According to the latest report by IMARC Group, that the global semiconductor packaging market size reached US$ 29.7 Billion in 2021. Semiconductor packaging refers to a metallic, glass, ceramic, and plastic casing used to enclose one or more discrete semiconductor devices and integrated circuit (IC) chips. Some commonly used semiconductor packaging variants include flip chip, embedded die, fan-in wafer-level, and fan-out wafer-level packaging.

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Global
Semiconductor
Packaging Market
Research
Report 2022-2027
Author: Elena Anderson
Marketing Manager
IMARC Group
© 2022 IMARC All Rights Reserved

2. Report Description
About IMARC Group
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3. Report Description
Report Description and Highlights
Global Semiconductor Packaging Market Outlook 2022-2027:
The latest report by IMARC Group, titled "Semiconductor Packaging Market: Global Industry
Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027," finds that the global
semiconductor packaging market size reached US$ 29.7 Billion in 2021.
Semiconductor packaging refers to a metallic, glass, ceramic, and plastic casing used to enclose one
or more discrete semiconductor devices and integrated circuit (IC) chips. Some commonly used
semiconductor packaging variants include flip chip, embedded die, fan-in wafer-level, and fan-out
wafer-level packaging.
It is widely used to protect logic units, silicon wafers, and memory devices against physical damage,
environmental impact, and corrosion during the manufacturing process. As a result, semiconductor
packaging is extensively utilized across various industries to enhance the functionality, performance,
and power of the electronic system by preventing damage due to radiofrequency noise emission,
cooling, electrostatic discharge, and mechanical factors.
Request for a PDF sample of this report: https://www.imarcgroup.com/semiconductor-packaging-
market/requestsample

4. Report Description
Report Description and Highlights
Global Semiconductor Packaging Market Drivers/Constraints:
Significant expansion in the consumer electronics industry represents the primary factor driving the
market growth. This can be attributed to the growing usage of semiconductors in small, lightweight, and
portable electronic devices, such as smartphones, smartwatches, fitness bands, tablets, and laptops.
Additionally, with the expanding automotive sector, the demand for semiconductor ICs has significantly
increased for use in automobile parts, including airbag control, infotainment systems, anti-lock braking
systems (ABS), windows, and collision detection devices. Along with this, the rising product adoption in
medical equipment, such as ultrasound devices, patient monitors, ventilators, and mobile X-ray systems,
has escalated the demand for semiconductor packaging.
Furthermore, the leading manufacturers are focusing on research and development (R&D) activities to
launch innovative packaging variants with enhanced characteristics, energy efficiency, and integration to
meet the escalating product demand from various industries..
View Report TOC, Figures and Tables: https://www.imarcgroup.com/semiconductor-packaging-
market/toc

5. Report Description
Report Description and Highlights
Key Market Segmentation
The research report includes the following segments:
Breakup by Type:
• Flip Chip
• Embedded DIE
• Fan-in WLP
• Fan-out WLP
Breakup by Packaging Material:
• Organic Substrate
• Bonding Wire
• Leadframe
• Ceramic Package
• Die Attach Material

6. Report Description
Report Description and Highlights
Breakup by Technology:
• Grid Array
• Small Outline Package
• Flat no-leads Package
• Dual In-Line Package
Breakup by End User:
• Consumer Electronics
• Automotive
• Healthcare
• IT and Telecommunication
• Aerospace and Defense

7. Report Description
Report Description and Highlights
Breakup by Region:
• North America
• Asia Pacific
• Europe
• Latin America
• Middle East and Africa
Looking forward, IMARC Group expects the market to reach US$ 47.92 Billion by 2027, exhibiting at
a CAGR of 7.70% during 2022-2027.

8. Report Description
Report Description and Highlights
Competitive Landscape:
• Amkor Technology Inc
• ASE Group
• ChipMOS Technologies Inc
• Fujitsu Limited
• Intel Corporation
• International Business Machines Corporation
• Jiangsu Changjiang Electronics Technology Co., Ltd
• Powertech Technology Inc
• Qualcomm Incorporated
• Samsung Electronics Co. Ltd
• STMicroelectronics International N.V
• Taiwan Semiconductor Manufacturing Company Limited
• Texas Instruments Incorporated
Note: We are updating our reports, If you want the report with the latest primary and secondary
data (2022-2027) including industry trends, market size and Competitive landscape, etc.
Click here: https://www.imarcgroup.com/semiconductor-packaging-market/requestsample

9. Report Description
Key Questions Answered in the Report
1. What has been the historical growth rate of the global Semiconductor Packaging Market?
2. What has been the impact of COVID-19 on the global Semiconductor Packaging Market?
3. What are the key factors driving the global Semiconductor Packaging Market?
4. What is the breakup of the global Semiconductor Packaging Market based on the type?
5. What is the breakup of the global Semiconductor Packaging Market based on the application?
6. What is the breakup of the global Semiconductor Packaging Market based on the distribution
channel?
7. What are the key regions in the global Semiconductor Packaging Market?
8. Who are the key players/companies in the global Semiconductor Packaging Market?

10. Report Description Table of Contents
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends

11. Report Description Table of Contents
5 Global Semiconductor Packaging Market Industry
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Breakup by Type
5.5 Market Breakup by Packaging Material
5.6 Market Breakup by Technology
5.7 Market Breakup by End User
5.8 Market Breakup by Region
Click here to visit the complete table of content with list of figures and tables:
https://www.imarcgroup.com/semiconductor-packaging-market/toc

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Partial List of Clients

13. A partial List of our Clients
We are the trusted business partners to the
world's leading corporates, governments, and
institutions
Partial List of Clients

14. Report Description
Report Description and Highlights
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