2. CONTENT :
Overview
Impedance matching technique for increasing bandwidth of MA
Probe compensation in Thick Microstrip patch
Increasing bandwidth of microstrip antenna by Proximity coupling
Characteristic of two layer electromagnetically coupled RPA
The SSFIP: A global concept for high performance broadband planar
antenna
4. Impedance matching technique for increasing
bandwidth of MA
Bandwidth increase by increasing substrate thickness
Or dielectric constant reduced
But this is limited by inductive Impedance
This problem overcome by use thick substrate with same type
Of additional impedance matching to cancel inductance
This paper use Bode Fano criteria to design matching network can
Increase impedance bandwidth by 10-12%
5.
6. Probe compensation in Thick Microstrip patch
Increase the substrate thickness
Inductive effect occur in which probe inductance prevent matching
of patch impedance to input connector
This inductive effect can be overcome by adding series capacitor
in probe feed circuit
7.
8. Increasing bandwidth of microstrip antenna by
Proximity coupling
Proximity coupling using small open tuning stub
Stub is connected in shunt with feed line
Provide broad bandwidth without excess substrate
thickness
9.
10. Characteristic of two layer electromagnetically coupled RPA
Bandwidth extension technique use two or more stagger tuned
Resonator
Implemented with stacked patches or combination of dissimilar
Element filled by air
Bandwidth increase from 10 to 20%
11.
12. The SSFIP: A global concept for high performance
broadband planar antenna
SSFIP = Strip-Slot-Foam-Inverted-Patch
Slot size used to increase bandwidth
Foam antenna substrate was used at x band to achieve excess of
bandwidth of 20%