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Digital VLSI Design
• Full Automation
• Maximum benefit of scaling
• High speed ,
• low power
• Robustness
Power dissipation
Why worry about power?
-- Heat Dissipation
DEC 21164
microprocessor power dissipation
Why worry about power — Portability
Multimedia Terminals
Laptop Computers
Digital Cellular Telephony
BATTERY
(40+ lbs)
Year
NominalCapacity(Watt-hours/lb)
Nickel-Cadium
Ni-Metal Hydride
65 70 75 80 85 90 95
0
10
20
30
40
50
Rechargable Lithium
Expected Battery Lifetime increase
over next 5 years: 30-40%
Where Does Power Go in CMOS?
• STATIC POWER---NIL
• Dynamic Power Consumption
• Short Circuit Currents
• Leakage
Charging and Discharging Capacitors
Short Circuit Path between Supply Rails during Switching
Leaking diodes and transistors
Power consumption
• 4 components
Static power consumption
Short circuit power consumption
Leakage power consumption
Dynamic power consumption
• The total power in a CMOS circuit is given
by Ptotal = Pd + Psc + Ps where
 Pd is the dynamic average power (previous chart),
 Psc is the short circuit power,
 and Ps is the static power due to ratio circuit current,
junction leakage, and sub-threshold Ioff leakage current
• Short circuit current flows during the brief
transient when the pull down and pull up
devices both conduct at the same time
where one (or both) of the devices are in
saturation
Static power consumption
Short circuit power
CMOS Short-Circuit Power Dissipation
Derivation
Short Circuit Path
Modelling
t1- t2, Mos operates in saturation
At t2, current reaches its maximum value
At this point vin=vdd/2, because inverter is
symmetrical
I mean= 2x [2/T] x ∫Isat dt : Limits(t1, t2)
Conditions—Vin(t)=(Vdd/τ) t;
--assume vin increases linearly with time
tr = tf = trf
Psc = (/12) (Vdd – 2Vt)3 (trf/tpin)
• For a balanced CMOS inverter with
n=p= , and Vtn = |Vtp|, the short
circuit power can be expressed by
Psc = (/12)(Vdd – 2Vt)3 (tr/f/tpin)
where tpin is the period of the input
waveform and trf is the input rise time
(or fall time) tr = tf = trf
Effect of load cap on short circuit
power
• P short circuit reduces
• Reason---- output start switching after
input has completely stabilized
Effect of Cload
Dynamic energy consumption
Energy stored across capacitor
Dynamic power consumption-derivation
Average Dynamic Power in CMOS
Inverter
• Average dynamic power derivation:
– On negative going input, pull-up
device charges the load
capacitance. On positive going
input, pull-down device discharges
the load into ground.
– Average power given by
Pave = (1/T)CL (dvout/dt) (Vdd – vout)dt
+ (1/T)(-1) CL (dvout/dt) vout dt
where the first integral is taken from
0 to T/2 and the second integral is
from T/2 to T
• completion of the integral yields
Pave = CL Vdd
2 f where f = 1/T
• Note that the dynamic power is
independent of the typical device
parameters, but is simply a
function of power supply, load
capacitance and frequency of
the switching!
Vin Vout
CL
Energy/transition = CL * Vdd
2
Power = Energy/transition * f = CL * Vdd
2
* f
Need to reduce CL, Vdd, and f to reduce power.
Vdd
Not a function of transistor sizes!
Reduce power consumption
• Reduce Vdd
• Reduce swing at the output
• Reduce CL
• Reduce Switching activity
To keep same speed, can we reduce Vdd,
increase (w/L)?  No
Inc in W inc in CL
Dynamic Power Consumption - Revisited
Power = Energy/transition * transition rate
= CL * Vdd
2
* f01
= CL * Vdd
2 * P01* f
= CEFF * Vdd
2
* f
Power Dissipation is Data Dependent
Function of Switching Activity
CEFF = Effective Capacitance = CL * P01
Power Consumption is Data Dependent
uniform distribution of inputs
Example: Static 2 Input NOR Gate
Assume:
P(A=1) = 1/2
P(B=1) = 1/2
P(Out=1) = 1/4
P(01)
= 3/4  1/4 = 3/16
Then:
= P(Out=0).P(Out=1)
CEFF = 3/16 * CL
Transition Probabilities for Basic Gates
Non-uniform distribution of inputs
No feedback
Power consumption—Correlated signals
½1
Sizing for min. power
consumption
For a given delay constraint
Sizing for power consumption
Vdd=Vddref
Vdd=Vddref
Vdd≠ Vddref
Graphical solution
Why energy reduces for F increasing?
• Assume delay reqd is tpref=5ns.
• As F inc CL inc. delay (tp) inc. and dyn. energy inc.
linearly
• But as f inc delay reduces exponentially, energy inc.
• for F= 1 delay is already small and close to tpref). Inc in f
does not cause much reduction rather energy increment is
more
• For F large, delay and energy are large values
• Hence as f inc., delay reduces drastically (become less than
tpref ). Hence to have given delay= tpref, energy is dec.
which inc. delay to tpref.
