The document discusses quality engineering (QE) and failure analysis (FA) techniques. It defines QE as engineering work related to ensuring a product meets specifications. QE aims to design robust products using techniques like Taguchi's quality loss functions and robust design methods. FA is defined as analyzing failed components to determine the root cause of failure. Several FA techniques are discussed along with the importance of FA in preventing failures in electronics. Classifying tests and understanding failure mechanisms and rates are important aspects of both QE and FA.

1. Need of Quality Engineering and Failure analysis
Techniques
9th Module Presentation
M. Sc. (Engg.) in Electronics System Design
Engineering
GREESHMA S
CWB0913004 , FT-2013
Module code : ESE2515
Module name : Mechanical Aspects of Electronic
System Design
Module leader : Mr. Ugra Mohan
Presentation on : 25/08/2014
M. S. Ramaiah School of Advanced Studies 1

2. Overview
FAT
1.INTRODUCTION
2. Importance of Failure Analysis
3.Classification of tests to capture failures
4. Failure Analysis for Electrical Overstress [EoS]
5. Failure Rate Curve
6. Role of FA in Electronic Component
7. FA Techniques
M. S. Ramaiah School of Advanced Studies 2
QE
1.INTRODUCTION
2.Authors View
3.Taguchi Loss Functions
4.Taguchi Robust Design
5. Examples
• CONCLUSION • REFERENCES

3. Introduction
THE overall objective of quality assurance is customer satisfaction. Conformance to customer
requirements is a basic requisite for this. Quality of delivery and dependability are the major
properties used in the quality evaluations
Quality engineering results in reliable products that meet the needs of the user, performs its
mission without variation, increases combat capability and has low monetary losses
The quality engineering concepts developed by Genichi Taguchi are the key to making the
seemingly incompatible goals of achieving high reliability and maintainability for future weapon
systems at reduced development, production, and operation costs
Taguchi’s quality engineering process was used in the conceptual design of a unique flight
vehicle
 From the viewpoint of quality engineering, the downstream quality problems of a product are
symptoms of its functional instability (lack of robustness)
M. S. Ramaiah School of Advanced Studies 3

4. Authors View
► Different authors have given various definitions of QE. Krishnamurthy [1] defined the term QE
as: the discipline that includes the technical methods, management and costing approaches,
statistical problem-solving tools, training and motivational methods, computer information
systems, and all the sciences behind them that are needed for designing, producing and delivering
products and services to satisfy customer needs
► Taguchi [1] described quality engineering as the technique used to improve performance and
reduce functional variations caused by three types of noises, namely, environnemental conditions
(outer noise), deterioration (inner noise) and manufacturing imperfection. He noted that the overall
aim of quality engineering is to produce products that are robust to all noise factors. Taguchi
separates quality control activities into two parts, which are off-line quality control and online
quality control
M. S. Ramaiah School of Advanced Studies 4

5. ► Gaspersz [1] defines quality engineering (QE) as the analysis of a manufacturing system at
all stages to maximize the quality of the process and the product it produces. QE have become
very important in every organization including whether manufacturing industry, ceramic and
paint industry, chemical manufacturer, hospital, education, business and others, and there are
many tools and techniques created to be implemented in order to be leader among their
challenge
► Quality engineering may be defined as follows: 'Engineering work related to the
conformance of the output of a production line with specification. It involves the design of
quality systems and the investigation of nonconformance with feedback for corrective action.
This can only be achieved by creative interaction with the other functions in a manufacturing
unit
M. S. Ramaiah School of Advanced Studies 5

6. Loss Functions by Taguchi
that excessive variation lay at the root of poor manufactured quality and that reacting to
individual items inside and outside specification was counterproductive. understanding
of quality costs in various situations
Figure 1: A Comparison of Methodologies [2] Figure 2: Taguchi Loss Function[2]
M. S. Ramaiah School of Advanced Studies 6

7. Taguchi Robust Design
Figure 3: Taguchi Robust Design[2]
M. S. Ramaiah School of Advanced Studies 7

8. Examples
Improves overall quality, improves programs, initiatives root cause and Manufactured practices,
Improved Productivity,
Table 1: Examples of Taguchi QE and Robust Design [1]
M. S. Ramaiah School of Advanced Studies 8

9. Introduction
Failure Analysis (FA) is a process of collecting and analyzing data to determine the cause
of failure. E.g. Failed components are taken for analysis and determine cause of the failure
using a wide array of methods and techniques
 Failure analysis engineers often play the lead role in this department
Types of failures can be due to component, manufacturing or during production processing
Failure analysis (FA) capability supports the development of semiconductor technology
and packaging. Failure analysts need new techniques and advanced equipment to match the
rate of Moore's Law so that problem solving can remain efficient and accurate
Moore's Law is the observation made in 1965 by Gordon Moore, co-founder of Intel, that
the number of transistors per square inch on integrated circuits has doubled every year since
the integrated circuit was invented
M. S. Ramaiah School of Advanced Studies 9

10. Importance of Failure Analysis
• Electronic parts, why they fail?
• Preserve failure mechanism, don’t loose
(Carelessness)
• Failure of Critical applications e.g. Space
satellite systems
• Big loss due to chain reaction
Figure 4: Failure Mechanism [FRACAS] [3] Figure 5: Chain reaction [3]
M. S. Ramaiah School of Advanced Studies 10

11. Classification of tests to capture failures [5]
• Environmental Tests
Temperature operating conditions, corrosion etc
• Mechanical Tests
Packaging, Materials, insulation resistance etc
• Electrical Tests
Electrical overstress, ground bounce etc
• Test Procedure, analysis and results
Documentation of the overall results, analysis and the desired modifications
M. S. Ramaiah School of Advanced Studies 11

12. Failure Analysis for Electrical Overstress [EoS]
• EOS- Thermal damage due to V or I beyond
limit specification
• Trace VI curve for i/p’s of each part “ part
characterization”
•Causes: [4]
a. Poor grounding
b.EMI
c. Uncontrolled supply
d. latchup
M. S. Ramaiah School of Advanced Studies 12

13. Failure Rate Curve
Figure 6: Failure Rate Curve [4]
M. S. Ramaiah School of Advanced Studies 13

14. Role of FA in Electronic Component [4]
M. S. Ramaiah School of Advanced Studies 14

15. FA Techniques [5]
M. S. Ramaiah School of Advanced Studies 15

16. Conclusion
To prevent thermally- induced failures in electronic systems and to achieve a high reliability
of operation quality engineering is needed. Loss function, robust design clearly signifies the
QE role. FRACAS failure mechanism , EoS , Failure rate curve focused on need for failure
analysis.
M. S. Ramaiah School of Advanced Studies 16

17. Reference
1. Jinyu Wang (2008). Robust Design Method in Quality Engineering and Its Application. China:
School of Economy and Management,. 2570-2576.
2. Ed Pohl (2009). SYSTEM DESIGN WITH QUALITY ENGINEERING. Usa: Wright-Patterson
M. S. Ramaiah School of Advanced Studies 17
AFB. 26-38.
3. Walter Willing, Jonathan Fleisher & Michael Cascio (2012) ,“Electronic Part Failure
Analysis Tools and Techniques” Northrop Grumman Corporation, USA.
4. ITEM Software, Inc (2007) ,“Reliability Prediction Basics” USA.
5. Jim Glancey (2006), “Failure Analysis Methods What, Why and How” USA.

18. Thank You
M. S. Ramaiah School of Advanced Studies 18