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PCB Production Introduction /How to Make PCB (1)

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PCB Production Introduction /How to Make PCB will separated with 3 parts to introduce about printed circuit boards PCB basic, different PCB types, PCB material, PCB sheet, PCB production process, main PCB manufacturing process include PCB drilling, plated through hole, dry film,PCB etching, solder mask, different PCB surface finishing and so on...

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PCB Production Introduction /How to Make PCB (1)

  1. 1. PCB Production Introduction PCB means printed circuits board or printed wiring boards. @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  2. 2. PCB is used to carry the electronic components and provide connection the parts. SingleSided PCB DoubleSided PCB Multilayer PCB Rigid PCB FlexPCB Rigidand flexPCB PTHPCB Buriedvia PCB Blindvia PCB HALPCB Cartonmask PCB Goldconnector PCB ImmersionGo PCB Platinggold PCB ENTEK PCB By Hardness PCB TypesPCB Types By Hole Depth Fabrication and Customer RequirementsBy Contracture @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  3. 3. PCB Base Structure Prepreg Copper Foil Copper foil thickness : 1/4 oz,1/3oz,1/2oz,1oz,2oz,3oz etc. @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  4. 4. Finished PCB As picture below : Solder mask Annual ring Screen Marks PAD Production Number 3C601 3C6013C601 12658Golden Finger @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  5. 5. Difference between double side PCB and multi layer PCB From the production process : 1. Double-sided PCB lamination with only prepreg and copper foil. Multilayer PCB with inner core except prepreg and copper foil. 2. Multilayer PCB is with inner layer production, and double layer PCB PCB manufacture| Printed circuit board production| How to make PCB| China PCB house
  6. 6. PCB Base Material Introduction  There are mainly 3 types divided from TG : 1.TG 130 , the resin consisted by two functional groups℃ Character: low TG, poor heat resistance. 2. TG 140 , the resin is consisted by four functional groups.℃ Character: good heat resistance, good stability, is most commonly used PCB material. @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  7. 7. 3. High TG (TG >150 ), the resin is composed of a plurality of functional groups.℃ Character: TG higher means better heat resistance, but also higher price. The production process is relatively more complex. By different related parts : 1. Halogen material Characters: Most of PCB material used currently is halogen material. It is harmful as it produces dioxides, dioxin TCDD, dioxin ring cyclohexane when burned, ben furan and others who with heavy smoke, highly toxic, carcinogenic, once printed circuit board manufacture|pcb production process|pcb manufacturing|china pcb
  8. 8. intake couldn’t exhaust , will harm to health. 2.Halogen-free material. Characters: Little proportion of halogen content. According to JPCA-ES-01-2003 standard CL, Br, I content less than 0.09% by weight could call halogen free material. Due to its harm to human ,relevant laws and regulations prohibit to use halogen materials for PCB plate (WEEE, ROHS). @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  9. 9. PCB Base Material Introduction  Divided by solder process  1. Leaded PCB manufacturing process is with toxic, harmful, reflected in mental  decline, nausea, headache, insomnia, loss of appetite and so on. Typically is  anemia, central nervous system disorder.  2.Leadfree is defined as the lead content <0.1% according to EU. But Japan is  0.2% as lead-free. It includes the coating of soldering, semiconductor, plated @ Agile Circuit Co., Ltd All Right Reserved ||www.agipcb.com ||custompcbboards.com
  10. 10. PCB Base Material Introduction  through hole and PCB pads, stabilizers and related (halogenated resins, wire, paint,  dye, glass bonding materials etc.) 1)Less toxic to the human body; 2)The melting point of solder material rises (about 217 );℃ 3)High requirement on heat resistance of PCB material 4) PCB sheet material requires low DK value, low CET ( before Z-axis expansion coefficient tg point 50PPM / , after tg 250PPM / ). Normal PCB material sheet℃ ℃ is before TG point 80PPM / , after TG point 300PPM /℃ ℃ @ Agile Circuit Co., Ltd All Right Reserved ||sales@agipcb.com ||custompcbboards.com

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