• As f is increased further, delay reduction reduces, only
energy increases
Design example—0.25um technology, find f, Vdd for
tpref=0.2ns. Cext=10Cg1, γ=1, Vref=2.5v
Design a chain of inv for min delay, min energy
Power delay product
Indicates that energy required  0 for Vdd 0  erroneous
Energy delay product
Shd. Be minimum
Energy delay product
optimum Vdd

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Advd lecture 08 -inverte rpart3

  • 1. Digital VLSI Design • Full Automation • Maximum benefit of scaling • High speed , • low power • Robustness
  • 3. Why worry about power? -- Heat Dissipation DEC 21164 microprocessor power dissipation
  • 4. Why worry about power — Portability Multimedia Terminals Laptop Computers Digital Cellular Telephony BATTERY (40+ lbs) Year NominalCapacity(Watt-hours/lb) Nickel-Cadium Ni-Metal Hydride 65 70 75 80 85 90 95 0 10 20 30 40 50 Rechargable Lithium Expected Battery Lifetime increase over next 5 years: 30-40%
  • 5. Where Does Power Go in CMOS? • STATIC POWER---NIL • Dynamic Power Consumption • Short Circuit Currents • Leakage Charging and Discharging Capacitors Short Circuit Path between Supply Rails during Switching Leaking diodes and transistors
  • 6. Power consumption • 4 components Static power consumption Short circuit power consumption Leakage power consumption Dynamic power consumption
  • 7. • The total power in a CMOS circuit is given by Ptotal = Pd + Psc + Ps where  Pd is the dynamic average power (previous chart),  Psc is the short circuit power,  and Ps is the static power due to ratio circuit current, junction leakage, and sub-threshold Ioff leakage current • Short circuit current flows during the brief transient when the pull down and pull up devices both conduct at the same time where one (or both) of the devices are in saturation
  • 10. CMOS Short-Circuit Power Dissipation Derivation
  • 12.
  • 14. t1- t2, Mos operates in saturation At t2, current reaches its maximum value At this point vin=vdd/2, because inverter is symmetrical I mean= 2x [2/T] x ∫Isat dt : Limits(t1, t2) Conditions—Vin(t)=(Vdd/τ) t; --assume vin increases linearly with time tr = tf = trf Psc = (/12) (Vdd – 2Vt)3 (trf/tpin)
  • 15. • For a balanced CMOS inverter with n=p= , and Vtn = |Vtp|, the short circuit power can be expressed by Psc = (/12)(Vdd – 2Vt)3 (tr/f/tpin) where tpin is the period of the input waveform and trf is the input rise time (or fall time) tr = tf = trf
  • 16. Effect of load cap on short circuit power • P short circuit reduces • Reason---- output start switching after input has completely stabilized
  • 19. Energy stored across capacitor
  • 21.
  • 22. Average Dynamic Power in CMOS Inverter • Average dynamic power derivation: – On negative going input, pull-up device charges the load capacitance. On positive going input, pull-down device discharges the load into ground. – Average power given by Pave = (1/T)CL (dvout/dt) (Vdd – vout)dt + (1/T)(-1) CL (dvout/dt) vout dt where the first integral is taken from 0 to T/2 and the second integral is from T/2 to T • completion of the integral yields Pave = CL Vdd 2 f where f = 1/T • Note that the dynamic power is independent of the typical device parameters, but is simply a function of power supply, load capacitance and frequency of the switching!
  • 23. Vin Vout CL Energy/transition = CL * Vdd 2 Power = Energy/transition * f = CL * Vdd 2 * f Need to reduce CL, Vdd, and f to reduce power. Vdd Not a function of transistor sizes!
  • 24. Reduce power consumption • Reduce Vdd • Reduce swing at the output • Reduce CL • Reduce Switching activity To keep same speed, can we reduce Vdd, increase (w/L)?  No Inc in W inc in CL
  • 25. Dynamic Power Consumption - Revisited Power = Energy/transition * transition rate = CL * Vdd 2 * f01 = CL * Vdd 2 * P01* f = CEFF * Vdd 2 * f Power Dissipation is Data Dependent Function of Switching Activity CEFF = Effective Capacitance = CL * P01
  • 26.
  • 27. Power Consumption is Data Dependent uniform distribution of inputs Example: Static 2 Input NOR Gate Assume: P(A=1) = 1/2 P(B=1) = 1/2 P(Out=1) = 1/4 P(01) = 3/4  1/4 = 3/16 Then: = P(Out=0).P(Out=1) CEFF = 3/16 * CL
  • 28.
  • 29. Transition Probabilities for Basic Gates Non-uniform distribution of inputs
  • 32.
  • 33.
  • 34. Sizing for min. power consumption For a given delay constraint
  • 35. Sizing for power consumption
  • 36.
  • 40.
  • 42. Why energy reduces for F increasing? • Assume delay reqd is tpref=5ns. • As F inc CL inc. delay (tp) inc. and dyn. energy inc. linearly • But as f inc delay reduces exponentially, energy inc. • for F= 1 delay is already small and close to tpref). Inc in f does not cause much reduction rather energy increment is more • For F large, delay and energy are large values • Hence as f inc., delay reduces drastically (become less than tpref ). Hence to have given delay= tpref, energy is dec. which inc. delay to tpref. • As f is increased further, delay reduction reduces, only energy increases
  • 43. Design example—0.25um technology, find f, Vdd for tpref=0.2ns. Cext=10Cg1, γ=1, Vref=2.5v
  • 44. Design a chain of inv for min delay, min energy
  • 45. Power delay product Indicates that energy required  0 for Vdd 0  erroneous