MEMS Pressure Sensor Market and Technologies 2018 Report by Yole Developpement

February © 2015
From Technologies to Market
MEMS Pressure
Sensor Market &
Technologies
2018
Sample
Market report
From Technologies to Market
Source : Merit

2
ABOUT THE AUTHORS
Yann de Charentenay works as aTechnology & Market Analyst forYole Développement
(Yole).As part of the MEMS & Sensors Business Unit,Yann is strongly involved in the
technology & market analysis of the applications of disruptive technologies and
components: memory, MEMS and sensors...Yann is daily contributing to the development
ofYole’s activities with a dedicated collection of market & technology reports as well as
custom consulting projects.
Prior his mission atYole,Yann was engaged as a marketing engineer at the Commissariat à
l’Energie Atomique (CEA, France) as well as a consultant at Algoe (France). He has spoken
in numerous international conferences and has authored or co-authored numerous press
articles.
Yann is graduated from the University of Compiegne (France) with a master degree in
innovation management. He is also graduated from INP Phelma (Grenoble, France) with a
master degree in materials science.
©2018 | www.yole.fr | MEMS Pressure Sensor 2018 - Market & Technologies Report - Sample

3
TABLE OF CONTENTS
• Table of Contents
• Glossary
• Companies Cited inThis Report
• Definitions
• Market Research Scope and Methodology
• Executive Summary p 13
• Global market Forecast p 33
• Market forecast by market (automotive, consumer, industrial, medical ,
avionics & high end)
• Applications Overview p 37
• Growth, pressure range, type of sensor used
• Market forecast by type of sensors
• Competitive landscape p 46
• MEMS ranking and global market share
• Players position by market
• Geographical localization
• Analysis of the value and supply chain
• M&A and potential acquisitions
• Focus on China
• Automotive Market p 66
• Market segmentation, market forecast by application,ASP.
• Applications description, main trends
• Players market share and supply chain analysis
• Consumer market p 97
• Similar content than automotive
• Industrial market p 118
• Medical market p 129
• Avionics & high end market p 143
• MEMS pressure sensor technologies p 154
• History of MEMS pressure sensors
• Position of main pressure sensor technologies
• Pressure range by applications
• Description of the main pressure sensor technologies
• Position of MEMS piezoresistive vs MEMS capacitive
• Players adoption of MEMS piezoresistive and capacitive
• Cost breakdown
• Main technical trends
• Technological roadmap
• General Conclusions p 176

4
REPORT OBJECTIVES
• This report’s objectives are as follows:
1. To give a detailed analysis of all MEMS pressure sensor applications
• Application description, sensor function, competing technologies, main market drivers and trends.
2. To provide market data on key pressure sensors market metrics & dynamics
• Pressure sensor sales in units & in revenue by market, by application, by sensor type, and technology
• Players market share globally and by market
3. To provide key technical insight on main pressure technologies and main technological trends
• Description of the main pressure sensor technologies
• Reverse engineering trends for TPMS and consumer applications
• Technological landscape and trends for MEMS technologies (piezoresistive and capacitive).
4. To provide an in-depth understanding of pressure sensor value chain, infrastructure and players
• Who are the key pressure sensor players (IDMs, module makers, vertically integrated players) and what is their market
and technological position?
• More generally, who are the key suppliers to watch and how will the pressure sensor market evolve?
• What are the potential targets for M&A ?

5
WHO SHOULD BE INTERESTED IN THIS REPORT?
• MEMS device manufacturers
• Evaluate market potential of future technologies and products
• Understand the differentiated value of your products and
technologies in this market
• Identify new business opportunities
• Identify potential strategic partners or technology providers
• Monitor and benchmark your competition’s advancements
• MEMS foundries, material and equipment suppliers,
packaging and test houses
• Understand which applications will drive volumes in the future
• Identify new business opportunities and prospects
• R&D centers
for new applicative markets
• Identify the best candidates for technology transfer
• System integrators and developers (automotive
manufacturers, medical system makers, cell phone &
tablet makers…)
to differentiate your own products
• Evaluate the benefits of using these new technologies in your
end-system; design architecture for the next generation of
systems
• Screen potential new suppliers able to provide new
functionalities, or cost and size savings
• Financial & strategic investors
• Understand the structure and value chain of the MEMS
pressure sensor industry
• Estimate the value of players developing disruptive products
and technologies
• Get the global list of main key players and emerging start-ups
in this industry

