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Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。
半導體製程用溶液之奈米粒子監控方案
Hsin-Chia Ho
Center for Measurement Standards
Industrial Technology Research Institute
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 2
Yield
良率
VLSI Research, 26 March 2013
Without measurement it is
impossible to adjust complex
processes
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 3
• The design rules shrink and new processes are introduced.
Source: 2015 IC Insights, KLA-Tencor
Recent high profile process
changes required enormous
engineering focus and led to
the implementation of new
inspection and metrology
steps to characterize the
associated defect and drive yield
learning.
---Excerpted from 2015 Solid State technology/Process
Watch: Increasing process steps and the tyranny of
numbers.
---Recent examples are immersion lithography, high-k metal
gates, gate-last integration, and FinFET transistor structures.
More and more inspection demands as
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 4
More particles in 3D gate structures
• Replacement gate structures require more CMP steps (4X)
→ more particles. Fins aspect ratio increase. Fins become
structurally weaker.
• Many new materials are introduced in the semiconductor
manufacturing which result in particles with many different
compositions.
• Particle interaction with surface depends on their compositions.
Crucial Issue for 10nm Semiconductor Yield
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 5
Metrology challenge in liquid particle measurement
• Defects are in starting materials, which impact yield
Proc. SPIE 9048, 90480P (17 April 2014)
Process Chemical, UPW
Metrology, Inspection, and Process Control for
Microlithography XXV, Steve McGarvey, Proc. of SPIE Vol.
7971, 79712P ·© 2011 SPIE
Slurry
Sub 10 nm
Defects
Michael Lercel, Senior Director of Nanodefectivity and Metrology,
SEMATECH, November 2012
• “Processes add very small particles (10 nm to 17 nm) that
CANNOT be detected with existing defect inspection tools”
- Michael Lercel, Senior director SEMATECH
Point of Use
Inspection
Materials Inspection
• Needed “eyes” for 20 nm technology node and beyond
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 6
10 nm?
300 mm wafer
→ 10 nm particle
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。
7
Abbas Rastegar, “Particle Control Challenges in Process Chemicals and
Ultra-pure Water for sub-10 nm Technology Nodes”,
5
Technical comparison
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。
Current technique - light scattering
• Optical scattering signal limitation
• Signal intensity proportional to d6
• Multiple scattering result in significant errors in both SLS and
DLS
• Nano- and micro-bubble
2015/6/12 8
100 nm SiO2 100 nm PSL 290 nm PSL
0
20
40
60
80
100
~3.5 %~5 %
Detectionefficiency(%)
~100 %
http://www.machinerylubrication.com/Read/351/particle-counters
Nanobubble
Metrology gaps in particle measurement
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 9
Breakthrough
Breakthrough of the measurement bottleneck for 5 nm particles :
• Current inspection tools for particles in liquid, based on light
scattering, limitation ≥ 40 nm for UPW and chemical
• ≥ 150 nm for slurry
• Solution to be transferred into aerosol particles, which frees those
particles from the interference of bubbles in the solution.
Method Range Feature
SuperSizer II
(pure chemical)
5 nm to
1000 nm
• Size and concentration of ultra-fine particle
• Excellent accuracy and resolution in size distribution
• Chemicals all-in-one design, set up by tool
SuperSizer I
(slurry)
5 nm to
1000 nm
• Size and concentration of working particles
• Additive (chemical) information
• Multiple channels auto-sampling monitor
Liquid particle
counter
40 nm to
5 μm
• Chemical inspection - Low concentration particle counter
• Interference of bubbles
• Poor accuracy and resolution
Particle sizing
system
≧ 150 nm • Slurry inspection - high concentration particle counter
• Only large particle count
• Interference of bubbles
• Non-consistence intra-instruments comparison
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 10
Technology
• A new generation monitoring system of nanoparticles in
solution, based on aerosol particles measurement
technology
• Core technologies – Auto-sampling, Atomizing, Differential
mobility analyzing, Condensation particle counting
• 24/7 automatic on-line monitor of the size and concentration
of particles in slurries, chemical solutions and ultra pure
water
• Ultra-fine monitoring range from 5 nm to 1000 nm
sampling, dilute, mixture atomizing, drying
Condensation particle
countercharging
Differential
mobility analysis
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 11
• 2012 – started collaboration with
semiconductor company
• 2013 – Alpha site for slurry
• 2014 – Beta site for slurry
• 2014 – invited talk and exhibition by,
“Parts Technology & Outsourcing
Workshop”, UMC
• 2015 – finalist of R&D 100 Awards
• 2016 – ITRI “傑出研究獎”
• 2016 – invited talk, “Liquid Particle
Counter Technolog” seminar, tsmc
Developed history & honor
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 12
Product - SuperSizer
ITRI – SuperSizer I
Product SuperSizer
Samples/
Applications
Particle in chemical, Slurry, pure water,
bionanoparticles
Monitor
Parameters
Size, distribution, additive, concentration
Range 5 nm to 1000 nm
Concentration 1014 / cm3 @ 100 nm
Variation < 5%
Sampling 24/7 Auto-sampling for multiple samples
Data Distribution (size spectrum)
Stirring Air dynamic
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。
13
Abbas Rastegar, “Particle Control Challenges in Process Chemicals and
Ultra-pure Water for sub-10 nm Technology Nodes”,
5
Technical comparison
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 14
More than size distribution - composition
Courtesy of Adrian Hess, Empa Switzerland
DMAS + ICP-MS Particle’s size and component
• Metallic contamination on Wet process tool
Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 15
Conclusion
• These projects are co-work with lead users in Taiwan. The
developed products are conducted by the needs of user.
• We are working with foundries and several material
suppliers to develop BKM for UPW and chemical monitors.
• The prototype of the monitor for pure chemicals and UPW
will be finished at 2017 Q1.
• Compositions of nanoparticle is a important issue, which is
under development.
Anysilicon
Partner : 20 % capacity in global

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半導體製程用溶液之奈米粒子監控方案

  • 1. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 半導體製程用溶液之奈米粒子監控方案 Hsin-Chia Ho Center for Measurement Standards Industrial Technology Research Institute
  • 2. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 2 Yield 良率 VLSI Research, 26 March 2013 Without measurement it is impossible to adjust complex processes
  • 3. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 3 • The design rules shrink and new processes are introduced. Source: 2015 IC Insights, KLA-Tencor Recent high profile process changes required enormous engineering focus and led to the implementation of new inspection and metrology steps to characterize the associated defect and drive yield learning. ---Excerpted from 2015 Solid State technology/Process Watch: Increasing process steps and the tyranny of numbers. ---Recent examples are immersion lithography, high-k metal gates, gate-last integration, and FinFET transistor structures. More and more inspection demands as
  • 4. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 4 More particles in 3D gate structures • Replacement gate structures require more CMP steps (4X) → more particles. Fins aspect ratio increase. Fins become structurally weaker. • Many new materials are introduced in the semiconductor manufacturing which result in particles with many different compositions. • Particle interaction with surface depends on their compositions. Crucial Issue for 10nm Semiconductor Yield
