MLCC Automotive Trends Webinar

1. MLCC Automotive Trends

2. EMV 2018

3. Trends in automotive
• Basics
• Trend of downsizing
• Example low voltage eCar
• ESD
• Flexterm for VW/AUDI applications
• KC-LINK

4. BASICS

5. Typical Multilayer Ceramic Capacitor
Silver/Copper
Nickel
Tin
Ceramic Body
Electrode
Plate Layers
Silver-Palladium-Alloy/Nickel
End
Termination
C = Capacitance
k = Dielectric constant
A = area
n = number of layers
PME = precious metal
electrode
BME = base metal electrode

6. HALT 175°C/400V 40pcs
Ur=50V IR_limit 3,89MΩ

7. distinguish between PME and BME
• The Nickel electrode is ferromagnetic

8. TREND OF DOWNSIZING

9. MLCC Process Flow
High Purity Ceramic
Raw Material
Dielectric Slip (Paste) Dielectric Sheet Electrode Printing
Stacking / LaminatingDicingThermal ProcessingCorner Rounding
Ag or Cu Termination Plating Testing / Reeling

10. Sheets
• Smaller case size give more chips per pad
• K is constant between 2700 .. 3200
KEMET MLCC Manufacturing video on Youtube

11. Case size effect
• Downsizing (0603,0402,0201) requires thinner dielectric
• Lower breakdown voltages
• lowers capacitance at typical DC-Bias levels (VCC)

12. E-CAR DC-LINK 12V

13. eCar - DC-Link
• Requirement 120µF, 14V @85°C Ripple 12Arms @ 180kHz
• minimum Space
• consider VCC
• Compare with

14. customers point of view
• Requirement 120µF, 14V @85°C
• Ripple12Arms @ 180kHz
Type Part Number U Ceff/1 RC/1 ESR / Part n Ceff/n RC A
space
mm²
Price/1 Price/n
KPS C1210C106M5R2C 50V 9,1 6,53
1
4
127,7 91,4 214,9 1,29 € 18,06 €
KPS C2220C226M5R2C 50V 17,7 9,44 1,57E-03 7 123,9 66,1 323,4 1,74 € 12,18 €
KPS C2220C476M3R2C 25V 36,9 11,03 1,15E-03 4 147,6 44,1 184,8 1,79 € 7,16 €
FT C1210X475K5RAC 50V 4,3 21,61 2,25E-03
2
9
123,5 626,7 445,2 0,74 € 21,49 €
FT C1210X106K3RAC 25V 7,8 31,21 1,70E-03
1
6
125,3 499,4 245,6 1,01 € 16,16 €
FT C2220X106K5RAC 50V 7,8 23,14 1,70E-03
1
6
125,3 370,2 739,2 1,63 € 26,10 €

15. C1210X106K3RACAUTO
• Net capacitance @ 85°C , 14VDC and 180kHz

16. ESD

17. Simulation ESD Test acc AEC-Q200

18. voltage across the CUT
AEC-
Q200
Machine IEC-801 HBM
CAP 330pF 200pF 150pF 100pF
U CUT U_CUT U_CUT U_CUT U_CUT
2.000 1nF 496 333 261 182
8.000 1nF 1985 1333 1043 727
16.000 1nF 3970 2667 2087 1455
25.000 1nF 6203 4167 3261 2273
2.000 4,7nF 131 82 62 42
8.000 4,7nF 525 327 247 167
16.000 4,7nF 1050 653 495 333
25.000 4,7nF 1640 1020 773 521

19. • the charge depends from the capacitance
• capacitance decrease due VCC
• Voltage across the CUT INCREASE
• X7R gets worse under multiple pulses
Charge and VCC

22. FLEXTERM

23. Flex Cracks
In Customer Complaint failure analysis
IR Failure due to Flex Cracks is the #1 failure mode
Flex Cracks have a very distinct, 45 degree angle that always starts inside the
termination.

24. Tightened Screws

25. flex mitigation designs

26. Flexterm acc VW80808

27. VW80808 X7R MLCC Range
• This is a subset of the family portfolio
• Mainly the corner value are missing

28. KC-LINK

29. H-Bridge - Ripplecurrent DC-Link

30. How much capacitance we need?
10kHz 100kHz 1MHz
1kW 6.5µF 657nF 66nF
15kW 10µF 1µF 100nF
50kW 200µF 20µF 2µF
Assume 400V and 10% ripple

31. Ripple Current ~ 68A/µF
• DC Voltage limits RC at lower frequencies ≤ 100kHz
• Maximum ripple currents are based on not exceeding the
150°C temperature or voltage capability

32. Ceramic Capacitors design drives
• Ceramic chip based on C0G material
• Extrem stable 30ppm/°C
• 3640 ( 9,6mm x 10,2mm x 2,5mm) 220nF 500V 150°C
• Footprint
• properties
• Capacitance
• Impedance and ESR
• Ripple current and thermal properties
• Leadless stack design

33. Ceramic Capacitors design drives
• Ceramic chip based on C0G material
• Extrem stable 30ppm/°C
• 3640 ( 9,6mm x 10,2mm x 2,5mm) 220nF 500V 150°C
• Footprint
• properties
• Capacitance
• Impedance and ESR
• Excellent Ripple current and thermal properties

34. Sum up
• Downsizing Ok but be careful
• KSIM allows you cost optimized designs
• Nose cancellation via KPS
• ESD 0603
• Flexterm for VW/AUDI
• KC-LINK

35. Thank You!
Axel Schmidt
Field application Engineer
Cell +49 172 89 25 284
email: AxelSchmidt@kemet.com
Hermann-Köhl-Str. 2
86899 Landsberg am Lech
Germany
www.kemet.com

36. NOISE CANCELATION

37. Example with 9234
• The fan speed and harmonics are clearly visible
in the unit’s measurements.

38. Piezo effect
• Caused by voltage
• Elongation in a range of 0.001nm .. 1nm
• depends on
– Dielectric material
– Permittivity ε↑ → ds↑
– Dielectric thickness t↓→ds↑
– Chip size
• Solution
– C0G ( NO piezo effect)
– Higher rated voltage (thicker dielectric)
– bigger chip (thicker dielectric)
– stack solutions

39. MLCC J-Lead
Output Noise
MLCC Compared to 1210 4.7µF, J-lead for
High Pass Filter Noise
Catalog X7R KEM_C1020_X7R_KPS Catalog C0G KEM_C1032_C0G_KPS_HV
Catalog HV KEM_C1033_X7R_KPS_HV Catalog HT KEM_C1038_X8L_KPS_150C