rangarajan Dr.Sagunthala R&D Institute Of Science And Technology, Chennai, India ---------------------------------------------------------------------***--------------------------------------------------------------------- Abstract - This Paper explains the performance analysis of D-Flip Flop using three different techniques. They are D-Flip Flop using CMOS technology, Gate-Diffusion-Input(GDI) and DSTC technique. D flip-flop has been designed and layout simulated using 45nm technology in the first technique. The Gate diffusion technique is utilizeddirectly followingexploring different flip flop circuits since it is found to give the most minimal power delay when contrasted with other CMOS designs. Thedynamicsingle-transistor-clocked(DSTC)flip-flop that experiences significant voltage drop at the result due to the capacitive coupling impact between the common node of the slave latch and the drifting result driving node of the master latch. The performance has been Analysed in terms of power dissipation and Propagation delay. Key Words: D flip-flop, CMOS, Gate diffusiontechnique, DSTC, Power Estimation, Propagation Delay. 1. INTRODUCTION A bistable multivibrator, often known as a flip-flop or latch, is a circuit with two stable states that can be used to store state information. Signals provided to one or more control inputs can cause the circuit to change state, and it will have one or two outputs. In sequential logic, it is the most fundamental storage element. Flip-flops and latches are essential components of digital electronics systems found in computers, communications, and a variety of other applications. The D flip- flop is extensively used. itisalsoreferred to as a "data” or “delay" flip-flop. The D flip- flopcapturesthe worth of the D- input at a particular portion of the clock cycle (alike because the rising edge of the clock). That captured value becomes the Q output. At further times, the output Q doesn't transform. The D flip- flop are oftenviewed as a memory cell, a zero- order hold, or a circuit. D flip-flop is bistable circuits whichgivetheresultin reaction to a reference pulse. So the data put away in flip flops on the rising and falling edge of the clock signal is applied. as the inputs to other sequential circuits.Thoseflip- flops that store data on both the rising and falling of the clock signal is named as double edge triggered flip flops and those flip flops that store data any of the rising or falling edge are known single edge-triggered flip flops. So the latches and flip flops are the sequential circuits that pile 1 and 0 state called logic states. Latches works on level- triggered whereas flip flops work on edge-triggered. In VLSI innovation the few past and years silicon CMOS innovation has turned into a prevailing creation process for moderately elite execution and cost-effective VLSI circuits. The VLSI innovation first semiconductor was created by William B. Hackey in 1947. [1] The incorporated circuits are created by the year 1960 and essentially there are four generations. The flip-flops termed so far in this module have been based on TTL technology, however many modern devices such as the 74HC and 74HCT series are CMOS ICs, which have deeply different internal structures. The flip flops in CMOS ICs persist on a different type of gate, called a ‘Transmission Gate’ or ‘Bi-lateral Switch’, which make it probable to build bi-stable flip-flops usinglessspace within the IC, and have naiver structures than those used in TTL ICs. Gate diffusion technique is termed as a new technique of low power digital combinationofcircuitdesign. This permits reduced power consumption and delayed propagation. [2] The GDI technique is more vital, because it involves less transistors compared to CMOS. GDI technique can be used to build fast, low power circuits using only few transistors and reduced power consumption, delayandarea of the digital circuit. It preserves low complexity of logic design. The dynamic single-transistor-clocked (DSTC) [3]flip-flop that experiences significant voltage drop at the result because of the capacitivecouplingimpactbetween the normal hub of the slave lock and the drifting result driving hub of the expert hook. This effect occurs at the rising edge of the clock and causes an extension in delay and short out power usage in the slave hook which could lead the extraordinary power use.
