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Machine Vision Systems And Applications
- 1. Machine Vision Systems& Applications In Semiconductor Manufacturing Francy Abraham, MSEE, MBA Sr. Member IEEE Sr. Member SME-MVA francy.abraham@gmail.com
- 2. Contents What ismachine vision system (vision system) Definition Operation scope Engineering domain Applications in general Industries that use vision systems Machine vision system components - Introduction Image processing - Introduction Machine vision system functions - Introduction Machine vision system performance Introduction to applications in electronic & semiconductor manufacturing Semiconductor front-end inspection & metrology Semiconductor back-end inspection & metrology IC assembly applications IC handling, inspection & metrology IC lead-frame inspection & metrology PCBA/Substrate assembly inspection Machine vision applications in IC assembly manufacturing
- 3. Machine Vision -Introduction What is machine vision system? A device & technique for automatic non- contact acquisition and analysis of images to obtain desired data for use in controlling a process or activity - Perry West
- 4. Operation Scope Operatebeyond Human Vision IR UV/DUV X-ray Radio UV X-rays Gamma RaysMicrowave Infrared Human Eye 103 10-12 10nm1500um Machine Eye 400nm700nm Sun Light ~250nm~20um Electromagnetic Spectrum
- 5. Machine Vision: EngineeringDomain •Optics/Electro-optics •Illumination •CCD/CMOS Cameras •Frame Grabber •Computer •Precision Mechanical Scan •Precision stages •Absolute Encoders •Motion Control •Image Processing (Software) •Pixel Count •Correlation/NC •Blob Analysis •Pattern Matching/GP •Decision Matrix •Neural Networks •Fuzzy Logic •Many more … Multimedia Scientific Imaging Image Processing Machine Vision Electronic Imaging
- 6. Industries That UseMachine Vision Systems Semiconductor PCB/A Automotive Pharmaceutical Packaging Military Electronic Components Food Processing Medical Device Glass Primary Metals (Partial List)
- 7. Machine Vision SystemApplications Quality Assurance Metrology Flaw Detection Defect Detection Foreign Particles Contamination Test & Calibration Sensor calibration Real-Time Process Control Optical fiber drawing Hot steel strip rolling Data Collection & Sorting Mail Sort Machine Monitoring Operation monitoring Material Handling - Storage, Retrieval, Routing Gauging/Metrology - Not contact measurement Robotic/Machine Guidance - Recognize, Locate, Guide ID Tracking - OCR, 1D & 2D barcode Counting - Counting bottles Or cans in a conveyor Safety - Detect Obstacles and alarm or stop Law Enforcement Vehicle tracking Electronic Road Pricing
- 8. Machine Vision SystemComponents Single or array of sensors to detect electromagnetic energy, usually 2D array Mechanism to collect reflected/transmitted energy Image formation hardware/electro-opto- mechanical assemblies Image acquisition hardware Image processing hardware & software I/O interfaces & User Interfaces Data communication
- 9. Images in MachineVision Systems Two dimensional array Each element is called a pixel Each pixel is a representation of surface information – 2D Height information – 3D (Voxel) The information can be Visual Non Visual Each pixel normally has a integer value (0 - 255) for 8 bit There are images with 10bit, 12bit, 16bit or 24 bit pixel resolutions The co-ordinate system has origin at top left corner
- 10. Image Processing Methods Pixel Counting Thresholding Connectivity & segmentation Blob analysis Edge Detection Template Matching Pattern Recognition Optical Character Recognition (OCR) Barcode Reading – 1D, 2D codes
- 11. Machine Vision SystemFunctions Location & Orientation Gauging/Metrology Inspection/ Flaw Detection Verification Identification Recognition Tracking & Guidance
- 12. Machine Vision SystemPerformance Perform Beyond Human Vision High Speed High Magnification/Resolution Highly Repeatable in controlled environment No fatigue - 24/7 Reliable Cheaper Good for unsafe and hazardous environment Operate well in space constrained environments
- 13. Semiconductor: Front-end Applications •SEM •Ellipsometer •Reflectometer •X-rayFluroscence •Interferometer •Wave-front Sensing •Dark Field Imaging
- 14. Semiconductor: Macro-inspection Applications •On-the-fly inspection • Template matching, blob Analysis, pixel counting • Laser triangulation • High speed con-focal Imaging • Interferometer
- 15. Applications In ICAssembly Manufacturing Auto-alignment Auto Pick-n-Place Inspection 2D DM Reader
- 16. Die Sort &Attach Equipment Die Sorter •Pick & Place Guidance •Crack & Chip out detection •Die contamination check •Die active area check •Wafer Bump inspection Flip-chip Bonder (Film frame to substrate) •Pick & Place Guidance •Vision guided die attach
- 17. Die Bonder &Wire Bonder Die Bonder •Pad Location & alignment •Glue Metrology •Die placement •Die position check Wire Bonder •Locate and align die pad and leadframe pad position
- 18. IC Package Mark& Sort Equipment Laser Mark & Inspection Transfer & Sort with 2D & 3D Inspection (Tray to Tray Strip to Strip) •Package Visual Inspection (Tray to Tray Tray to Tape) •Package 2D & 3D Inspection (Tape to Tube)
- 19. IC Package VisualInspection
- 20. IC Package, Lead,Ball Inspection •Contamination •Package size •Pin1 marking •Orientation •OCV •Cracks •Chip out •Warpage •Lead pitch/bend •Sweep •Lead co-planarity •Lead length •Lead width •Stand off •Missing Ball •Over sized ball •Under sized ball •Extra ball •Ball residue •Ball Height •Co planarity
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