PCB Manufacturer-Hpcb.com
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PCB stands for Printed Circuit Boards. HPCB PCB manufacturer specializes in prototype to medium production volumes. With our speedy and strong engineering support, we can provide simple solutions to complex design issues. Just simply send a Gerber file to us; we come back with the PCB of your choice with the stated time frame.
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PCB Manufacturer-Hpcb.com
- 1. Start 1
- 2. 2 Pre-engineering Pattern imaging Etching Laminating Drilling Cu plating Hole plugging Pattern imaging Lamination Laser Ablation Mechanical drilling Cu plating Pattern imaging Solder Mask Surface Finished Routing Electric test Visual inspection Shipping
- 3. Pre-engineering Pattern imaging Etching Laminating Drilling 3
- 4. 4 Desmear Cu plating Hole plugging Belt Sanding Cu plating
- 5. Pattern imaging Lamination Laser Ablation Mechanical drilling Cu plating 5
- 6. 6 Pattern imaging Solder Mask Gold plating Routing Electrical test
- 7. 7 Visual inspection Hole counter Shipping
- 8. 8 * Raw material (Thin Core,Copper,Prepreg…...) RRRRaaaawwww MMMMaaaatttteeeerrrriiiiaaaallll :::: FFFFRRRR-4444 ((((DDDDiiiiffffuuuunnnnttttiiiioooonnnnaaaallll,,,,TTTTeeeettttrrrraaaaffffuuuunnnnttttiiiioooonnnnaaaallll)) SSSSuuuupppppppplllliiiieeeerrrr :::: EEEEMMMMCCCC ,,,,NNNNaaaannnn-YYYYaaaa SSSShhhheeeeeeeetttt ssssiiiizzzzeeee :::: 33336666”****44448888” ,,,, 44440000”****44448888” ,,,,44442222”****44448888 CCCCoooorrrreeee TTTThhhhiiiicccckkkknnnneeeessssssss :::: 0000....000000003333”,,,,0000....000000004444”,,,,0000....000000005555”,,,,0000....000000006666” 0000....000000008888”,,,,0000....000011110000”,,,,0000....000011112222”,,,,0000....000011115555” 0000....000022221111”,,,,0000....000033331111”,,,,0000....000033339999”,,,,0000....000044447777” CCCCooooppppppppeeeerrrr FFFFooooiiiillll :::: 1111////3333 oooozzzz,,,,1111////2222 oooozzzz,,,,1111....0000 oooozzzz,,,,2222 oooozzzz PPPPrrrreeeepppprrrreeeegggg ttttyyyyppppeeee :::: 1111000088880000,,,,2222111111113333,,,,2222111111116666,,,,1111555500006666,,,,7777666622228888,,,,7777666633330000
- 9. 9 1. Innerlayer (THIN CORE) Laminate Copper Foil (Panel Size) CCCCOOOOPPPPPPPPEEEERRRR FFFFOOOOIIIILLLL EEEEppppooooxxxxyyyy GGGGllllaaaassssssss
- 10. 10 PPPPhhhhoooottttoooo RRRReeeessssiiiisssstttt 2. Dry Film Resist Coat Etch Photoresist (D/F)
- 11. PPPPhhhhoooottttoooo RRRReeeessssiiiisssstttt 11 3. Inner Artwork Expose Dry film AAAArrrrttttwwwwoooorrrrkkkk Before Expose After Expose
- 12. 12 4. Inner layer immage Develop PPPPhhhhoooottttoooo RRRReeeessssiiiisssstttt
- 13. 13 5. Inner Layer Etch PPPPhhhhoooottttoooo RRRReeeessssiiiisssstttt
- 14. 14 6. Inner Layer Strip Resist
- 15. 15 7. Oxide Coating
