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ODSA Power and Heat

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Presentation by Ali Husain, ON Semiconductor

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Consume. Collaborate. Contribute.Consume. Collaborate. Contribute. Power & Heat ODSA Project Workshop March 28, 2019 Ali Husain, ON Semiconductor
Consume. Collaborate. Contribute. Topics POC 1.0 • Power Distribution • Power Conversion • Thermal Budgeting • Differential thermal expansion (reliability) FUTURE • Active Interposer • Integrate Passive Components • PMIC Chiplets
Consume. Collaborate. Contribute. Power Architecture For Intel Cores, high power input (>100A) at 1.8V On-chip regulator converts from 1.8V → 0.9V (unregulated) Digital & Analog Domains? 1.2/3.3V 1.8V 1.8V 0.9V
Consume. Collaborate. Contribute. Power Architecture – Future? • 3.3 or 5V input – local PMIC/chiplet ⎻ Use less power pins ⎻ Separate analog & digital domians ⎻ Need pins for passives ⎻ Conversion losses need to be dissipated • Active interposer ⎻ Technology ⎻ Heat Dissipation ⎻ Ground planes ⎻ Passives 5V 0.9V 1.8V1.2V PMIC 0.9V LDO 0.8V
Consume. Collaborate. Contribute. Heat • Thermal Budgeting • Temperature Sensors • Chiplet performance vs. temperature • Local Heating Effects → Power/Thermal Management Controller
Consume. Collaborate. Contribute. Chiplet Necessary Specifications • Input Voltage • Max & Typical Supply Current (workload vs. current) • Rth to interposer, case • Power limiting functionality, speed • PMBus or SVID interface?
Consume. Collaborate. Contribute.

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ODSA Power and Heat

  • 1. Consume. Collaborate. Contribute.Consume. Collaborate. Contribute. Power & Heat ODSA Project Workshop March 28, 2019 Ali Husain, ON Semiconductor
  • 2. Consume. Collaborate. Contribute. Topics POC 1.0 • Power Distribution • Power Conversion • Thermal Budgeting • Differential thermal expansion (reliability) FUTURE • Active Interposer • Integrate Passive Components • PMIC Chiplets
  • 3. Consume. Collaborate. Contribute. Power Architecture For Intel Cores, high power input (>100A) at 1.8V On-chip regulator converts from 1.8V → 0.9V (unregulated) Digital & Analog Domains? 1.2/3.3V 1.8V 1.8V 0.9V
  • 4. Consume. Collaborate. Contribute. Power Architecture – Future? • 3.3 or 5V input – local PMIC/chiplet ⎻ Use less power pins ⎻ Separate analog & digital domians ⎻ Need pins for passives ⎻ Conversion losses need to be dissipated • Active interposer ⎻ Technology ⎻ Heat Dissipation ⎻ Ground planes ⎻ Passives 5V 0.9V 1.8V1.2V PMIC 0.9V LDO 0.8V
  • 5. Consume. Collaborate. Contribute. Heat • Thermal Budgeting • Temperature Sensors • Chiplet performance vs. temperature • Local Heating Effects → Power/Thermal Management Controller
  • 6. Consume. Collaborate. Contribute. Chiplet Necessary Specifications • Input Voltage • Max & Typical Supply Current (workload vs. current) • Rth to interposer, case • Power limiting functionality, speed • PMBus or SVID interface?