1
PC :https://teksun.com/blog/iot-solutions-connectivity-revolution-in-the-automotive-sector/
gattirathish@gmail.com
1.IoT Concepts – Mechanical Perspective
2.Mechanical Engineering in IoT Devices
3.IoT in Mechanical Engineering Applications
AGENDA
2
gattirathish@gmail.com
3
gattirathish@gmail.com
IoT Layers
https://www.altexsoft.com/blog/iot-architecture-layers-components/
4
gattirathish@gmail.com
What is IoT?
https://www.altexsoft.com/blog/iot-architecture-layers-components/
5
gattirathish@gmail.com
https://www.altexsoft.com/blog/iot-architecture-layers-components/
Focus of Electronics and Mechanical Engineers : Perception layer: converting analog signals into digital data
6
gattirathish@gmail.com
https://www.altexsoft.com/blog/iot-architecture-layers-components/
Focus of Electronics and Mechanical Engineers : Perception layer: converting analog signals into digital data
Sensors
Actuators
Machine/Device
External Stimuli
Motor RPM
Harley-Davidson Livewire
CPU
7
https://www.carandbike.com/harley-davidson-bikes/livewire
gattirathish@gmail.com
https://www.altexsoft.com/blog/iot-architecture-layers-components/
Focus of Electronics and Mechanical Engineers : Perception layer: converting analog signals into digital data
Sensors Actuators
Machine/Device [ Stand-alone]
External Stimuli Basic CPU
Sensors Actuators
Machine/Device[IoT Ready ]
External Stimuli
Advanced
CPU
Antenna
8
gattirathish@gmail.com
HD bike Server
Local Dirt bike
Server
V2V
V2G
Dirt bike Crashing
Game
9
gattirathish@gmail.com
Orange car to Orange car
Orange car to Orange Server
Orange Server to Orange Gamer HMI
V2I
V2V
10
https://www.pcgamesn.com/rocket-league/rocket-league-tips
gattirathish@gmail.com
Vehicle-to-Vehicle (V2V)
Vehicle-to-Infrastructure (V2I)
Vehicle-to-Server (V2S)
Vehicle-to-X (V2X)
11
(Highest Integration)
gattirathish@gmail.com
PC : https://www.counterpointresearch.com/connected-car-data-shaping-automotive-industry/
12
gattirathish@gmail.com
Role of mechanical engineering in IoT
In Design of IoT Devices
1. IoT Device packaging
2. Minimizing energy consumption of IoT devices
3. Design of electronic cooling systems for IoT devices
In Deployment of IoT
1.Design and Integration of IoT devices into physical systems.
2.Sensor Selection and Placement
3.Data Acquisition and Analysis from IoT devices
13
gattirathish@gmail.com
1. IoT Device packaging
Form Factor and Size Optimization
Mechanical engineers consider the overall size, shape, and aesthetics
of the IoT device enclosure. They ensure that the packaging design is
compact and fits the required electronic components, sensors, and
connectivity modules while meeting functional and aesthetic
requirements.
Design for EP and Regulatories
Mechanical engineers design the packaging to provide adequate
protection against environmental factors such as dust, moisture,
temperature variations, and physical impacts. They consider factors like
IP (Ingress Protection) ratings to ensure the device operates reliably in
different environments.
▪ IP (Ingress Protection) Ratings
▪ RoHS (Restriction of Hazardous Substances)
▪ WEEE (Waste Electrical and Electronic Equipment)
▪ REACH (Registration, Evaluation, Authorization, and
Restriction of Chemicals)
▪ UL (Underwriters Laboratories)
▪ ISO 14001: ISO 14001 (ISO for EMS)
▪ EPEAT (Electronic Product Environmental Assessment Tool)
Raspberry Pi form factor versions
PCB Design FF Optimize
Enclosure Design
FF Optimize
Min(L)
Min(H)
Min(B)
14
gattirathish@gmail.com
1. IoT Device packaging
Structural Integrity
Mechanical engineers ensure that the packaging design provides
sufficient structural integrity to protect the internal components and
withstand mechanical stresses during handling, transportation, and
operation. They consider factors such as material selection,
reinforcement techniques, and appropriate fastening methods to
ensure durability and reliability.
Thermal Management
IoT devices generate heat during operation, and mechanical engineers
design the packaging to facilitate effective thermal management. They
consider factors such as heat sinks, ventilation, and thermal insulation to
prevent overheating and ensure optimal performance and longevity of the
device.
PC: https://www.mechsol.com/case-study/shock-and-vibration-finite-element-
analysis-of-a-printed-circuit-board/
PC: https://www.1-act.com/markets/power-electronics/
15
gattirathish@gmail.com
1. IoT Device packaging
Electromagnetic Interference (EMI) Shielding
Mechanical engineers design the packaging to provide electromagnetic
shielding to minimize electromagnetic interference and protect the internal
electronics from external electromagnetic sources. They use materials with
appropriate shielding properties and ensure proper grounding techniques to
maintain signal integrity.
User Interface Integration
Mechanical engineers integrate user interfaces, such as buttons, switches,
displays, and connectors, into the packaging design. They consider factors
like ergonomic placement, ease of use, and accessibility while ensuring
these interfaces are seamlessly integrated with the enclosure.
PC: https://www.harwin.com/blog/emc-emi-shielding-explained/ https://www.keepitusable.com/human-machine-interface
16
gattirathish@gmail.com
1. IoT Device packaging
Mounting and Installation
Mechanical engineers design the packaging to facilitate easy mounting and
installation of the IoT device in various applications. They consider factors
like mounting brackets, connectors, and interfaces to ensure compatibility
with different mounting options and configurations.
Serviceability and Maintenance
Mechanical engineers design the packaging to allow for easy access and
serviceability of internal components during maintenance or repairs. They
consider factors like removable panels, modular design, and tool-less access
to enable efficient servicing and minimize downtime.
PC: https://www.machinedesign.com/automation-iiot/sensors/article/21834290/sensor-mounting-considerations
17
gattirathish@gmail.com
1. IoT Device packaging
Manufacturing Considerations
Mechanical engineers optimize the packaging design for ease of manufacturing, assembly, and cost-effectiveness. They
consider factors like manufacturability, material selection, production processes, and component integration to ensure
efficient and scalable production of the IoT device.
18
gattirathish@gmail.com
PC: https://www.leemah.com/capabilities/printed-circuit-board-assembly-thumb/
2. Minimizing energy consumption of IoT devices
Data
rate
Energy
Consumption
Solution 1 : Generate More Energy
Solution 2 : Spend Less Energy
ULP /LP components - Design for less
energy consumption like low-power
components, Cooling of Power electronic
devices by air, water, coolant.
Energy Harvesting
19
gattirathish@gmail.com
https://www.analog.com/en/technical-articles/microgen-s-piezo-mems-vibration-
energy-harvesters-enable-linear-technology-smartmesh-ip-wireless.html
https://toshiba.semicon-storage.com/eu/semiconductor/design-
development/referencedesign/detail.RD229.html
3. Electronic Cooling of IoT devices
https://www.javelin-tech.com/3d/technology/solidworks-electronic-cooling/
20
gattirathish@gmail.com
21
gattirathish@gmail.com
https://data-flair.training/blogs/industrial-iot-applications/
IoT in Manufacturing – Operational Intelligence
22
gattirathish@gmail.com
https://data-flair.training/blogs/industrial-iot-applications/
Remote Condition Monitoring (RCM) - Maintenance
23
gattirathish@gmail.com
https://data-flair.training/blogs/industrial-iot-applications/
Autonomous vehicle Design
24
gattirathish@gmail.com
Defence Design
25
gattirathish@gmail.com
https://www.computer.org/publications/tech-news/research/internet-of-military-battlefield-things-iomt-iobt
Medical Devices Design
26
gattirathish@gmail.com
https://www.tomsonelectronics.com/blogs/news/iot-in-healthcare
Logistics
27
gattirathish@gmail.com
https://www.sam-solutions.com/blog/iot-in-logistics/
THANK YOU ☺
28
gattirathish@gmail.com

IoT in Mechanical Engineering

  • 1.
  • 2.
    1.IoT Concepts –Mechanical Perspective 2.Mechanical Engineering in IoT Devices 3.IoT in Mechanical Engineering Applications AGENDA 2 gattirathish@gmail.com
  • 3.
  • 4.
  • 5.
  • 6.
    https://www.altexsoft.com/blog/iot-architecture-layers-components/ Focus of Electronicsand Mechanical Engineers : Perception layer: converting analog signals into digital data 6 gattirathish@gmail.com
  • 7.
    https://www.altexsoft.com/blog/iot-architecture-layers-components/ Focus of Electronicsand Mechanical Engineers : Perception layer: converting analog signals into digital data Sensors Actuators Machine/Device External Stimuli Motor RPM Harley-Davidson Livewire CPU 7 https://www.carandbike.com/harley-davidson-bikes/livewire gattirathish@gmail.com
  • 8.
    https://www.altexsoft.com/blog/iot-architecture-layers-components/ Focus of Electronicsand Mechanical Engineers : Perception layer: converting analog signals into digital data Sensors Actuators Machine/Device [ Stand-alone] External Stimuli Basic CPU Sensors Actuators Machine/Device[IoT Ready ] External Stimuli Advanced CPU Antenna 8 gattirathish@gmail.com
  • 9.
    HD bike Server LocalDirt bike Server V2V V2G Dirt bike Crashing Game 9 gattirathish@gmail.com
  • 10.
    Orange car toOrange car Orange car to Orange Server Orange Server to Orange Gamer HMI V2I V2V 10 https://www.pcgamesn.com/rocket-league/rocket-league-tips gattirathish@gmail.com
  • 11.
    Vehicle-to-Vehicle (V2V) Vehicle-to-Infrastructure (V2I) Vehicle-to-Server(V2S) Vehicle-to-X (V2X) 11 (Highest Integration) gattirathish@gmail.com PC : https://www.counterpointresearch.com/connected-car-data-shaping-automotive-industry/
  • 12.
  • 13.
    Role of mechanicalengineering in IoT In Design of IoT Devices 1. IoT Device packaging 2. Minimizing energy consumption of IoT devices 3. Design of electronic cooling systems for IoT devices In Deployment of IoT 1.Design and Integration of IoT devices into physical systems. 2.Sensor Selection and Placement 3.Data Acquisition and Analysis from IoT devices 13 gattirathish@gmail.com
  • 14.
    1. IoT Devicepackaging Form Factor and Size Optimization Mechanical engineers consider the overall size, shape, and aesthetics of the IoT device enclosure. They ensure that the packaging design is compact and fits the required electronic components, sensors, and connectivity modules while meeting functional and aesthetic requirements. Design for EP and Regulatories Mechanical engineers design the packaging to provide adequate protection against environmental factors such as dust, moisture, temperature variations, and physical impacts. They consider factors like IP (Ingress Protection) ratings to ensure the device operates reliably in different environments. ▪ IP (Ingress Protection) Ratings ▪ RoHS (Restriction of Hazardous Substances) ▪ WEEE (Waste Electrical and Electronic Equipment) ▪ REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) ▪ UL (Underwriters Laboratories) ▪ ISO 14001: ISO 14001 (ISO for EMS) ▪ EPEAT (Electronic Product Environmental Assessment Tool) Raspberry Pi form factor versions PCB Design FF Optimize Enclosure Design FF Optimize Min(L) Min(H) Min(B) 14 gattirathish@gmail.com
  • 15.
    1. IoT Devicepackaging Structural Integrity Mechanical engineers ensure that the packaging design provides sufficient structural integrity to protect the internal components and withstand mechanical stresses during handling, transportation, and operation. They consider factors such as material selection, reinforcement techniques, and appropriate fastening methods to ensure durability and reliability. Thermal Management IoT devices generate heat during operation, and mechanical engineers design the packaging to facilitate effective thermal management. They consider factors such as heat sinks, ventilation, and thermal insulation to prevent overheating and ensure optimal performance and longevity of the device. PC: https://www.mechsol.com/case-study/shock-and-vibration-finite-element- analysis-of-a-printed-circuit-board/ PC: https://www.1-act.com/markets/power-electronics/ 15 gattirathish@gmail.com
  • 16.
    1. IoT Devicepackaging Electromagnetic Interference (EMI) Shielding Mechanical engineers design the packaging to provide electromagnetic shielding to minimize electromagnetic interference and protect the internal electronics from external electromagnetic sources. They use materials with appropriate shielding properties and ensure proper grounding techniques to maintain signal integrity. User Interface Integration Mechanical engineers integrate user interfaces, such as buttons, switches, displays, and connectors, into the packaging design. They consider factors like ergonomic placement, ease of use, and accessibility while ensuring these interfaces are seamlessly integrated with the enclosure. PC: https://www.harwin.com/blog/emc-emi-shielding-explained/ https://www.keepitusable.com/human-machine-interface 16 gattirathish@gmail.com
  • 17.
    1. IoT Devicepackaging Mounting and Installation Mechanical engineers design the packaging to facilitate easy mounting and installation of the IoT device in various applications. They consider factors like mounting brackets, connectors, and interfaces to ensure compatibility with different mounting options and configurations. Serviceability and Maintenance Mechanical engineers design the packaging to allow for easy access and serviceability of internal components during maintenance or repairs. They consider factors like removable panels, modular design, and tool-less access to enable efficient servicing and minimize downtime. PC: https://www.machinedesign.com/automation-iiot/sensors/article/21834290/sensor-mounting-considerations 17 gattirathish@gmail.com
  • 18.
    1. IoT Devicepackaging Manufacturing Considerations Mechanical engineers optimize the packaging design for ease of manufacturing, assembly, and cost-effectiveness. They consider factors like manufacturability, material selection, production processes, and component integration to ensure efficient and scalable production of the IoT device. 18 gattirathish@gmail.com PC: https://www.leemah.com/capabilities/printed-circuit-board-assembly-thumb/
  • 19.
    2. Minimizing energyconsumption of IoT devices Data rate Energy Consumption Solution 1 : Generate More Energy Solution 2 : Spend Less Energy ULP /LP components - Design for less energy consumption like low-power components, Cooling of Power electronic devices by air, water, coolant. Energy Harvesting 19 gattirathish@gmail.com https://www.analog.com/en/technical-articles/microgen-s-piezo-mems-vibration- energy-harvesters-enable-linear-technology-smartmesh-ip-wireless.html https://toshiba.semicon-storage.com/eu/semiconductor/design- development/referencedesign/detail.RD229.html
  • 20.
    3. Electronic Coolingof IoT devices https://www.javelin-tech.com/3d/technology/solidworks-electronic-cooling/ 20 gattirathish@gmail.com
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  • 24.
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