- 16. 16 8. Lay-up Building LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6 Layer 1 Layer 2 Layer 3 Layer 4 Copper Foil Prepreg Inner Layer Prepreg Copper Foil
- 17. 17 9. Lamination
- 18. 18 Typical of the multilayer structure of stacked plates and laminated . . . The hot plate press machine • Superimposed with the steel COPPER FOIL 0.5 OZ Thin Core ,FR-4 prepreg COMP S0LD. prepreg Thin Core ,FR-4 prepreg COPPER FOIL 0.5 OZ Superimposed with the steel 11110000-11112222層疊合 Superimposed with the steel COPPER FOIL 0.5 OZ Thin Core ,FR-4 prepreg The hot plate press machine COMP S0LD. prepreg Thin Core ,FR-4 prepreg COPPER FOIL 0.5 OZ Superimposed with the steel
- 19. 19 Alu base board 10. NC Drilling
- 20. 20 11. Desmear & Copper Deposition
- 21. 21 12. Hole Plugging 13. Belt Sanding
- 22. 22 14. Copper Reduction Option 15. Belt Sanding Option
- 23. 23 16. Dry Film Lamination (Outer layer) Photo Resist
- 24. 24 17. Outerlayer Expose UV
- 25. 25 18. After Exposed
- 26. 26 19. Outerlayer Develop
- 27. 27 20. Etch
- 28. 28 20. Strip Resist
- 29. 29 21. Build-up Layer Lamination RRRRCCCCCCCC (Reeeessssiiiinnnn Cooooaaaatttteeeedddd Cooooppppppppeeeerrrr ffffooooiiiillll))))
- 30. 30 AAAArrrrttttwwwwoooorrrrkkkk AAAArrrrttttwwwwoooorrrrkkkk 22. Conformal Mask Before Exposure After Exposure
- 32. 32 24. Conformal Mask (for Etching)
- 33. 33 25. Conformal Mask
- 34. 34 26. Laser Ablation and NC Drilling
- 35. 35 Laser Microvia (Blind Via) Mechanical Drill (P.T.H.) 27. Mechanical Drill
- 36. 36 28. Desmear Copper Deposition
- 37. 37 29. Outerlayer Pattern imaging) Dry Film Lamination)
- 38. 38 Outerlayer Exposure Dry Film Developing
- 39. 39 Etching Dry Film Stripping
- 40. 40 30. Solder Mask Process
- 41. 41 HPCB 94V-0 R305 31. S/M Developing 32. Legend Printing
- 42. 42 33. Electroless Ni/Au , HAL_lead free and Etc. HPCB 94V-0 R305
- 43. 43 34. Outline Profile and Electrical Testing • HPCB • 94V-0 R305
- 44. 44 • HPCB • 94V-0 R305 R305 36. Final Inspection 37. O.S.P. (Entek plus Cu_106A….) →Option • HPCB • 94V-0
- 45. 45 BURIED VIA AND LASER BLIND VIA OPTION A = THROUGH VIA HOLE B = BURIED VIA HOLE C = One Level Laser Blind Via D = Two Level Laser Via C FR-4 Core B A A B LASER BLIND BURIED VIA LAY-UP D B-SSSSTTTTAAAAGGGGEEEE LASER BLIND BURIED VIA LAY-UP C D C C B-SSSSTTTTAAAAGGGGEEEE RCC FR-4 Core RCC
- 46. 46 BLIND AND BURIED VIA OPTION A = THROUGH VIA HOLE B = BURIED VIA HOLE C = BLIND VIA HOLE D = BLIND HOLE MLB VIA BURIED VIA LAY-UP BLIND VIA LAY-UP BLIND VIA SEQUENTIAL LAY-UP A B B A R E S I N B-STAGE D A E C C
- 47. 47 Conventional PTH Conventional PTH Conventional PCB FR-4 Build-up Layer FR-4 Build-up Layer Photo-via Photo-Imageable Dielectric (PID)
- 48. 48 Conventional PTH Conventional PCB PTH Chip-on- SVH Blind Via PCB 3 mil line SVH IV H FR-4 Conventional PTH
- 49. End 49