The 3D semiconductor packaging market is expected to grow from 2014 to 2022, driven by demand for miniaturized circuits and advancements in electronics, especially in the automotive and portable device sectors. Asia-Pacific led the market in 2015, contributing over 50% of revenue, with China, South Korea, and Japan being key players, while North America, particularly the U.S., also holds significant market share. Technologies like 3D wire bonding and TSV are prominent, with TSV expected to see the highest growth rate of 17%.

1. Published Date: 29-Dec-16
World 3D
Semiconductor
Packaging Market
Opportunities and Forecasts,
2014 – 2022

2.  3D semiconductor packaging is an advanced packaging technology
to fabricate high-performance chips such as flash memories,
DRAMS, NAND, and others, which are highly used in high-
performance computers, image sensors, smartphones, and others.
 The demand for 3D semiconductor packaging market is globally
expected to rise during the forecast period due to increase in
demand for miniaturized circuits and short replacement period of
electronics products
 Surge in the automotive sector and growth in demand for miniature
circuits in portable electronic devices provide opportunities in the
market. Asia-Pacific dominated the market in 2015, accounting over
50% of the total market revenue, and is expected to maintain its
dominance throughout the forecast period.
3D SEMICONDUCTOR PACKAGING MARKET - INTRODUCTION

3. 3D SEMICONDUCTOR PACKAGING MARKET - KEY
FINDINGS
 3D wire bonded dominated the market in
2015 with over 43% of market share,
however, 3D TSV is expected to witness the
highest growth rate of 17% In 2015,
 Die attach materials is estimated to be one of
the fastest growing segment in coming years,
growing at an estimated CAGR of 17.4%,
 Asia-Pacific dominated the market in 2015,
countries such as China, South Korea and
Japan supported the growth in the region
 In North America, United States accounts for
over 70% of the overall market owing to high
penetration of 3D TSV technology.

4. TABLE OF CONTENTS
 INTRODUCTION
 EXECUTIVE SUMMARY
 MARKET OVERVIEW
 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY
TECHNOLOGY
 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY
MATERIAL
 WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY
GEOGRAPHY
 COMPANY PROFILES

5. 3D SEMICONDUCTOR PACKAGING MARKET – TOP
WINNING STRATEGIES

6. 3D SEMICONDUCTOR PACKAGING MARKET :
SEGMENT REVIEW

7. Factors Impacting 3D Semiconductor Packaging
Market

8. 3D SEMICONDUCTOR PACKAGING MARKET - BY
GEOGRAPHY
North America, Europe, Asia Pacific, LAMEA

9. 1) Amkor Technology
2) ASE group
3) Siliconware Precision Industries Co.
4) Jiangsu Changjiang Electronics Technology Co.
5) SSS MicroTec AG.,
6) International Business Machines Corporation (IBM)
7) Intel Corporation
8) Qualcomm Technologies
9) STMicroelectronics
10)Taiwan Semiconductor Manufacturing Company
COMPANY PROFILES

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