The document discusses Micro-Electro-Mechanical Systems (MEMS), which is a technology that creates tiny integrated devices combining mechanical and electrical components, ranging in size from micrometers to millimeters. As an example, it describes the DENSO Micro-Car, a miniature version of Toyota's first passenger car fabricated at 1/1000 the size using MEMS. It also provides information on MEMS applications, commercialization, fabrication methods, and industry challenges.

1. MEMSMEMS

2. The DENSO Micro-Car is a miniature version of
Toyota’s first passenger car. Fabricated using MEMS,
at 1/1000 th the size of the original.
It consists of a 0.67 mm magnetic-type working motor
and when supplied with 3 V 20 mA of alternating
current through a 18 m copper wire,μ
The engine runs at 600 rpm equivalent to 5-6 mm/s

3. Micro-elctro-mechanical-systems is the
technology of very small devices.
MEMS can range in size from a few
micrometers to millimetres.
It is a process technology used to create
tiny integrated devices or systems that
combine mechanical and electrical
components.

4. MEMS are separate and distinct from the
hypothetical vision of molecular
nanotechnology.
They usually consist of a central unit that
processes data (the microprocessor) and several
components that interact with the surroundings
such as microsensors.
At these size scales, the standard constructs
of classical physics are not always useful.
Because of the large surface area to volume
ratio of MEMS, surface effects such as
electrostatics and wetting dominate over volume
effects such as inertia or thermal mass.

5. APPLICATION AREAS

6. MEMS silicon motor together
with a strand of human hair

7. Legs of a spider mite standing
on gears from a micro-engine

8. The first commercial
accelerometer from Analog
Devices (1990)

9. Lab-on-a-chip technology

10. ● (a) Disposable blood pressure sensor
connected to an IV line
● (b) disposable blood pressure sensors (as
shipped)
● (c) intracardial catheter-tip sensors for
monitoring blood pressure during shown
on the head of a pin

11. MEMS optical cross connect consisting of
an array of microscopic mirrors

12. COMMERCIALIZATION

13. Worldwide market size in 1996 and 2002 for
existing MEMS product types in $US millions

14. Worldwide market size in 1996 and 2002 for
emerging MEMS product types in $US millions

15. MEMS device complexity by structural
layers

16. MEMS FABRICATION METHODS
● DEPOSITION
PROCESSES
● ETCHING
PROCESSES
● DIE
PREPARATION
● HIGH-ASPECT-RATIO
MICROMACHINING
(HARM).
● SURFACE
MICROMACHINING.
● BULK
MICROMACHINING.

17. DEPOSITION PROCESSES
Physical deposition
Chemical deposition
Patterning
Lithography
Photolithography
Electron beam lithography
Ion beam lithography
Ion track technology
X-ray lithography
Diamond patterning

18. ETCHING PROCESSES
Wet etching
Isotropic etching
Anisotropic etching
HF etching
Electrochemical etching
Dry etching
Vapor etching
Plasma etching
Reactive ion etching (RIE)

19. INDUSTRY CHALLENGES
● Limited access to MEMS fabrication
facilities.
● Design, Simulation and Modelling.
● Packaging and Testing.
● Standardization.
● Education and Training.