  • 2. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 602 2. SIMULATOR 2.1 TANNER EDA TOOL Tanner EDA is a set of tools for the design of integrated circuits. These tools permit you to enter schematics, accomplish SPICE simulations, do physical design (i.e., chip layout), and achieve design rule checks (DRC) and layout versus schematic (LVS) checks. S-edit - a schematic capture tool T-SPICE - the SPICE simulation appliance combined with S- edit L-edit - the physical design tool S-edit is a schematic access tool that is used to document circuits that can be focused forward into a layout of an integrated circuit. It also provides the capacity to achieve SPICE simulations of the circuits using a simulation engine called T-SPICE. T-SPICE can be setup and invoked from within S-edit. Today, in industry we utilizeEDAtoolsto manufacture a netlist. It is easy to understand and debug. Also, for testability, it is easy if we have D flip-flops in scan chain. 3. SIMULATION METHODOLOGY 3.1 D FLIP-FLOP USING CMOS TECHNOLOGY There are three bases of power dissipation inCMOS digital circuits. The first one is because of signal transistor, the following one is due to the leakage current and the final one is because of short circuit current which runs straight from the supply terminal totheground.Highleakagecurrent plays the most significant part of contributor in the power dissipation of CMOS circuit as the threshold voltage, gate oxide thickness on the channel length is decreased. The schematic design of D flip-flop is publicized in below figure 1 in which the 5 transistors where 3 NMOS and 2 PMOS are used. Fig 1: schematic design of D flip-flop D flip-flop terms into a multi-threshold CMOS technology when 1 PMOS transistor and 1 NMOS transistor are linked to the circuit of D flip-flop so the clock is high and input is low because of the transistor M1 and M2 are “on” and M3 and M4 are “off” and the M5 transistor is “on” because of the output is low. The clock is high the input is high this transistor M1 is “off” and M2, M3, M4 transistors are on and the M5 transistor is “off” due to the output is high state i.e. High impudence state. In alternative way the clock is in low state due to the input is in low state and the M1 transistor is “on” and M2, M2, M3, M4, M5 transistors are “off” due to the output is low state. After designing the early schematic in the Fig 1, we test the running of the circuit in Tanner EDA tool for supplementary analysis. So the circuit is designed in S-Edit software simulations arisen. The data stored is one, thenthe outputs will the similar. Fig 2: D Flip-Flop Using CMOS Fig 3: Output of D Flip-Flop Using CMOS The D flip flop using CMOS Technology has a propagation delay 93.5197n/sec. The power consumption due to the width to length is 1.8856uW.
  • 3. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 603 3.2 D FLIP-FLOP USING GDI TECHNIQUE Fig 4: Schematic diagram of GDI The main purpose of this effort is to minimize the power dissipation using GDI Technique. It is called Gate Diffusion Input Technique since the inputs are directly diffused hooked on to the gates of the transistors of N type and P type devices. An innovative usage of a GDI DFF is give the idea in Fig 3. It depends on the Master-Slave link of two GDI D Latches. Every lock contains of four fundamental GDI cells, fetching about a basiceight-transistorstructure.Thecircuit's segments can be subdivided into two principle classifications: (a) Body doors - in control of the circuit's condition. These doors are organized by the CIk flag and create two option ways: one for straightforward condition of the lock (when the CIk is low and the signs are flourishing through PMOS transistors), and one more for the holding condition of the lock (when the Clk is high and inward values are saved up because of conductionofthe NMOS transistors) (b) Inverters (checked by x) - in control of synchronizedthe reciprocal estimations of the inward signs and the circuit yields. An extra vigorous part of inverters is buffering of the inward flags for swing rebuilding and enhanced driving capacities of the yields. This distribution of classes can aid understanding and improvement of circuit operation. The signal is transmitted through the dispersion hubsoftheGDIcells in body entryways, as can be observed. It could cause a swing drop in VTH in yield signals. The inwardinverters in their cradle part understand this problem. To get a small power delay item, theproposedcircuit'sexecution can be improved by changing the transistor sizes (as a scope parameter in reenactment). This iterative technique includes a collection of independent size conformities: Fig 5: D Flip-Flop Using GDI (a) First, the samescalingcomponentisobtainedfor all of the circuit's transistors (body entryways and inverters). (b) Second, while focusing on the negligible force delay item, iterative size advancements are connected separately to inverters and body entryways (for the most part via inverse moving of the scaling components around the "operation point" established in (a). (c) For high load requirements, an additional streamlining on the Slave lock's inverter can be conducted independently. The proposed DFF's somewhat conservative structure, which includes 18 transistors(plusaninverterforreciprocal D estimate), gives it a capable option for obtaining a blendof low range and good performance. Fig 6: Output of D Flip-Flop Using GDI The D flip flop using GDI Technologyhasa propagationdelay 54.521n/sec. The power consumption due to the width to length is 1.1475uW. After designing the early schematic in the Fig 3, we test the running of the circuit in Tanner EDA tool for supplementary analysis. So the circuit is designed in S-Edit software simulations arisen. The data stored is one, thenthe outputs will the similar.
