This document discusses techniques for measuring junction depth and sheet resistance of diffused layers. It describes two common junction depth measurement methods: the groove-and-stain method which uses etching and staining to measure junction depth, and the angle-lap method which mounts and laps the wafer edge to create an interference pattern for measurement. The document also outlines two sheet resistance measurement techniques: the four-point probe method for infinite sheets, and Van der Pauw's method which applies a correction factor to resistance measurements taken from multiple contacts.