6
Alps,Amphenol, Bosch, CF sensor, Continental, Delphi, Denso, Elmos SMI, First Sensor,
GE Druck, Honeywell, Infineon, Invensense, Kistler, Kulite, Meggit, Melexis, Memscap,
MEMSensing Microsystems, Merit, MT microsystem, Murata, Murata, Nano-MEMS, NXP,
Omron, Panasonic, Rohm, Schraeder, Sensata, Sensirion, ShuangQiao Sensor, ST
Microelectronics,TDK,TE connectivity,Thales, Xfab
KEY COMPANIES CITED IN THIS REPORT

7
DEFINITIONS
• MEMS (Micro Electro Mechanical Systems) are semiconductor devices that include moving parts in the µm to mm
range and use a photolithography process for manufacturing. A MEMS pressure sensor is a device for pressure
measurement of gases or liquids. It converts a pressure into an electric signal. Position of pressure sensors in the
supply chain :
Second level
Packaging = module,
transducer, transmitter
• MEMS pressure sensor chips are built from silicon (front end manufacturing), assembled generally with an ASIC chip
and packaged in a first level packaging (back end manufacturing). Second level packaging is adding further electronic,
robust housing, and connectors. In the report, we will consider only value of first level packaging and not module
value (called also transducer or transmitter).
• Exceptions : for TPMS, we will consider TPMS SiP value (pressure sensor+accelerometer, RF, MCU) and for
applications that integrates chips directly in a second level packaging (automotive HVAC or oil) we will consider a
theoretical first level packaging value.
Sensor + ASIC
packaged
Sensor alone or Sensor + ASIC chips
(multi chips packages or monolithic)
First Level Packaging :
Devices considered for
market forecasts
Systems
(Automotive power train
example)
Front end manufacturing Back end manufacturing

8
MARKET RESEARCH SCOPE AND METHODOLOGY
• Market research scope
• This report surveys MEMS pressure sensors.
• Products not covered :
• Other pressure sensor technologies : ceramic, thin film…
• Pressure switches
• This includes the following MEMS technologies:
• MEMS piezo resistive
• MEMS capacitive
• Market estimates are for the period 2017 – 2023 in $ (with $1.1 = one euro conversion).
• Methodology:
• This report has been prepared based on research into:
• Primary information sources: direct interviews with companies (sensor manufacturers, integrators).
• Secondary information sources: conferences, web sites, newsletters....
• All data, graphs, tables, and calculations in this report are based on Yole Développement’s
investigation.

Applications Overview
Sensata Schraeder TPMS valve

10
MEMS PRESSURE SENSOR APPLICATIONS
Overview
Pressure
sensors are
used in a
wide variety
of
applications
(29 covered
by the
report)
MEMS pressure sensors
Application
Automotive
Avionics & high end
Medical
Consumer
Industrial
Smartphones
& tablets Wearables
Blood pressure
monitoringRespiratory
Smart inhalder
TPMS
Side airbags
Particle filter
HVAC
Process control
FADEC
Air data
BAP
Electronic cigarette
Transportation

11
MEMS PRESSURE SENSOR APPLICATIONS
Covered markets and applications
29
applications
analysed
and
forecasted
• Automotive
• Powertrain
• MAP
• BAP
• Particle filter
• Fuel tank
• Exhaust gaz
recirculation
• Engine oil
• Automatic
transmission oil
• Safety
• TPMS
• Brake booster
• Side airbags
• Pedestrian
protection
• Comfort
• HVAC
• Industrial
• Industrial process controls
• HVAC
• Transportation & other
• Medical
• Blood monitoring invasive
• Blood monitoring non invasive
• Respiratory
• Smart inhaler
• Other medical applications
• Consumer
• Smartphone & tablets
• Wearable
• Electronic cigarette
• Drones
• Smart home
• Avionics & High-End
• Avionics air Data
• Avionics FADEC
• Avionics Hydraulic
• Other high end applications

12
MEMS PRESSURE SENSOR MARKET FORECAST
By market in $
CAGR is
3,8% in $
• Automotive is the
largest market by
far (about 50% of
the total) and with
significant growth.
• Consumer is much
smaller due to low
pricing but will
grow significantly.
• Medical and
industrial has
similar size with
same moderate
growth.
• Avionics&high end
is a niche market
but with high
growth.

