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The composition and packaging of integrated circuits
1. What is an integrated circuit
Integrated circuit, English for IntegratedCircuit,
abbreviated as IC; as the name implies, is a certain number
of commonly used electronic components, such as resistors,
capacitors, transistors, etc., and the connections between
these components, integrated by semiconductor processes
with specific functions Circuit.
Classification of integrated circuits
① Functional structure
Integrated circuits, also known as ICs, can be divided into
three categories: analog integrated circuits, digital
2. integrated circuits, and digital / analog hybrid integrated
circuits according to their functions and structures.
Analog integrated circuits, also known as linear circuits,
are used to generate, amplify, and process various analog
signals (referring to signals whose amplitude varies with
time. For example, audio signals from semiconductor radios,
tape signals from VCRs, etc.). ratio. Digital integrated
circuits are used to generate, amplify and process various
digital signals (referring to signals with discrete values
in time and amplitude. For example, 3G mobile phones,
digital cameras, computer CPUs, digital TV logic control
and playback audio signals And video signals).
② Production process
Integrated circuits can be divided into semiconductor
integrated circuits and film integrated circuits according
to the manufacturing process.
Film integrated circuits are classified into thick film
integrated circuits and thin film integrated circuits.
③Integration level
3. Integrated circuits can be divided into:
SSIC Small Scale Integrated Circuits
MSIC Medium Scale Integrated Circuits
LSIC Large Scale Integrated Circuits
VLSIC Very Large Scale Integrated Circuits
ULSIC UltraLargeScale Integrated circuits
GSIC huge scale integrated circuits are also called very
large scale integrated circuits or very large scale
integrated circuits (GigaScaleIntegraTIon).
④ Conductive type
Integrated circuits can be divided into bipolar integrated
circuits and unipolar integrated circuits according to the
conductive type. They are both digital integrated circuits.
The manufacturing process of bipolar integrated circuits is
complicated and the power consumption is large, which means
that integrated circuits include TTL, ECL, HTL, LST-TL, and
STTL. The unipolar integrated circuit has a simple
manufacturing process and low power consumption, and is
4. easy to be made into a large-scale integrated circuit. The
representative integrated circuits include CMOS, NMOS, and
PMOS.
⑤Use
Integrated circuits can be divided into TV integrated
circuits, audio integrated circuits, video player
integrated circuits, video recorder integrated circuits,
computer (microcomputer) integrated circuits, electronic
piano integrated circuits, communication integrated
circuits, and camera integrated circuits. Circuits, remote
control integrated circuits, language integrated circuits,
integrated circuits for alarms, and various application-
specific integrated circuits.
⑥ Application field
Integrated circuits can be divided into standard universal
integrated circuits and application-specific integrated
circuits according to the application field.
⑦According to appearance
5. Integrated circuits can be divided into circular (metal
case transistor package type, generally suitable for high
power), flat type (good stability, small size) and dual in-
line type according to the shape.
How integrated circuits work
An integrated circuit is a miniature electronic device or
component. Adopt a certain process to interconnect
transistors, resistors, capacitors, inductors and other
components and wiring required in a circuit, make it on a
small or several small semiconductor wafers or dielectric
substrates, and then package them in a tube case , To
become a miniature structure with the required circuit
functions; all components have been integrated into a
structure, making electronic components a big step towards
miniaturization, low power consumption, intelligence and
high reliability.
Structure and composition of integrated circuits
(1) IC on paper
Generally, we use top-down levels to understand integrated
circuits, which is easier to understand and more organized.
6. 1) System level
Take the mobile phone as an example. The whole mobile phone
is a complex circuit system. It can make calls, play games,
listen to music, and beep. It consists of multiple chips
and resistors, inductors, and capacitors connected to each
other, which is called the system level. (Of course, with
the development of technology, the technology of making an
entire system on a chip has also appeared for many years-
SoC technology)
2) Module level
There are many functional modules in the entire system,
each performing its own duties. Some are responsible for
power management, some are for communication, some are for
display, some are for vocalization, some are for overall
calculations, and so on. We call this the module level.
Each of these modules is a huge field, which has gathered
the crystallization of countless human wisdom, and has also
supported many companies.
3) Register transfer level (RTL)
7. So what does each module consist of? Take digital circuit
modules (which are specifically responsible for logic
operations and the processed electrical signals are
discrete 0 and 1), which account for a large proportion of
the entire system. It is composed of registers and
combinational logic circuits.
Package form of integrated circuit
(1) SOP small outline package
SOP, also called SOL and DFP, is a very common component
form. At the same time, it is also one of the surface-mount
packages. The pins are drawn from both sides of the package
into a gull-wing shape (L-shaped). Packaging materials are
divided into plastic and ceramic. It started in the late
1970s.
SOP package has a wide range of applications. In addition
to memory LSI, but also in the field of input and output
terminals not exceeding 10-40, SOP is the most widely used
surface mount package. Later, in order to meet the needs of
production, some small outline packages such as SOJ, SSOP,
TSSOP, SOIC were also gradually derived.
8. (2) PGA pin grid array package
The PGA chip package is commonly used in the packaging of
microprocessors. Generally, integrated circuits (ICs) are
packaged in ceramic plates. The bottom of the ceramic
plates are arranged in square pins. The corresponding
socket is very suitable for applications that require
frequent wave insertion. For the same pin chip, the PGA
package usually requires a smaller area than the
conventional dual in-line package.
The PGA package has the characteristics of more convenient
plug-in operation, high reliability, and adaptability to
higher frequencies. Early Pentium chips, 80486 in the InTel
series CPU, and Pentium and PentiumPro all use this
package.
(3) BGA ball grid array package
The BGA package is an improvement from the PGA pin grid
array. It is a packaging method that covers a certain
surface in a grid-like manner. The electronic signal can be
transmitted from the integrated circuit to The printed
circuit board where it is located. Under the BGA package,
9. the pins are replaced by solder balls at the bottom of the
package. These solder balls can be configured manually or
by an automated machine, and they are positioned by flux.
The BGA package can provide more pins than other in-line
packages or four-pin flat packages. The ground surface of
the entire device can be used as pins, which can be shorter
than the surrounding package types Average wire length for
more high-speed performance.
(4) DIP dual in-line package
The so-called DIP dual in-line package refers to integrated
circuit chips packaged in dual in-line form. Most small and
medium-scale integrated circuit ICs use this packaging
form, and the number of pins generally does not exceed 100.
The CPU chip in the DIP package has two rows of pins and
needs to be inserted into a chip socket with a DIP
structure. When inserting or removing a DIP packaged chip
from the chip socket, be careful to avoid damaging the
pins.
For all kinds of logic ICs, You can view here
https://www.jotrin.com/product/category/ICs to know the