  • 5. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 5 Metrology challenge in liquid particle measurement • Defects are in starting materials, which impact yield Proc. SPIE 9048, 90480P (17 April 2014) Process Chemical, UPW Metrology, Inspection, and Process Control for Microlithography XXV, Steve McGarvey, Proc. of SPIE Vol. 7971, 79712P ·© 2011 SPIE Slurry Sub 10 nm Defects Michael Lercel, Senior Director of Nanodefectivity and Metrology, SEMATECH, November 2012 • “Processes add very small particles (10 nm to 17 nm) that CANNOT be detected with existing defect inspection tools” - Michael Lercel, Senior director SEMATECH Point of Use Inspection Materials Inspection • Needed “eyes” for 20 nm technology node and beyond
  • 6. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 6 10 nm? 300 mm wafer → 10 nm particle
  • 7. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 7 Abbas Rastegar, “Particle Control Challenges in Process Chemicals and Ultra-pure Water for sub-10 nm Technology Nodes”, 5 Technical comparison
  • 8. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 Current technique - light scattering • Optical scattering signal limitation • Signal intensity proportional to d6 • Multiple scattering result in significant errors in both SLS and DLS • Nano- and micro-bubble 2015/6/12 8 100 nm SiO2 100 nm PSL 290 nm PSL 0 20 40 60 80 100 ~3.5 %~5 % Detectionefficiency(%) ~100 % http://www.machinerylubrication.com/Read/351/particle-counters Nanobubble Metrology gaps in particle measurement
  • 9. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 9 Breakthrough Breakthrough of the measurement bottleneck for 5 nm particles : • Current inspection tools for particles in liquid, based on light scattering, limitation ≥ 40 nm for UPW and chemical • ≥ 150 nm for slurry • Solution to be transferred into aerosol particles, which frees those particles from the interference of bubbles in the solution. Method Range Feature SuperSizer II (pure chemical) 5 nm to 1000 nm • Size and concentration of ultra-fine particle • Excellent accuracy and resolution in size distribution • Chemicals all-in-one design, set up by tool SuperSizer I (slurry) 5 nm to 1000 nm • Size and concentration of working particles • Additive (chemical) information • Multiple channels auto-sampling monitor Liquid particle counter 40 nm to 5 μm • Chemical inspection - Low concentration particle counter • Interference of bubbles • Poor accuracy and resolution Particle sizing system ≧ 150 nm • Slurry inspection - high concentration particle counter • Only large particle count • Interference of bubbles • Non-consistence intra-instruments comparison
  • 10. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 10 Technology • A new generation monitoring system of nanoparticles in solution, based on aerosol particles measurement technology • Core technologies – Auto-sampling, Atomizing, Differential mobility analyzing, Condensation particle counting • 24/7 automatic on-line monitor of the size and concentration of particles in slurries, chemical solutions and ultra pure water • Ultra-fine monitoring range from 5 nm to 1000 nm sampling, dilute, mixture atomizing, drying Condensation particle countercharging Differential mobility analysis
  • 11. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 11 • 2012 – started collaboration with semiconductor company • 2013 – Alpha site for slurry • 2014 – Beta site for slurry • 2014 – invited talk and exhibition by, “Parts Technology & Outsourcing Workshop”, UMC • 2015 – finalist of R&D 100 Awards • 2016 – ITRI “傑出研究獎” • 2016 – invited talk, “Liquid Particle Counter Technolog” seminar, tsmc Developed history & honor
  • 12. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 12 Product - SuperSizer ITRI – SuperSizer I Product SuperSizer Samples/ Applications Particle in chemical, Slurry, pure water, bionanoparticles Monitor Parameters Size, distribution, additive, concentration Range 5 nm to 1000 nm Concentration 1014 / cm3 @ 100 nm Variation < 5% Sampling 24/7 Auto-sampling for multiple samples Data Distribution (size spectrum) Stirring Air dynamic
  • 13. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 13 Abbas Rastegar, “Particle Control Challenges in Process Chemicals and Ultra-pure Water for sub-10 nm Technology Nodes”, 5 Technical comparison
  • 14. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 14 More than size distribution - composition Courtesy of Adrian Hess, Empa Switzerland DMAS + ICP-MS Particle’s size and component • Metallic contamination on Wet process tool
  • 15. Copyright 2015 ITRI 工業技術研究院 工研院重要規劃資料,禁止複製、轉載、外流,請依規定保管使用。 15 Conclusion • These projects are co-work with lead users in Taiwan. The developed products are conducted by the needs of user. • We are working with foundries and several material suppliers to develop BKM for UPW and chemical monitors. • The prototype of the monitor for pure chemicals and UPW will be finished at 2017 Q1. • Compositions of nanoparticle is a important issue, which is under development. Anysilicon Partner : 20 % capacity in global