Competitive Landscape

14
MEMS PRESSURE SENSOR COMPETITIVE LANDSCAPE
Leading players by market
Market
leaders are
different for
each market
except for
Bosch.
Honeywell,
and NXP have
strong
presence in 3
markets
Automotive IndustrialConsumer avionics &
High-End
No.1
No.2
No.3
No.4
No.5
Medical

15
MEMS PRESSURE SENSOR SUPPLY CHAIN
Key players categories and business models
Various
supply chain
are possible
depending
on the
market
• There is a competition between IDM’s, module and systems makers to produce first level pressure sensors.
xxxx
• xxxx
• xxxxx
Pressure sensor die ASIC die First level
packaging
IDM
(Integrated
Device Manufacturers)
Module
IDM + module
IDM + module+ System :
Vertically integrated
players
System
Players focused on
one step of the value chain

16
MEMS PRESSURE SENSOR PLAYERS
Players market share at the first packaging level
Automotive
players are
owning xx %
of the
business
Market Share of all players 2018
$xxM

Automotive market

18
AUTOMOTIVE MARKET DESCRIPTION
Source : Infineon, 2016

Consumer market

20
CONSUMER MARKET DESCRIPTION

Industrial Market
Rosemount Emerson pressure sensors

22
INDUSTRIAL MARKET DESCRIPTION

MEMS Pressure Sensor
Technologies
Bosch BMP 280 pressure sensor

24
PRESSURE SENSORTECHNOLOGIES
History of MEMS technology & pressure sensor
Pressure
sensor is one
of the very-
first device of
the MEMS
history
1960 1970 1980 1990 2000
BJT Transistor
IC
Pressure Sensor
(Honeywell, Fairchild)
Si Pressure Sensor
(Motorola)
Silicon-to-silicon fusion
bond Pressure Sensor
(NovaSensor)
IR imager
(Honeywell)
Accelerometer
(ADI)
DMD, DLP (TI)
Si Gyro
(Draper)
RF MEMS
Bio MEMS
DRIE (Bosch)
XeF2 (UCLA)
Ink jet nozzle
(HP)
Product’s first
commercialization
Micromachining
related process
Anisotropic silicon
etching
University &
industrial R&D
Pressure sensor research
(Stanford)
Pressure Sensor
(National Semiconductor)
DLP research (TI)
Piezoresistive
pressure sensor
research (Kulite)
Accelerometer research
(ADI)
LIGA
Metal sacrificial
process Silicon-to-silicon
fusion bond
PolySi beams
Pressure sensor
related

25
Ceramic capacitive technology
• Structure: 2 disks of metallized (on one face) ceramic form the 2 electrodes of a capacitor. The dielectric thickness changes with
the pressure applied on one of the disks and the capacitor change is measured by an electronic circuit, mounted on the second
disk.
• Diameter and thickness of the disk exposed to the media define the range of pressure.
Sensata’s ceramic capacitive
pressure sensor P500
• With relative (gauge) pressure sensors, the
back of the diaphragm is vented, i.e. this
sensor measures the gauge pressure
relative to the atmospheric pressure.
• With absolute pressure sensors, the vacuum created in
the production process between the diaphragm and the
body of the cell is permanent.This permits pressure
measurements related to the vacuum.
Source: Nelege

26
MEMS technologies comparison
• MEMS capacitive has some technical advantages over MEMS piezoresisitive
but is still rarely used.
• It can be explained by the following factors :
• Xx
• Xx
• xx
Despite
significant
technical
advantages,
capacitive
technology is
still less
widespread
than
piezoresistive
MEMS piezoresistive MEMS capacitive
Measurement of differential pressure ●●● o
Accuracy
Power consumption
Sensitivity to temperature
Pressure range
Chip size
Signal treatment cost
Minimal order quantity
●●● Good position ● Medium position o Requirement not fulfilled

