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POWER Introduction to Low Power VLSI Design Dr Anu Mehra
Where Does Power Go in CMOS?
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Dynamic Power  Charging and discharging of capacitors due to logic switching event
[object Object],[object Object],[object Object]
Dynamic Power Dissipation Energy/transition = C L  * V dd 2 Power = Energy/transition *  f =  C L * V dd 2 * f 0   to1  or 1 to 0 Need to reduce C L , V dd , and  f to reduce power. Not a function of transistor sizes! i VDD f 0 to1  or 1 to 0  is the frequency of transition Vin Vout C L Vdd
Half the energy stored in the Capacitor, the other half is lost !
Node Transition Activity and Power
Transistor Sizing for Minimum Energy ,[object Object]
Delay Formula C int  =   C gin  with         1 f  =  C ext /C gin   - effective fanout C ext =fC gin R = R unit /W ; C int  =WC unit t p 0  = 0.69 R unit C unit Let tp=0.69 Req(Cint+Cext) =0.69 ReqCint(1+Cext/Cint) =tp0(1+Cext/Cint) =tp0(1+f/  )
Transistor Sizing for Minimum Energy ,[object Object],[object Object],[object Object]
Delay as a function of V DD
[object Object],[object Object],[object Object],[object Object],[object Object]
Transistor Sizing (2) ,[object Object],[object Object]
Let for a reference device f=1
 
Transistor Sizing (3) F =1 2 5 10 20 V DD = f (f) E/E ref = f (f)
[object Object],[object Object],Short Circuit Currents scr is short circuit rise time And scf is short circuit fall time P SC  is short circuit power consumption I SC  is the short circuit current consumed Δ t sc   is the duration for which the short circuit current flows I SC , avg  is the average crowbar current during rise and fall.
C sc  is short circuit  capacitance
Short Circuit Currents - another approach ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],V T VDD-V T 1 2 time voltage
Direct Path currents contd. Area of an equilateral triangle is 1/2base. perpendicular P=VI, E=Pt
f 0   to1  or 1 to 0 is switching frequency ts is 0 to 100% transition time tr(f) is 10 to 90% transition time
How to minimize crowbar currents? ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
How to minimize crowbar currents? ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Short Circuit Currents
How to keep Short-Circuit Currents Low? Short circuit current goes to zero if t fall  >> t rise , but can’t do this for cascade logic, so ... Input slope is fixed
Conclusion… ,[object Object],[object Object],[object Object],[object Object],[object Object]
Minimizing Short-Circuit Power Vdd =1.5 Vdd =2.5 Vdd =3.3
[object Object],[object Object],[object Object],[object Object],[object Object],V T VDD-V T 1 2 time voltage
Dynamic Power -Glitches Glitches are caused by arrival time of  two separate input signals. If a given input signal arrives first and causes the output to switch, later another input signal arrives and causes the output to switch back to original value. Undesired Power dissipation ! Glitches propagate thought the fanout gate and cause further unintended transitions
[object Object],[object Object],[object Object]
Static Power Consumption  ,[object Object],[object Object],[object Object]
Leakage Sub-threshold current one of most compelling issues in low-energy circuit design!
Reverse-Biased Diode Leakage JS =  10-100 pA/  m2  at 25 deg C for  0.25  m CMOS JS  doubles for every 9 deg C!
Junction Leakage currents are caused by thermally generated carriers. Their value increases with increasing temperature. At 85 degrees Celsius, (upper bound for junction temperature) their value increases by 60 times over room temperature value.
Subthreshold Leakage Component
Sub threshold Leakage issues Closer V T  is to 0 V, larger is the static power dissipation as I D  becomes larger L is getting smaller as source and drain are getting closer Supply voltages are being scaled while keeping V T  constant. This leads to increase in delay –see next slide. As Supply voltage goes down to 2V T,,  performance goes down substantially. If V T  is lowered, performance improves, sub threshold leakage becomes an issue i.e. Trade off between power and delay!
Delay as a function of V DD V T =0.5V
Static Power Consumption Wasted energy … Should be avoided in almost all  cases, but could help reducing energy in others (e.g. sense amps)
Principles for Power Reduction ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Modification for Circuits with Reduced Swing
Power Equation Static power loss in pseudo nmos only half the time!
POWER DELAY TRADE OFF We want low power and small delay. Why not minimize the product? P avg  is average Power consumed  t p  is average delay Only dominant term in Power Equation Assume Gate switches at maximum possible rate so rise and fall
To Reduce PDP ,[object Object],[object Object],[object Object],[object Object],[object Object]
Differentiating EDp w.r.t. V DD  and putting the result equal to 0
V DD (V) V T =0.5V
LPVD Lecture-1   ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],SOURCES OF POWER DISSIPATION
LPVD Lecture-1   ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],LOW POWER APPROACHES
LPVD Lecture-1   ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
LPVD Lecture-1   ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Thank you ………….

