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2SC1775, 2SC1775A
Silicon NPN Epitaxial
Application
• Low frequency low noise amplifier
• Complementary pair with 2SA872/A
Outline
1. Emitter
2. Collector
3. Base
TO-92 (1)
3
2
1
2SC1775, 2SC1775A
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol 2SC1775 2SC1775A Unit
Collector to base voltage VCBO 90 120 V
Collector to emitter voltage VCEO 90 120 V
Emitter to base voltage VEBO 5 5 V
Collector current IC 50 50 mA
Collector power dissipation PC 300 300 mW
Junction temperature Tj 150 150 °C
Storage temperature Tstg –55 to +150 –50 to +150 °C
Electrical Characteristics (Ta = 25°C)
2SC1775 2SC1775A
Item Symbol Min Typ Max Min Typ Max Unit Test conditions
Collector to emitter
breakdown voltage
V(BR)CEO 90 — — 120 — — V IC = 1 mA, RBE = ∞
Collector cutoff current ICBO — — 0.5 — — — µA VCB = 75 V, IE = 0
— — — — — 0.5 µA VCB = 100 V, IE = 0
DC current transfer ratio hFE1*1
400 — 1200 400 — 1200 VCE = 12 V, IC = 2 mA
hFE2 160 — — 160 — — VCE = 12 V,
IC = 0.1 mA
Base to emitter voltage VBE — — 0.75 — — 0.75 V VCE = 12 V, IC = 2 mA
Collector to emitter
saturation voltage
VCE(sat) — — 0.5 — — 0.5 V IC = 10 mA, IB = 1 mA
Gain bandwidth product fT — 200 — — 200 — MHz VCE = 12 V, IC = 2 mA
Collector output
capacitance
Cob — 1.6 — — 1.6 — pF VCB = 25 V, IE = 0,
f = 1 MHz
Noise figure NF — — 5.0 — — 5.0 dB VCE = 6 V,
IC = 50 µA,
Rg = 50 kΩ
f = 10
Hz
— — 1.5 — — 1.5 dB f = 1
kHz
Note: 1. The 2SC1775/A is grouped by hFE1 as follows.
E F
400 to 800 600 to 1200
2SC1775, 2SC1775A
3
0
100
200
300
50
Ambient Temperature Ta (°C)
CollectorPowerDissipationPC(mW) Maximum Collector Dissipation Curve
100 150 0
2
8
6
4
10
2010
Collector to Emitter Voltage VCE (V)
CollectorCurrentIC(mA)
Typical Output Characteristics
30 40 50
10
8
6
2 µA
IB = 0
P
C
=
300
m
W
4
0.03
0.01
3
1.0
0.30
0.10
10
0.40.30.2
Base to Emitter Voltage VBE (V)
CollectorCurrentIC(mA)
Typical Transfer Characteristics
0.5 0.6 0.7 0.8
VCE = 12 V
Ta=100°C
75
50
25
0
–25
0
400
200
1,000
800
600
1,200
0.10.030.01
Collector Current IC (mA)
DCCurrentTransferRatiohFE
DC Current Transfer Ratio vs.
Collector Current
0.3 1.0 3 10 30
VCE = 12 V
Ta = 100°C
75
50
25
0
–25
2SC1775, 2SC1775A
4
10
30
1,000
300
100
0.10.030.01
Collector Current IC (mA)
GainBandwidthProductfT(MHz)
Gain Bandwidth Product vs.
Collector Current
0.3 1.0 3 10 30
VCE = 12 V
2
1.0
0.5
10
5
50
20
51 2
Collector to Base Voltage VCB (V)
CollectorOutputCapacitanceCob(pF)
Collector Output Capacitance vs.