27
RELATED REPORTS

The automotive industry is the oldest and the
biggest market for MEMS pressure sensors.
Powertrain applications represent more than
50% of the business, followed by safety, with
tire pressure management systems (TPMS)
being the biggest single automotive application.
Driven by CO2 emission reduction and
automation, pressure sensors will increasingly
be used in the next five years, especially in
China, whose regulations will require pressure
sensors for several applications. These include
TPMS, diesel and gasoline particle filters (DPF,
GPF) and fuel tank evaporation (EVAP).
The consumer market is now the second largest
pressuresensorbusiness,thankstorecentrapid
adoption in high-end smartphones and tablets.
This will further extend to Android mid-to-low
value smartphones, driven by new use cases,
such as indoor and outdoor navigation. Lower
sensor costs and better accuracy and power
also enable new applications to grow, such as
wearables, electronic cigarettes, drones, and
smart homes.
Avionics and high-end applications are still
niche markets, but exhibit the fastest market
growth thanks to the dynamic aircraft market
and MEMS taking over from traditional
technologies.
The medical and industrial markets are
growing at a moderate rate because there is no
significant change in term of applications, with
one exception. New medical smart inhalers
are in between the medical and consumer
markets, and pave the way for many future
medical consumer Internet of Things (IoT)
applications.
Overall, the MEMS pressure sensor market will
grow by 3.8% per year, reaching a value of $2B
in 2023. The report identifies the key driving
forces and restraints for each pressure sensor
market and application, and provides accurate
market value and volume forecasts.
MEMS PRESSURE SENSOR MARKET AND TECHNOLOGIES 2018
Market & Technology report - May 2018
AUTOMOTIVE AND CONSUMER APPLICATIONSWILL CONTINUE TO DRIVE
THE PRESSURE SENSOR BUSINESS
Automotive and consumer applications are propelling the MEMS pressure sensor business to new
heights.
(Yole Développement, May 2018)
MEMS pressure sensor market forecast, broken down by market
WHAT’S NEW
• Updated market forecast for 29
applications
• New applications: pedestrian
protection, wearables, drones,
electronic cigarettes, transportation,
smart inhalers and avionic hydraulics
• Main specifications and trends for
each application
• In depth analysis of automotive
applications, especially tire pressure
monitoring systems (TPMS) with key
products reverse engineered
• In depth analysis of consumer
applications with key products
reverse engineered
• In depth analysis of key players by
market and by piezoresistive or
capacitive technology, and expected
evolution
• Analysis of past mergers and acquisi-
tions and potential future targets
• New market forecast broken down
into absolute, gauge and differential
pressure sensor categories
• Competitive positioning of
MEMS technology against other
technologies
• Competitive positioning of piezore-
sistive against capacitive MEMS
• Analysis of main technical trends:
miniaturization and monolithic
approaches
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Market forecast for 2017-2023 in
volume and value; broken down
by market, spanning automotive,
consumer, industrial, medical,
avionics and high-end applications;
broken down across 29 different
applications; and broken down into
absolute, gauge and differential
pressure sensor categories
• Competitive landscape with player
market shares by technology and
market, supply chain analysis and
market dynamics
• Pressure sensor applications, market
drivers, main trends and key players
• Technology descriptions and compa-
risons, main trends and main players
$ 0
$ 500
$1 000
$1 500
$2 000
$2 500
2016 2017 2018 2019 2020 2021 2022 2023
Avionics and high end Medical Industrial Consumer Automotive
THE COMPETITIVE LANDSCAPEVARIES BETWEEN THE AUTOMOTIVE,
CONSUMER, MEDICAL, INDUSTRIAL, AVIONICS AND HIGH END MARKETS
The competitive landscape varies greatly with
the type of market addressed.
• In both the high-volume automotive and
consumer markets, Bosch is clearly the
dominant leader. This is a unique position.
Bosch has succeeded in leveraging its
automotive product leadership to become
leader in the newer consumer market.

MEMS PRESSURE SENSOR MARKET AND TECHNOLOGIES 2018
TECHNICAL TRENDS: AUTOMOTIVE ELECTRIFICATION WILL TRANSFORM THE
PRESSURE SENSOR BUSINESS
MEMS pressure sensor technologies are now
quite mature, and are basically segmented into
piezoresistive and capacitive categories. These
two technologies are not hugely different. Today
piezoresistive is clearly leading in terms of market
share, and that will continue. We don’t expect
big technical breakthroughs, mainly incremental
improvements, with miniaturization as important
as in all semiconductor products.
We expect bigger changes at the system level,
especially in automotive, which has been shaken
by electrification and automation. Electrification is
positive for pressure sensors when it is deployed
in hybrid vehicles (HEVs) that have combustion
engines that use many pressure sensors. But
zero emission vehicles (ZEVs), which includes
pure battery vehicles (BEVs) and fuel cell vehicles
(FCVs), eliminate the combustion engine, and
with it the demand for powertrain sensors.
With powertrain sensors representing 50% of
the automotive MEMS pressure sensor business,
leading powertrain pressure sensor makers like
Bosch, Infineon, or Denso must be worried about
their future business. However, the transition will
take more than a decade. This report will help
readers find new, alternative markets.
Leading players, broken down by market
Long term zero emission vehicle (ZEV) impact on the automotive
powertrain business
COMPANIES CITED IN THE REPORT (non exhaustive list)
Alps, Amphenol, Bosch, CFSensor, Continental, Delphi, Denso, Elmos SMI, First Sensor, GE Druck,
Honeywell, Infineon, Invensense, Kistler, Kulite, Meggit, Melexis, Memscap, MEMSensing Microsystems,
Merit, MT microsystem, Murata, Murata, Nano-MEMS, NXP, Omron, Panasonic, Rohm, Schraeder,
Sensata, Sensirion, ShuangQiao Sensor, ST Microelectronics, TDK, TE Connectivity, Thales, Xfab…
Bosch has aggregated both markets’ production
volume to reduce cost, and further increase
its competitive advantage. Other players
like Infineon, Sensata, Denso and Melexis
are mainly focused on automotive, while ST
Microelectronic and Alps serve the consumer
market. Only TE Connectivity and NXP also
have multimarket presence. The key players are
large groups active in various MEMS sensors,
with inertial, pressure and gas sensor devices.
Vertical integration is usual in automotive at
companies like Bosch, Denso and Sensata, but
not in consumer, because systems are smaller
and thus there is no need for tier one component
suppliers.
• The medium-to-low-volume medical, industrial,
avionics and high-end markets all have many of
the same key players. They include Honeywell,
Amphenol, NXP, TE Connectivity, Omron,
First Sensor, Merit, Elmos SMI, and TDK. These
companies grow their business by targeting
multiple markets, and by making added-value
modules. There are also pure avionics and high-
end market players, such as Kulite or Memscap.
Mergers and acquisitions (MA) between
Amphenol and GE, Sensata, Schrader and CST,
TDK and Invensense, and Qualcomm, NXP and
Freescale all included pressure sensor activities,
and activity has therefore been concentrated.
The budget for future acquisitions will probably
exceed $100M. The report lists future possible
targets, and ranks them to help MA decision
makers.
Automotive IndustrialConsumer Avionics
high-end
No.1
No.2
No.3
No.4
No.5
Medical
$ 793M $ 302M $ 256M $ 64M$ 221M
0%
10%
20%
30%
40%
50%
60%
$ 0
$ 200
$ 400
$ 600
$ 800
$1 000
$1 200
2016 2023 2030 2050
Safety Comfort ZEV %Powertrain

OBJECTIVES OF THE REPORT
• To give a detailed analysis of all MEMS pressure sensor applications
- Application description, sensor function, competing technologies, main market drivers and
trends
• To provide market data on key pressure sensors market metrics and dynamics
- Pressure sensor sales in volume and value by market, by application, by sensor type, and
technology
- Players market share globally and by market
• To provide key technical insight on main pressure technologies and main technological trends
- Description of the main pressure sensor technologies
- Reverse engineering trends for tire pressure monitoring systems (TPMS) and consumer
applications
- Technological landscape and trends for piezoresistive and capacitive MEMS technologies
• To provide an in-depth understanding of pressure sensor value chain, infrastructure and players
- Who are the key pressure sensor players, including integrated device manufacturers,
module makers and vertically integrated players, and what is their market and technological
position?
- More generally, who are the key suppliers to watch and how will the pressure sensor
market evolve?
- What are the potential targets for mergers and acquisitions?
MARKET TECHNOLOGY REPORT
Find more
details about
this report here:

Table of contents
Glossary
Companies cited in this report
Definitions
Market research scope and methodology
Executive summary 13
Global market forecast 33
Market forecast by market: automotive,
consumer, industrial, medical and
avionics and high-end
Application overviews 37
Growth, pressure range, type of sensor
used
Market forecast by type of sensors
Competitive landscape 46
MEMS ranking and global market share
Player positions by market
Geographical localization
Analysis of the value and supply chain
MA and potential acquisitions
Focus on China
Automotive market 66
Market segmentation and market
forecast by application and ASP
Application descriptions and main trends
Electrification’s impact on powertrain
business
Players’ market shares and supply chain
analysis
Consumer market 97
Similar content to automotive
Industrial market 118
Medical market 129
Avionics and high end market 143
MEMS pressure sensor technologies 154
History of MEMS pressure sensors
Position of main pressure sensor
technologies
Pressure range by application
Description of the main pressure sensor
technologies
Position of piezoresistive vs capacitive
MEMS
Player adoption of piezoresistive and
capacitive MEMS
Cost breakdown
Main technical trends
Technological roadmap
General conclusions 176
TABLE OF CONTENTS (complete content on i-Micronews.com)
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2017
RELATED REPORTS
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AUTHOR
Yann de Charentenay works as
a Technology Market Analyst for
Yole Développement (Yole). As part
of the MEMS Sensors Business Unit,
Yann is strongly involved in technology
market analysis of applications of
disruptive technologies and components
such as memory, MEMS and sensors.
Yann contributes to the development of
Yole’s activities daily, with a dedicated
collection of market and technology
reports as well as custom consulting
projects.
Prior to joining Yole, Yann was
engaged as a marketing engineer at
the Commissariat à l’Energie Atomique
(CEA), France, as well as a consultant at
Algoe, also in France. He has spoken at
numerous international conferences and
has authored or co-authored numerous
press articles.
Yann graduated from the University of
Compiegne in France, with a master’s
degree in innovation management.
He also graduated from INP Phelma
in Grenoble, France, with a master’s
degree in materials science.
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o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
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• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/3)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− Gas Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – byYole Développement
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Update
− Radar Technologies for Automotive 2018 - Update
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –
Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure 2018
− RF Front-End Modules in Smartphones
− RF GaN*
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module and Wafer Level Optics Industry 2018 -
Update
− 3D Imaging and Sensing 2018 - Update
− Machine Vision for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
− CMOS Image Sensors
− Compact Camera Modules
− LiDAR – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 - Update
− Processing Hardware and Software for AI 2018 – Vol. 1 2
Update : 2017 version still available / *To be confirmed

ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like
PCB Trends
− Fan-Out Packaging 2018 – Update*
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update*
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Memory Packaging Market and Technology Report 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI 2018 – Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− RF Front-End SiP
− Fan-Out Packaging *
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
− Wafer Starts for More Than Moore Applications
− Equipment for More than Moore: Technology Market Trends for Lithography
Bonding/Debonding 2018
− Equipment for More than Moore: Technology Market Trends for Thin Film
Deposition Etching 2018
− Wafer Bonding Technology Overview 2018
MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing 2018 (NAND DRAM)
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape Analysis
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – byYole Développement
− Status of Compound Semiconductor Industry 2018*
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –
Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Power SiC Devices
− Power GaN Devices
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Modules Packaging 2018 - Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for EV/HEV 2018 - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
− Power ICs Market 2018 – Update
− Power ICs Market 2018*
− Power Modules*
BATTERY AND ENERGY MANAGEMENT
− Solid State Electrolyte Battery 2018
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 -
Update
− Solid-State Batteries – Patent Landscape Analysis
− Status of the Battery IP – Patent Watch 2018 Patent Activity 2017
SOLID STATE LIGHTING
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− LiFi 2018
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Displays and Optical Vision Systems for AR / VR / MR 2018
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medial
Applications 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies - Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation Laboratory
Markets 2018*
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis
− OCT Medical Imaging – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed

OUR 2017 PUBLISHED REPORTS (1/3)
MEMS SENSORS
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING PHOTONICS
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES ANDTECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
− Embedded Software in Vision Systems
MEDTECH
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology Market Analysis 2017

OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
SOLID STATE LIGHTING
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Management ICs Market 2017
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
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Email: laferriere@yole.fr – + 1 310 600-8267
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Email: oshiba@yole.fr - +81-80-3577-3042
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• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
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Email eloy@yole.fr - +33 4 72 83 01 80
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