  • 4. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 604 3.3 D FLIP-FLOP USING DSTC TECHNIQUE Fig 7: Schematic diagram of DSTC Because of the topological contrasts among the current hooks, some of them required an altered test seat, i.e., a double information and/or a solitary yield. Be thatasit may, these changes did not modify the examination's key methodology in view of the recreation conditions. In DSTC circuit, we have utilized 12 transistors be that as it may, in GDI number of transistors utilized are 18 to manufacture D flip failure, so in DSTC lesser be the zone, lesser force scattering and lesser deferral as contrast with the GDI based D Flip Flop. Among all these circuits DSTC utilizes lesser transistors,lesserregion,lesserpostponement and lesser the force dispersal. The fundamental purposeof theimprovementisthe minimization of the force delay item, given the constantly introduce trade-off in the middle of force andspeed.Thelow power/high-speed performance of D flip-flops based on resistance is presented. Fig 8: D Flip-Flop Using DSTC Fig 7 represents the Schematic diagram of DSTC and Above Figure (fig 8) shows the implementation of fig 5 in tanner tool. the circuit is designed in S-Edit software simulations arisen. Fig 9: Output of D Flip-Flop Using DSTC The D flip flop using DSTC Technology has a propagation delay 70.733n/sec. Thepowerconsumptionduetothe width to length is 1.4349uW. 4. RESULTS AND DISCUSSIONS The layout simulations occur in T-Edit and W-Edit software. So the simulation results performed in the d flip flop layout consist of p diffusion and n diffusion and metal and contact cuts and substrate. Power Consumption(uW) Propagation Delay(n/sec) CMOS 1.8856 93.5197 GDI 1.1475 54.521 DSTC 1.4349 70.733 Table: Performance Results of D Flip flop Propagation delay is obtained using delay formula and power is obtained using .Power (dot power) command in TANNER TOOL. The output signal wave forms of D Flip-Flop using CMOS, GDI and DSTC are shown in Fig 3, Fig 6 and Fig 9 respectively. 6. CONCLUSION D Flip-Flop using CMOS, GDI and DSTC Techniques has been successfully designed and their performances is analyzed in terms of propagation delay and power estimation. An assortment of circuits has been actualized in 45 nm to contrast the proposed GDI structure and an organization of representative flip-flops, normally used for high execution outline. The simulation results are based on Tanner tool and it gives good lashing ability with good output signal and improved performance. DSTC uses fewer transistors, a smaller region, less postponement, and less force dispersal than the other circuits. Given the constant introduce tradeoff between force andspeed,the maingoal of the improvement is to minimize the force delay item. The resistance-based low-power/high-speed performance of D flip-flops is presented.
  • 5. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 05 | May 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 605 REFERENCES [1] K. Srilatha, B. Pujitha and M. V. Sirisha ”Implementation of D Flip-Flop using CMOS Technology. ”International Journal of Trend in Scientific ResearchandDevelopment (IJTSRD). ISSN:2456-6470, Volume-4 — Issue-3, April 2020, pp.624-626. [2] Nandyala Naveena, Nimmagadda Poojitha, Pallewar Rageshwari, and Somashekhar Malipatil.”Low Power Area Efficient Digital Circuits Design for Portable Devices using GDI”Journal of Xidian University, 14. 1780-1785. 10.37896/jxu14.6/212. [3] B. Aparna and V. Anandi . ” Design of a D flip flop for optimization of power dissipation using GDI technique” 2017 2nd IEEE International Conference on Recent Trends in Electronics, Information Communication Technology (RTEICT)2017, pp.172-177. [4] Yash Vardhan, Dhruv Nair, M. Vinoth Kumar. ”Design and analysis of flip flop for low power VLSI applications - A Review” International Journal for Research Trends and Innovation(IJRTI),Volume2,Issue 2 , ISSN: 2456-3315. [5] Kunal Nidhi Kedia, ”GDI Technique : A Power-Efficient Method for Digital Circuits”,2012 under International Journal of Advanced Electrical and Electronics Engineering,(IJAEEE) ISSN (Print): 2278-8948, Volume-1, Issue-3, 2012. [6] Hardeep Kaur, Sukhdeep Kaur and Er.Poonam Rani, ”Design of Single Edge Triggered D Flip-FlopUsing GDI Technique.” IOSR Journal of Electronics and Communication Engineering (IOSR-JECE)e-ISSN:2278- 2834,p- ISSN: 2278-8735.Volume 10, Issue 2, Ver. II (Mar - Apr.2015),PP 47-50. [7] S. Gupta and N. Saxena, ”Tolerant design of low power D Flip Flop using GDI and DSTC for higher performance” 2015 International Conference on Communication Networks (ICCN) 2015, pp. 339-342. [8] H. Sunagawa and H. Onodera, ”Variation-tolerantdesign of D-flipflops” 23rd IEEE International SOC Conference 2010, pp. 147-151. [9] Morgenshtein, Arkadiy Fish, Alexander Wagner, Israel ”An efficient implementation of D-Flip-Flop using the GDI technique” 2004 IEEE International Symposium on Circuits and Systems(IEEE Cat. No.04CH37512), 2004, pp. II-673. [10] A. Morgenshtein, A. Fish and I. A. Wagner, ”Gate- diffusion input (GDI): a power-efficient method for digital combinatorial circuits” IEEE Transactions on Very Large Scale Integration (VLSI) Systems VOL. 10, NO. 5, OCTOBER 2002