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Power

  • 1. POWER Introduction to Low Power VLSI Design Dr Anu Mehra
  • 2. Where Does Power Go in CMOS?
  • 3.
  • 4. Dynamic Power Charging and discharging of capacitors due to logic switching event
  • 5.
  • 6. Dynamic Power Dissipation Energy/transition = C L * V dd 2 Power = Energy/transition * f = C L * V dd 2 * f 0 to1 or 1 to 0 Need to reduce C L , V dd , and f to reduce power. Not a function of transistor sizes! i VDD f 0 to1 or 1 to 0 is the frequency of transition Vin Vout C L Vdd
  • 7. Half the energy stored in the Capacitor, the other half is lost !
  • 9.
  • 10. Delay Formula C int =  C gin with   1 f = C ext /C gin - effective fanout C ext =fC gin R = R unit /W ; C int =WC unit t p 0 = 0.69 R unit C unit Let tp=0.69 Req(Cint+Cext) =0.69 ReqCint(1+Cext/Cint) =tp0(1+Cext/Cint) =tp0(1+f/  )
  • 11.
  • 12. Delay as a function of V DD
  • 13.
  • 14.
  • 15. Let for a reference device f=1
  • 16.  
  • 17. Transistor Sizing (3) F =1 2 5 10 20 V DD = f (f) E/E ref = f (f)
  • 18.
  • 19. C sc is short circuit capacitance
  • 20.
  • 21. Direct Path currents contd. Area of an equilateral triangle is 1/2base. perpendicular P=VI, E=Pt
  • 22. f 0 to1 or 1 to 0 is switching frequency ts is 0 to 100% transition time tr(f) is 10 to 90% transition time
  • 23.
  • 24.
  • 26. How to keep Short-Circuit Currents Low? Short circuit current goes to zero if t fall >> t rise , but can’t do this for cascade logic, so ... Input slope is fixed
  • 27.
  • 28. Minimizing Short-Circuit Power Vdd =1.5 Vdd =2.5 Vdd =3.3
  • 29.
  • 30. Dynamic Power -Glitches Glitches are caused by arrival time of two separate input signals. If a given input signal arrives first and causes the output to switch, later another input signal arrives and causes the output to switch back to original value. Undesired Power dissipation ! Glitches propagate thought the fanout gate and cause further unintended transitions
  • 31.
  • 32.
  • 33. Leakage Sub-threshold current one of most compelling issues in low-energy circuit design!
  • 34. Reverse-Biased Diode Leakage JS = 10-100 pA/  m2 at 25 deg C for 0.25  m CMOS JS doubles for every 9 deg C!
  • 35. Junction Leakage currents are caused by thermally generated carriers. Their value increases with increasing temperature. At 85 degrees Celsius, (upper bound for junction temperature) their value increases by 60 times over room temperature value.
  • 37. Sub threshold Leakage issues Closer V T is to 0 V, larger is the static power dissipation as I D becomes larger L is getting smaller as source and drain are getting closer Supply voltages are being scaled while keeping V T constant. This leads to increase in delay –see next slide. As Supply voltage goes down to 2V T,, performance goes down substantially. If V T is lowered, performance improves, sub threshold leakage becomes an issue i.e. Trade off between power and delay!
  • 38. Delay as a function of V DD V T =0.5V
  • 39. Static Power Consumption Wasted energy … Should be avoided in almost all cases, but could help reducing energy in others (e.g. sense amps)
  • 40.
  • 41. Modification for Circuits with Reduced Swing
  • 42. Power Equation Static power loss in pseudo nmos only half the time!
  • 43. POWER DELAY TRADE OFF We want low power and small delay. Why not minimize the product? P avg is average Power consumed t p is average delay Only dominant term in Power Equation Assume Gate switches at maximum possible rate so rise and fall
  • 44.
  • 45. Differentiating EDp w.r.t. V DD and putting the result equal to 0
  • 46. V DD (V) V T =0.5V
  • 47.
  • 48.
  • 49.
  • 50.