Collector to Base Voltage
10 20 50 100
IE = 0
f = 1 MHz
0.01
0.1
10
3
1.0
0.3
100
30
0.10.03
Collector Current IC (mA)
SignalSourceResistanceRg(kΩ)
Contours of Constant Noise Figure
0.3 1.0 3 10
VCE = 6 V
f = 10 Hz
NF = 1 dB
2
4
6
8
10
2SC1775, 2SC1775A
5
0.01
0.1
10
3
1.0
0.3
100
30
0.10.03
Collector Current IC (mA)
SignalSourceResistanceRg(kΩ) Contours of Constant Noise Figure
0.3 1.0 3 10
VCE = 6 V
f = 120 Hz
NF = 1 dB
2
4
6
810
0.01
0.1
10
3
1.0
0.3
100
30
0.10.03
Collector Current IC (mA)
SignalSourceResistanceRg(kΩ)
Contours of Constant Noise Figure
0.3 1.0 3 10
VCE = 6 V
f = 1 kHz
NF = 1 dB
2
4
6
810
0.60 Max
0.5 ± 0.1
4.8 ± 0.3 3.8 ± 0.3
5.0±0.2
0.7
2.3Max
12.7Min
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
Unit: mm
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
URL NorthAmerica : http:semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HXHitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to:

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Original NPN Transistor 2SC1775 C1775 C1775A 1775 TO-92 New HITACHI

  • 1. 2SC1775, 2SC1775A Silicon NPN Epitaxial Application • Low frequency low noise amplifier • Complementary pair with 2SA872/A Outline 1. Emitter 2. Collector 3. Base TO-92 (1) 3 2 1
  • 2. 2SC1775, 2SC1775A 2 Absolute Maximum Ratings (Ta = 25°C) Item Symbol 2SC1775 2SC1775A Unit Collector to base voltage VCBO 90 120 V Collector to emitter voltage VCEO 90 120 V Emitter to base voltage VEBO 5 5 V Collector current IC 50 50 mA Collector power dissipation PC 300 300 mW Junction temperature Tj 150 150 °C Storage temperature Tstg –55 to +150 –50 to +150 °C Electrical Characteristics (Ta = 25°C) 2SC1775 2SC1775A Item Symbol Min Typ Max Min Typ Max Unit Test conditions Collector to emitter breakdown voltage V(BR)CEO 90 — — 120 — — V IC = 1 mA, RBE = ∞ Collector cutoff current ICBO — — 0.5 — — — µA VCB = 75 V, IE = 0 — — — — — 0.5 µA VCB = 100 V, IE = 0 DC current transfer ratio hFE1*1 400 — 1200 400 — 1200 VCE = 12 V, IC = 2 mA hFE2 160 — — 160 — — VCE = 12 V, IC = 0.1 mA Base to emitter voltage VBE — — 0.75 — — 0.75 V VCE = 12 V, IC = 2 mA Collector to emitter saturation voltage VCE(sat) — — 0.5 — — 0.5 V IC = 10 mA, IB = 1 mA Gain bandwidth product fT — 200 — — 200 — MHz VCE = 12 V, IC = 2 mA Collector output capacitance Cob — 1.6 — — 1.6 — pF VCB = 25 V, IE = 0, f = 1 MHz Noise figure NF — — 5.0 — — 5.0 dB VCE = 6 V, IC = 50 µA, Rg = 50 kΩ f = 10 Hz — — 1.5 — — 1.5 dB f = 1 kHz Note: 1. The 2SC1775/A is grouped by hFE1 as follows. E F 400 to 800 600 to 1200
  • 3. 2SC1775, 2SC1775A 3 0 100 200 300 50 Ambient Temperature Ta (°C) CollectorPowerDissipationPC(mW) Maximum Collector Dissipation Curve 100 150 0 2 8 6 4 10 2010 Collector to Emitter Voltage VCE (V) CollectorCurrentIC(mA) Typical Output Characteristics 30 40 50 10 8 6 2 µA IB = 0 P C = 300 m W 4 0.03 0.01 3 1.0 0.30 0.10 10 0.40.30.2 Base to Emitter Voltage VBE (V) CollectorCurrentIC(mA) Typical Transfer Characteristics 0.5 0.6 0.7 0.8 VCE = 12 V Ta=100°C 75 50 25 0 –25 0 400 200 1,000 800 600 1,200 0.10.030.01 Collector Current IC (mA) DCCurrentTransferRatiohFE DC Current Transfer Ratio vs. Collector Current 0.3 1.0 3 10 30 VCE = 12 V Ta = 100°C 75 50 25 0 –25
  • 4. 2SC1775, 2SC1775A 4 10 30 1,000 300 100 0.10.030.01 Collector Current IC (mA) GainBandwidthProductfT(MHz) Gain Bandwidth Product vs. Collector Current 0.3 1.0 3 10 30 VCE = 12 V 2 1.0 0.5 10 5 50 20 51 2 Collector to Base Voltage VCB (V) CollectorOutputCapacitanceCob(pF) Collector Output Capacitance vs. Collector to Base Voltage 10 20 50 100 IE = 0 f = 1 MHz 0.01 0.1 10 3 1.0 0.3 100 30 0.10.03 Collector Current IC (mA) SignalSourceResistanceRg(kΩ) Contours of Constant Noise Figure 0.3 1.0 3 10 VCE = 6 V f = 10 Hz NF = 1 dB 2 4 6 8 10
  • 5. 2SC1775, 2SC1775A 5 0.01 0.1 10 3 1.0 0.3 100 30 0.10.03 Collector Current IC (mA) SignalSourceResistanceRg(kΩ) Contours of Constant Noise Figure 0.3 1.0 3 10 VCE = 6 V f = 120 Hz NF = 1 dB 2 4 6 810 0.01 0.1 10 3 1.0 0.3 100 30 0.10.03 Collector Current IC (mA) SignalSourceResistanceRg(kΩ) Contours of Constant Noise Figure 0.3 1.0 3 10 VCE = 6 V f = 1 kHz NF = 1 dB 2 4 6 810
  • 6. 0.60 Max 0.5 ± 0.1 4.8 ± 0.3 3.8 ± 0.3 5.0±0.2 0.7 2.3Max 12.7Min 0.5 1.27 2.54 Hitachi Code JEDEC EIAJ Weight (reference value) TO-92 (1) Conforms Conforms 0.25 g Unit: mm
  • 7. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 For further information write to: