The document outlines the drivers and challenges in the electronics and semiconductor packaging industries, highlighting trends such as miniaturization, increased product complexity, and evolving consumer demands. It discusses the implications of technological advancements, including the performance impacts of Moore's Law and the need for economic viability in various markets. Additionally, it addresses the shift towards globalized manufacturing processes and advanced automation solutions to adapt to these market changes.

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Electronics Industry Market Drivers
Specialized computing for
Military/Industrial
Consumer products for personal
use
Mass global adoption
Evolution and growth over the past 50 years…

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Electronics Industry Market Drivers
Increasing Product Diversity
• Reduced time-to-market
requirements
• Expectation of more features,
options and flexibility (no more one
size fits all)
New demands create new challenges for electronics manufacturers…
Increased
Performance/Complexity
• Moore’s law: bandwidth,
processing, memory
2000
CPU: 500MHz
RAM: 128MB
Storage: 30GB
Bandwidth: 56K bps
2010
CPU: 1GHz
RAM: 512MB
Storage: 32GB
Bandwidth: 3G
Shortened Life-Cycles
• Contracted market window
• Increased new product
introductions
• Abbreviated product lifetime

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End Market Drivers
Slowing Pace of
Lithographic Shrinks
Power
Ubiquitous Information
Access & Control
Mobile Phone
& Tablets
Automotive
LED Lighting
Mega Trends
Emerging Economy
Middle Class
Fine Pitch Flip Chip
White Goods
Energy
Efficiency
Server
& Infrastructure
Wafer Level Packaging
Vertical Interconnects
Security
& Safety
Growing End Markets
Technology Solution Implications
Rapidly increasing signal & power density:
Increasing mlcc per die , reduced formfactor,
Cu Pillar
Drives hi-speed, accuracy
Vertical Integration:
embedded, POP, SIP, TSV,eWLB
Drives convergence: TAP, AB, hi
accuracy die place + MLCC

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Semiconductor Packaging Industry Market Drivers
Miniaturization Increasing
Product Density
• Reduced feature sizes
• Smaller, Thinner Die
• 2.5D & 3D Packaging
Economic Viability
• Consumer Market – Hi Volume
• B2B Market – Mid to Hi Volume
• High End market – Aero / Mil / Med
2000
CPU: 500MHz
RAM: 128MB
Storage: 30GB
Bandwidth: 56K bps
2010
CPU: 1GHz
RAM: 512MB
Storage: 32GB
Bandwidth: 3G
0
500
1000
1500
2000
2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
WaferStartsperWeek
(300mm)
Sub 55nm Node Market Growth
>= 160nm 56 - 159nm < 55nm
Source: VLSI, September 2011
Increased
Performance/Complexity
• Moore’s law: bandwidth,
processing, memory
• Combining Functionality in a
package

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Semiconductor Packaging Challenges
Miniaturization Increasing
Product Density
• Reduced feature sizes – Hi
Accuracy, Hi Mag, FOV, Low
Force
• Smaller, Thinner Die – Force
control
• 2.5D & 3D Packaging – Force
control, multi p/n’s
New demands create new challenges for Semiconductor manufacturers…
Increased
Performance/Complexity
• Accuracy Requirements
• Multi component inventory
• Multi component process
Multi Component Assembly
Chip
35 um Bump, 50 um Pitch
Component Stacking
Economic Viability
• Consumer Market – Hi Speed, Large Working
Area Assembly
• B2B Market – Hi Speed, Quick Conversion
Manufacturing
• High End market – Hi Accuracy, Traceability

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APAS Advantages
Miniaturization Increasing
Product Density
• Reduced feature sizes – 10 um
Accuracy, .2 MPP Camera, IL7
Low Force Head
• Smaller, Thinner Die – Il7 Low
Force Head
• 2.5D & 3D Packaging –
Increased
Performance/Complexity
• +/- 10 um Accuracy
• T&R, Tray, Wafer Feeding
• Material Handling - Substrate,
Leadframe, Carrier, Boat
Multi Component Assembly
Material Handling
Chip
35 um Bump, 50 um Pitch
Component Stacking
Economic Viability
• Consumer Market – Hi Speed Placement,
Large Work Area
• B2B Market – Hi speed placement, 5 minute
Conversions
• High End market – +/- 10 um Accuracy,
Traceability

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Market Evolution Driven by Consumer
Globalization

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Market Evolution Solutions
Design to
Manufacturing
Process Support
Globalized
Factory SW
Integration
Efficient
Multi-Function
SMT
In-Line
Automation
Efficiency
Automation
Flexibility
OEE
Optimized
SMT
Agile
SMT Line
Configurability